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Fathom the supply chain — every fact sourced.

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FATHOM · BY TETTARES

Fathom

Fathom the supply chain — every fact sourced.

← tettares.com
239companies (154 with financials)
9317source documents
54281financial facts
421supply edges (370 confirmed)
818products

Beta. Relationships at pending_review; FX is ECB period-average (approximate). Snapshot 2026-07-17.

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Type

ABB LtdpublicRelationships + financials

physical ai · 🇨🇭 Switzerland · 49 sources · 0 products · 4 patents

$33.2Brevenue · FY2025 · USD$142.0B mkt cap

Parent (created for subsidiary mapping).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $26.1BFY2021: $28.9BFY2022: $29.4BFY2023: $32.2BFY2024: $30.6BFY2025: $33.2B wins 2026-07-12 · → ABB Robotics physical_ai — click for source events 2023-12-13 · other — The new facility will integrate ABB robotics technology, digital operations and a Center of Excellence to support job training, customer collaboration and advanced research and development.2023-12-13 · capacity expansion — ABB breaks ground on a new 90,000-square-foot manufacturing facility in Albuquerque, New Mexico representing a $40 million investment to expand production of Elastimold cable accessory solutions.2022-06-28 · partnership — ABB presented at SelectUSA Tech: The Future of High-Tech Industries alongside SoftBank Group International, GymPass and A-to-Be to discuss automation, robotics, and reshoring.

Rolled up across ABB + its subsidiaries

  • 2026-07-12 design-win → ABB Robotics physical_ai source ↗
  • 2023-12-13 other The new facility will integrate ABB robotics technology, digital operations and a Center of Excellence to support job training, customer collaboration and advanced research and development.
  • 2023-12-13 capacity expansion ABB breaks ground on a new 90,000-square-foot manufacturing facility in Albuquerque, New Mexico representing a $40 million investment to expand production of Elastimold cable accessory solutions.
  • 2022-06-28 partnership ABB presented at SelectUSA Tech: The Future of High-Tech Industries alongside SoftBank Group International, GymPass and A-to-Be to discuss automation, robotics, and reshoring.

Patents — 4 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 4

Financials — multi-year, confidence 1.0 (filings)

revenue

$26.1B '20
$28.9B '21
$29.4B '22
$32.2B '23
$30.6B '24
$33.2B '25

operating income

$1.6B '20
$5.7B '21
$3.3B '22
$4.9B '23
$4.8B '24
$5.7B '25

net income

$5.1B '20
$4.5B '21
$2.5B '22
$3.7B '23
$3.9B '24
$4.7B '25

Supplies → 1

🇨🇭 ABB Robotics physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

ABB RoboticspublicProduct-grade

physical ai · 🇨🇭 Switzerland · SIX: ABBN · 37 sources · 7 products · 2803 patents

$33.2Brevenue · FY2025 · USD$69.0B mkt cap

ABB Robotics is the robotics and automation division of ABB Ltd, a Swiss industrial technology group. It manufactures industrial robots including the IRB series, GoFa, and YuMi collaborative robots for manufacturing automation.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $26.1BFY2021: $28.9BFY2022: $29.4BFY2023: $32.2BFY2024: $30.6BFY2025: $33.2B wins 2026-07-12 · ABB → physical_ai — click for source2026-05-04 · Nabtesco → planetary_reducers — click for source2020-02-25 · Covariant → physical_ai — click for source2026-05-26 · Shuanghuan Driveline → planetary_reducers — click for source2026-03-17 · Skild AI → physical_ai — click for source2025-08-05 · Regal Rexnord → Thomson Movotrak CTU 7th Axis, Kollmorgen motors and software — click for source events 2025-08-05 · partnership — ABB Robotics certified the Thomson Movotrak CTU as the first cobot 7th axis technology in its partner ecosystem.2023-12-31 · financial — ABB achieved record return on capital employed of 21.1% in 2023, a 460 basis point improvement.2023-12-31 · financial — ABB delivered record high cash flow of $3.7 billion in 2023, exceeding the $3 billion target.2023-12-31 · partnership — ABB Robotics was added as a new Industry 4.0 supplier by RS in 2023, offering robotics, autonomous mobile robots, and machine automation solutions.
  • 2026-07-12 design-win ABB → physical_ai source ↗
  • 2026-05-26 design-win Shuanghuan Driveline → planetary_reducers source ↗
  • 2026-05-04 design-win Nabtesco → planetary_reducers source ↗
  • 2026-03-17 design-win Skild AI → physical_ai source ↗
  • 2025-08-05 partnership ABB Robotics certified the Thomson Movotrak CTU as the first cobot 7th axis technology in its partner ecosystem.
  • 2025-08-05 design-win Regal Rexnord → Thomson Movotrak CTU 7th Axis, Kollmorgen motors and software source ↗
  • 2023-12-31 financial ABB achieved record return on capital employed of 21.1% in 2023, a 460 basis point improvement.
  • 2023-12-31 financial ABB delivered record high cash flow of $3.7 billion in 2023, exceeding the $3 billion target.
  • 2023-12-31 partnership ABB Robotics was added as a new Industry 4.0 supplier by RS in 2023, offering robotics, autonomous mobile robots, and machine automation solutions.
  • 2020-02-25 design-win Covariant → physical_ai source ↗

Patents — 2803 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 1403
Electric motors 514
Power electronics 455
Gears / reducers 91
Batteries 69
IMU / navigation 69
Computing 51
Force / torque sensors 45
Lidar / ranging 37
Imaging / cameras 33
Bearings 30
Other 6

Newest 57 of 2803, most recent first — all on Google Patents →

  • 2026-06-25WO2026130729A LINE-HOLDING ASSEMBLY AND A ROBOT SYSTEM
  • 2026-06-18WO2026124755INDUSTRIAL ROBOT AND METHOD OF CONTROLLING INDUSTRIAL ROBOT
  • 2026-06-04WO2026112835METHOD AND ELECTRONIC DEVICE OF DETECTING FAILURE OF COMPONENT
  • 2026-06-04WO2026112913ROBOTIC JOINT
  • 2026-05-28US20260149351MULTIPHASE CONVERTER AND MOTOR
  • 2026-05-28WO2026107686METHOD AND ELECTRONIC DEVICE OF DETERMINING SAFETY ZONE FOR INDUSTRIAL ROBOT
  • 2026-05-28WO2026109146AN INDUSTRIAL ROBOT
  • 2026-05-21WO2026102727METHOD AND SYSTEM FOR CALIBRATING A CONVEYOR
  • 2026-05-15WO2026097282A GRIPPER FOR A ROBOT
  • 2026-05-15WO2026098774METHOD AND DEVICE FOR DEMONSTRATION-BASED ROBOT PROGRAMMING SUPPLEMENTED BY SPOKEN INTERACTION
  • 2026-05-14US20260135454LINE START PERMANENT MAGNET ASSISTED SYNCHRONOUS RELUCTANCE MOTOR
  • 2026-05-07WO2026090807ROBOTIC ARM AND METHOD OF PRODUCING THE SAME
  • 2026-05-07WO2026090938SPEED REDUCER AND ASSOCIATED ACTUATOR
  • 2026-05-07WO2026092842METHOD AND DEVICE FOR DEMONSTRATION-BASED PROGRAMMING OF A ROBOT OPERABLE IN MULTIPLE CONTROL MODES
  • 2026-04-30WO2026085729METHOD FOR OPERATING A ROBOT
  • 2026-04-23WO2026081074A ROBOTIC TEACH PENDANT
  • 2026-04-23WO2026082299METHOD FOR GENERATING A POWER AND FORCE LIMITING ZONE FOR A ROBOT
  • 2026-04-16WO2026076608METHOD AND ELECTRONIC DEVICE OF DETERMINING MOUNTING ANGLE OF ROBOT AND ROBOTIC SYSTEM
  • 2026-04-16WO2026076714METHODS, APPARATUSES, DEVICES, MEDIUM AND PRODUCT OF CONTROLLING VIRTUAL ROBOT ON ROBOT TRAINING PLATFORM
  • 2026-04-16WO2026077521METHOD AND DEVICE FOR DEMONSTRATION-BASED ROBOT PROGRAMMING SUPPLEMENTED BY VIDEO
  • 2026-04-09WO2026073546METHOD FOR CONTROLLING A MOVEMENT OF A ROBOT
  • 2026-04-02WO2026067958METHOD OF CONTROLLING INDUSTRIAL ROBOT, AND ROBOT SYSTEM
  • 2026-04-02WO2026067985A METHOD FOR AUTOMATIC IMAGE PAINTING ON A SURFACE AND A PAINTING SYSTEM
  • 2026-03-26WO2026060556METHOD FOR USE WITH INDUSTRIAL ROBOT, CORRESPONDING DEVICE AND ROBOTIC SYSTEM
  • 2026-03-26WO2026060571A WRIST JOINT FOR AN INDUSTRIAL ROBOT
  • 2026-03-26WO2026060599AN ACTUATOR AND AN INDUSTRIAL ROBOT
  • 2026-03-26WO2026063918AUTOMATIC TRANSFER BETWEEN VIALS
  • 2026-03-19WO2026055853TEACH PENDANT UNIT, TEACHING ASSEMBLY, ROBOTIC SYSTEM AND METHOD OF TEACHING ROBOT
  • 2026-03-19WO2026057161ASSESSING THE SAFETY OF COLLABORATIVE ROBOT-HUMAN SITUATIONS
  • 2026-03-12WO2026050984SCRAPER APPARATUS
  • 2026-03-12WO2026051064AN INDUSTRIAL ROBOT WITH IMPROVED TOPOLOGY
  • 2026-03-12WO2026053010POROUS, FLAME-QUENCHING LININGS IN FLAME PATHS OF MOTOR ENCLOSURES TO REDUCE PEAK EXPLOSION PRESSURE AND PREVENT FLAME TRANSMISSION
  • 2026-03-05WO2026044520MOTOR WITH A BRAKE AND A POSITION SENSOR
  • 2026-03-05WO2026044558CALIBRATION-FREE PATH GENERATION FOR COLLABORATIVE ROBOTS
  • 2026-03-05WO2026046491ROBOT TEACHING MODEL
  • 2026-03-05WO2026046496METHOD OF PROVIDING A SPECIALIZED LARGE LANGUAGE MODEL FOR CONTROLLING A MACHINE
  • 2026-03-05WO2026047383ELECTRIC MOTOR WITH EXPLOSION INHIBITING MATERIAL
  • 2026-03-05WO2026049719FORCE LIMITING FOR EXTERNAL AXIS
  • 2026-02-26WO2026041233DETERMINING A SAFETY CONFIGURATION FOR A ROBOT WORKSTATION
  • 2026-02-26WO2026041234VERIFYING AND OPTIMIZING A SAFETY BARRIER CONFIGURATION FOR A ROBOT WORKSTATION
  • 2026-02-26WO2026041238METHOD FOR CONTROLLING A MANIPULATOR
  • 2026-02-19WO2026036301INDUSTRIAL ROBOT
  • 2026-02-12WO2026032494POSITIONING SYSTEM FOR POSITIONING WORK OBJECT, INDUSTRIAL SYSTEM, AND METHOD OF CONTROLLING POSITIONING SYSTEM
  • 2026-02-05WO2026025210INDUSTRIAL ROBOT
  • 2026-02-05WO2026025226INDUSTRIAL ROBOT
  • 2026-01-22WO2026016008PACKAGING SYSTEM AND METHOD OF PACKAGING OBJECT
  • 2026-01-22WO2026016192ROBOT ARM
  • 2026-01-22WO2026018056POROUS BARRIERS TO REDUCE PEAK EXPLOSION PRESSURE INSIDE A FLAME-PROOF ENCLOSURE OF A SYNCHRONOUS RELUCTANCE MOTOR
  • 2026-01-22WO2026018057POROUS LININGS TO REDUCE PEAK EXPLOSION PRESSURE INSIDE A FLAME-PROOF ENCLOSURE OF A SYNCHRONOUS RELUCTANCE MOTOR
  • 2026-01-15WO2026012568METHOD OF CLEANING SURFACE, AND CLEANING SYSTEM
  • 2026-01-08WO2026006946METHOD AND ELECTRONIC DEVICE FOR USE WITH MAGNETIC CONTROLLER, METHOD AND ELECTRONIC DEVICE FOR USE WITH ROBOT CONTROLLER, AND CORRESPONDING ROBOTIC SYSTEM
  • 2026-01-08WO2026008143OPERATOR PENDANT FOR AN INDUSTRIAL ROBOT
  • 2026-01-08WO2026010607AUTOMATIC ROBOT POURING
  • 2026-01-02WO2026003551SYSTEM AND METHOD FOR DYNAMICALLY ASSIGNING COLLISION CLEARANCE DISTANCES FOR MOTION OF A ROBOT
  • 2025-12-18WO2025256740METHOD AND DEVICE FOR DEMONSTRATION-BASED ROBOT PROGRAMMING WITH ADAPTIVE REFERENCE FRAMES
  • 2025-12-11WO2025252300SEALING ARRANGEMENT, AND INDUSTRIAL ROBOT
  • 1997-10-07US5675229Apparatus and method for adjusting robot positioning

Financials — multi-year, confidence 1.0 (filings)

revenue

$34.3B '17
$27.7B '18
$28.0B '19
$26.1B '20
$28.9B '21
$29.4B '22
$32.2B '23
$30.6B '24
$33.2B '25

operating income

$3.4B '17
$2.2B '18
$1.9B '19
$1.6B '20
$5.7B '21
$3.3B '22
$4.9B '23
$4.8B '24
$5.7B '25

net income

$2.2B '17
$1.6B '18
$1.1B '19
$345M '20
$4.5B '21
$2.5B '22
$3.7B '23
$3.9B '24
$4.7B '25

Buys from ← 7

🇨🇭 ABB physical_ai L2 50
🇯🇵 Nabtesco planetary_reducers → IRB 6700 L3 53
🇺🇸 Covariant physical_ai → IRB 6700 L3 50
🇨🇳 Sunrise Instruments force_torque L2 50
🇨🇳 Shuanghuan Driveline planetary_reducers L2 53
🇺🇸 Skild AI physical_ai L2 50
Regal Rexnord Thomson Movotrak CTU 7th Axis, Kollmorgen motors and software L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

GoFaYuMiIRB 14000IRB 910SCIRB 2400IRB 1200IRB 6700

ACM ResearchpublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: ACMR · 155 sources · 12 products · 1 patents

$901Mrevenue · FY2025 · USD$5.4B mkt cap

ACM Research is a US semiconductor equipment maker based in Fremont, California, producing wafer cleaning, PECVD, track, and furnace equipment, including its Tahoe cleaning platform.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $157MFY2021: $260MFY2022: $389MFY2023: $558MFY2024: $782MFY2025: $901M wins 2025-11-05 · → SK hynix ai_chips — click for source2025-02-26 · → Hua Hong ai_chips — click for source2020-01-22 · → Micron ai_chips — click for source2025-02-26 · → SMIC ai_chips — click for source events 2026-06-30 · capacity expansion — Oregon facility operations expected beginning in the second half of 2026 to serve as initial base for production in the United States.2026-02-28 · financial — In February 2026, ACM completed the sale of approximately 4.8 million ACM Shanghai shares at RMB 160 per share, generating approximately $111 million in gross proceeds.2025-12-31 · financial — Revenue grew 9% in the fourth quarter and 15% for the full year 2025.2025-12-31 · capacity expansion — The Lingang production and R&D center's two facilities can support up to $3 billion in annual output.2025-10-01 · product launch — ACM delivered its first Ultra ECP ap-p horizontal panel-level electroplating tool to industry-leading large panel fabrication customer in Q4 2025.2025-10-01 · product launch — ACM delivered its first Ultra Lith BK system in Q4 2025, marking entry into the display panel market.2025-09-30 · financial — ACM Shanghai completed a private offering of ordinary share, generating approximately $623 million in net proceeds in September 2025.2025-01-01 · financial — In early January, we introduced our 2025 revenue outlook in the range of $850 million to $950 million.2024-12-02 · regulatory — On December 2nd, the U.S. Department of Commerce added ACM Shanghai and ACM Korea to its Entity List.2024-10-20 · capacity expansion — ACM Shanghai hosted an opening ceremony for the Lingang production and R&D center on October 20th with state-of-the-art automation system.2024-10-01 · capacity expansion — In the fourth quarter of 2024, we had a grand opening ceremony for our Lingang Production and R&D Center with a 2,300 square meter class 100 clean room.2024-10-01 · capacity expansion — ACM completed the purchase of a new Oregon facility on October 1st which includes 5,200 square feet cleaning room with plans to move in early 2025.2024-10-01 · capacity expansion — In October 2024, we completed the purchasing of our new 40,000 square foot Oregon facility with a 5,200 square-foot clean room.2024-09-01 · supply deal — In early September, ACM announced purchasing orders for four wafer-level packaging tools from US customer and US R&D centers scheduled for delivery in the first half of 2025.2020-07-06 · financial — ACM Research stock surged 23.6% in a single trading session following positive sentiment about Chinese semiconductor sector.2020-01-14 · financial — ACM Research lifted its full-year revenue guidance from $105 million to a range of $105 million to $107 million, for year-over-year growth of 41% to 43%, and called for revenue of $130 million to $150 million for 2020.
  • 2026-06-30 capacity expansion Oregon facility operations expected beginning in the second half of 2026 to serve as initial base for production in the United States.
  • 2026-02-28 financial In February 2026, ACM completed the sale of approximately 4.8 million ACM Shanghai shares at RMB 160 per share, generating approximately $111 million in gross proceeds.
  • 2025-12-31 financial Revenue grew 9% in the fourth quarter and 15% for the full year 2025.
  • 2025-12-31 capacity expansion The Lingang production and R&D center's two facilities can support up to $3 billion in annual output.
  • 2025-11-05 design-win → SK hynix ai_chips source ↗
  • 2025-10-01 product launch ACM delivered its first Ultra ECP ap-p horizontal panel-level electroplating tool to industry-leading large panel fabrication customer in Q4 2025.
  • 2025-10-01 product launch ACM delivered its first Ultra Lith BK system in Q4 2025, marking entry into the display panel market.
  • 2025-09-30 financial ACM Shanghai completed a private offering of ordinary share, generating approximately $623 million in net proceeds in September 2025.
  • 2025-02-26 design-win → Hua Hong ai_chips source ↗
  • 2025-02-26 design-win → SMIC ai_chips source ↗
  • 2025-01-01 financial In early January, we introduced our 2025 revenue outlook in the range of $850 million to $950 million.
  • 2024-12-02 regulatory On December 2nd, the U.S. Department of Commerce added ACM Shanghai and ACM Korea to its Entity List.
  • 2024-10-20 capacity expansion ACM Shanghai hosted an opening ceremony for the Lingang production and R&D center on October 20th with state-of-the-art automation system.
  • 2024-10-01 capacity expansion In the fourth quarter of 2024, we had a grand opening ceremony for our Lingang Production and R&D Center with a 2,300 square meter class 100 clean room.
  • 2024-10-01 capacity expansion ACM completed the purchase of a new Oregon facility on October 1st which includes 5,200 square feet cleaning room with plans to move in early 2025.
  • 2024-10-01 capacity expansion In October 2024, we completed the purchasing of our new 40,000 square foot Oregon facility with a 5,200 square-foot clean room.
  • 2024-09-01 supply deal In early September, ACM announced purchasing orders for four wafer-level packaging tools from US customer and US R&D centers scheduled for delivery in the first half of 2025.
  • 2020-07-06 financial ACM Research stock surged 23.6% in a single trading session following positive sentiment about Chinese semiconductor sector.
  • 2020-01-22 design-win → Micron ai_chips source ↗
  • 2020-01-14 financial ACM Research lifted its full-year revenue guidance from $105 million to a range of $105 million to $107 million, for year-over-year growth of 41% to 43%, and called for revenue of $130 million to $150 million for 2020.

Patents — 1 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 1

Supplies → 4

🇰🇷 SK hynix ai_chips → HBM (High Bandwidth Memory) L3 50
🇨🇳 Hua Hong ai_chips L2 50
🇺🇸 Micron ai_chips L2 50
🇨🇳 SMIC ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Stress-free polishing equipmentAdvanced packaging equipmentPECVD EquipmentECP EquipmentSemi-critical cleaning equipmentSingle wafer cleaning equipmentTahoePlating EquipmentECPPECVDFurnace equipmentTrack equipment

Advanced Micro DevicespublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: AMD · 294 sources · 9 products · 2070 patents

$34.6Brevenue · FY2025 · USD$816.8B mkt cap

Advanced Micro Devices, Inc. (AMD) is a US semiconductor company producing CPUs, GPUs and the Instinct MI-series AI accelerators, alongside EPYC server processors; headquartered in Santa Clara, California.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $9.8BFY2021: $16.4BFY2022: $23.6BFY2023: $22.7BFY2024: $25.8BFY2025: $34.6B wins 2024-07-22 · Samsung Electro-Mechanics → advanced_packaging — click for source2024-07-22 · → Cadence Design merchant_gpu — click for source2023-11-07 · AT&S → advanced_packaging — click for source2026-02-03 · → Amazon merchant_gpu — click for source2026-05-12 · → Arteris merchant_gpu — click for source2025-08-05 · Astera Labs → switch_silicon — click for source2023-04-20 · Shinko Electric Industries → advanced_packaging — click for source2026-01-21 · Advantest → ai_chips — click for source2026-07-13 · SK hynix → hbm — click for source2026-02-03 · → Microsoft merchant_gpu — click for source2024-12-30 · Ibiden → advanced_packaging — click for source2026-07-11 · MaxLinear → ai_compute — click for source2025-05-06 · → Siemens EDA merchant_gpu — click for source2023-02-13 · → Hewlett Packard Enterprise merchant_gpu — click for source2025-08-05 · Arteris → ai_compute — click for source events 2026-07-22 · product launch — AMD is hosting an 'Advancing AI 2026' event on July 22-23 in San Francisco.2026-07-17 · financial — AMD stock dropped over 5% during Thursday's market selloff in AI chip-related stocks.2026-07-16 · financial — Advanced Micro Devices stock is down 5% to $505 on July 16, 2026, amid broader AI hardware de-risking.2026-07-16 · financial — Jefferies analyst Blayne Curtis maintained a Buy rating on Advanced Micro Devices with a price target of $515.00.2026-07-16 · financial — AMD shares fell 6% in the session.2026-07-13 · financial — AMD shares declined in the Nasdaq Composite Index on July 13.2026-07-06 · partnership — Japanese self-driving startup Turing began using AMD's AI GPUs for roughly 10% of its AI training workloads and secured investment from AMD's venture capital arm.2026-06-26 · financial — AMD shares were mentioned among major stocks tracked in cautious Canadian trading on June 26, 2026.2026-06-18 · financial — AMD is positioned to benefit from the AI capex supercycle with hyperscalers expected to spend $757 billion in 2026 and $920 billion in 2027.2026-06-10 · financial — AMD dropped 4.86 percent in US trading amid concerns over an AI bubble.2026-06-09 · financial — AMD went up 5.14 percent on sentiment that AI-related business fundamentals remain strong.2026-06-04 · litigation — Caprock Integrated Technologies, LLC sues Advanced Micro Devices, Inc. for patent infringement regarding 830 Patent.2026-05-13 · financial — AMD fell 2.29 percent on Wall Street overnight.2026-03-01 · financial — AMD Ventures invested in Video Rebirth's $80 million seed round in March 2026.2025-12-31 · financial — We closed $17 billion in design wins in 2025, up nearly 20% year over year.2025-10-29 · supply deal — AMD announced a comprehensive multiyear agreement with OpenAI to deploy 6 gigawatts of Instinct GPUs with the first gigawatt of MI450 Series accelerators scheduled to start coming online in the second half of 2026.2025-10-28 · partnership — AMD completed the sale of the ZT manufacturing business to Sanmina and entered a strategic partnership making Sanmina the lead manufacturing partner for Helios.2025-06-30 · financial — AMD delivered record revenue of $7.7 billion in Q2 2025, up 32% year-over-year.2025-06-01 · capacity expansion — AMD began volume production of the MI350 series ahead of schedule in June and expects a steep production ramp in the second half of the year.2025-05-01 · M&A — AMD entered into agreement with Sanmina Corporation to sell the ZT manufacturing business for $3 billion in cash and stock, inclusive of contingent payment, expected to close near the end of 2025.2025-05-01 · financial — AMD Board of Directors approved an additional $6 billion share repurchase authorization in May.2025-04-01 · regulatory — In April, a new export license requirement was put in place for MI308 shipments to China, with an estimated $700 million revenue reduction in Q2 and approximately $1.5 billion impact for full year 2025.2025-04-01 · capacity expansion — AMD passed key milestones in April to begin manufacturing fifth-gen EPYC at TSMC's new Arizona fab, with first production shipments expected in the second half of 2025.2025-04-01 · M&A — AMD closed the acquisition of ZT Systems early in the second quarter.2025-03-31 · M&A — AMD completed its acquisition of ZT Systems on March 31st, 2025, adding world-class systems design expertise.2025-03-05 · product launch — GraniteShares announced 2x Long AMD and 1x Short AMD Daily ETFs tracking AMD stock performance.2025-02-01 · partnership — AMD announced a strategic partnership with G42 to build one of France's most powerful AI compute facilities powered by Instinct accelerators.2021-06-30 · financial — Advanced Micro Devices controlled 17% of the discrete GPU market in the second quarter of 2021.
  • 2026-07-22 product launch AMD is hosting an 'Advancing AI 2026' event on July 22-23 in San Francisco.
  • 2026-07-17 financial AMD stock dropped over 5% during Thursday's market selloff in AI chip-related stocks.
  • 2026-07-16 financial Advanced Micro Devices stock is down 5% to $505 on July 16, 2026, amid broader AI hardware de-risking.
  • 2026-07-16 financial Jefferies analyst Blayne Curtis maintained a Buy rating on Advanced Micro Devices with a price target of $515.00.
  • 2026-07-16 financial AMD shares fell 6% in the session.
  • 2026-07-13 financial AMD shares declined in the Nasdaq Composite Index on July 13.
  • 2026-07-13 reported edge SK hynix → hbm source ↗
  • 2026-07-11 design-win MaxLinear → ai_compute source ↗
  • 2026-07-06 partnership Japanese self-driving startup Turing began using AMD's AI GPUs for roughly 10% of its AI training workloads and secured investment from AMD's venture capital arm.
  • 2026-06-26 financial AMD shares were mentioned among major stocks tracked in cautious Canadian trading on June 26, 2026.
  • 2026-06-18 financial AMD is positioned to benefit from the AI capex supercycle with hyperscalers expected to spend $757 billion in 2026 and $920 billion in 2027.
  • 2026-06-10 financial AMD dropped 4.86 percent in US trading amid concerns over an AI bubble.
  • 2026-06-09 financial AMD went up 5.14 percent on sentiment that AI-related business fundamentals remain strong.
  • 2026-06-04 litigation Caprock Integrated Technologies, LLC sues Advanced Micro Devices, Inc. for patent infringement regarding 830 Patent.
  • 2026-05-13 financial AMD fell 2.29 percent on Wall Street overnight.
  • 2026-05-12 design-win → Arteris merchant_gpu source ↗
  • 2026-03-01 financial AMD Ventures invested in Video Rebirth's $80 million seed round in March 2026.
  • 2026-02-03 design-win → Amazon merchant_gpu source ↗
  • 2026-02-03 design-win → Microsoft merchant_gpu source ↗
  • 2026-01-21 design-win Advantest → ai_chips source ↗
  • 2025-12-31 financial We closed $17 billion in design wins in 2025, up nearly 20% year over year.
  • 2025-10-29 supply deal AMD announced a comprehensive multiyear agreement with OpenAI to deploy 6 gigawatts of Instinct GPUs with the first gigawatt of MI450 Series accelerators scheduled to start coming online in the second half of 2026.
  • 2025-10-28 partnership AMD completed the sale of the ZT manufacturing business to Sanmina and entered a strategic partnership making Sanmina the lead manufacturing partner for Helios.
  • 2025-08-05 design-win Astera Labs → switch_silicon source ↗
  • 2025-08-05 design-win Arteris → ai_compute source ↗
  • 2025-06-30 financial AMD delivered record revenue of $7.7 billion in Q2 2025, up 32% year-over-year.
  • 2025-06-01 capacity expansion AMD began volume production of the MI350 series ahead of schedule in June and expects a steep production ramp in the second half of the year.
  • 2025-05-06 design-win → Siemens EDA merchant_gpu source ↗
  • 2025-05-01 M&A AMD entered into agreement with Sanmina Corporation to sell the ZT manufacturing business for $3 billion in cash and stock, inclusive of contingent payment, expected to close near the end of 2025.
  • 2024-12-30 design-win Ibiden → advanced_packaging source ↗
  • 2024-07-22 design-win Samsung Electro-Mechanics → advanced_packaging source ↗
  • 2024-07-22 design-win → Cadence Design merchant_gpu source ↗
  • 2023-11-07 design-win AT&S → advanced_packaging source ↗
  • 2023-04-20 design-win Shinko Electric Industries → advanced_packaging source ↗
  • 2023-02-13 design-win → Hewlett Packard Enterprise merchant_gpu source ↗

Patents — 2070 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 1746
Memory 164
Semiconductors 121
Other 23
Power electronics 9
Imaging / cameras 7

Newest 39 of 2070, most recent first — all on Google Patents →

  • 2026-07-02US20260186557DYNAMIC VOLTAGE MARGIN ADJUSTMENT BASED ON WORKLOAD CHARACTERISTICS
  • 2026-07-02US20260186776SYSTEMS AND METHODS FOR EFFICIENT EXECUTION OF VECTOR OPERATIONS
  • 2026-07-02US20260186777PROCESSING 16-BIT BRAIN FLOATING-POINT INSTRUCTIONS
  • 2026-07-02US20260186789MACHINE LEARNING-BASED OPTIMIZATION OF PROCESSING SYSTEM PARAMETERS AND APPLICATION SETTINGS
  • 2026-07-02US20260186899METADATA SUPPORT FOR DRAM-BASED DATA PROCESSING SYSTEMS
  • 2026-07-02US20260187013PROTOCOL ENHANCEMENTS FOR LOW LATENCY APPLICATIONS
  • 2026-07-02US20260187254MACHINE LEARNING MODEL SECURITY AT A PROCESSOR
  • 2026-07-02US20260187313MACHINE LEARNING-BASED OPTIMIZATION OF PROCESSING SYSTEM HARDWARE
  • 2026-07-02US20260188376SUB-CHANNEL SUPPORT ACROSS SAME MEMORY MODULE
  • 2026-06-25US20260178070LOOKUP TABLE ACCESS FOR QUANTIZATION AND DEQUANTIZATION OPERATIONS
  • 2026-06-25US20260178109Adaptive Voltage Regulator Configurations
  • 2026-06-25US20260178205POWER REDUCTION FOR COMMAND SUB-QUEUE MEMORIES
  • 2026-06-25US20260178278PSEUDORANDOM NUMBER GENERATION IN HARDWARE
  • 2026-06-25US20260178325MATRIX MULTIPLICATION SCHEDULING BASED ON REPEATED MATRICES
  • 2026-06-25US20260178327TRANSPOSE INSTRUCTIONS FOR 6-BIT FLOATING-POINT OPERATIONS
  • 2026-06-25US20260178330Selective Data Compression for Non-Critical Memory Requests
  • 2026-06-25US20260178338System and Methods for Neural Instruction Scheduling
  • 2026-06-25US20260178339CO-ISSUE OF INSTRUCTIONS IN MULTI-CHIPLET PROCESSORS
  • 2026-06-25US20260178379SCHEDULING INFERENCING TASKS ON HARDWARE RESOURCES
  • 2026-06-25US20260178392LOOKAHEAD RESOURCE ALLOCATION FOR ACCELERATOR UNITS
  • 2026-06-25US20260178405EFFICIENT RESOURCE MANAGEMENT FOR HIGHLY CONCURRENT SCALAR-VECTOR SYSTEMS
  • 2026-06-25US20260178422Accelerating and Improved Fairness for Semaphores
  • 2026-06-25US20260178459ACCELERATOR DEBUGGING AND WATCHPOINTS WITH HARDWARE MONITORS
  • 2026-06-25US20260178495Last-Level-Cache-Aware Reader-Writer Semaphore
  • 2026-06-25US20260178499Selective Insertion of Prefetched Data and Instructions
  • 2026-06-25US20260178500Stacked Die Configuration with Metadata Storage
  • 2026-06-25US20260178507Mixed Memory Architecture Cache Level
  • 2026-06-25US20260178508PAGE TABLE ENTRY OPTIMIZATION FOR MEMORY OPERATIONS
  • 2026-06-25US20260178510CACHE RESIDENCY CONTROL
  • 2026-06-25US20260178529SMART RETIMER DEVICE
  • 2026-06-25US20260178554STORING POPULARITY METADATA FOR EMBEDDING VECTORS
  • 2026-06-25US20260178603DATA FORMAT SCALING AND CONVERSION TECHNIQUES
  • 2026-06-25US20260178692MIXED-PRECISION MATRIX MULTIPLICATION
  • 2026-06-25US20260178693MATRIX BLOCK BUFFERING FOR MATRIX MULTIPLICATION OPERATIONS USING REPEATED MATRIX BLOCKS
  • 2026-06-25US20260178732Anomaly Detection Using Spatial Voting, Machine Learning, And Power Management Framework On An Embedded Neural Processing Unit
  • 2026-06-25US20260178832SELECTIVE RECOMPUTATION OF KEY VALUE DATA
  • 2026-06-25US20260180947AUTONOMOUS INTELLIGENT WORKFLOW COMMUNICATIONS AGENT
  • 2026-06-18US20260169743Instruction Padding For Coordinating And Aligning Performance Counters And Increments In Accelerator Processing Units
  • 2026-06-18US20260169933REMOTE MEMORY TRAFFIC MANAGEMENT

Financials — multi-year, confidence 1.0 (filings)

revenue

$9.8B '20
$16.4B '21
$23.6B '22
$22.7B '23
$25.8B '24
$34.6B '25

operating income

$1.4B '20
$3.6B '21
$1.3B '22
$401M '23
$1.9B '24
$3.7B '25

net income

$2.5B '20
$3.2B '21
$1.3B '22
$854M '23
$1.6B '24
$4.3B '25

Sources: AMD 10-Q 2025-11-05 (acc 0000002488-25-000166) · AMD 10-Q 2024-05-01 (acc 0000002488-24-000056) · AMD 10-K 2024-01-31 (acc 0000002488-24-000012) · AMD 10-Q 2023-11-01 (acc 0000002488-23-000195) · AMD 10-Q 2025-08-06 (acc 0000002488-25-000108) · AMD 10-K 2026-02-04 (acc 0000002488-26-000018) · AMD 10-Q 2023-08-02 (acc 0000002488-23-000139) · Caprock Integrated Technologies, LLC v. Advanced Micro Dev… · AMD 10-Q 2025-05-07 (acc 0000002488-25-000047) · AMD 10-Q 2023-05-03 (acc 0000002488-23-000076)

Buys from ← 9

🇰🇷 Samsung Electro-Mechanics advanced_packaging → Instinct MI300X L3 50
🇦🇹 AT&S advanced_packaging → Instinct MI300X L3 50
🇺🇸 Astera Labs switch_silicon → Instinct MI300X L3 50
🇯🇵 Shinko Electric Industries advanced_packaging → Instinct MI300X L3 50
🇯🇵 Advantest ai_chips → Instinct MI300X L3 50
🇰🇷 SK hynix hbm → Instinct MI300X L3
🇯🇵 Ibiden advanced_packaging → Instinct MI300X L3 50
🇺🇸 MaxLinear ai_compute L2 50
🇺🇸 Arteris ai_compute → Instinct MI300X L3 50

Supplies → 6

🇺🇸 Cadence Design merchant_gpu L2 50
🇺🇸 Amazon merchant_gpu → Amazon Web Services (AWS) L3 50
🇺🇸 Arteris merchant_gpu L2 50
🇺🇸 Microsoft merchant_gpu → Microsoft Azure L3 50
🇩🇪 Siemens EDA merchant_gpu L2 50
🇺🇸 Hewlett Packard Enterprise merchant_gpu L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Instinct MI250ROCmEPYC BergamoRyzen ThreadripperInstinct MI300Instinct MI300XInstinct MI250XEPYC GenoaInstinct MI210

Advantech Co., Ltd.publicRelationships + financials

ai compute · 🇹🇼 Taiwan · TWSE: 2395 · 1 sources · 5 products · 10 patents

$2.2Brevenue · FY2025 · USD$13.8B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.6BFY2021: $1.8BFY2022: $2.1BFY2023: $2.0BFY2024: $1.8BFY2025: $2.2B wins events

Patents — 10 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 10

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.6B '20
$1.8B '21
$2.1B '22
$2.0B '23
$1.8B '24
$2.2B '25

operating income

$292M '20
$320M '21
$420M '22
$374M '23
$280M '24
$360M '25

net income

$223M '20
$255M '21
$335M '22
$337M '23
$281M '24
$327M '25

Buys from ← 1

🇩🇪 Bosch Rexroth roller_screws L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

AIMB SeriesARK SeriesMIC SeriesEAC SeriesMXM Modules

AdvantestpublicProduct-grade

ai compute · 🇯🇵 Japan · TSE: 6857 · 61 sources · 5 products · 426 patents

$6.9Brevenue · FY2026 · USD$122.8B mkt cap

ATE test (HBM/GPU)

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $1.9BFY2022: $2.6BFY2023: $3.4BFY2024: $3.0BFY2025: $5.1BFY2026: $7.5B wins 2025-01-09 · FormFactor → ai_compute — click for source2025-12-24 · → Taiwan Manufacturing ai_chips — click for source2026-01-21 · → Micron ai_chips — click for source2026-01-21 · → NVIDIA ai_chips — click for source2026-01-21 · → Advanced Micro Devices ai_chips — click for source2026-01-21 · → SK hynix ai_chips — click for source2026-01-21 · → Samsung Electronics ai_chips — click for source events 2026-01-27 · financial — Advantest stock was purchased by market participants following strong U.S. semiconductor sector performance.2025-04-01 · financial report — Advantest reports half-year financial results for fiscal period 2025/04/01-2025/09/30.2025-01-27 · financial — Advantest stock rose as part of semiconductor-related buying following Philadelphia Semiconductor Index's 18-consecutive day rally.
  • 2026-01-27 financial Advantest stock was purchased by market participants following strong U.S. semiconductor sector performance.
  • 2026-01-21 design-win → Micron ai_chips source ↗
  • 2026-01-21 design-win → NVIDIA ai_chips source ↗
  • 2026-01-21 design-win → Advanced Micro Devices ai_chips source ↗
  • 2026-01-21 design-win → SK hynix ai_chips source ↗
  • 2026-01-21 design-win → Samsung Electronics ai_chips source ↗
  • 2025-12-24 design-win → Taiwan Manufacturing ai_chips source ↗
  • 2025-04-01 financial report Advantest reports half-year financial results for fiscal period 2025/04/01-2025/09/30.
  • 2025-01-27 financial Advantest stock rose as part of semiconductor-related buying following Philadelphia Semiconductor Index's 18-consecutive day rally.
  • 2025-01-09 design-win FormFactor → ai_compute source ↗

Patents — 426 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 277
Memory 56
Power electronics 39
Semiconductors 30
Other 21
Imaging / cameras 3

Newest 12 of 426, most recent first — all on Google Patents →

  • 2026-06-04WO2026114481METHOD AND SYSTEM FOR OBTAINING A SPECIFICATION LIMIT VALUE FOR USE AS ACCEPTANCE CRITERION IN A DEVICE ACCEPTANCE TEST
  • 2026-02-05US20260038618Write latency testing systems and methods
  • 2025-12-04WO2025250130TESTER FOR AN AUTOMATIC TEST EQUIPMENT SYSTEM AND METHOD FOR CONTROLLING THE SAME
  • 2025-11-27US2025363023TESTING SYSTEMS AND METHODS WITH CROSS-PLATFORM BRIDGE COMPONENTS
  • 2025-11-13US2025348422SYNCHRONIZATION TECHNIQUES BETWEEN SINGLE-SITE AND MULTI-SITE DUT TEST PROGRAMS
  • 2025-06-12WO2025120999TESTING DEVICE, TESTING METHOD, AND PROGRAM
  • 2025-04-24WO2025083771PATTERN-GENERATING DEVICE
  • 2025-03-27US2025102562MULTI-USER DEVELOPMENT SYSTEM FOR SYSTEM LEVEL DEVICE TESTING
  • 2025-02-13US2025056755COOLING SHROUD AND ENCLOSURE FOR CONSUMER ELECTRONIC MEMORY DEVICE FOR OPTIMIZED PERFORMANCE THEREOF
  • 2024-08-08US2024264221INDEPENDENT THERMAL CONTROLLER FOR MEMORY DEVICES AND DEVICE INTERFACE BOARDS
  • 2024-05-30US2024176721Lockless log and error reporting for automatic test equipment
  • 2024-05-30US2024176757Automatic test equipment architecture providing odd sector size support

Buys from ← 1

🇺🇸 FormFactor ai_compute L2 50

Supplies → 6

🇹🇼 Taiwan Manufacturing ai_chips L2 50
🇺🇸 Micron ai_chips → HBM (High-Bandwidth Memory) L3 50
🇺🇸 NVIDIA ai_chips → Data center GPUs / AI accelerators L3 50
🇺🇸 Advanced Micro Devices ai_chips → Instinct MI300X L3 50
🇰🇷 SK hynix ai_chips → HBM (High Bandwidth Memory) L3 50
🇰🇷 Samsung Electronics ai_chips → HBM (High Bandwidth Memory) L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

T2000V93000ExplorerEDA (Test Simulation)VSTA

Aichi Steel CorporationpublicRelationships + financials

- · 🇯🇵 Japan · 1 sources · 0 products

$1.9Brevenue · FY2026 · USD$192.7B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $1.3BFY2022: $1.6BFY2023: $1.8BFY2024: $1.8BFY2025: $1.8BFY2026: $1.9B wins 2026-07-17 · → JTEKT steel — click for source events
  • 2026-07-17 reported edge → JTEKT steel source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.3B '21
$1.6B '22
$1.8B '23
$1.8B '24
$1.8B '25
$1.9B '26

operating income

$22M '21
$19M '22
$24M '23
$77M '24
$79M '25
$111M '26

net income

$19M '21
$7M '22
$10M '23
$41M '24
$48M '25
$69M '26

Supplies → 1

🇯🇵 JTEKT steel L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Allegro MicroSystemspublicRelationships + financials

physical ai · 🇺🇸 United States · 28 sources · 0 products · 154 patents

$890Mrevenue · FY2026 · USD$8.8B mkt cap

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Current Sensing Hall Effect IC' for EC Series Servo Drives. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $591MFY2022: $769MFY2023: $974MFY2024: $1.0BFY2025: $725MFY2026: $890M wins 2026-07-16 · UMC → foundry — click for source2026-07-16 · Taiwan Manufacturing → foundry — click for source2026-07-16 · → ai_compute — click for source2026-07-16 · SMIC → foundry — click for source2026-07-16 · → Tesla physical_ai — click for source events 2026-12-31 · financial — For the full year, free cash flow was a record $125 million, and we also made $60 million in voluntary debt payments.2026-12-31 · financial — FY '26 sales increased by 23% year-over-year to $890 million and EPS more than doubled to $0.54 per share.2026-12-31 · product launch — In fiscal 2026, we released our first isolated gate driver specifically designed for silicon carbide transistors and are seeing strong customer interest.2025-06-30 · product launch — Released a new 48-volt motor driver IC that results in more efficient, quieter and more reliable cooling fans for use in AI data center installations.2025-06-30 · financial — Made voluntary debt repayment totaling $35 million in Q1, bringing debt balance down to $310 million.2025-06-30 · product launch — Released an innovative new ASIL-C current sensor this quarter specifically designed to meet the safety, efficiency and commercial needs of xEV inverters.2025-06-30 · product launch — Released first U-core current sensor ICs that enable customers to use smaller magnetic cores or cordless inverter current sensor systems.2024-07-01 · M&A — Allegro repurchased 39 million shares from Sanken, which reduced Sanken's ownership in Allegro from 51% to 33%.
  • 2026-12-31 financial For the full year, free cash flow was a record $125 million, and we also made $60 million in voluntary debt payments.
  • 2026-12-31 financial FY '26 sales increased by 23% year-over-year to $890 million and EPS more than doubled to $0.54 per share.
  • 2026-12-31 product launch In fiscal 2026, we released our first isolated gate driver specifically designed for silicon carbide transistors and are seeing strong customer interest.
  • 2026-07-16 reported edge UMC → foundry source ↗
  • 2026-07-16 reported edge Taiwan Manufacturing → foundry source ↗
  • 2026-07-16 reported edge → ai_compute source ↗
  • 2026-07-16 reported edge SMIC → foundry source ↗
  • 2026-07-16 reported edge → Tesla physical_ai source ↗
  • 2025-06-30 product launch Released a new 48-volt motor driver IC that results in more efficient, quieter and more reliable cooling fans for use in AI data center installations.
  • 2025-06-30 financial Made voluntary debt repayment totaling $35 million in Q1, bringing debt balance down to $310 million.
  • 2025-06-30 product launch Released an innovative new ASIL-C current sensor this quarter specifically designed to meet the safety, efficiency and commercial needs of xEV inverters.
  • 2025-06-30 product launch Released first U-core current sensor ICs that enable customers to use smaller magnetic cores or cordless inverter current sensor systems.
  • 2024-07-01 M&A Allegro repurchased 39 million shares from Sanken, which reduced Sanken's ownership in Allegro from 51% to 33%.

Patents — 154 CPC-scoped to physical ai (physical-AI-relevant classes)

Power electronics 46
Force / torque sensors 38
Lidar / ranging 35
Imaging / cameras 18
Electric motors 13
Gears / reducers 2
IMU / navigation 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$591M '21
$769M '22
$974M '23
$1.0B '24
$725M '25
$890M '26

operating income

$12M '21
$137M '22
$203M '23
$196M '24
$-20M '25
$43M '26

net income

$18M '21
$119M '22
$187M '23
$153M '24
$-73M '25
$-15M '26

Buys from ← 4

🇹🇼 UMC foundry L2
🇹🇼 Taiwan Manufacturing foundry L2
ai_compute L2
🇨🇳 SMIC foundry L2

Supplies → 1

🇺🇸 Tesla physical_ai L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Amazon.com, Inc.publicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: AMZN · 182 sources · 6 products · 41 patents

$716.9Brevenue · FY2025 · USD$2.69T mkt cap

US cloud/e-commerce company; AWS is a major AI-compute buyer, and Amazon is a Figure AI investor. HQ Seattle; founded 1994.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $386.1BFY2021: $469.8BFY2022: $514.0BFY2023: $574.8BFY2024: $638.0BFY2025: $716.9B wins 2025-02-05 · Qualcomm → compute — click for source2024-04-14 · Figure AI → humanoid — click for source2024-08-31 · Covariant → physical_ai — click for source2024-12-03 · Marvell → custom_asic — click for source2026-02-03 · Advanced Micro Devices → merchant_gpu — click for source2026-05-06 · Arm → ai_chips — click for source2026-06-25 · Broadcom → custom_asic — click for source2026-07-01 · Zhongji InnoLight → optical_modules — click for source2026-05-15 · Agility Robotics → humanoid — click for source2026-07-01 · Micron → hbm — click for source2024-10-31 · Intel → merchant_gpu — click for source2026-07-11 · Taiwan Manufacturing → foundry — click for source2026-02-10 · Astera Labs → switch_silicon — click for source2026-04-18 · Eoptolink → optical_modules — click for source2026-04-23 · STMicroelectronics → imu — click for source2026-06-13 · Corning → advanced_packaging — click for source2026-07-11 · IonQ → quantum — click for source2025-08-28 · NVIDIA → ai_gpu — click for source2026-04-22 · Einride → physical_ai — click for source2025-12-10 · Synopsys → ai_chips — click for source events 2027-01-01 · partnership — OpenAI committed to consume approximately two gigawatts of Trainium capacity beginning in 2027.2026-07-16 · financial — Amazon.com ended the day at $254.96 up 3%.2026-07-09 · capital raised — Amazon.com, Inc. closed a debt offering on July 9, 2026, issuing $24.923 billion in aggregate principal amount of notes across eight series (floating rate notes due 2029, and fixed-rate notes due 2029–2066 with rates ranging from 4.600% to 6.250%), with net proceeds of approximat2026-06-25 · other — Amazon Prime Day featured up to 35% discounts on gaming laptops and desktops including Lenovo Legion 5 at 15% discount.2026-06-24 · other — Amazon Prime Day featured gaming PC deals with discounts up to 35% on prebuilt laptops and desktops with cutting-edge graphics cards and processors.2026-06-23 · product launch — Amazon Prime Day sale featured gaming laptops and desktops with discounts up to 35% on top-rated devices.2026-04-30 · financial — Amazon reported stronger-than-expected first quarter 2026 earnings.2026-04-30 · financial — Amazon.com reported stronger-than-expected revenue in the first quarter of 2026.2026-04-30 · financial — Amazon.com reported stronger-than-expected revenue in the first quarter of 2026.2026-04-01 · financial — AWS revenue grew 28% in the first quarter of 2026, reaching $37.6 billion, the segment's fastest growth in 15 quarters.2026-04-01 · financial — Amazon's custom chip unit has an annual revenue run rate above $20 billion, growing at triple-digit percentage rates year over year.2026-04-01 · financial — Amazon's chip business has $225 billion in revenue commitments for Trainium chips.2026-02-05 · financial — We expect to invest about $200 billion in capital expenditures across Amazon.com, Inc., but predominantly in AWS.2026-02-02 · other — Amazon is cutting 84 jobs in Seattle and Bellevue across engineering, recruiting, software development, and product management roles.2026-01-01 · capacity expansion — Amazon announced plans to deploy more than 1 million Nvidia GPUs starting in 2026.2026-01-01 · financial — Amazon expects about $200 billion in capital expenditures across the company in 2026.2026-01-01 · product launch — Amazon's Trainium3 AI accelerator chips started shipping at the beginning of 2026 and are nearly fully subscribed.2026-01-01 · capacity expansion — Amazon plans to deploy more than 1 million Nvidia GPUs starting in 2026.2025-12-31 · financial — Full year operating cash flow increased to $139.5 billion in 2025, up 20% year over year.2025-12-31 · capacity expansion — AWS added more than one gigawatt of capacity in Q4 2025 and added more data center capacity than any other company in the world in 2025.2025-12-31 · product launch — Amazon's custom chips business, inclusive of Graviton and Tranium, is now over $10 billion in annual revenue run rate growing triple-digit percentages year over year.2025-12-31 · financial — AWS revenue was $35.6 billion, growing 24% year over year with an annualized run rate of $142 billion.2025-12-31 · product launch — We just launched NovaForge which gives customers early checkpoints on our Amazon Nova models allows them to securely mix their own proprietary data with the model's data in the pre-training stage.2025-12-31 · partnership — We have dozens of commercial agreements already signed for Amazon LEO, including with AT&T, DIRECTV Latin America, JetBlue, and Australia's national broadband network.2025-12-31 · capacity expansion — We've landed over 1.4 million Tranium two chips our fastest ramping chip launch ever.2025-12-31 · financial — Bedrock is now a multibillion-dollar annualized run rate business, and customer spend grew 60% quarter over quarter.2025-12-31 · product launch — We recently launched Tranium three, which is up to 40% more price performance than Trainium two.2025-12-31 · partnership — We announced new agreements with OpenAI, Visa, MBA, BlackRock, Perplexity, Lyft, United Airlines, DoorDash, Salesforce, US Air Force, Adobe, Thomson Reuters, AT&T, S&P Global, National Bank of Canada, the London Stock Exchange, Choice Hotels, Accenture, Indeed, HSBC, CrowdStrike,2025-12-31 · financial — Amazon reported a 16% emissions increase for 2025 in its sustainability report.2025-12-31 · capacity expansion — We've launched 180 satellites have more than 20 launches planned in 2026, more than 30 in 2027, and expect to launch commercially in 2026.2025-12-31 · product launch — We launched Frontier Agents including Kiro autonomous agents for coding tasks, AWS DevOps agents for detecting and resolving operational issues, and AWS security agents for proactively securing applications.2025-12-31 · financial — Advertising revenue grew 22% in the fourth quarter and we added over $12 billion of incremental revenue in 2025 alone.2025-06-30 · financial — AWS segment revenue was $30.9 billion in Q2 2025, a 17.5% increase year-over-year, with an annualized revenue run rate of more than $123 billion.2025-06-30 · partnership — Amazon announced an integration between Disney's real-time ad exchange and Amazon DSP, allowing advertisers direct access to Disney's premium inventory.2025-06-30 · capacity expansion — Amazon increased the share of orders moving through direct lanes by over 40% year-over-year in Q2 2025.2025-06-30 · product launch — AWS released Kiro, an agentic integrated development environment coding agent, with several hundred thousand developers using it in the first couple of weeks.2025-06-30 · financial — AWS backlog at June 30, 2025 was $195 billion, up about 25% year-over-year.2025-06-30 · partnership — Amazon announced a partnership with Roku in June 2025, giving advertisers access to 80 million connected TV households through Amazon DSP.2025-06-30 · product launch — Amazon Bedrock released AgentCore, a set of building blocks providing the industry's first secure serverless runtime for deploying agents.2025-06-30 · financial — Cash CapEx in Q2 2025 was $31.4 billion, with AWS being the primary driver of investments in AI services, custom silicon, and infrastructure.2025-06-30 · product launch — Amazon deployed its 1 millionth robot across its global fulfillment network in Q2 2025.2025-05-31 · product launch — Amazon released Strands, an open-source tool for building agents, which garnered 2,500 stars on GitHub and over 300,000 downloads.2025-05-01 · other — Project Kuiper reached a significant milestone by launching its first satellite into orbit with more launches planned soon and service expected to begin later in 2025.2025-03-05 · product launch — GraniteShares announced a 2x Long AMZN Daily ETF tracking Amazon stock performance.2025-01-14 · financial — Nancy Pelosi disclosed buying 50 call options of Amazon.com on January 14, 2025, which were exercised in January 2026 for 5,000 shares.2024-12-31 · capacity expansion — We expanded the number of same-day delivery sites by more than 60% in 2024, which now serve more than 140 metro areas.2024-12-31 · financial — Capital investments were $26.3 billion in the fourth quarter, and we think that run rate will be reasonably representative of our 2025 capital investment rate.2024-12-01 · product launch — Tranium 2 just launched at our AWS reInvent conference in December, E2 instances with these chips are typically 30 to 40 percent more price per form than other current GPU-powered instances available.2024-10-31 · product launch — Amazon launched its 12th-generation fulfillment center design in Shreveport, Louisiana, incorporating newest robotics inventions that reduce fulfillment processing time by up to 25%.2024-10-31 · capacity expansion — Over 40 million customers in the past quarter had their orders delivered for free with same-day delivery, an increase of more than 25% year-over-year.2024-10-31 · capacity expansion — Amazon opened more than 15 inbound buildings in the last few months and improved its ability to spread inventory across fulfillment centers by 25% year-over-year.2024-10-31 · product launch — Amazon launched a completely new Kindle lineup including the first-ever color Kindle, the fastest Kindle Paperwhite, a new pocket-sized Kindle, and Kindle Scribe with AI-powered notebook capabilities.2024-10-31 · financial — Amazon expects to spend approximately $75 billion in CapEx in 2024, with the majority to support growing technology infrastructure needs primarily for AWS AI services.2024-06-22 · financial — Amazon.com stock faced selling pressure as a hyperscale cloud operator amid concerns about intensifying AI development competition.2022-06-23 · product launch — Amazon showcased Astro, a home robot system designed for mainstream consumer use, at re:Mars 2022.2022-06-23 · product launch — Amazon debuted Proteus, a new autonomous robot for fulfillment centers, at re:Mars 2022.2021-07-20 · other — Amazon.com founder Jeff Bezos sponsored Wally Funk's spaceflight aboard Blue Origin's New Shepard rocketship in July 2021.2020-03-13 · other — Amazon canceled re:MARS 2020, an annual AI event focusing on machine learning, automation, robotics and space, due to COVID-19 pandemic concerns.

Rolled up across Amazon + its subsidiaries

  • 2027-01-01 partnership OpenAI committed to consume approximately two gigawatts of Trainium capacity beginning in 2027.
  • 2026-07-16 financial Amazon.com ended the day at $254.96 up 3%.
  • 2026-07-11 design-win Taiwan Manufacturing → foundry source ↗
  • 2026-07-11 design-win IonQ → quantum source ↗
  • 2026-07-09 capital raised Amazon.com, Inc. closed a debt offering on July 9, 2026, issuing $24.923 billion in aggregate principal amount of notes across eight series (floating rate notes due 2029, and fixed-rate notes due 2029–2066 with rates ranging from 4.600% to 6.250%), with net proceeds of approximat
  • 2026-07-01 design-win Zhongji InnoLight → optical_modules source ↗
  • 2026-07-01 design-win Micron → hbm source ↗
  • 2026-06-25 other Amazon Prime Day featured up to 35% discounts on gaming laptops and desktops including Lenovo Legion 5 at 15% discount.
  • 2026-06-25 design-win Broadcom → custom_asic source ↗
  • 2026-06-24 other Amazon Prime Day featured gaming PC deals with discounts up to 35% on prebuilt laptops and desktops with cutting-edge graphics cards and processors.
  • 2026-06-23 product launch Amazon Prime Day sale featured gaming laptops and desktops with discounts up to 35% on top-rated devices.
  • 2026-06-13 reported edge Corning → advanced_packaging source ↗
  • 2026-05-15 design-win Agility Robotics → humanoid source ↗
  • 2026-05-06 design-win Arm → ai_chips source ↗
  • 2026-04-30 financial Amazon reported stronger-than-expected first quarter 2026 earnings.
  • 2026-04-30 financial Amazon.com reported stronger-than-expected revenue in the first quarter of 2026.
  • 2026-04-30 financial Amazon.com reported stronger-than-expected revenue in the first quarter of 2026.
  • 2026-04-23 design-win STMicroelectronics → imu source ↗
  • 2026-04-22 design-win Einride → physical_ai source ↗
  • 2026-04-18 design-win Eoptolink → optical_modules source ↗
  • 2026-04-01 financial AWS revenue grew 28% in the first quarter of 2026, reaching $37.6 billion, the segment's fastest growth in 15 quarters.
  • 2026-04-01 financial Amazon's custom chip unit has an annual revenue run rate above $20 billion, growing at triple-digit percentage rates year over year.
  • 2026-04-01 financial Amazon's chip business has $225 billion in revenue commitments for Trainium chips.
  • 2026-02-10 design-win Astera Labs → switch_silicon source ↗
  • 2026-02-05 financial We expect to invest about $200 billion in capital expenditures across Amazon.com, Inc., but predominantly in AWS.
  • 2026-02-03 design-win Advanced Micro Devices → merchant_gpu source ↗
  • 2026-02-02 other Amazon is cutting 84 jobs in Seattle and Bellevue across engineering, recruiting, software development, and product management roles.
  • 2026-01-01 capacity expansion Amazon announced plans to deploy more than 1 million Nvidia GPUs starting in 2026.
  • 2026-01-01 financial Amazon expects about $200 billion in capital expenditures across the company in 2026.
  • 2026-01-01 product launch Amazon's Trainium3 AI accelerator chips started shipping at the beginning of 2026 and are nearly fully subscribed.
  • 2026-01-01 capacity expansion Amazon plans to deploy more than 1 million Nvidia GPUs starting in 2026.
  • 2025-12-31 financial Full year operating cash flow increased to $139.5 billion in 2025, up 20% year over year.
  • 2025-12-31 capacity expansion AWS added more than one gigawatt of capacity in Q4 2025 and added more data center capacity than any other company in the world in 2025.
  • 2025-12-10 design-win Synopsys → ai_chips source ↗
  • 2025-08-28 design-win NVIDIA → ai_gpu source ↗
  • 2025-02-05 design-win Qualcomm → compute source ↗
  • 2024-12-03 design-win Marvell → custom_asic source ↗
  • 2024-10-31 design-win Intel → merchant_gpu source ↗
  • 2024-08-31 design-win Covariant → physical_ai source ↗
  • 2024-04-14 design-win Figure AI → humanoid source ↗

Patents — 41 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 33
Computing 8

Newest 8 of 41, most recent first — all on Google Patents →

  • 2026-07-09US20260195427ORDERED TEMPORARY CREDENTIALS FOR ZERO-TRUST SYSTEMS
  • 2026-06-18US20260169341ELECTRONIC DEVICES WITH A FRONT LIGHT PANEL LAYER
  • 2026-06-18US20260169825PROVISIONED POLLERS FOR OPTIMIZED CLOUD RESOURCE UTILIZATION
  • 2026-06-18US20260170262DIFFUSION SAFETY GUIDANCE
  • 2026-06-18US20260170361PERFORMANCE TIER FOR A TOKEN BASED SERVICE
  • 2026-06-18US20260172388REGIONAL NETWORK ADDRESS TRANSLATION GATEWAYS FOR CLOUD COMPUTING RESOURCES
  • 2026-06-18US20260173314SYSTEM AND METHOD FOR CONTROLLING COOLING OF COMPUTING SYSTEM
  • 2026-06-11US20260161356HARDWARE-BASED MIXED INSTRUCTION SET ARCHITECTURE SCHEDULER FOR MACHINE LEARNING ACCELERATOR

Financials — multi-year, confidence 1.0 (filings)

revenue

$280.5B '19
$386.1B '20
$469.8B '21
$514.0B '22
$574.8B '23
$638.0B '24
$716.9B '25

operating income

$14.5B '19
$22.9B '20
$24.9B '21
$12.2B '22
$36.9B '23
$68.6B '24
$80.0B '25

net income

$11.6B '19
$21.3B '20
$33.4B '21
$-2722M '22
$30.4B '23
$59.2B '24
$77.7B '25

Sources: AMZN 10-K 2024-02-02 (acc 0001018724-24-000008) · AMZN 10-Q 2025-08-01 (acc 0001018724-25-000086) · AMZN 8-K 2026-07-09 (acc 0001104659-26-082293) · Amazon.com, Inc. Form 10-K (accession 0001018724-25-000004) · Amazon.com, Inc. Form 10-K (accession 0001018724-23-000004) · Amazon.com, Inc. Form 10-K (accession 0001018724-24-000008) · AMZN 10-K 2023-02-03 (acc 0001018724-23-000004) · AMZN 10-Q 2024-05-01 (acc 0001018724-24-000083) · AMZN 10-Q 2023-04-28 (acc 0001018724-23-000008) · Amazon.com, Inc. Form 10-K (accession 0001018724-26-000004)

Buys from ← 22

🇺🇸 Qualcomm compute L2 50
🇺🇸 Figure AI humanoid L2 50
🇺🇸 Standard Bots physical_ai L2 50
🇺🇸 Covariant physical_ai L2 50
🇺🇸 Marvell custom_asic → AWS Trainium L3 50
🇺🇸 Advanced Micro Devices merchant_gpu → Amazon Web Services (AWS) L3 50
🇬🇧 Arm ai_chips → AWS Trainium L3 50
🇺🇸 Broadcom custom_asic → AWS Trainium L3 50
🇨🇳 Zhongji InnoLight optical_modules L2 50
🇺🇸 Agility Robotics humanoid L2 50
🇺🇸 Credo switch_silicon → Amazon Web Services (AWS) L3 50
🇺🇸 Micron hbm L2 50
🇺🇸 Intel merchant_gpu → Amazon Web Services (AWS) L3 50
🇹🇼 Taiwan Manufacturing foundry → AWS Inferentia L3 50
🇺🇸 Astera Labs switch_silicon → AWS Trainium L3 50
🇨🇳 Eoptolink optical_modules L2 50
🇨🇭 STMicroelectronics imu L2 50
🇺🇸 Corning advanced_packaging L2
🇺🇸 IonQ quantum L2 50
🇺🇸 NVIDIA ai_gpu → Amazon EC2 L3 75
🇸🇪 Einride physical_ai L2 50
🇺🇸 Synopsys ai_chips → AWS Trainium L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

AWS InferentiaAmazon EC2Amazon BedrockAWS SageMakerAmazon Web Services (AWS)AWS Trainium

AMECpublicProduct-grade

ai compute · 🇨🇳 China · STAR: 688012 · 23 sources · 0 products

$1.8Brevenue · FY2025 · USD

Etch, MOCVD

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $336MFY2021: $460MFY2022: $699MFY2023: $926MFY2024: $1.3BFY2025: $1.8B wins 2024-02-24 · → Taiwan Manufacturing ai_chips — click for source events
  • 2024-02-24 design-win → Taiwan Manufacturing ai_chips source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$248M '18
$282M '19
$336M '20
$460M '21
$699M '22
$926M '23
$1.3B '24
$1.8B '25

operating income

$22M '18
$29M '19
$76M '20
$176M '21
$188M '22
$280M '23
$252M '24
$323M '25

net income

$14M '18
$27M '19
$73M '20
$157M '21
$173M '22
$264M '23
$225M '24
$311M '25

Supplies → 2

🇹🇼 Taiwan Manufacturing ai_chips → N6 L3 50
🇨🇳 SMIC ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Amkor TechnologypublicRelationships + financials

ai compute · 🇺🇸 United States · NASDAQ: AMKR · 143 sources · 0 products · 165 patents

$6.7Brevenue · FY2025 · USD$15.6B mkt cap

OSAT; $7B AZ packaging fab

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $5.1BFY2021: $6.1BFY2022: $7.1BFY2023: $6.5BFY2024: $6.3BFY2025: $6.7B wins 2026-06-20 · → Taiwan Manufacturing osat — click for source2025-02-10 · Infineon → ai_chips — click for source2025-07-24 · → Intel osat — click for source events 2026-06-16 · partnership — Amkor Technology entered into a 10-year partnership with TSMC to expand advanced semiconductor packaging and testing capabilities in Arizona.2026-06-16 · partnership — Amkor announced a landmark 10-year partnership with TSMC for advanced packaging and testing services from Arizona operations.2026-04-27 · financial — Amkor reported record first-quarter 2026 revenue of $1.7 billion, up 27% year-over-year, with advanced product revenue climbing to $1.4 billion.2025-10-29 · capacity expansion — The Arizona campus will include 750,000 square feet of clean room space and create up to 3,000 high-quality jobs, with Phase 1 construction expected to be completed in mid-2027 and production beginning in early 2028.2025-10-29 · capacity expansion — Amkor marked a major milestone with the groundbreaking of a new advanced packaging and test campus in Arizona with total projected investment increased to $7 billion.2025-10-29 · financial — Third quarter 2025 revenue was $1.99 billion with 31% sequential growth and 7% year-on-year growth.2025-10-29 · executive change — Giel Rutten announced his retirement from Amkor at the end of 2025, with Kevin Engel as his successor.2025-10-29 · financial — 2025 CapEx forecast has increased to $950 million, up from $850 million to support expanded investment in the Arizona campus.2024-12-31 · financial — Amkor secured $407 million in CHIPS funding to support its planned Arizona facility.2024-12-31 · financial — Advanced SiP reached a record of $3.1 billion in 2024.2024-12-31 · financial — The Computing end market reached a record of $1.2 billion driven by growth in ARM-based PCs and 2.5D technology for AI GPUs.2024-12-31 · partnership — Amkor expanded its partnership with TSMC to support Advanced Packaging in the US.2024-12-31 · partnership — Amkor expanded its partnership with Infineon to support power modules in Europe.2024-12-31 · capacity expansion — Amkor qualified its new Vietnam facility and ran production for system and package and memory devices.2024-07-18 · regulatory — Amkor aligned on a nonbinding preliminary memorandum of terms with the US Department of Commerce for up to $400 million in grants under the CHIPS and Science Act to support building a new facility in Arizona.
  • 2026-06-20 design-win → Taiwan Manufacturing osat source ↗
  • 2026-06-16 partnership Amkor Technology entered into a 10-year partnership with TSMC to expand advanced semiconductor packaging and testing capabilities in Arizona.
  • 2026-06-16 partnership Amkor announced a landmark 10-year partnership with TSMC for advanced packaging and testing services from Arizona operations.
  • 2026-04-27 financial Amkor reported record first-quarter 2026 revenue of $1.7 billion, up 27% year-over-year, with advanced product revenue climbing to $1.4 billion.
  • 2025-10-29 capacity expansion The Arizona campus will include 750,000 square feet of clean room space and create up to 3,000 high-quality jobs, with Phase 1 construction expected to be completed in mid-2027 and production beginning in early 2028.
  • 2025-10-29 capacity expansion Amkor marked a major milestone with the groundbreaking of a new advanced packaging and test campus in Arizona with total projected investment increased to $7 billion.
  • 2025-10-29 financial Third quarter 2025 revenue was $1.99 billion with 31% sequential growth and 7% year-on-year growth.
  • 2025-10-29 executive change Giel Rutten announced his retirement from Amkor at the end of 2025, with Kevin Engel as his successor.
  • 2025-10-29 financial 2025 CapEx forecast has increased to $950 million, up from $850 million to support expanded investment in the Arizona campus.
  • 2025-07-24 design-win → Intel osat source ↗
  • 2025-02-10 design-win Infineon → ai_chips source ↗
  • 2024-12-31 financial Amkor secured $407 million in CHIPS funding to support its planned Arizona facility.
  • 2024-12-31 financial Advanced SiP reached a record of $3.1 billion in 2024.
  • 2024-12-31 financial The Computing end market reached a record of $1.2 billion driven by growth in ARM-based PCs and 2.5D technology for AI GPUs.
  • 2024-12-31 partnership Amkor expanded its partnership with TSMC to support Advanced Packaging in the US.
  • 2024-12-31 partnership Amkor expanded its partnership with Infineon to support power modules in Europe.
  • 2024-12-31 capacity expansion Amkor qualified its new Vietnam facility and ran production for system and package and memory devices.
  • 2024-07-18 regulatory Amkor aligned on a nonbinding preliminary memorandum of terms with the US Department of Commerce for up to $400 million in grants under the CHIPS and Science Act to support building a new facility in Arizona.

Patents — 165 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 143
Computing 13
Other 6
Memory 3

Newest 3 of 165, most recent first — all on Google Patents →

  • 2007-05-22US7220915Memory card and its manufacturing method
  • 2006-08-22US7095103Leadframe based memory card
  • 1998-10-29WO9848461INTEGRATED CIRCUIT PACKAGE

Financials — multi-year, confidence 1.0 (filings)

revenue

$5.1B '20
$6.1B '21
$7.1B '22
$6.5B '23
$6.3B '24
$6.7B '25

operating income

$457M '20
$763M '21
$897M '22
$470M '23
$438M '24
$467M '25

net income

$338M '20
$643M '21
$766M '22
$360M '23
$354M '24
$374M '25

Sources: AMKR 10-Q 2024-10-29 (acc 0001047127-24-000203) · AMKR 10-Q 2024-07-30 (acc 0001047127-24-000159) · AMKR 10-Q 2023-05-03 (acc 0001047127-23-000015) · AMKR 10-Q 2024-05-01 (acc 0001047127-24-000094) · AMKR 10-K 2024-02-16 (acc 0001047127-24-000019) · AMKR 10-Q 2023-08-01 (acc 0001047127-23-000024) · AMKR 10-Q 2026-04-28 (acc 0001047127-26-000020) · AMKR 10-K 2025-02-21 (acc 0001047127-25-000030) · AMKR 10-K 2026-02-20 (acc 0001047127-26-000014) · AMKR 10-Q 2023-11-01 (acc 0001047127-23-000030)

Buys from ← 1

🇩🇪 Infineon ai_chips L2 50

Supplies → 4

🇹🇼 Taiwan Manufacturing osat L2 50
🇺🇸 Qualcomm osat L2 50
🇺🇸 Astera Labs osat L2 50
🇺🇸 Intel osat L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Analog DevicespublicProduct-grade

physical ai · 🇺🇸 United States · NASDAQ: ADI · 88 sources · 7 products · 551 patents

$11.0Brevenue · FY2025 · USD$185.4B mkt cap

Precision IMUs, mixed-signal

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $5.6BFY2021: $7.3BFY2022: $12.0BFY2023: $12.3BFY2024: $9.4BFY2025: $11.0B wins 2025-05-22 · Taiwan Manufacturing → foundry — click for source2025-08-20 · → NVIDIA imu — click for source events 2026-07-02 · other — Analog Devices entered into a 364-day revolving credit facility with Bank of America as administrative agent and multiple co-documentation agents (Citibank, JPMorgan Chase, Morgan Stanley, Barclays, BNP Paribas) for $3.0 billion in aggregate principal amount, expiring July 1, 2022026-07-01 · partnership — Analog Devices formed a 50:50 joint venture with MEIL to invest USD 300-500 million in physical intelligence systems over three to four years.2026-07-01 · partnership — Analog Devices formed an equal joint venture with Megha Engineering & Infrastructures to deploy Physical Intelligence solutions in India with $300-500 million investment over three years.2026-07-01 · partnership — Analog Devices formed a 50:50 joint venture with MEIL focused on physical intelligence machines that learn from the real world, planning USD 300-500 million investment over three to four years.2026-07-01 · partnership — Analog Devices founder and CEO Alex Kipman signed a memorandum of understanding with MEIL to form a joint venture for developing physical intelligence technologies for India, with a focus on intelligent infrastructure and traffic management systems.2026-07-01 · partnership — Analog Devices announced a strategic partnership with Megha Engineering & Infrastructures Limited (MEIL) to create India's first city-scale Physical Intelligence grid starting in Hyderabad.
  • 2026-07-02 other Analog Devices entered into a 364-day revolving credit facility with Bank of America as administrative agent and multiple co-documentation agents (Citibank, JPMorgan Chase, Morgan Stanley, Barclays, BNP Paribas) for $3.0 billion in aggregate principal amount, expiring July 1, 202
  • 2026-07-01 partnership Analog Devices formed a 50:50 joint venture with MEIL to invest USD 300-500 million in physical intelligence systems over three to four years.
  • 2026-07-01 partnership Analog Devices formed an equal joint venture with Megha Engineering & Infrastructures to deploy Physical Intelligence solutions in India with $300-500 million investment over three years.
  • 2026-07-01 partnership Analog Devices formed a 50:50 joint venture with MEIL focused on physical intelligence machines that learn from the real world, planning USD 300-500 million investment over three to four years.
  • 2026-07-01 partnership Analog Devices founder and CEO Alex Kipman signed a memorandum of understanding with MEIL to form a joint venture for developing physical intelligence technologies for India, with a focus on intelligent infrastructure and traffic management systems.
  • 2026-07-01 partnership Analog Devices announced a strategic partnership with Megha Engineering & Infrastructures Limited (MEIL) to create India's first city-scale Physical Intelligence grid starting in Hyderabad.
  • 2025-08-20 design-win → NVIDIA imu source ↗
  • 2025-05-22 design-win Taiwan Manufacturing → foundry source ↗

Patents — 551 CPC-scoped to physical ai (physical-AI-relevant classes)

Power electronics 148
IMU / navigation 113
Lidar / ranging 113
Other 69
Imaging / cameras 54
Batteries 32
Force / torque sensors 13
Computing 4
Robotics / manipulators 3
Memory 1
Semiconductors 1

Newest 2 of 551, most recent first — all on Google Patents →

  • 2026-01-15US20260017800SEMANTIC SEGMENTATION AND SCENE INTEGRATION OF 3D IMAGE FRAMES
  • 2025-12-11US2025375896PROCESS TOOL TENDING ROBOTS

Financials — multi-year, confidence 1.0 (filings)

revenue

$5.6B '20
$7.3B '21
$12.0B '22
$12.3B '23
$9.4B '24
$11.0B '25

operating income

$1.5B '20
$1.7B '21
$3.3B '22
$3.8B '23
$2.0B '24
$2.9B '25

net income

$1.2B '20
$1.4B '21
$2.7B '22
$3.3B '23
$1.6B '24
$2.3B '25

Sources: ADI 10-Q 2024-05-22 (acc 0000006281-24-000132) · ADI 10-Q 2025-08-20 (acc 0000006281-25-000144) · ADI 10-Q 2024-08-21 (acc 0000006281-24-000159) · ADI 10-K 2025-11-25 (acc 0000006281-25-000153) · ADI 10-Q 2026-05-20 (acc 0000006281-26-000052) · ADI 10-Q 2026-02-18 (acc 0000006281-26-000016) · ADI 8-K 2026-07-02 (acc 0001193125-26-294488) · ADI 10-Q 2023-02-15 (acc 0000006281-23-000031) · ADI 10-Q 2023-05-24 (acc 0000006281-23-000152) · ADI 10-Q 2025-05-22 (acc 0000006281-25-000125)

Buys from ← 1

🇹🇼 Taiwan Manufacturing foundry L2 50

Supplies → 1

🇺🇸 NVIDIA imu → Omniverse L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

ADIS16IMUADIS16xxx SeriesADIS16260ADXL SeriesADIS16480/ADIS16485ADIS16505/ADIS16507ADIS16AMLZ

Applied MaterialspublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: AMAT · 89 sources · 10 products · 2033 patents

$28.4Brevenue · FY2025 · USD$445.4B mkt cap

Deposition, etch, CMP, packaging

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $17.2BFY2021: $23.1BFY2022: $25.8BFY2023: $26.5BFY2024: $27.2BFY2025: $28.4B wins 2026-07-07 · → GlobalFoundries ai_chips — click for source2026-05-08 · → Intel ai_chips — click for source2025-03-19 · Taiwan Manufacturing → foundry — click for source2026-07-08 · GlobalFoundries → foundry — click for source2025-06-29 · Samsung Electronics → ai_chips — click for source2025-07-11 · SK hynix → hbm — click for source2026-07-07 · → Qualcomm ai_chips — click for source events 2026-07-07 · partnership — Applied Materials is working with GlobalFoundries, Qualcomm Technologies, and EssilorLuxottica to help move intelligent optical systems toward broader commercialization.2026-07-07 · product launch — Applied Materials introduced its SENZ integrated ambient visual platform for AI-powered smart glasses combining waveguide optics, light engines, vision correction, and electronic dimming into a single integrated system.2026-06-18 · financial — Applied Materials is positioned to benefit from the AI capex supercycle as a production technology equipment supplier.2026-06-17 · product launch — Applied Materials unveiled SENZ, an integrated ambient visual platform designed to accelerate the development of AI-powered smart glasses.2026-06-17 · partnership — Applied Materials established strategic collaborations with GlobalFoundries for large-scale waveguide fabrication, Qualcomm Technologies for AI-powered integration, and EssilorLuxottica to advance the commercialization of intelligent optical systems.2026-03-01 · capacity expansion — Applied Materials' new flagship R&D facility, the EPIC Center in Silicon Valley remains on track to begin operations in spring 2026.2024-06-18 · financial — Applied Materials semiconductor equipment stock rose.2024-02-01 · product launch — Sym3 Magnum etch system for advanced patterning generated more than $1.2 billion of revenue since launch in February 2024.
  • 2026-07-08 design-win GlobalFoundries → foundry source ↗
  • 2026-07-07 partnership Applied Materials is working with GlobalFoundries, Qualcomm Technologies, and EssilorLuxottica to help move intelligent optical systems toward broader commercialization.
  • 2026-07-07 product launch Applied Materials introduced its SENZ integrated ambient visual platform for AI-powered smart glasses combining waveguide optics, light engines, vision correction, and electronic dimming into a single integrated system.
  • 2026-07-07 design-win → GlobalFoundries ai_chips source ↗
  • 2026-07-07 design-win → Qualcomm ai_chips source ↗
  • 2026-06-18 financial Applied Materials is positioned to benefit from the AI capex supercycle as a production technology equipment supplier.
  • 2026-06-17 product launch Applied Materials unveiled SENZ, an integrated ambient visual platform designed to accelerate the development of AI-powered smart glasses.
  • 2026-06-17 partnership Applied Materials established strategic collaborations with GlobalFoundries for large-scale waveguide fabrication, Qualcomm Technologies for AI-powered integration, and EssilorLuxottica to advance the commercialization of intelligent optical systems.
  • 2026-05-08 design-win → Intel ai_chips source ↗
  • 2026-03-01 capacity expansion Applied Materials' new flagship R&D facility, the EPIC Center in Silicon Valley remains on track to begin operations in spring 2026.
  • 2025-07-11 design-win SK hynix → hbm source ↗
  • 2025-06-29 design-win Samsung Electronics → ai_chips source ↗
  • 2025-03-19 design-win Taiwan Manufacturing → foundry source ↗
  • 2024-06-18 financial Applied Materials semiconductor equipment stock rose.
  • 2024-02-01 product launch Sym3 Magnum etch system for advanced patterning generated more than $1.2 billion of revenue since launch in February 2024.

Patents — 2033 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 1719
Computing 218
Robotics / manipulators 39
Memory 33
Power electronics 7
Imaging / cameras 5
Other 3
Electric motors 3
Force / torque sensors 3
Lidar / ranging 2
Gears / reducers 1

Newest 30 of 2033, most recent first — all on Google Patents →

  • 2026-07-02US20260187784TOOL-SPECIFIC MACHINE LEARNING SOLUTIONS FOR SEMICONDUCTOR EXAMINATION
  • 2026-06-11US20260162513RANKING ANOMALOUS SENSOR BY CRITICALITY USING CAUSAL INFERENCE TECHNIQUES
  • 2026-06-11US20260165142HIGHLY-EFFECTIVE ULTRATHIN SPUTTER ABLE AND TAMPER-RESISTANT SHIELDS WITH METAL-REFRACTORY ALLOY STACKS
  • 2026-04-30US20260119302PLASMA STATUS MONITORING USING AN ARTIFICIAL INTELLIGENCE MODEL
  • 2026-04-30US20260119733METHODS AND SYSTEMS FOR CALIBRATING ON-TOOL DIGITAL TWIN MODELS
  • 2026-04-23US20260112023DEFECT IMAGE GENERATION
  • 2026-04-09US20260099638MODELING APPROACH FOR DEVELOPMENT OF GAS INJECTION UNIT WITHIN PROCESSING CHAMBER
  • 2026-04-02US20260093575SUBSTRATE DEFECT TROUBLESHOOTING ANALYSIS USING MACHINE LEARNING
  • 2026-03-19US20260082866AUGMENTED CHEMICAL MECHANICAL PLANARIZATION
  • 2026-03-12US20260072414CLASSIFICATION OF ASPECTS OF MANUFACTURING EQUIPMENT USING ARTIFICIAL INTELLIGENCE
  • 2026-03-05US20260064925SUBSTRATE PROCESS DATA LABELING
  • 2026-02-26US20260057935RAPID PROGRAMMING OF MEMORY ARRAYS WITH CONCURRENT PROGRAMMING AND VERIFICATION
  • 2026-02-19US20260050566SCALABLE DECENTRALIZED DATABASE ARCHITECTURE
  • 2026-02-05US20260038137IMAGE SIMULATION FOR SEMICONDUCTOR EXAMINATION
  • 2026-01-29US20260030090SUBSTRATE DEFECT ANALYSIS BASED ON MULTIPLE DATA TYPES
  • 2026-01-22US20260023332PHYSICS INFORMED ARTIFICIAL INTELLIGENCE FOR DYNAMIC SYSTEMS IN SEMICONDUCTOR MANUFACTURING
  • 2026-01-22US20260026296AUTOMATIC CREATION OF AN IMAGING RECIPE
  • 2025-12-25US2025391114ALGORITHM FOR 3D RECONSTRUCTION OF DIAGONALLY CUT SEMICONDUCTOR LOGIC STRUCTURE
  • 2025-12-11US2025378138SYSTEM AND METHOD FOR CHAMBER MATCHING USING PHASE-BASED SCORING
  • 2025-12-04US2025370426METHODS FOR TROUBLESHOOTING SUBSTRATE DEFECTS USING MACHINE LEARNING
  • 2025-10-09US2025315565PROCESS RECIPE TRANSFER AND CHAMBER MATCHING BY MODELING
  • 2025-10-09US2025315585MODIFYING A CURVILINEAR PATTERN IN A DESIGN LAYOUT OF A SEMICONDUCTOR SPECIMEN
  • 2025-10-02US2025307499MITIGATION OF SUBSTRATE DEFORMATION IN DEVICE MANUFACTURING USING MACHINE LEARNING SYSTEMS AND TECHNIQUES
  • 2025-08-21US2025265697REGISTRATION BETWEEN AN INSPECTION IMAGE AND A DESIGN IMAGE
  • 2025-07-03US2025216347NONDESTRUCTIVE ESTIMATION OF STRUCTURAL PROPERTIES OF A SPECIMEN VIA X-RAY MODELLING BASED ON SIMULATIONS AND GROUND TRUTH MEASUREMENTS
  • 2025-05-22US2025165591METHODS AND MECHANISMS TO PERFORM AUTOMATED CLASSIFICATIONS OF ANOMALOUS TRACE SHAPES
  • 2025-05-22US2025167027CLOSED LOOP CONTROL SYSTEM TO MONITOR INSIDE PARAMETERS OF A SUBSTRATE CARRIER
  • 2025-05-01US2025140538MODEL-DRIVEN PRESSURE ESTIMATION
  • 2025-04-10US2025117561STRUCTURE AND TECHNIQUE OF PHOTO-DEFINED SEMICONDUCTOR DEVICE WITH SELECTIVE DIELECTRIC CONSTANT REDUCTION
  • 2025-03-13US2025086342Comprehensive modeling platform for manufacturing equipment

Financials — multi-year, confidence 1.0 (filings)

revenue

$17.2B '20
$23.1B '21
$25.8B '22
$26.5B '23
$27.2B '24
$28.4B '25

operating income

$4.4B '20
$6.9B '21
$7.8B '22
$7.7B '23
$7.9B '24
$8.3B '25

net income

$3.6B '20
$5.9B '21
$6.5B '22
$6.9B '23
$7.2B '24
$7.0B '25

Sources: AMAT 10-Q 2023-02-23 (acc 0000006951-23-000012) · AMAT 10-Q 2023-05-26 (acc 0000006951-23-000022) · AMAT 10-Q 2025-05-22 (acc 0000006951-25-000024) · AMAT 10-Q 2026-02-19 (acc 0001628280-26-009694) · AMAT 10-K 2025-12-12 (acc 0001628280-25-056742) · AMAT 10-Q 2023-08-24 (acc 0000006951-23-000031) · AMAT 10-Q 2025-02-20 (acc 0000006951-25-000011) · AMAT 10-Q 2024-02-27 (acc 0000006951-24-000012) · AMAT 10-Q 2024-08-22 (acc 0000006951-24-000032) · AMAT 10-Q 2025-08-21 (acc 0000006951-25-000037)

Buys from ← 4

🇹🇼 Taiwan Manufacturing foundry L2 53
🇺🇸 GlobalFoundries foundry L2 50
🇰🇷 Samsung Electronics ai_chips L2 53
🇰🇷 SK hynix hbm L2 53

Supplies → 3

🇺🇸 GlobalFoundries ai_chips L2 50
🇺🇸 Intel ai_chips → Gaudi Accelerators L3 53
🇺🇸 Qualcomm ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

DxZProducerEnduraEnablerGasonics AvantuSSelectraPolarisCenturaMirraMosaic

AptivpublicRelationships + financials

physical ai · 🇮🇪 Ireland · 287 sources · 7 products · 676 patents

$20.1Brevenue · FY2023 · USD$13.7B mkt cap

Aptiv is an Ireland-domiciled automotive technology supplier providing ADAS, automated driving platforms, vehicle electrical architectures, and connectivity solutions; it was spun off from Delphi Automotive in 2017.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $13.1BFY2021: $15.6BFY2022: $17.5BFY2023: $20.1B wins 2024-10-31 · Tesla → humanoid — click for source2025-10-30 · → BYD physical_ai — click for source events 2026-04-01 · M&A — During the quarter, we finalized the leadership team for our electrical distribution systems business, which remains on track to spin out as Versagen on April 1, under the leadership of Joe Liatine.2026-03-31 · M&A — The first quarter concluded with the successful completion of the separation of our Electrical Distribution Systems business into a new independent public company, Versigent.2025-04-01 · financial — We completed our $3 billion accelerated share repurchase program on April 1st, which reduced our share count by 18%, bringing the percentage of shares retired over the last 12 months to 20%.2024-07-30 · financial — Aptiv announced a new $5 billion share repurchase authorization, which includes a $3 billion accelerated share repurchase plan commencing the day after the call.2022-01-11 · M&A — Aptiv acquired Wind River Systems
  • 2026-04-01 M&A During the quarter, we finalized the leadership team for our electrical distribution systems business, which remains on track to spin out as Versagen on April 1, under the leadership of Joe Liatine.
  • 2026-03-31 M&A The first quarter concluded with the successful completion of the separation of our Electrical Distribution Systems business into a new independent public company, Versigent.
  • 2025-10-30 design-win → BYD physical_ai source ↗
  • 2025-04-01 financial We completed our $3 billion accelerated share repurchase program on April 1st, which reduced our share count by 18%, bringing the percentage of shares retired over the last 12 months to 20%.
  • 2024-10-31 design-win Tesla → humanoid source ↗
  • 2024-07-30 financial Aptiv announced a new $5 billion share repurchase authorization, which includes a $3 billion accelerated share repurchase plan commencing the day after the call.
  • 2022-01-11 M&A Aptiv acquired Wind River Systems

Patents — 676 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 429
Imaging / cameras 68
IMU / navigation 45
Computing 39
Power electronics 35
Batteries 30
Robotics / manipulators 23
Electric motors 4
Force / torque sensors 2
Bearings 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$14.4B '18
$14.4B '19
$13.1B '20
$15.6B '21
$17.5B '22
$20.1B '23

operating income

$1.6B '18
$1.4B '19
$851M '20
$1.1B '21
$1.3B '22
$1.6B '23

net income

$1.1B '18
$990M '19
$1.8B '20
$590M '21
$594M '22
$2.9B '23

Buys from ← 1

🇺🇸 Tesla humanoid L2 50

Supplies → 1

🇨🇳 BYD physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Secure Connectivity SolutionsMotor Control UnitsElectrical Architecture SolutionsVehicle-to-Everything (V2X) TechnologyAdvanced Driver Assistance Systems (ADAS)Infotainment SystemsAutomated Driving Platform

Arm HoldingspublicProduct-grade

ai compute · 🇬🇧 United Kingdom · NASDAQ: ARM · 251 sources · 8 products · 49 patents

$4.9Brevenue · FY2026 · USD$278.8B mkt cap

Arm Holdings is a UK-based semiconductor IP company, founded in 1990, that designs and licenses CPU architectures such as Cortex-A/R/M and GPU technology (Mali), majority-owned by SoftBank Group.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $2.0BFY2022: $2.7BFY2023: $2.7BFY2024: $3.2BFY2025: $4.0BFY2026: $4.9B wins 2026-07-16 · Taiwan Manufacturing → foundry — click for source2026-07-16 · Microsoft → ai_compute — click for source2026-05-06 · → Amazon ai_chips — click for source2026-05-06 · → NVIDIA ai_chips — click for source2025-11-05 · → Samsung Electronics ai_chips — click for source2026-05-06 · → Microsoft ai_chips — click for source2025-02-18 · Cadence Design → ai_chips — click for source2026-05-06 · → Infineon ai_chips — click for source events 2026-09-14 · product launch — Arm Holdings completed its initial public offering on September 14, with share prices popping nearly 25% on the first day of trading.2026-07-16 · regulatory — Arm CEO commented on US export restrictions for AI capable CPUs to China and highlighted complexity in enforcing potential bans.2026-07-16 · partnership — Arm is working with partners including TSMC, Oracle and Microsoft to secure key components across its supply chain for next generation chips.2026-07-16 · product launch — Arm CEO pointed to stronger demand for Arm's AGI CPU, with customers such as ByteDance and Oracle now using the product.2026-07-13 · financial — Arm Holdings fell in the Nasdaq Composite Index on July 13.2026-07-09 · financial — Arm Holdings stock soared 224.4% in the first half of 2026, reaching a market cap of $350 billion as of July 9, 2026.2026-06-30 · financial — Arm Holdings stock soared 224.4% through the first half of 2026.2026-05-07 · financial — Arm Holdings reported fiscal Q4 revenue of $1.24 billion, up 34% year-over-year, with adjusted EPS of $0.55 versus $0.36 in the prior year.2026-05-06 · financial — Customer demand for Arm's AGI CPU across fiscal 2027 and fiscal 2028 exceeded $2 billion as of May 6, 2026, more than double the amount discussed at launch.2026-03-31 · financial — Arm's fiscal 2026 revenue was up 23% year over year to $4.92 billion, comprising royalty revenue of $2.61 billion and licensing revenue of $2.31 billion.2026-03-31 · product launch — Arm's AGI CPU, developed with Meta Platforms as the lead partner, was launched in late March 2026 and designed for agentic AI data centers.2025-12-31 · product launch — Arm Holdings is set to launch AI chips by late 2025.2025-06-30 · financial — NVIDIA owned 1.1 million shares of Arm Holdings valued at $178.1 million at the end of Q2 2025.2025-06-09 · other — Arm Holdings CEO Rene Haas attended a White House roundtable on Trump's investment account initiative for newborn babies.2025-06-04 · product launch — Arm Holdings announced a major rebranding initiative retiring the Cortex brand and confirmed plans to enter the chip design space as a strategic pivot.2025-04-08 · financial — Arm Holdings stock more than doubled since the U.S.-Iran ceasefire agreement on April 8.2025-03-31 · financial — We delivered record royalty of $607 million this quarter.2025-03-31 · partnership — We signed a large multi-year agreement with the Malaysian government to accelerate the development of an Arm-based AI ecosystem in the country.2025-03-31 · financial — Licensing revenue hit an all-time high of $634 million.2025-03-31 · financial — For the full year, revenue topped $4 billion and royalty revenue surpassed $2 billion, also a first.2025-03-31 · financial — Q4 revenue exceeded $1 billion for the first time ever in our history.2025-03-24 · product launch — Arm launched the Arm AGI CPU at the Arm Everywhere event, purpose-built for Agentic AI with more than 2x the performance per rack compared with x86 platforms.2025-03-05 · partnership — Arm Holdings established an ASEAN and Oceania regional base of operations in Malaysia with a $250 million deal to share IP with local companies.2025-03-01 · product launch — Arm announced in March 2025 that it will begin developing its own semiconductor brand, transitioning from providing circuit design IP to semiconductor makers.2024-12-31 · financial — Licensing revenue increased 14% year-on-year to $403 million in Q3 fiscal 2025.2024-12-31 · financial — Total revenue grew 19% year-on-year to an all-time high of $983 million in Q3 fiscal 2025.2024-12-31 · financial — Royalty revenue grew 23% year-on-year to a new record of $580 million in Q3 fiscal 2025.2024-12-31 · financial — Revenue increased 19% to $983 million in Q3 fiscal 2025 as AI drove demand for energy efficient computing platforms.2024-12-31 · financial — Non-GAAP net income increased 26% to $0.39 per diluted share in Q3 fiscal 2025.2024-09-30 · financial — Licensing revenue declined 15% year-over-year to $330 million, which was better than our expectations, which was for a 25% decline.2024-09-30 · financial — Royalty revenue was $514 million, which grew 23% year-over-year and matched our highest royalty revenue quarter to date.2024-09-30 · financial — Total revenue was $844 million, which was above the top end of our guided range.2024-06-18 · financial — Arm Holdings stock rose along with other semiconductor-related stocks.2023-09-22 · product launch — Arm Holdings went public with shares closing at $51.32, just above its IPO price of $51.2023-01-01 · financial — SoftBank focused on initial public offering of Arm at New York Stock Exchange in 2023 pursuing a valuation of at least $60 billion while maintaining a controlling stake.2022-12-21 · other — ARM Holdings is analyzed as a company in the IoT Security and Privacy market report.2022-09-14 · other — Arm Holdings is listed as a select competitor in the global Interface IP market.2022-09-09 · executive change — Dr. John Liu, who previously served as a non-executive director on the board of Arm Holdings Plc, was appointed to the Board of Directors of Pixelworks, Inc.2022-03-15 · executive change — Arm Holdings announced plans to cut up to 15% of its workforce with most job losses in the UK and US.2022-02-22 · other — Arm Holdings is mentioned as a company providing 5G technology, infrastructure, and services related to MVNO market opportunities.2022-02-09 · financial — Arm Holdings announced plans to cut up to 15% of its workforce following the collapse of its $40bn sale to NVIDIA.2022-02-08 · M&A — SoftBank shelved the $40bn sale of Arm Holdings to NVIDIA due to regulatory hurdles.2022-02-08 · M&A — SoftBank announced plans to list Arm Holdings on the Nasdaq stock exchange instead of completing the NVIDIA sale.2022-02-08 · M&A — The $40 billion sale of Arm Holdings to NVIDIA collapsed due to regulatory hurdles.2022-02-08 · financial — Arm Holdings plans to list on the Nasdaq stock exchange in the US instead of being acquired by NVIDIA.
  • 2026-09-14 product launch Arm Holdings completed its initial public offering on September 14, with share prices popping nearly 25% on the first day of trading.
  • 2026-07-16 regulatory Arm CEO commented on US export restrictions for AI capable CPUs to China and highlighted complexity in enforcing potential bans.
  • 2026-07-16 partnership Arm is working with partners including TSMC, Oracle and Microsoft to secure key components across its supply chain for next generation chips.
  • 2026-07-16 product launch Arm CEO pointed to stronger demand for Arm's AGI CPU, with customers such as ByteDance and Oracle now using the product.
  • 2026-07-16 reported edge Taiwan Manufacturing → foundry source ↗
  • 2026-07-16 design-win Microsoft → ai_compute source ↗
  • 2026-07-13 financial Arm Holdings fell in the Nasdaq Composite Index on July 13.
  • 2026-07-09 financial Arm Holdings stock soared 224.4% in the first half of 2026, reaching a market cap of $350 billion as of July 9, 2026.
  • 2026-06-30 financial Arm Holdings stock soared 224.4% through the first half of 2026.
  • 2026-05-07 financial Arm Holdings reported fiscal Q4 revenue of $1.24 billion, up 34% year-over-year, with adjusted EPS of $0.55 versus $0.36 in the prior year.
  • 2026-05-06 financial Customer demand for Arm's AGI CPU across fiscal 2027 and fiscal 2028 exceeded $2 billion as of May 6, 2026, more than double the amount discussed at launch.
  • 2026-05-06 design-win → Amazon ai_chips source ↗
  • 2026-05-06 design-win → NVIDIA ai_chips source ↗
  • 2026-05-06 design-win → Microsoft ai_chips source ↗
  • 2026-05-06 design-win → Infineon ai_chips source ↗
  • 2026-03-31 financial Arm's fiscal 2026 revenue was up 23% year over year to $4.92 billion, comprising royalty revenue of $2.61 billion and licensing revenue of $2.31 billion.
  • 2026-03-31 product launch Arm's AGI CPU, developed with Meta Platforms as the lead partner, was launched in late March 2026 and designed for agentic AI data centers.
  • 2025-12-31 product launch Arm Holdings is set to launch AI chips by late 2025.
  • 2025-11-05 design-win → Samsung Electronics ai_chips source ↗
  • 2025-06-30 financial NVIDIA owned 1.1 million shares of Arm Holdings valued at $178.1 million at the end of Q2 2025.
  • 2025-06-09 other Arm Holdings CEO Rene Haas attended a White House roundtable on Trump's investment account initiative for newborn babies.
  • 2025-06-04 product launch Arm Holdings announced a major rebranding initiative retiring the Cortex brand and confirmed plans to enter the chip design space as a strategic pivot.
  • 2025-04-08 financial Arm Holdings stock more than doubled since the U.S.-Iran ceasefire agreement on April 8.
  • 2025-03-31 financial We delivered record royalty of $607 million this quarter.
  • 2025-03-31 partnership We signed a large multi-year agreement with the Malaysian government to accelerate the development of an Arm-based AI ecosystem in the country.
  • 2025-03-31 financial Licensing revenue hit an all-time high of $634 million.
  • 2025-03-31 financial For the full year, revenue topped $4 billion and royalty revenue surpassed $2 billion, also a first.
  • 2025-02-18 design-win Cadence Design → ai_chips source ↗

Patents — 49 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 39
Memory 7
Other 2
Semiconductors 1

Newest 28 of 49, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.0B '21
$2.7B '22
$2.7B '23
$3.2B '24
$4.0B '25
$4.9B '26

operating income

$242M '21
$633M '22
$671M '23
$111M '24
$831M '25
$900M '26

net income

$388M '21
$549M '22
$524M '23
$306M '24
$792M '25
$904M '26

Sources: ARM 20-F 2025-05-28 (acc 0001973239-25-000016) · ARM 20-F 2024-05-29 (acc 0001973239-24-000012) · ARM 20-F 2026-05-26 (acc 0001973239-26-000097)

Buys from ← 3

🇹🇼 Taiwan Manufacturing foundry L2
🇺🇸 Microsoft ai_compute L2
🇺🇸 Cadence Design ai_chips → Ethos L3 50

Supplies → 7

🇨🇳 AgiBot ai_chips L2 50
SoftBank ai_chips → Arm Holdings L3 50
🇺🇸 Amazon ai_chips → AWS Trainium L3 50
🇺🇸 NVIDIA ai_chips → Grace CPU L3 50
🇰🇷 Samsung Electronics ai_chips → Exynos AI L3 50
🇺🇸 Microsoft ai_chips → Microsoft Azure L3 50
🇩🇪 Infineon ai_chips → Power semiconductors L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

EthosNeonCortex-MSVE/SVE2ARM ISAMaliCortex-RCortex-A

ArterispublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: AIP · 29 sources · 10 products · 231 patents

$71Mrevenue · FY2025 · USD$1.4B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $32MFY2021: $38MFY2022: $50MFY2023: $54MFY2024: $58MFY2025: $71M wins 2024-11-05 · Synopsys → ai_chips — click for source2026-02-12 · → Intel ai_compute — click for source2026-02-12 · → NXP Semiconductors ai_compute — click for source2026-05-12 · Advanced Micro Devices → merchant_gpu — click for source2026-07-12 · → Samsung Electronics ai_compute — click for source2025-02-18 · → Infineon ai_compute — click for source2026-07-12 · → Texas Instruments ai_compute — click for source2026-07-12 · Cadence Design → ai_chips — click for source2025-08-05 · → Advanced Micro Devices ai_compute — click for source events 2026-03-31 · financial — Trailing 12-month royalties was $7.9 million, 67% higher year over year, setting a new record high.2026-03-31 · financial — We ended the quarter with $41.9 million in cash, cash equivalents and investments, and we have no financial debt.2026-03-31 · financial — Total revenue for the first quarter was $22.9 million up 39% year over year and above the top end of our guidance range.2026-03-31 · financial — At the end of the first quarter, ACV plus royalties was $92.8 million up 39% year over year. Above the top end of our guidance range and at a new record high.2026-03-31 · financial — Remaining Performance Obligations, or RPO, which is our contract future revenue at the end of the first quarter totaled $118 million, 33% higher year over year and another record high for Arteris.2026-03-31 · financial — 2026 was a robust quarter for Arteris, as we reached another record annual contract value plus royalties of 92.8 million representing a 39% year on year increase.2026-01-14 · M&A — On January 14, we closed the acquisition of Cycuity, a leading provider of semiconductor cybersecurity assurance products.2025-12-31 · financial — Remaining performance obligations, or RPO, which is our contracted future revenue at the end of the fourth quarter totaled $117 million, representing a 32% year-over-year increase.2025-12-31 · financial — In the fourth quarter of 2025, we achieved yet another record annual contract value plus royalties of $83.6 million, which represents a 28% year-on-year increase.2025-12-31 · financial — Total revenue for the fourth quarter was $20.1 million, up 16% sequentially and 30% year-over-year.2025-12-31 · financial — For the full year 2025, total revenue was $70.6 million, 22% higher year-over-year.2025-12-31 · financial — We ended the year with $59.5 million in cash, cash equivalents and investments, and we have no financial debt.2025-09-30 · partnership — NanoXplore, a provider of radiation hardened silicon technology serving the aerospace, defense, avionics and industrial markets, licensed FlexGen's Smart NoC IP to address the demanding mission-critical computing requirements in space.2025-09-30 · financial — Trailing 12-month variable royalties was 36% higher year-over-year.2025-09-30 · financial — Remaining performance obligations at the end of the third quarter was $104.7 million, representing a 34% year-over-year increase, a new high and exceeding the $100 million milestone for the first time.2025-09-30 · partnership — Arteris announced an expanded collaboration with Alibaba Damo Academy, enabling better integration and optimize performance between the RISC-V CPU cores and Arteris data movement system IPs.2025-09-30 · partnership — Altera selected Arteris technology portfolio to streamline design workflows, optimize data movement and enable intelligent computing across data center, communications, vision, industrial applications, robotics, aerospace and defense applications.2025-09-30 · supply deal — AMD licensed the Smart NoC IP to provide high-performance data transport in AI chiplets across AMD's broad portfolio from data centers to edge devices, and in the third quarter, AMD has ordered additional incremental licenses.2025-09-30 · financial — In the third quarter of 2025, Arteris achieved a record annual contract value plus royalties of $74.9 million, resulting in 24% year-over-year growth.2025-09-30 · partnership — Arteris joined the Ultra Accelerator Link Consortium, or UALink, with other companies including AMD, Astera Labs, AWS, Cisco, Google, HP Enterprise, Intel, Meta and Microsoft.2025-03-31 · financial — Remaining performance obligations, or RPO, at the end of the first quarter were $88.9 million, representing 19% year-over-year increase, once again, a new high for Arteris.2025-03-31 · financial — At the end of the first quarter, annual contract value or ACV plus royalties was $66.8 million, up 15% year-over-year, above the midpoint of our guidance range and a record high for the company.2025-03-31 · product launch — In the first quarter, Arteris also released the latest generation of Magillem register management automation software used for semiconductor hardware and software integration.2025-03-31 · financial — In the first quarter of 2025, we achieved another record annual contract value plus royalties of $66.8 million and generated $2.7 million in non-GAAP positive free cash flow.2025-01-01 · product launch — Moreover, I'm very excited to announce today our FlexGen Smart NoC IP, which has the potential to revolutionize semiconductor designs by delivering up to 10x engineering productivity and lowering power consumption and improving overall PPA.2024-12-31 · financial — Remaining performance obligations, or RPO, at the end of the fourth quarter were $88.4 million, representing 22% year-over-year increase and growing to the highest level we have ever reported.2024-12-31 · financial — In the fourth quarter of 2024 we achieved a record annual contract value plus royalties of $65.1 million as demand for commercial semiconductor system IP products continues to grow.2024-12-31 · product launch — In the fourth quarter over 75% of FlexNoC Interconnect IP customers chose this more advanced version which was introduced just 1.5 years ago.2024-10-01 · product launch — In October, we announced the addition of NoC Tiling supported by mesh and innovation in our IP products to accelerate the design of AI SoCs.2024-09-30 · financial — Remaining performance obligations, or RPO, at the end of the third quarter were $78.4 million, representing a 25% year-over-year increase.2024-09-30 · financial — We also delivered positive free cash flow of $1.1 million, making it our third consecutive quarter of positive free cash flow.2024-09-30 · financial — In the third quarter of 2024, we achieved a record annual contract value plus royalties of $60.5 million.2024-09-30 · financial — Annual contract value or ACV plus royalties was $60.5 million at the midpoint of our guidance range and a record high for the company.2024-06-30 · partnership — This was followed by an ecosystem partnership with ADAS Technology to support the growing adoption of RISC-V SoCs for AI, 5G, and other applications.2024-06-30 · financial — In the second quarter of 2024, we achieved record annual contract value plus royalties of $60.1 million.2024-06-30 · financial — We ended the quarter with $53.9 million in cash, cash equivalents and investments.2024-06-30 · financial — For the second consecutive quarter, we also delivered positive free cash flow.2024-06-30 · financial — In addition, in the second quarter, Arteris was included in the Russell 2000 Index.2024-06-30 · financial — We signed four new license deals with current customers who comprised of the world's top 30 technology companies.2024-06-30 · financial — We expanded our customer base in the second quarter with seven new customers licensing our Arteris system IP products.2024-06-30 · financial — During the quarter, we experienced steady design activity from our customers with 21 confirmed design starts.2024-06-30 · financial — Remaining performance obligations, or RPO, at the end of the second quarter was $77.5 million, representing a 19% year-over-year increase, also growing to the highest level we have ever reported.2024-03-01 · partnership — In March, we announced support for Armv9 processors with focus on automotive applications.2022-12-01 · M&A — Since the acquisition of Semifore in December 2022, we've seen a growing number of customers recognize the value of our hardware, software interface technology.
  • 2026-07-12 design-win → Samsung Electronics ai_compute source ↗
  • 2026-07-12 design-win → Texas Instruments ai_compute source ↗
  • 2026-07-12 design-win Cadence Design → ai_chips source ↗
  • 2026-05-12 design-win Advanced Micro Devices → merchant_gpu source ↗
  • 2026-03-31 financial Trailing 12-month royalties was $7.9 million, 67% higher year over year, setting a new record high.
  • 2026-03-31 financial We ended the quarter with $41.9 million in cash, cash equivalents and investments, and we have no financial debt.
  • 2026-03-31 financial Total revenue for the first quarter was $22.9 million up 39% year over year and above the top end of our guidance range.
  • 2026-03-31 financial At the end of the first quarter, ACV plus royalties was $92.8 million up 39% year over year. Above the top end of our guidance range and at a new record high.
  • 2026-03-31 financial Remaining Performance Obligations, or RPO, which is our contract future revenue at the end of the first quarter totaled $118 million, 33% higher year over year and another record high for Arteris.
  • 2026-03-31 financial 2026 was a robust quarter for Arteris, as we reached another record annual contract value plus royalties of 92.8 million representing a 39% year on year increase.
  • 2026-02-12 design-win → Intel ai_compute source ↗
  • 2026-02-12 design-win → NXP Semiconductors ai_compute source ↗
  • 2026-01-14 M&A On January 14, we closed the acquisition of Cycuity, a leading provider of semiconductor cybersecurity assurance products.
  • 2025-12-31 financial Remaining performance obligations, or RPO, which is our contracted future revenue at the end of the fourth quarter totaled $117 million, representing a 32% year-over-year increase.
  • 2025-12-31 financial In the fourth quarter of 2025, we achieved yet another record annual contract value plus royalties of $83.6 million, which represents a 28% year-on-year increase.
  • 2025-12-31 financial Total revenue for the fourth quarter was $20.1 million, up 16% sequentially and 30% year-over-year.
  • 2025-12-31 financial For the full year 2025, total revenue was $70.6 million, 22% higher year-over-year.
  • 2025-12-31 financial We ended the year with $59.5 million in cash, cash equivalents and investments, and we have no financial debt.
  • 2025-09-30 partnership NanoXplore, a provider of radiation hardened silicon technology serving the aerospace, defense, avionics and industrial markets, licensed FlexGen's Smart NoC IP to address the demanding mission-critical computing requirements in space.
  • 2025-09-30 financial Trailing 12-month variable royalties was 36% higher year-over-year.
  • 2025-09-30 financial Remaining performance obligations at the end of the third quarter was $104.7 million, representing a 34% year-over-year increase, a new high and exceeding the $100 million milestone for the first time.
  • 2025-09-30 partnership Arteris announced an expanded collaboration with Alibaba Damo Academy, enabling better integration and optimize performance between the RISC-V CPU cores and Arteris data movement system IPs.
  • 2025-09-30 partnership Altera selected Arteris technology portfolio to streamline design workflows, optimize data movement and enable intelligent computing across data center, communications, vision, industrial applications, robotics, aerospace and defense applications.
  • 2025-09-30 supply deal AMD licensed the Smart NoC IP to provide high-performance data transport in AI chiplets across AMD's broad portfolio from data centers to edge devices, and in the third quarter, AMD has ordered additional incremental licenses.
  • 2025-09-30 financial In the third quarter of 2025, Arteris achieved a record annual contract value plus royalties of $74.9 million, resulting in 24% year-over-year growth.
  • 2025-09-30 partnership Arteris joined the Ultra Accelerator Link Consortium, or UALink, with other companies including AMD, Astera Labs, AWS, Cisco, Google, HP Enterprise, Intel, Meta and Microsoft.
  • 2025-08-05 design-win → Advanced Micro Devices ai_compute source ↗
  • 2025-02-18 design-win → Infineon ai_compute source ↗
  • 2024-11-05 design-win Synopsys → ai_chips source ↗

Patents — 231 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 229
Memory 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$32M '20
$38M '21
$50M '22
$54M '23
$58M '24
$71M '25

operating income

$-4M '20
$-22M '21
$-29M '22
$-35M '23
$-32M '24
$-33M '25

net income

$-3M '20
$-23M '21
$-27M '22
$-37M '23
$-34M '24
$-35M '25

Buys from ← 3

🇺🇸 Synopsys ai_chips L2 50
🇺🇸 Advanced Micro Devices merchant_gpu L2 50
🇺🇸 Cadence Design ai_chips L2 50

Supplies → 6

🇺🇸 Intel ai_compute → Gaudi Accelerators L3 50
🇳🇱 NXP Semiconductors ai_compute → Neural Processing Units (NPUs) L3 50
🇰🇷 Samsung Electronics ai_compute L2 50
🇩🇪 Infineon ai_compute → Power semiconductors L3 50
🇺🇸 Texas Instruments ai_compute L2 50
🇺🇸 Advanced Micro Devices ai_compute → Instinct MI300X L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

SoC Integration AutomationNcoreNetwork-on-Chip (NoC) IPUCIe ControllersFlexNoCMemory ControllersBoW ControllersADAS Interconnect IPXSR ControllersCodaXpress

ASMLpublicProduct-grade

ai compute · 🇳🇱 Netherlands · AMS: ASML · 101 sources · 5 products · 89 patents

$37.5Brevenue · FY2025 · USD$687.9B mkt cap

EUV / High-NA lithography

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $16.0BFY2021: $21.3BFY2022: $24.2BFY2023: $29.8BFY2024: $32.3BFY2025: $37.5B wins 2026-06-30 · → Taiwan Manufacturing ai_chips — click for source2026-07-12 · → SK hynix ai_chips — click for source events 2026-07-15 · financial — ASML reported €9.3 billion in second-quarter net sales, net income of €2.9 billion, and raised full-year 2026 revenue guidance to €43-45 billion from €36-40 billion.2026-07-15 · product launch — Intel Foundry is using ASML High-NA EUV technology on the Intel 18A process node to produce a subset of its Intel Core Ultra Series 3 processors.2026-07-15 · capacity expansion — ASML announced plans to increase EUV lithography system production by 30% for 2027 and is investigating a further 30% increase for 2028, with similar expansion targets for deep ultraviolet immersion lithography.2026-07-15 · financial report — ASML reported Q2 2026 total net sales of €9.3 billion and net income of €2.9 billion, and increased its 2026 outlook to total net sales between €43 billion and €45 billion with gross margin between 54% and 56%.2026-03-31 · financial — ASML reported quarterly revenue of €8.77 billion and net profit of €2.76 billion for the quarter ending March 31, 2026, compared to €7.74 billion revenue and €2.36 billion net profit in the prior year.2025-12-31 · financial — EUV revenue grew 39% in 2025 compared to 2024.2025-12-31 · financial — ASML generated 32.7 billion euros (almost $37 billion) in net sales for full-year 2025, up 15% from the year before.2025-12-31 · financial — ASML's installed base business revenue reached EUR 8.2 billion in 2025, growing 26%.2025-12-31 · financial — ASML achieved EUR 32.7 billion in net revenue for full year 2025 with 52.8% gross margin.2025-07-16 · financial — With respect to installed base management, the upgrade business has been strong in the first half of the year as we completed most of the productivity upgrades on the NXE:3800E systems in the field to bring them to full specification.2025-07-16 · financial — We expect installed base management revenue to grow more than 20% over last year.2025-07-16 · financial — Net system sales were at EUR 5.6 billion, which includes EUR 2.7 billion from EUV sales and EUR 2.9 billion from non-EUV sales.2025-07-16 · financial — In the second quarter of 2025, total net sales were EUR 7.7 billion, which is at the upper end of our guidance, primarily due to revenue recognition of one High NA system and additional upgrade business.2025-07-16 · capacity expansion — We expect our advanced customers to add about 30% more EUV capacity compared to 2024.2025-07-16 · financial — Installed Base Management sales for the quarter came in above the guidance at EUR 2.1 billion.2025-07-16 · capacity expansion — The higher productivity of the NXE:3800E means that we can address that capacity increase with about the same number of systems as in 2024, but with higher ASP and improved gross margin.2025-07-16 · product launch — This quarter, we also shipped and commenced the install of the first EXE:5200B system, which is intended to support the High NA technology insertion into high-volume manufacturing.2025-07-16 · financial — In line with our 2024 Capital Market Day, we expect a 2030 revenue opportunity between EUR 44 billion and EUR 60 billion with gross margin expected between 56% and 60%.2025-07-16 · other — With respect to China business, revenue is expected to account for over 25% of total revenue this year, as it moderates to more closely represent its proportion of the backlog.2025-07-16 · financial — Gross margin for the quarter was above guidance at 53.7%, driven by an increase in upgrade business, one-off items resulting in lower cost and lower-than-expected impact from tariffs.2025-07-16 · financial — We ended Q2 at around EUR 33 billion backlog, with an adjustment of EUR 1.4 billion in Q2 related to customers' response to 2024 export restrictions.2025-07-16 · regulatory — The EUR 1.4 billion adjustment in the backlog is related to customers now in light of the export restrictions of last year making up their mind what they want to do and that has led to the debooking or the cancellation of orders for about EUR 1.4 billion.2025-07-16 · financial — Q2 net system bookings came in at EUR 5.5 billion, which is made up of EUR 2.3 billion of EUV and EUR 3.2 billion of non-EUV.2025-07-16 · financial — We now guide the full 2025 revenue to increase by around 15% with gross margin of around 52%.2025-01-29 · capacity expansion — ASML is preparing to build supply in anticipation of AI-driven customer capacity additions.2025-01-29 · financial — ASML 2025 guidance is €30 billion to €35 billion in revenue with gross margin between 51% and 53%.2024-12-31 · product launch — ASML shipped the NXT:2150i immersion DUV system capable of throughput over 310 wafers per hour.2024-12-31 · product launch — ASML shipped the first NXT:870B KrF system capable of throughput over 400 wafers per hour.2024-12-31 · financial — ASML reported full year 2024 net sales of €28.3 billion with gross margin of 51.3%.2024-12-31 · product launch — ASML demonstrated the NXE:3800E Low NA EUV system at full system specification with 220 wafers per hour throughput and record overlay performance.2024-12-31 · financial — ASML generated free cash flow of €9.1 billion in 2024.2024-12-31 · product launch — ASML recognized first revenue from eScan 1100 Multi-beam Inspection systems after completing customer evaluations.2024-12-31 · product launch — ASML completed installation and customer acceptance of two High NA EUV systems in Q4 2024.2024-12-31 · financial — ASML reported Q4 2024 total net sales of €9.3 billion with gross margin of 51.7%.2024-12-31 · financial — ASML ended Q4 2024 with net systems backlog of approximately €36 billion.2024-07-17 · financial — ASML confirms 2025 revenue guidance expected to be between EUR30 billion and EUR40 billion.2024-07-17 · financial — Net system sales of EUR4.8 billion in Q2 2024, made up of EUR1.5 billion of EUV sales and EUR3.3 billion of non-EUV sales.2024-07-17 · partnership — EUV customers are using ASML's High NA system in the joint ASML-imec demo lab in Veldhoven for their initial development.2024-07-17 · financial — Q2 net system bookings came in at EUR5.6 billion, which is made up of EUR2.5 billion of EUV bookings and EUR3.1 billion of non-EUV bookings.2024-07-17 · capacity expansion — ASML is driving towards the capacity of 600 deep EUV tools and 90 EUV tools, with additional expansion for High NA capacity towards 20 High NA tools medium term.2024-07-17 · financial — Total net sales came in at EUR6.2 billion in Q2 2024, which is just above guidance.2024-07-17 · product launch — ASML shipped the second High NA system this quarter, and it is currently under installation, with the first system shipped to a customer running qualification wafer.2024-07-17 · financial — At the end of Q2 2024, ASML finished with a backlog of around EUR39 billion.2024-07-17 · financial — ASML expects Q3 2024 total net sales to be between EUR6.7 billion and EUR7.3 billion.
  • 2026-07-15 financial ASML reported €9.3 billion in second-quarter net sales, net income of €2.9 billion, and raised full-year 2026 revenue guidance to €43-45 billion from €36-40 billion.
  • 2026-07-15 product launch Intel Foundry is using ASML High-NA EUV technology on the Intel 18A process node to produce a subset of its Intel Core Ultra Series 3 processors.
  • 2026-07-15 capacity expansion ASML announced plans to increase EUV lithography system production by 30% for 2027 and is investigating a further 30% increase for 2028, with similar expansion targets for deep ultraviolet immersion lithography.
  • 2026-07-15 financial report ASML reported Q2 2026 total net sales of €9.3 billion and net income of €2.9 billion, and increased its 2026 outlook to total net sales between €43 billion and €45 billion with gross margin between 54% and 56%.
  • 2026-07-12 design-win → SK hynix ai_chips source ↗
  • 2026-06-30 design-win → Taiwan Manufacturing ai_chips source ↗
  • 2026-03-31 financial ASML reported quarterly revenue of €8.77 billion and net profit of €2.76 billion for the quarter ending March 31, 2026, compared to €7.74 billion revenue and €2.36 billion net profit in the prior year.
  • 2025-12-31 financial EUV revenue grew 39% in 2025 compared to 2024.
  • 2025-12-31 financial ASML generated 32.7 billion euros (almost $37 billion) in net sales for full-year 2025, up 15% from the year before.
  • 2025-12-31 financial ASML's installed base business revenue reached EUR 8.2 billion in 2025, growing 26%.
  • 2025-12-31 financial ASML achieved EUR 32.7 billion in net revenue for full year 2025 with 52.8% gross margin.
  • 2025-07-16 financial With respect to installed base management, the upgrade business has been strong in the first half of the year as we completed most of the productivity upgrades on the NXE:3800E systems in the field to bring them to full specification.
  • 2025-07-16 financial We expect installed base management revenue to grow more than 20% over last year.
  • 2025-07-16 financial Net system sales were at EUR 5.6 billion, which includes EUR 2.7 billion from EUV sales and EUR 2.9 billion from non-EUV sales.
  • 2025-07-16 financial In the second quarter of 2025, total net sales were EUR 7.7 billion, which is at the upper end of our guidance, primarily due to revenue recognition of one High NA system and additional upgrade business.
  • 2025-07-16 capacity expansion We expect our advanced customers to add about 30% more EUV capacity compared to 2024.
  • 2025-07-16 financial Installed Base Management sales for the quarter came in above the guidance at EUR 2.1 billion.
  • 2025-07-16 capacity expansion The higher productivity of the NXE:3800E means that we can address that capacity increase with about the same number of systems as in 2024, but with higher ASP and improved gross margin.
  • 2025-07-16 product launch This quarter, we also shipped and commenced the install of the first EXE:5200B system, which is intended to support the High NA technology insertion into high-volume manufacturing.
  • 2025-07-16 financial In line with our 2024 Capital Market Day, we expect a 2030 revenue opportunity between EUR 44 billion and EUR 60 billion with gross margin expected between 56% and 60%.
  • 2025-07-16 other With respect to China business, revenue is expected to account for over 25% of total revenue this year, as it moderates to more closely represent its proportion of the backlog.
  • 2025-07-16 financial Gross margin for the quarter was above guidance at 53.7%, driven by an increase in upgrade business, one-off items resulting in lower cost and lower-than-expected impact from tariffs.

Patents — 89 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 58
Computing 14
Other 11
Memory 6

Newest 20 of 89, most recent first — all on Google Patents →

  • 2026-07-02WO2026139198COMPUTATIONAL LITHOGRAPHY SIMULATION USING A MULTI-CHANNEL PHYSICS-INFORMED NEURAL NETWORK FOR A 3D MASK
  • 2025-11-13WO2025233065SEMICONDUCTOR BONDING DISTORTION ADJUSTMENT SYSTEMS AND METHODS
  • 2025-11-13WO2025233066SEMICONDUCTOR BONDING SUBSTRATE HOLDING SYSTEMS AND METHODS
  • 2025-11-13WO2025233088SEMICONDUCTOR BONDING ALIGNMENT SYSTEMS AND METHODS
  • 2025-06-26WO2025131543SENSOR AND METHOD FOR QUALIFICATION OF A TOPOGRAPHY OF A SURFACE OF A DIE FOR DIE BONDING
  • 2025-06-26WO2025131545APPARATUS AND METHOD FOR MULTI-STAGE DIE BONDING
  • 2025-06-26WO2025131758SYSTEM AND METHOD FOR DIE BONDING WITH RADIATION RELEASE
  • 2024-12-05WO2024245688METHOD AND SYSTEM FOR PREDICTING AFTER-DEVELOPMENT STOCHASTIC EFFECTS FOR FULL CHIP APPLICATIONS
  • 2024-02-01WO2024022854TRAINING A MACHINE LEARNING MODEL TO GENERATE MRC AND PROCESS AWARE MASK PATTERN
  • 2023-10-05WO2023186441DATA RETRIEVAL
  • 2023-08-17WO2023151919ACTIVE LEARNING TO IMPROVE WAFER DEFECT CLASSIFICATION
  • 2023-06-22WO2023110285METHOD AND SYSTEM OF DEFECT DETECTION FOR INSPECTION SAMPLE BASED ON MACHINE LEARNING MODEL
  • 2023-05-25WO2023088641SIMULATION MODEL STABILITY DETERMINATION METHOD
  • 2023-04-27WO2023066657PATTERN MATCHING METHOD
  • 2023-03-30WO2023046385PATTERN SELECTION SYSTEMS AND METHODS
  • 2023-03-16WO2023036526A METHOD OF MONITORING A LITHOGRAPHIC PROCESS AND ASSOCIATED APPARATUSES
  • 2023-01-26WO2023001463METHODS AND COMPUTER PROGRAMS FOR DATA MAPPING FOR LOW DIMENSIONAL DATA ANALYSIS
  • 2022-11-10WO2022233591SYSTEM AND METHOD FOR DISTRIBUTED IMAGE RECORDING AND STORAGE FOR CHARGED PARTICLE SYSTEMS
  • 2022-11-03WO2022229312HIERARCHICAL CLUSTERING OF FOURIER TRANSFORM BASED LAYOUT PATTERNS
  • 2022-09-09WO2022184578CONFIGURATION OF PATTERNING PROCESS

Financials — multi-year, confidence 1.0 (filings)

revenue

$12.9B '18
$13.2B '19
$16.0B '20
$21.3B '21
$24.2B '22
$29.8B '23
$32.3B '24
$37.5B '25

operating income

$3.5B '18
$3.1B '19
$4.6B '20
$7.7B '21
$7.4B '22
$10.3B '23
$10.3B '24
$12.9B '25

net income

$3.1B '18
$2.9B '19
$4.1B '20
$6.7B '21
$6.4B '22
$9.0B '23
$8.7B '24
$11.0B '25

Sources: ASML 20-F 2023-02-15 (acc 0000937966-23-000014) · ASML 20-F 2026-02-25 (acc 0001628280-26-011378) · ASML 20-F 2025-03-05 (acc 0000937966-25-000009) · ASML 20-F 2024-02-14 (acc 0000937966-24-000008)

Supplies → 4

🇮🇳 Tata Electronics ai_chips L2 50
🇺🇸 Intel ai_chips → Gaudi Accelerators L3 50
🇹🇼 Taiwan Manufacturing ai_chips → N3 L3 50
🇰🇷 SK hynix ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

High-NA EUV systems (NXE:3400B)EUV lithography systems (NXE series)DUV lithography systems (Twinscan series)Inspection and metrology systemsArF immersion systems

Astera LabspublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: ALAB · 53 sources · 6 products · 58 patents

$853Mrevenue · FY2025 · USD$54.8B mkt cap

PCIe/CXL connectivity

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202220232024202520262027 rev FY2022: $80MFY2023: $116MFY2024: $396MFY2025: $853M wins 2025-02-10 · Micron → hbm — click for source2026-05-05 · → NVIDIA switch_silicon — click for source2025-08-05 · → Advanced Micro Devices switch_silicon — click for source2026-05-05 · → Microsoft switch_silicon — click for source2026-02-10 · → Amazon switch_silicon — click for source events 2026-03-31 · financial — Revenue for Q1 2026 was $308 million, up 14% from the prior quarter and up 93% versus Q1 of last year.2026-03-02 · executive change — Desmond Lynch will join Astera Labs as the new CFO effective March 2.2025-12-31 · financial — For full year 2025, revenue was $852.5 million, up 115% versus the prior year.2024-12-31 · capacity expansion — Astera Labs increased headcount in 2024 by nearly 80% to 440 full-time employees.2024-12-31 · financial — Full year 2024 revenue was $396 million, up 242% year-over-year.2024-10-01 · partnership — Astera Labs has joined the Ultra Accelerator Link, UALink Consortium as a promoting member on the Board of Directors, along with industry-leading hyperscalers and AI platform providers.2024-10-01 · product launch — Astera Labs announced its fourth product line, the Scorpio Smart Fabric Switch family, which expands its mission of solving increasingly complex connectivity challenges within AI infrastructure.2024-09-30 · capacity expansion — Non-GAAP operating expenses for Q3 were $51.2 million, up from $41.1 million in the previous quarter, driven by greater-than-expected hiring conversion during the quarter as we aggressively pushed to support additional commercial opportunities.2024-09-30 · financial — Astera Labs delivered record quarterly revenue of $113.1 million in Q3 2024, up 47% versus the previous quarter and 206% higher than Q3 2023.2024-06-30 · product launch — We have started shipping initial quantities of preproduction orders of our PCIe Gen 6 solution, Aries 6.2024-06-30 · financial — Non-GAAP operating margin was 24.4%, and we delivered $0.13 of non-GAAP diluted earnings per share.2024-06-30 · capacity expansion — During the quarter, we expanded our Cloud-Scale Interop Lab to Taiwan and announced the opening of a new R&D center in India.2024-06-30 · financial — Revenue in Q2 was $76.9 million up 18% from the previous quarter and up 619% from the same period in 2023.2024-06-30 · product launch — Our 400-gig Taurus Ethernet SCMs have shifted into volume production, with an expected ramp through the back half of 2024.2024-06-30 · executive change — We also announced the appointment of Bethany Mayer to our Board of Directors, bringing additional strategic leadership to the company.2024-06-30 · product launch — In June, we announced the industry's first demonstration of end-to-end PCIe optical connectivity to provide unprecedented reach for larger GPU clusters.2024-06-30 · financial — Operating cash flow generation was also strong during the quarter, coming in at $29.8 million.
  • 2026-05-05 design-win → NVIDIA switch_silicon source ↗
  • 2026-05-05 design-win → Microsoft switch_silicon source ↗
  • 2026-03-31 financial Revenue for Q1 2026 was $308 million, up 14% from the prior quarter and up 93% versus Q1 of last year.
  • 2026-03-02 executive change Desmond Lynch will join Astera Labs as the new CFO effective March 2.
  • 2026-02-10 design-win → Amazon switch_silicon source ↗
  • 2025-12-31 financial For full year 2025, revenue was $852.5 million, up 115% versus the prior year.
  • 2025-08-05 design-win → Advanced Micro Devices switch_silicon source ↗
  • 2025-02-10 design-win Micron → hbm source ↗
  • 2024-12-31 capacity expansion Astera Labs increased headcount in 2024 by nearly 80% to 440 full-time employees.
  • 2024-12-31 financial Full year 2024 revenue was $396 million, up 242% year-over-year.
  • 2024-10-01 partnership Astera Labs has joined the Ultra Accelerator Link, UALink Consortium as a promoting member on the Board of Directors, along with industry-leading hyperscalers and AI platform providers.
  • 2024-10-01 product launch Astera Labs announced its fourth product line, the Scorpio Smart Fabric Switch family, which expands its mission of solving increasingly complex connectivity challenges within AI infrastructure.
  • 2024-09-30 capacity expansion Non-GAAP operating expenses for Q3 were $51.2 million, up from $41.1 million in the previous quarter, driven by greater-than-expected hiring conversion during the quarter as we aggressively pushed to support additional commercial opportunities.
  • 2024-09-30 financial Astera Labs delivered record quarterly revenue of $113.1 million in Q3 2024, up 47% versus the previous quarter and 206% higher than Q3 2023.
  • 2024-06-30 product launch We have started shipping initial quantities of preproduction orders of our PCIe Gen 6 solution, Aries 6.
  • 2024-06-30 financial Non-GAAP operating margin was 24.4%, and we delivered $0.13 of non-GAAP diluted earnings per share.
  • 2024-06-30 capacity expansion During the quarter, we expanded our Cloud-Scale Interop Lab to Taiwan and announced the opening of a new R&D center in India.
  • 2024-06-30 financial Revenue in Q2 was $76.9 million up 18% from the previous quarter and up 619% from the same period in 2023.
  • 2024-06-30 product launch Our 400-gig Taurus Ethernet SCMs have shifted into volume production, with an expected ramp through the back half of 2024.
  • 2024-06-30 executive change We also announced the appointment of Bethany Mayer to our Board of Directors, bringing additional strategic leadership to the company.
  • 2024-06-30 product launch In June, we announced the industry's first demonstration of end-to-end PCIe optical connectivity to provide unprecedented reach for larger GPU clusters.
  • 2024-06-30 financial Operating cash flow generation was also strong during the quarter, coming in at $29.8 million.

Patents — 58 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 36
Other 17
Memory 3
Semiconductors 2

Newest 3 of 58, most recent first — all on Google Patents →

  • 2025-12-18US2025385452PLUGGABLE RETIMER MODULE
  • 2025-12-04US2025370930METADATA-CACHING INTEGRATED CIRCUIT DEVICE
  • 2024-10-03US2024329854SSD-form-factor memory-expansion cartridge with field-replaceable DRAM modules

Buys from ← 2

🇺🇸 Micron hbm L2 50
🇺🇸 Amkor osat L2 50

Supplies → 5

🇺🇸 NVIDIA switch_silicon → NVIDIA B200 L3 50
🇺🇸 NVIDIA switch_silicon → NVIDIA B200 L3 50
🇺🇸 Advanced Micro Devices switch_silicon → Instinct MI300X L3 50
🇺🇸 Microsoft switch_silicon → Microsoft Azure L3 50
🇺🇸 Amazon switch_silicon → AWS Trainium L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Scorpio Smart Fabric SwitchesAries PCIe/CXL Smart DSP RetimersAries PCIe/CXL Smart Cable ModulesLeo CXL Memory Connectivity ControllersCOSMOSTaurus Ethernet Smart Cable Modules

AT&SpublicProduct-grade

ai compute · 🇦🇹 Austria · VIE: ATS · 87 sources · 5 products · 22 patents

$2.0Brevenue · FY2026 · USD$7.0B mkt cap

IC substrates, PCB

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $1.4BFY2022: $1.8BFY2023: $2.0BFY2024: $1.8BFY2025: $1.8BFY2026: $2.0B wins 2023-11-07 · → Advanced Micro Devices advanced_packaging — click for source2025-04-08 · → Intel advanced_packaging — click for source events
  • 2025-04-08 design-win → Intel advanced_packaging source ↗
  • 2023-11-07 design-win → Advanced Micro Devices advanced_packaging source ↗

Patents — 22 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 16
Computing 3
Semiconductors 2
Robotics / manipulators 1

Newest 1 of 22, most recent first — all on Google Patents →

  • 2024-05-23WO2024104845COMPONENT CARRIER WITH MUTUALLY OFFSET ROWS OF EQUIDISTANT WIRING ELEMENTS

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.4B '21
$1.8B '22
$2.0B '23
$1.8B '24
$1.8B '25
$2.0B '26

operating income

$91M '21
$145M '22
$167M '23
$36M '24
$317M '25
$53M '26

net income

$45M '21
$118M '22
$156M '23
$-42M '24
$103M '25
$-29M '26

Supplies → 2

🇺🇸 Advanced Micro Devices advanced_packaging → Instinct MI300X L3 50
🇺🇸 Intel advanced_packaging → Xeon Processors L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

IC SubstratesHDI PCBsBuild-up TechnologyChip-on-Board (COB)Advanced Packaging Solutions

BroadcompublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: AVGO · 158 sources · 14 products · 34 patents

$63.9Brevenue · FY2025 · USD$1.78T mkt cap

Custom AI ASIC co-design; networking

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $23.9BFY2021: $27.4BFY2022: $33.2BFY2023: $35.8BFY2024: $51.6BFY2025: $63.9B wins 2026-07-11 · → Hewlett Packard Enterprise custom_asic — click for source2026-06-25 · → Microsoft custom_asic — click for source2026-06-25 · → Amazon custom_asic — click for source2026-04-18 · → Zhongji InnoLight custom_asic — click for source2025-07-29 · Corning → advanced_packaging — click for source events 2026-07-17 · financial — Broadcom stock plunged approximately 5% during Thursday's market selloff in AI chip-related stocks.2026-07-16 · financial — Broadcom stock is down 3% to $381 on July 16, 2026, and has gained 10% year-to-date.2026-07-16 · financial — Broadcom shares fell 4.6% in afternoon trading session.2026-07-13 · financial — Broadcom declined in the Nasdaq Composite Index on July 13.2026-07-08 · capacity expansion — Broadcom will receive $1.5 billion investment in its manufacturing facility in Fort Collins, Colorado.2026-07-08 · partnership — Broadcom confirmed an expanded, multi-year partnership with Apple exceeding $30 billion for custom silicon components and wireless technologies through 2031.2026-07-08 · capacity expansion — Broadcom will invest $1.5 billion to expand its production facility in Fort Collins, Colorado as part of the Apple supply agreement.2026-07-08 · supply deal — Broadcom extended its Apple supplier contract to 2031, including a deal to develop custom chips for future Apple products.2026-07-07 · financial — Broadcom benefits from highly lucrative custom silicon networking contracts and absorbed significant collateral damage from the semiconductor sector sell-off.2026-07-06 · other — Broadcom Inc. and Apple Inc. agreed to expand their technology collaboration through 2031 by entering into new multi-year long-term agreements for Broadcom to develop and supply custom ASIC silicon products for multiple generations of Apple products.2026-07-06 · supply deal — Broadcom extended its silicon supply partnership with Apple through 2031, securing a long-term agreement for custom ASIC chip development and supply.2026-06-30 · litigation — G98 Networks LLC sues Broadcom Inc. for patent infringement regarding 830 Patent.2026-06-25 · product launch — Broadcom and OpenAI unveiled their custom AI inference chip named 'Jalapeño,' designed to match NVIDIA's Blackwell and Google's TPUs in speed and efficiency.2026-06-18 · financial — Broadcom is positioned to benefit from the AI capex supercycle with strong earnings growth from hyperscaler spending.2026-06-12 · executive change — Kirsten Spears, Chief Financial Officer, will be retiring June 12, with Amie Thuener as incoming Chief Financial Officer.2026-06-10 · financial — Broadcom slid 5.12 percent in US trading amid concerns over an AI bubble.2026-06-10 · financial — Broadcom lost 1.12 percent on disappointing earnings forecast.2026-06-05 · financial — Broadcom tumbled more than 12 percent after the US chipmaker's quarterly results and outlook for AI-related revenue fell short of investors' expectations.2026-04-01 · partnership — In April, Broadcom entered into a long-term agreement with Google to develop and supply multiple generations of TPUs and AI networking.2026-04-01 · partnership — In April, Broadcom announced a partnership with Meta to deliver multiple generations of MTIA XPUs with expected deployment of 3 gigawatts through the end of 2028.2026-04-01 · partnership — For Anthropic, Broadcom is providing access to Broadcom TPU-based compute of over 1 gigawatt in 2026 and entered into an agreement for another 5 gigawatts of next-generation TPU-based compute beginning in 2027.2024-06-03 · financial — Broadcom's stock declined 22% post-earnings on June 3 and ended at $411 by Thursday.2022-12-21 · other — Broadcom (CA Technologies) is analyzed as a company in the IoT Security and Privacy market report.
  • 2026-07-17 financial Broadcom stock plunged approximately 5% during Thursday's market selloff in AI chip-related stocks.
  • 2026-07-16 financial Broadcom stock is down 3% to $381 on July 16, 2026, and has gained 10% year-to-date.
  • 2026-07-16 financial Broadcom shares fell 4.6% in afternoon trading session.
  • 2026-07-13 financial Broadcom declined in the Nasdaq Composite Index on July 13.
  • 2026-07-11 design-win → Hewlett Packard Enterprise custom_asic source ↗
  • 2026-07-08 capacity expansion Broadcom will receive $1.5 billion investment in its manufacturing facility in Fort Collins, Colorado.
  • 2026-07-08 partnership Broadcom confirmed an expanded, multi-year partnership with Apple exceeding $30 billion for custom silicon components and wireless technologies through 2031.
  • 2026-07-08 capacity expansion Broadcom will invest $1.5 billion to expand its production facility in Fort Collins, Colorado as part of the Apple supply agreement.
  • 2026-07-08 supply deal Broadcom extended its Apple supplier contract to 2031, including a deal to develop custom chips for future Apple products.
  • 2026-07-07 financial Broadcom benefits from highly lucrative custom silicon networking contracts and absorbed significant collateral damage from the semiconductor sector sell-off.
  • 2026-07-06 other Broadcom Inc. and Apple Inc. agreed to expand their technology collaboration through 2031 by entering into new multi-year long-term agreements for Broadcom to develop and supply custom ASIC silicon products for multiple generations of Apple products.
  • 2026-07-06 supply deal Broadcom extended its silicon supply partnership with Apple through 2031, securing a long-term agreement for custom ASIC chip development and supply.
  • 2026-06-30 litigation G98 Networks LLC sues Broadcom Inc. for patent infringement regarding 830 Patent.
  • 2026-06-25 product launch Broadcom and OpenAI unveiled their custom AI inference chip named 'Jalapeño,' designed to match NVIDIA's Blackwell and Google's TPUs in speed and efficiency.
  • 2026-06-25 design-win → Microsoft custom_asic source ↗
  • 2026-06-25 design-win → Amazon custom_asic source ↗
  • 2026-06-18 financial Broadcom is positioned to benefit from the AI capex supercycle with strong earnings growth from hyperscaler spending.
  • 2026-06-12 executive change Kirsten Spears, Chief Financial Officer, will be retiring June 12, with Amie Thuener as incoming Chief Financial Officer.
  • 2026-06-10 financial Broadcom slid 5.12 percent in US trading amid concerns over an AI bubble.
  • 2026-06-10 financial Broadcom lost 1.12 percent on disappointing earnings forecast.
  • 2026-06-05 financial Broadcom tumbled more than 12 percent after the US chipmaker's quarterly results and outlook for AI-related revenue fell short of investors' expectations.
  • 2026-04-18 design-win → Zhongji InnoLight custom_asic source ↗
  • 2026-04-01 partnership In April, Broadcom entered into a long-term agreement with Google to develop and supply multiple generations of TPUs and AI networking.
  • 2026-04-01 partnership In April, Broadcom announced a partnership with Meta to deliver multiple generations of MTIA XPUs with expected deployment of 3 gigawatts through the end of 2028.
  • 2025-07-29 design-win Corning → advanced_packaging source ↗

Patents — 34 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 28
Computing 2
Semiconductors 2
Imaging / cameras 1
Memory 1

Newest 2 of 34, most recent first — all on Google Patents →

  • 2017-05-23US9659624Method for sense reference generation for MTJ based memories
  • 2016-09-27US9455598Programmable micro-core processors for packet parsing

Financials — multi-year, confidence 1.0 (filings)

revenue

$23.9B '20
$27.4B '21
$33.2B '22
$35.8B '23
$51.6B '24
$63.9B '25

operating income

$4.0B '20
$8.5B '21
$14.2B '22
$16.2B '23
$13.5B '24
$25.5B '25

net income

$3.0B '20
$6.7B '21
$11.5B '22
$14.1B '23
$5.9B '24
$23.1B '25

Sources: AVGO 10-Q 2023-09-06 (acc 0001730168-23-000077) · AVGO 10-Q 2024-03-14 (acc 0001730168-24-000023) · AVGO 10-Q 2025-06-11 (acc 0001730168-25-000064) · AVGO 10-Q 2025-09-10 (acc 0001730168-25-000098) · AVGO 10-K 2025-12-18 (acc 0001730168-25-000121) · AVGO 10-Q 2026-03-11 (acc 0001730168-26-000016) · AVGO 8-K 2026-07-06 (acc 0001193125-26-295589) · G98 Networks LLC v. Broadcom Inc. — District Court, W.D. T… · AVGO 10-Q 2024-06-13 (acc 0001730168-24-000080) · AVGO 10-Q 2023-06-07 (acc 0001730168-23-000064)

Buys from ← 1

🇺🇸 Corning advanced_packaging L2 50

Supplies → 5

🇺🇸 Hewlett Packard Enterprise custom_asic L2 50
🇨🇳 Eoptolink custom_asic L2 50
🇺🇸 Microsoft custom_asic → Microsoft Azure L3 50
🇺🇸 Amazon custom_asic → AWS Trainium L3 50
🇨🇳 Zhongji InnoLight custom_asic L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

XPU-based racks and systemsCustom Accelerators / XPUsCustom ASICsEthernet Switching & RoutingCustom Silicon Solutions / ASICsEthernet NICs (Network Interface Cards)Physical layer devices (PHYs)Racks and SystemsCustom Silicon Solutions / XPUsEthernet Network Interface Cards (NICs)Custom accelerators (XPUs)Ethernet Switching & Routing siliconNetwork Interface Cards (NICs)Optical components

BYDpublicProduct-grade

physical ai · 🇨🇳 China · SZSE: 002594 · 95 sources · 8 products · 2025 patents

$117.4Brevenue · FY2025 · USD$125.3B mkt cap

Blade batteries; also EV

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $23.1BFY2021: $31.9BFY2022: $62.7BFY2023: $88.6BFY2024: $114.6BFY2025: $117.4B wins 2024-01-12 · Ningbo Yunsheng → rare_earth_magnets — click for source2026-03-05 · RoboSense → vision — click for source2024-08-06 · Estun Automation → industrial_arm — click for source2026-03-24 · Hesai → vision — click for source2025-09-18 · JL MAG Rare-Earth → rare_earth_magnets — click for source2025-10-30 · Aptiv → physical_ai — click for source2022-12-13 · Zhongke Sanhuan → rare_earth_magnets — click for source2025-04-16 · Samsung Electro-Mechanics → advanced_packaging — click for source2022-03-24 · → Einride batteries — click for source events 2027-01-01 · regulatory — The US Defense Department placed BYD under a battery-procurement restriction that bars the Pentagon from buying its batteries, effective in 2027.2026-06-08 · regulatory — Pentagon designated BYD, China's top electric-vehicle company, as supporting the Chinese military on the 1260H list.
  • 2027-01-01 regulatory The US Defense Department placed BYD under a battery-procurement restriction that bars the Pentagon from buying its batteries, effective in 2027.
  • 2026-06-08 regulatory Pentagon designated BYD, China's top electric-vehicle company, as supporting the Chinese military on the 1260H list.
  • 2026-03-24 design-win Hesai → vision source ↗
  • 2026-03-05 design-win RoboSense → vision source ↗
  • 2025-10-30 design-win Aptiv → physical_ai source ↗
  • 2025-09-18 design-win JL MAG Rare-Earth → rare_earth_magnets source ↗
  • 2025-04-16 design-win Samsung Electro-Mechanics → advanced_packaging source ↗
  • 2024-08-06 design-win Estun Automation → industrial_arm source ↗
  • 2024-01-12 design-win Ningbo Yunsheng → rare_earth_magnets source ↗
  • 2022-12-13 design-win Zhongke Sanhuan → rare_earth_magnets source ↗
  • 2022-03-24 design-win → Einride batteries source ↗

Patents — 2025 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 1449
Electric motors 279
Power electronics 98
Gears / reducers 62
Imaging / cameras 35
Lidar / ranging 31
Other 22
IMU / navigation 14
Bearings 10
Force / torque sensors 10
Computing 9
Robotics / manipulators 6

Newest 15 of 2025, most recent first — all on Google Patents →

  • 2026-06-18WO2026123223ACTUATOR, SUSPENSION SYSTEM, AND VEHICLE
  • 2026-06-04WO2026113408ROTOR, ELECTRIC MOTOR, DRIVE ASSEMBLY AND VEHICLE
  • 2026-06-04WO2026113855ELECTRIC MOTOR, SUSPENSION ASSEMBLY AND VEHICLE
  • 2026-06-04WO2026114191SECONDARY ASSEMBLY AND MACHINING METHOD THEREFOR, MOTOR, SUSPENSION ASSEMBLY, AND VEHICLE
  • 2026-06-04WO2026114222STATOR CORE, STATOR, ELECTRIC MOTOR, POWERTRAIN, AND VEHICLE
  • 2026-06-04WO2026114225STATOR LAMINATION, STATOR CORE, STATOR, ELECTRIC MOTOR, POWERTRAIN, AND VEHICLE
  • 2026-06-04WO2026114243ROTOR CORE, ROTOR, ELECTRIC MOTOR, POWERTRAIN AND VEHICLE
  • 2026-05-21WO2026103135ELECTRIC MOTOR, SUSPENSION SYSTEM AND VEHICLE
  • 2026-05-21WO2026103522STATOR, MOTOR, AND VEHICLE
  • 2026-05-07WO2026092145STATOR COOLING STRUCTURE, MOTOR AND VEHICLE
  • 2026-05-07WO2026092245LIDAR AND ASSEMBLY METHOD THEREFOR, LIDAR ELECTRIC MOTOR, MOBILE PLATFORM, AND VEHICLE
  • 2026-04-30WO2026086520STATOR CORE AND MOUNTING METHOD THEREFOR, MOTOR, ACTUATOR, SUSPENSION SYSTEM, AND VEHICLE
  • 2026-04-30WO2026086627ROTOR, ELECTRIC MOTOR, POWERTRAIN AND VEHICLE
  • 2026-03-05WO2026046205ROTOR, PERMANENT MAGNET ELECTRIC MOTOR, POWERTRAIN AND VEHICLE
  • 2026-02-26WO2026040474IRON CORE, MAGNETIC ASSEMBLY, STATOR ASSEMBLY, LINEAR MOTOR, SUSPENSION STRUCTURE, AND VEHICLE

Financials — multi-year, confidence 1.0 (filings)

revenue

$19.7B '18
$18.5B '19
$23.1B '20
$31.9B '21
$62.7B '22
$88.6B '23
$114.6B '24
$117.4B '25

operating income

$642M '18
$335M '19
$1.0B '20
$683M '21
$3.2B '22
$5.6B '23
$7.4B '24
$3.3B '25

net income

$421M '18
$234M '19
$614M '20
$449M '21
$2.5B '22
$4.4B '23
$5.9B '24
$4.8B '25

Buys from ← 10

🇨🇳 Ningbo Yunsheng rare_earth_magnets L2 50
🇨🇳 RoboSense vision L2 50
🇨🇳 Estun Automation industrial_arm L2 50
🇨🇳 Hesai vision L2 50
🇨🇳 JL MAG Rare-Earth rare_earth_magnets L2 50
🇨🇳 Dobot industrial_arm L2 50
🇨🇳 PaXini Tech physical_ai L2 50
🇮🇪 Aptiv physical_ai L2 50
🇨🇳 Zhongke Sanhuan rare_earth_magnets L2 50
🇰🇷 Samsung Electro-Mechanics advanced_packaging L2 50

Supplies → 1

🇸🇪 Einride batteries → T-pod L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

TangBlade Battery (LFP)SongQinHan EVBYD Battery-BoxYuan PlusAtto 3 (Yuan Plus)

Cadence Design SystemspublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: CDNS · 72 sources · 10 products · 531 patents

$5.3Brevenue · FY2025 · USD$100.6B mkt cap

EDA suite, IP

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $2.7BFY2021: $2.7BFY2022: $3.0BFY2023: $4.1BFY2024: $4.6BFY2025: $5.3B wins 2024-07-22 · Advanced Micro Devices → merchant_gpu — click for source2025-10-27 · → Samsung Electronics ai_chips — click for source2025-10-27 · Taiwan Manufacturing → foundry — click for source2025-02-18 · → GlobalFoundries ai_chips — click for source2025-10-27 · → Infineon ai_chips — click for source2025-02-18 · → Arm ai_chips — click for source2025-07-28 · → SK hynix ai_chips — click for source2025-02-18 · → Marvell ai_chips — click for source2026-07-12 · → Arteris ai_chips — click for source2025-05-01 · → NVIDIA ai_chips — click for source events 2026-06-16 · partnership — Cadence announced an expanded collaboration with Hewlett Packard Enterprise to accelerate data center modernization through digital twin technology.2026-06-12 · financial — Cadence Design Systems has a gross margin of 87.1% and a free cash flow margin of 25.9%, trading at $387 per share or 16.6x forward price-to-sales.2026-06-09 · partnership — Cadence Design Systems announced a multi-year Design Technology Co-Optimization partnership with Intel Foundry aimed at Intel 14A.2026-06-09 · partnership — Cadence Design Systems announced a Design Technology Co-Optimization collaboration with Intel Foundry on a multiyear project targeting Intel 14A process node.2026-06-09 · financial — Stifel increased its price target for Cadence Design Systems from $395 to $432 and maintained its Buy rating.2026-06-08 · partnership — Cadence announced an expanded multi-year partnership with Intel Foundry focused on Design Technology Co-Optimization (DTCO) for Intel's upcoming process nodes beginning with Intel 14A.2026-06-01 · product launch — Cadence Design Systems launched the first fully autonomous virtual engineer for semiconductor development at Computex 2026, running in NVIDIA OpenShell runtime environment.2026-05-31 · product launch — Cadence is using NVIDIA OpenShell to secure its ChipStack AI Super Agent, a fully autonomous AI engineer that executes chip design and verification.2026-04-27 · financial — Cadence reported Q1 fiscal 2026 revenue of $1.47 billion, up 19% year-over-year, exceeding analyst forecasts of $1.45 billion.2026-04-27 · financial — Cadence reported non-GAAP earnings per share of $1.96 in Q1 fiscal 2026, up 25% year-over-year, ahead of consensus estimate of $1.89.2026-02-23 · financial — Jim Cramer recommended Cadence Design Systems as a hold with a buy recommendation if the stock price declines, praising the company's performance after strong quarterly results.2026-02-01 · M&A — Cadence completed its €2.7 billion acquisition of Hexagon's Design & Engineering business in February 2026 to unify semiconductor design with mechanical simulation.2025-12-31 · financial — Cadence finished 2025 with a record backlog of $7.8 billion.2025-12-31 · financial — Cadence delivered 14% revenue growth and 45% operating margin for 2025.2025-07-04 · financial — We expect the One Big Beautiful Bill Act to decrease Cadence's United States federal tax payments for the remainder of fiscal 2025 by approximately $140 million.2024-09-18 · financial — Cadence Design Systems stock closed at $269.69, down 1.86% from the previous trading session on September 18, 2024.2024-07-23 · financial — Cadence updated 2024 revenue guidance to $4.6 billion to $4.66 billion, representing over 13% year-over-year growth.2024-07-23 · capacity expansion — Cadence is ramping up production capacity for its Palladium Z3 and Protium X3 emulation and prototyping systems in response to strong demand.2024-06-30 · M&A — Cadence completed the acquisition of BETA CAE in Q2 2024 to expand its Multiphysics platform.2024-06-30 · financial — Cadence delivered Q2 2024 total revenue of $1.061 billion with GAAP operating margin of 27.7% and non-GAAP operating margin of 40.1%.2024-04-01 · product launch — Cadence launched new Palladium Z3 and Protium X3 systems in April 2024 with capacity of 1 trillion transistors.2022-09-14 · other — Cadence Design Systems is listed as a select competitor in the global Interface IP market.2021-12-16 · other — Dr. Anirudh Devgan, President and CEO of Cadence Design Systems, received the 2021 Phil Kaufman Award for Distinguished Contributions to Electronic System Design.2021-12-16 · other — Dr. Anirudh Devgan, President and CEO of Cadence Design Systems, received the 2021 Phil Kaufman Award for Distinguished Contributions to Electronic System Design.2021-12-15 · executive change — Dr. Anirudh Devgan assumed the role of Cadence CEO on December 15, 2021.2021-12-15 · executive change — Dr. Anirudh Devgan assumed the role of CEO on December 15, 2021.
  • 2026-07-12 design-win → Arteris ai_chips source ↗
  • 2026-06-16 partnership Cadence announced an expanded collaboration with Hewlett Packard Enterprise to accelerate data center modernization through digital twin technology.
  • 2026-06-12 financial Cadence Design Systems has a gross margin of 87.1% and a free cash flow margin of 25.9%, trading at $387 per share or 16.6x forward price-to-sales.
  • 2026-06-09 partnership Cadence Design Systems announced a multi-year Design Technology Co-Optimization partnership with Intel Foundry aimed at Intel 14A.
  • 2026-06-09 partnership Cadence Design Systems announced a Design Technology Co-Optimization collaboration with Intel Foundry on a multiyear project targeting Intel 14A process node.
  • 2026-06-09 financial Stifel increased its price target for Cadence Design Systems from $395 to $432 and maintained its Buy rating.
  • 2026-06-08 partnership Cadence announced an expanded multi-year partnership with Intel Foundry focused on Design Technology Co-Optimization (DTCO) for Intel's upcoming process nodes beginning with Intel 14A.
  • 2026-06-01 product launch Cadence Design Systems launched the first fully autonomous virtual engineer for semiconductor development at Computex 2026, running in NVIDIA OpenShell runtime environment.
  • 2026-05-31 product launch Cadence is using NVIDIA OpenShell to secure its ChipStack AI Super Agent, a fully autonomous AI engineer that executes chip design and verification.
  • 2026-04-27 financial Cadence reported Q1 fiscal 2026 revenue of $1.47 billion, up 19% year-over-year, exceeding analyst forecasts of $1.45 billion.
  • 2026-04-27 financial Cadence reported non-GAAP earnings per share of $1.96 in Q1 fiscal 2026, up 25% year-over-year, ahead of consensus estimate of $1.89.
  • 2026-02-23 financial Jim Cramer recommended Cadence Design Systems as a hold with a buy recommendation if the stock price declines, praising the company's performance after strong quarterly results.
  • 2026-02-01 M&A Cadence completed its €2.7 billion acquisition of Hexagon's Design & Engineering business in February 2026 to unify semiconductor design with mechanical simulation.
  • 2025-12-31 financial Cadence finished 2025 with a record backlog of $7.8 billion.
  • 2025-12-31 financial Cadence delivered 14% revenue growth and 45% operating margin for 2025.
  • 2025-10-27 design-win → Samsung Electronics ai_chips source ↗
  • 2025-10-27 design-win Taiwan Manufacturing → foundry source ↗
  • 2025-10-27 design-win → Infineon ai_chips source ↗
  • 2025-07-28 design-win → SK hynix ai_chips source ↗
  • 2025-07-04 financial We expect the One Big Beautiful Bill Act to decrease Cadence's United States federal tax payments for the remainder of fiscal 2025 by approximately $140 million.
  • 2025-05-01 design-win → NVIDIA ai_chips source ↗
  • 2025-02-18 design-win → GlobalFoundries ai_chips source ↗
  • 2025-02-18 design-win → Arm ai_chips source ↗
  • 2025-02-18 design-win → Marvell ai_chips source ↗
  • 2024-09-18 financial Cadence Design Systems stock closed at $269.69, down 1.86% from the previous trading session on September 18, 2024.
  • 2024-07-23 financial Cadence updated 2024 revenue guidance to $4.6 billion to $4.66 billion, representing over 13% year-over-year growth.
  • 2024-07-23 capacity expansion Cadence is ramping up production capacity for its Palladium Z3 and Protium X3 emulation and prototyping systems in response to strong demand.
  • 2024-07-22 design-win Advanced Micro Devices → merchant_gpu source ↗
  • 2024-06-30 M&A Cadence completed the acquisition of BETA CAE in Q2 2024 to expand its Multiphysics platform.
  • 2024-06-30 financial Cadence delivered Q2 2024 total revenue of $1.061 billion with GAAP operating margin of 27.7% and non-GAAP operating margin of 40.1%.

Patents — 531 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 468
Memory 31
Other 30
Semiconductors 2

Newest 1 of 531, most recent first — all on Google Patents →

  • 2026-04-02US20260093880System and Method for Automatic Data Library Creation Associated with an Electronic Design

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.7B '20
$2.7B '21
$3.0B '22
$4.1B '23
$4.6B '24
$5.3B '25

operating income

$646M '20
$646M '21
$1.1B '22
$1.3B '23
$1.4B '24
$1.5B '25

net income

$591M '20
$591M '21
$849M '22
$1.0B '23
$1.1B '24
$1.1B '25

Sources: CDNS 10-K 2023-02-13 (acc 0000813672-23-000011) · CDNS 10-Q 2024-07-24 (acc 0000813672-24-000155) · CDNS 10-Q 2024-10-30 (acc 0000813672-24-000192) · CDNS 10-Q 2024-04-24 (acc 0000813672-24-000092) · CDNS 10-Q 2025-10-29 (acc 0000813672-25-000148) · CDNS 10-Q 2026-05-01 (acc 0000813672-26-000047) · CDNS 10-Q 2025-04-30 (acc 0000813672-25-000051) · CDNS 10-Q 2023-07-24 (acc 0000813672-23-000041) · CDNS 10-Q 2025-07-30 (acc 0000813672-25-000113) · CDNS 10-K 2025-02-21 (acc 0000813672-25-000024)

Buys from ← 2

🇺🇸 Advanced Micro Devices merchant_gpu L2 50
🇹🇼 Taiwan Manufacturing foundry L2 50

Supplies → 8

🇰🇷 Samsung Electronics ai_chips → NPU (Neural Processing Unit) L3 50
🇺🇸 GlobalFoundries ai_chips L2 50
🇩🇪 Infineon ai_chips → Power semiconductors L3 50
🇬🇧 Arm ai_chips → Ethos L3 50
🇰🇷 SK hynix ai_chips L2 50
🇺🇸 Marvell ai_chips L2 50
🇺🇸 Arteris ai_chips L2 50
🇺🇸 NVIDIA ai_chips → Data center GPUs / AI accelerators L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

VirtuosoXceliumPalladiumGenusConformalIUSInnovusAllegroSpectreJasperGold

CATLpublicProduct-grade

physical ai · 🇨🇳 China · SZSE: 300750 · 40 sources · 6 products · 13 patents

$59.0Brevenue · FY2025 · USD

CATL (Contemporary Amperex Technology Co., Ltd.) is a Chinese manufacturer of lithium-ion batteries, producing LFP and NCM cells, sodium-ion batteries, and energy storage systems for EVs and grid applications. Founded in 2011, it is headquartered in Ningde, Fujian, and is publicly listed.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $7.4BFY2021: $19.2BFY2022: $48.5BFY2023: $59.3BFY2024: $53.4BFY2025: $59.0B wins 2026-06-24 · Galbot → humanoid — click for source2026-06-24 · → Galbot batteries — click for source events 2027-01-01 · regulatory — The US Defense Department placed CATL under a battery-procurement restriction that bars the Pentagon from buying its batteries, effective in 2027.2026-07-14 · financial — CATL CEO Robin Zeng topped Forbes China's 2026 Best CEOs List with an estimated fortune of $57 billion.2026-07-09 · financial — Goldman Sachs forecasts 50% jump in CATL's share price over the next 12 months driven by energy storage system business growth.2026-07-09 · supply deal — CATL will supply 0.5 GWh of CB7T0 LFP cells and L324D06 battery pack platform to Energy In Motion for electric heavy commercial vehicles in India.2026-07-07 · other — CATL pre-registered as an exhibitor for IAA MOBILITY 2027.2026-07-06 · M&A — CATL acquired a strategic 20 percent stake in CarbonScape, a New Zealand-based company that converts forestry byproducts into graphite for lithium batteries.2026-06-20 · supply deal — CATL booked 5.4 GWh of orders in the first two weeks of June 2026, including a 3 GWh system with Finland's Merus Power for the Nordic region and 2.4 GWh for Australia's Edify Energy.2026-06-17 · capacity expansion — CATL's Jianxiawo lithium mine in Yichun, Jiangxi province passed preliminary land pre-review and will produce approximately 46,000 tons of lithium carbonate annually.
  • 2027-01-01 regulatory The US Defense Department placed CATL under a battery-procurement restriction that bars the Pentagon from buying its batteries, effective in 2027.
  • 2026-07-14 financial CATL CEO Robin Zeng topped Forbes China's 2026 Best CEOs List with an estimated fortune of $57 billion.
  • 2026-07-09 financial Goldman Sachs forecasts 50% jump in CATL's share price over the next 12 months driven by energy storage system business growth.
  • 2026-07-09 supply deal CATL will supply 0.5 GWh of CB7T0 LFP cells and L324D06 battery pack platform to Energy In Motion for electric heavy commercial vehicles in India.
  • 2026-07-07 other CATL pre-registered as an exhibitor for IAA MOBILITY 2027.
  • 2026-07-06 M&A CATL acquired a strategic 20 percent stake in CarbonScape, a New Zealand-based company that converts forestry byproducts into graphite for lithium batteries.
  • 2026-06-24 design-win Galbot → humanoid source ↗
  • 2026-06-24 design-win → Galbot batteries source ↗
  • 2026-06-20 supply deal CATL booked 5.4 GWh of orders in the first two weeks of June 2026, including a 3 GWh system with Finland's Merus Power for the Nordic region and 2.4 GWh for Australia's Edify Energy.
  • 2026-06-17 capacity expansion CATL's Jianxiawo lithium mine in Yichun, Jiangxi province passed preliminary land pre-review and will produce approximately 46,000 tons of lithium carbonate annually.

Patents — 13 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 13

Financials — multi-year, confidence 1.0 (filings)

revenue

$4.5B '18
$6.6B '19
$7.4B '20
$19.2B '21
$48.5B '22
$59.3B '23
$53.4B '24
$59.0B '25

operating income

$631M '18
$834M '19
$1.0B '20
$2.9B '21
$5.4B '22
$7.9B '23
$9.5B '24
$13.2B '25

net income

$513M '18
$660M '19
$810M '20
$2.3B '21
$4.5B '22
$6.5B '23
$7.5B '24
$10.7B '25

Buys from ← 1

🇨🇳 Galbot humanoid L2 50

Supplies → 2

🇺🇸 Tesla batteries → Powerwall L3 50
🇨🇳 Galbot batteries L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

LFP (Lithium Iron Phosphate) Cells/PacksNCM (Nickel Cobalt Manganese) Cells/PacksCATL Blade BatteryBattery Management System (BMS)Sodium-ion BatteryEnergy Storage Systems (ESS)

China Rare Earth Group Co., Ltd.state_ownedRelationships + financials

physical ai · 🇨🇳 China · 8 sources · 0 products

$470Mrevenue · FY2025 · USD$48.3B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $245MFY2022: $440MFY2023: $623MFY2024: $448MFY2025: $470M wins 2026-07-17 · → JL MAG Rare-Earth physical_ai — click for source events
  • 2026-07-17 reported edge → JL MAG Rare-Earth physical_ai source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$245M '20
$440M '22
$623M '23
$448M '24
$470M '25

operating income

$43M '20
$38M '22
$81M '23
$-37M '24
$36M '25

net income

$41M '20
$29M '22
$114M '23
$-42M '24
$26M '25

Supplies → 2

🇨🇳 JL MAG Rare-Earth physical_ai L2 50
🇨🇳 JL MAG Rare-Earth physical_ai L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

CoherentpublicProduct-grade

ai compute · 🇺🇸 United States · NYSE: COHR · 100 sources · 4 products · 29 patents

$5.8Brevenue · FY2025 · USD$43.9B mkt cap

Optical transceivers, lasers

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $2.4BFY2021: $3.1BFY2022: $3.3BFY2023: $5.2BFY2024: $4.7BFY2025: $5.8B wins 2025-11-12 · GlobalFoundries → foundry — click for source2026-05-06 · → NVIDIA optical_modules — click for source events 2026-03-02 · financial — Coherent received a $2 billion equity investment from NVIDIA announced on March 2, 2026.2026-03-02 · partnership — NVIDIA announced a $2 billion equity investment in Coherent with a multiyear supply agreement extending through the end of the decade for CPO-related products.2026-01-31 · M&A — Coherent closed the sale of its Munich, Germany product division at the end of January 2026.2025-09-01 · M&A — We completed the sale of our Aerospace and Defense business at the beginning of September.2025-08-01 · M&A — Coherent announced an agreement to sell its Aerospace and Defense business for $400 million, expected to close this quarter.2025-08-01 · capacity expansion — Coherent tripled indium phosphide capacity year-over-year and will begin production this month of a new 6-inch indium phosphide line in Sherman, Texas facility, described as the world's first 6-inch indium phosphide production platform.2025-08-01 · partnership — Coherent entered into a new multiyear agreement with Apple for a new generation of VCSEL products that support Apple's iPhone and iPad products, with revenue expected to begin in the second half of calendar 2026.2025-06-30 · product launch — Coherent began initial revenue shipments of its new Optical Circuit Switch in fiscal Q4.2025-06-30 · financial — Full year revenue increased by approximately 23% year-over-year to a record $5.81 billion.2025-06-30 · product launch — Coherent began initial revenue shipments of its new 1.6T Transceivers in Q4 and expects 1.6T volumes to ramp throughout the balance of calendar year with more meaningful revenue contribution in calendar 2026.2025-03-01 · product launch — At the Optical Fiber Communications Conference in March, we introduced many new optical networking products and technologies with six of our products receiving awards.
  • 2026-05-06 design-win → NVIDIA optical_modules source ↗
  • 2026-03-02 financial Coherent received a $2 billion equity investment from NVIDIA announced on March 2, 2026.
  • 2026-03-02 partnership NVIDIA announced a $2 billion equity investment in Coherent with a multiyear supply agreement extending through the end of the decade for CPO-related products.
  • 2026-01-31 M&A Coherent closed the sale of its Munich, Germany product division at the end of January 2026.
  • 2025-11-12 design-win GlobalFoundries → foundry source ↗
  • 2025-09-01 M&A We completed the sale of our Aerospace and Defense business at the beginning of September.
  • 2025-08-01 M&A Coherent announced an agreement to sell its Aerospace and Defense business for $400 million, expected to close this quarter.
  • 2025-08-01 capacity expansion Coherent tripled indium phosphide capacity year-over-year and will begin production this month of a new 6-inch indium phosphide line in Sherman, Texas facility, described as the world's first 6-inch indium phosphide production platform.
  • 2025-08-01 partnership Coherent entered into a new multiyear agreement with Apple for a new generation of VCSEL products that support Apple's iPhone and iPad products, with revenue expected to begin in the second half of calendar 2026.
  • 2025-06-30 product launch Coherent began initial revenue shipments of its new Optical Circuit Switch in fiscal Q4.
  • 2025-06-30 financial Full year revenue increased by approximately 23% year-over-year to a record $5.81 billion.
  • 2025-06-30 product launch Coherent began initial revenue shipments of its new 1.6T Transceivers in Q4 and expects 1.6T volumes to ramp throughout the balance of calendar year with more meaningful revenue contribution in calendar 2026.
  • 2025-03-01 product launch At the Optical Fiber Communications Conference in March, we introduced many new optical networking products and technologies with six of our products receiving awards.

Patents — 29 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 25
Computing 2
Power electronics 1
Semiconductors 1

Newest 2 of 29, most recent first — all on Google Patents →

  • 2026-04-23US20260110897Diffraction Grating Design Techniques and Arrangements Using Sub-Wavelength Structures
  • 2024-12-26US2024427973Modular Design Flow

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.4B '20
$3.1B '21
$3.3B '22
$5.2B '23
$4.7B '24
$5.8B '25

operating income

$127M '20
$402M '21
$414M '22
$-37M '23
$96M '24
$549M '25

net income

$-67M '20
$298M '21
$235M '22
$-259M '23
$-156M '24
$49M '25

Sources: COHR 10-Q 2023-11-07 (acc 0000820318-23-000029) · COHR 10-Q 2024-11-06 (acc 0000820318-24-000035) · COHR 10-Q 2024-02-06 (acc 0000820318-24-000004) · COHR 10-Q 2025-11-05 (acc 0000820318-25-000019) · COHR 10-Q 2025-02-05 (acc 0000820318-25-000004) · COHR 10-Q 2023-05-10 (acc 0000820318-23-000009) · COHR 10-K 2024-08-16 (acc 0000820318-24-000016) · COHR 10-Q 2023-02-08 (acc 0000820318-23-000005) · COHR 10-K 2023-08-18 (acc 0000820318-23-000016) · COHR 10-Q 2026-05-06 (acc 0000820318-26-000013)

Buys from ← 1

🇺🇸 GlobalFoundries foundry L2 50

Supplies → 1

🇺🇸 NVIDIA optical_modules → Data center GPUs / AI accelerators L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

ZR/ZR+ transceiverdatacenter transceiverstelecom transport productsindustrial lasers

CorningpublicProduct-grade

ai compute · 🇺🇸 United States · NYSE: GLW · 89 sources · 10 products · 925 patents

$15.6Brevenue · FY2025 · USD$136.4B mkt cap

Glass substrates, optical fiber

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $11.3BFY2021: $14.1BFY2022: $14.2BFY2023: $12.6BFY2024: $13.1BFY2025: $15.6B wins 2026-02-11 · → GlobalFoundries advanced_packaging — click for source2023-07-07 · → SUMCO ai_compute — click for source2025-07-29 · → NVIDIA advanced_packaging — click for source2026-06-13 · → Amazon advanced_packaging — click for source2025-07-29 · → Broadcom advanced_packaging — click for source events 2026-07-20 · product launch — Motorola Edge 70 Max features Corning Gorilla Glass 7i on front and rear.2026-05-06 · financial — Corning will upgrade and extend its Springboard plan through 2030 at its investor event on May 6.2025-12-31 · financial — Display segment net income expected to be $900 million to $950 million in 2025 with net income margin of 25%, consistent with the last five years.2024-12-31 · financial — Full year 2024 free cash flow was $1.25 billion, up 42% versus prior year.2024-06-01 · product launch — We introduced new GenAI products in June of 2024 and launched the first outside plant deployment of Corning's new GenAI fiber and cable system.

Rolled up across Corning + its subsidiaries

  • 2026-07-20 product launch Motorola Edge 70 Max features Corning Gorilla Glass 7i on front and rear.
  • 2026-06-13 reported edge → Amazon advanced_packaging source ↗
  • 2026-05-06 financial Corning will upgrade and extend its Springboard plan through 2030 at its investor event on May 6.
  • 2026-02-11 design-win → GlobalFoundries advanced_packaging source ↗
  • 2025-12-31 financial Display segment net income expected to be $900 million to $950 million in 2025 with net income margin of 25%, consistent with the last five years.
  • 2025-07-29 design-win → NVIDIA advanced_packaging source ↗
  • 2025-07-29 design-win → Broadcom advanced_packaging source ↗
  • 2024-12-31 financial Full year 2024 free cash flow was $1.25 billion, up 42% versus prior year.
  • 2024-06-01 product launch We introduced new GenAI products in June of 2024 and launched the first outside plant deployment of Corning's new GenAI fiber and cable system.
  • 2023-07-07 design-win → SUMCO ai_compute source ↗

Patents — 925 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 598
Semiconductors 273
Memory 28
Batteries 11
Other 10
Imaging / cameras 2
Bearings 2
Power electronics 1

Newest 21 of 925, most recent first — all on Google Patents →

  • 2026-05-14US20260134242TOUCHLESS SELECTION OF MACHINE READABLE CODES IN DENSELY POPULATED ENVIRONMENTS
  • 2026-01-22US20260022056TRANSPARENT AND TRANSLUCENT GLASS-CERAMICS AND GLASSES FOR FORMING THE SAME
  • 2025-08-14US2025258521FOLDABLE SUBSTRATES, FOLDABLE ARTICLES, AND METHODS OF MAKING THE SAME
  • 2025-03-13US2025085741Glass articles, natively colored glass housings, and methods of making the same
  • 2024-12-26WO2024263617CHEMICALLY STRENGTHENED GLASS-BASED ARTICLES
  • 2024-12-19WO2024258554DEVICES TO DIRECT THE PATH OF ELECTROMAGNETIC RADIATION
  • 2024-12-12US2024409456DYNAMICALLY BENDABLE AUTOMOTIVE INTERIOR DISPLAY SYSTEMS
  • 2024-12-05WO2024249026COMPOSITION, POLYMER-BASED PORTION, FOLDABLE APPARATUS CONTAINING THE SAME, AND METHODS OF MAKING
  • 2024-11-07US2024368031METHOD OF MANUFACTURING FLEXIBLE COVER WINDOW AND FLEXIBLE COVER WINDOW MANUFACTURED USING SAME
  • 2024-09-12WO2024186512SILICON NITRIDE CORE RIB WAVEGUIDES AND METHODS OF MANUFACTURING THE SAME
  • 2024-08-22WO2024172834FABRICATION OF DOPED TRANSPARENT POLYCRYSTALLINE CERAMIC MATERIALS
  • 2024-07-11WO2024147910FOLDABLE SUBSTRATES
  • 2024-05-10WO2024097088FOLDABLE SUBSTRATES, FOLDABLE APPARATUS, AND METHODS OF MAKING
  • 2023-12-28WO2023249823DISPLAYS WITH REDUCED EDGE LIGHT LEAKAGE
  • 2023-10-12WO2023195967GRAPHICAL USER INTERFACE FOR CABLE ASSEMBLY DESIGN TOOL
  • 2023-10-12WO2023195968CABLE ASSEMBLY DESIGN TOOL WITH POLARITY ASSIGNMENT
  • 2023-10-12WO2023195969CABLE ASSEMBLY DESIGN TOOL WITH FIBER UTILIZATION COUNTER
  • 2023-09-21WO2023177614FOLDABLE APPARATUS AND METHOD OF MAKING THE SAME
  • 2023-07-06WO2023129360COVER SUBSTRATES FOR DISPLAYS WITH DECORATIVE LAYERS HAVING INTEGRATED LOGIC CIRCUITS AND METHODS OF FORMING THE SAME
  • 2023-06-01WO2023096773LAMINATE WITH INTEGRAL SENSOR AND RELATED METHODS
  • 2022-08-25WO2022177797FOLDABLE APPARATUS AND METHODS OF MAKING

Financials — multi-year, confidence 1.0 (filings)

revenue

$11.3B '20
$14.1B '21
$14.2B '22
$12.6B '23
$13.1B '24
$15.6B '25

operating income

$509M '20
$2.1B '21
$1.4B '22
$890M '23
$1.1B '24
$2.3B '25

net income

$512M '20
$1.9B '21
$1.3B '22
$581M '23
$506M '24
$1.6B '25

Sources: GLW 10-K 2023-02-13 (acc 0001437749-23-003123) · GLW 10-Q 2025-05-02 (acc 0001628280-25-021711) · GLW 10-Q 2026-05-01 (acc 0000024741-26-000205) · GLW 10-Q 2023-10-30 (acc 0001437749-23-029347) · GLW 10-Q 2024-05-02 (acc 0001437749-24-014319) · GLW 10-Q 2023-07-27 (acc 0001437749-23-020854) · GLW 10-K 2025-02-13 (acc 0001628280-25-005347) · GLW 10-Q 2024-11-01 (acc 0001437749-24-032912) · GLW 10-Q 2023-04-28 (acc 0001437749-23-011533) · GLW 10-Q 2024-08-02 (acc 0001437749-24-024494)

Supplies → 4

🇺🇸 GlobalFoundries advanced_packaging L2 50
🇺🇸 NVIDIA advanced_packaging → Data center GPUs / AI accelerators L3 50
🇺🇸 Amazon advanced_packaging L2
🇺🇸 Broadcom advanced_packaging L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

SMF-28e® Ultra and SMF-28e® Contour fibersClearCurve® ultra-bendable fiberEvolv™ platformLEAF® optical fiberSMF-28e+™ single-mode optical fiberRocketRibbon® and miniXtend® cable portfoliosClearCurve® ultra-bendable single-mode fiberVascade® optical fibersCentrix platformSMF-28e® ULL and TXF® fiber

Credo TechnologypublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: CRDO · 68 sources · 10 products · 23 patents

$1.3Brevenue · FY2026 · USD$38.8B mkt cap

Credo Technology is a US semiconductor company providing high-speed connectivity products for data centers, including SerDes chiplets, active electrical cables, optical DSPs, and retimers. Founded in 2008, it is publicly listed on Nasdaq.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $59MFY2022: $107MFY2023: $184MFY2024: $193MFY2025: $437MFY2026: $1.3B wins 2025-09-03 · → NVIDIA switch_silicon — click for source events
  • 2025-09-03 design-win → NVIDIA switch_silicon source ↗

Patents — 23 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 20
Computing 2
Memory 1

Newest 2 of 23, most recent first — all on Google Patents →

  • 2026-05-21US20260140916Adaptive Retimer with Bypass
  • 2003-09-04WO03073513USE OF ELECTROACTIVE MONOLAYERS IN GENERATING NEGATIVE DIFFERENTIAL RESISTANCE BEHAVIORS AND DEVICES EMPLOYING THE SAME

Supplies → 2

🇺🇸 NVIDIA switch_silicon → Data center GPUs / AI accelerators L3 50
🇺🇸 Amazon switch_silicon → Amazon Web Services (AWS) L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

ZeroFlap (ZF) Active Electrical CablesRetimersSerDes ChipletsOmniConnectSerDes IPZeroFlap (ZF) Active Electrical Cables (AECs)Retimers and DSPsZeroFlap OpticsPILOTDSPs

Daido Steel Co., Ltd.publicRelationships + financials

- · 🇯🇵 Japan · 1 sources · 0 products

$3.6Brevenue · FY2026 · USD$458.3B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $2.5BFY2022: $3.3BFY2023: $3.6BFY2024: $3.6BFY2025: $3.5BFY2026: $3.6B wins 2026-07-17 · → NSK steel — click for source2026-07-17 · → Harmonic Drive steel — click for source2026-07-17 · → THK steel — click for source events
  • 2026-07-17 reported edge → NSK steel source ↗
  • 2026-07-17 reported edge → Harmonic Drive steel source ↗
  • 2026-07-17 reported edge → THK steel source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.5B '21
$3.3B '22
$3.6B '23
$3.6B '24
$3.5B '25
$3.6B '26

operating income

$62M '21
$228M '22
$289M '23
$239M '24
$264M '25
$225M '26

net income

$28M '21
$166M '22
$224M '23
$188M '24
$174M '25
$201M '26

Supplies → 3

🇯🇵 NSK steel L2
🇯🇵 Harmonic Drive steel L2
🇯🇵 THK steel L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Delta ElectronicspublicProduct-grade

ai compute · 🇹🇼 Taiwan · TWSE: 2308 · 32 sources · 5 products · 2014 patents

$17.9Brevenue · FY2025 · USD$140.0B mkt cap

Power supplies, cooling

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $8.7BFY2021: $11.3BFY2022: $11.9BFY2023: $12.4BFY2024: $13.0BFY2025: $17.9B wins 2026-03-09 · → Agility Robotics ai_chips — click for source2025-08-04 · Navitas → ai_chips — click for source2026-06-01 · NVIDIA → ai_chips — click for source events 2024-09-30 · litigation — The bond in the case of computing systems that are affected by the infringement was set by the ALJ at 100% of their value.
  • 2026-06-01 design-win NVIDIA → ai_chips source ↗
  • 2026-03-09 reported edge → Agility Robotics ai_chips source ↗
  • 2025-08-04 design-win Navitas → ai_chips source ↗
  • 2024-09-30 litigation The bond in the case of computing systems that are affected by the infringement was set by the ALJ at 100% of their value.

Patents — 2014 CPC-scoped to ai compute (physical-AI-relevant classes)

Power electronics 1435
Computing 447
Semiconductors 68
Other 24
Electric motors 16
Batteries 9
Robotics / manipulators 4
Imaging / cameras 4
Gears / reducers 3
Lidar / ranging 2
Memory 2

Newest 9 of 2014, most recent first — all on Google Patents →

  • 2026-06-18US20260170026GENERATIVE QUESTION ANSWERING SYSTEM AND GENERATIVE QUESTION ANSWERING METHOD
  • 2026-05-28WO2026107727CONTROL APPARATUS AND MONITORING METHOD
  • 2026-05-21US20260143647CONTROL SYSTEM FOR COOLING DISTRIBUTION UNIT AND CONTROL METHOD FOR CDU GROUP FLOW CONTROL
  • 2026-04-30WO2026085705METHOD FOR TESTING HUMAN-MACHINE INTERFACE AND HUMAN-MACHINE INTERFACE TESTING DEVICE
  • 2026-03-05US20260064454MACHINE-TUNING SYSTEM AND MACHINE-TUNING METHOD FOR INTEGRATING VIRTUAL SIMULATIONS AND PHYSICAL OPERATIONS
  • 2026-03-05US20260066180POWER MODULE
  • 2025-10-16US2025321732METHOD AND SYSTEM OF SOFTWARE COMPONENT IDENTIFICATION IN EMBEDDED SYSTEM FIRMWARE
  • 2025-09-25US2025298904BACKUP-BASED RANSOMWARE ATTACK SIMULATION METHOD AND SIMULATION DEVICE
  • 2025-09-18US2025293470POWER BRIDGING STRUCTURE FOR RACKS AND POWER BUS BAR BRIDGING DEVICE THEREOF

Financials — multi-year, confidence 1.0 (filings)

revenue

$7.9B '18
$8.7B '19
$8.7B '20
$11.3B '21
$11.9B '22
$12.4B '23
$13.0B '24
$17.9B '25

operating income

$605M '18
$630M '19
$971M '20
$977M '21
$1.3B '22
$1.3B '23
$1.5B '24
$2.6B '25

net income

$606M '18
$750M '19
$794M '20
$826M '21
$1.1B '22
$1.0B '23
$1.1B '24
$2.1B '25

Buys from ← 2

🇺🇸 Navitas ai_chips L2 50
🇺🇸 NVIDIA ai_chips L2 50

Supplies → 1

🇺🇸 Agility Robotics ai_chips → Digit L3

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

AFC SeriesDPS SeriesDPP SeriesEcoFitPFC Series

Denso / Denso WavepublicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6902 · 12 sources · 4 products · 2049 patents

$46.4Brevenue · FY2026 · USD$32.6B mkt cap

Small assembly robots, cobots

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $30.4BFY2022: $33.9BFY2023: $39.4BFY2024: $44.0BFY2025: $47.0BFY2026: $50.1B wins 2025-07-29 · Vishay Intertechnology → ai_compute — click for source events 2025-04-01 · financial report — Denso reported financial results for the first half of fiscal year 103 (April 2025-March 2026).
  • 2025-07-29 design-win Vishay Intertechnology → ai_compute source ↗
  • 2025-04-01 financial report Denso reported financial results for the first half of fiscal year 103 (April 2025-March 2026).

Patents — 2049 CPC-scoped to physical ai (physical-AI-relevant classes)

Electric motors 501
Power electronics 460
Lidar / ranging 428
Batteries 278
IMU / navigation 114
Imaging / cameras 81
Other 50
Gears / reducers 40
Force / torque sensors 39
Robotics / manipulators 31
Computing 19
Bearings 6
Semiconductors 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$30.4B '21
$33.9B '22
$39.4B '23
$44.0B '24
$47.0B '25
$50.1B '26

operating income

$905M '21
$2.1B '22
$2.6B '23
$2.3B '24
$3.4B '25
$3.7B '26

net income

$771M '21
$1.6B '22
$1.9B '23
$1.9B '24
$2.8B '25
$2.9B '26

Sources: 株式会社デンソー — 臨時報告書 · 株式会社デンソー — 臨時報告書 · 株式会社デンソー — 半期報告書-第103期(2025/04/01-2026/03/31) · 株式会社デンソー — 有価証券報告書-第103期(2025/04/01-2026/03/31) · 株式会社デンソー — 臨時報告書 · 株式会社デンソー — 臨時報告書

Buys from ← 1

🇺🇸 Vishay Intertechnology ai_compute L2 50

Supplies → 1

Toyota Motor industrial_arm L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

VS seriesGM seriesQT seriesQR series

DobotpublicRelationships + financials

physical ai · 🇨🇳 China · HKEX: 2432 · 3 sources · 5 products · 15 patents

$73Mrevenue · FY2025 · USD$1.3B mkt cap

Cobots, education robots

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202120222023202420252026 rev FY2021: $26MFY2022: $36MFY2023: $42MFY2024: $55MFY2025: $73M wins events

Patents — 15 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 15

Financials — multi-year, confidence 1.0 (filings)

revenue

$26M '21
$36M '22
$42M '23
$55M '24
$73M '25

operating income

$-5M '21
$-9M '22
$-14M '23
$-13M '24
$-17M '25

net income

$-6M '21
$-8M '22
$-15M '23
$-14M '24
$-12M '25

Supplies → 2

🇨🇳 BYD industrial_arm L2 50
🇯🇵 Omron (Adept) industrial_arm L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Dobot MagicianDobot VisionDobot NovaDobot CR seriesDobot M1 Pro

Doosan RoboticspublicFinancials only

physical ai · 🇰🇷 South Korea · KRX: 454910 · 28 sources · 5 products · 77 patents

$22Mrevenue · FY2025 · USD$2.9B mkt cap

Collaborative robots

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $14MFY2021: $25MFY2022: $30MFY2023: $41MFY2024: $34MFY2025: $23M wins events 2026-07-24 · disclosure — Doosan Robotics will hold an IR conference call on July 24, 2026 at 16:00 to present Q2 2026 financial results and conduct Q&A with securities analysts.2026-07-24 · financial report — Doosan Robotics announced advance notice of financial results disclosure for the fiscal period from January 1, 2026 to June 30, 2026, with results scheduled for public disclosure on July 24, 2026.2026-06-17 · financial — Korea Eximbank will provide $110 million in financing for Doosan's planned copper clad laminate production facility in Thailand.2026-06-17 · capacity expansion — Doosan plans to construct a high-end CCL production facility at Araya Industrial Park in Thailand scheduled to begin construction in 2026.2026-06-08 · disclosure — Doosan Robotics announced the scheduling of investor relations/corporate briefing.2026-06-02 · financial — Doosan Robotics jumped 20.45 percent to 166,700 won on expectations of potential AI partnerships with NVIDIA.2026-06-02 · financial — Doosan Robotics surged 20.45 percent to close at 166,700 won following Nvidia CEO's expressed interest in investing in Korea's robotics industry.2026-06-01 · disclosure — Doosan Robotics disclosed corporate governance report.2026-05-29 · disclosure — Doosan Robotics disclosed large enterprise group status report for Q1 2026.2026-05-15 · financial report — Doosan Robotics filed quarterly report for Q1 2026.2026-05-11 · disclosure — Doosan Robotics is holding an investor relations briefing session.2026-05-06 · disclosure — Doosan Robotics is holding an investor relations briefing session.2026-04-30 · partnership — Doosan Robotics is pushing for technology cooperation with AI chip giant NVIDIA.2026-04-30 · partnership — Doosan Robotics spiked 8.02 percent on news that it is pushing for technology cooperation with NVIDIA.2026-04-28 · financial report — Doosan Robotics reports consolidated interim operating results for the period.2026-04-16 · disclosure — Doosan Robotics announces advance notice of financial results disclosure.2026-04-16 · disclosure — Doosan Robotics is holding an investor relations briefing session.
  • 2026-07-24 disclosure Doosan Robotics will hold an IR conference call on July 24, 2026 at 16:00 to present Q2 2026 financial results and conduct Q&A with securities analysts.
  • 2026-07-24 financial report Doosan Robotics announced advance notice of financial results disclosure for the fiscal period from January 1, 2026 to June 30, 2026, with results scheduled for public disclosure on July 24, 2026.
  • 2026-06-17 financial Korea Eximbank will provide $110 million in financing for Doosan's planned copper clad laminate production facility in Thailand.
  • 2026-06-17 capacity expansion Doosan plans to construct a high-end CCL production facility at Araya Industrial Park in Thailand scheduled to begin construction in 2026.
  • 2026-06-08 disclosure Doosan Robotics announced the scheduling of investor relations/corporate briefing.
  • 2026-06-02 financial Doosan Robotics jumped 20.45 percent to 166,700 won on expectations of potential AI partnerships with NVIDIA.
  • 2026-06-02 financial Doosan Robotics surged 20.45 percent to close at 166,700 won following Nvidia CEO's expressed interest in investing in Korea's robotics industry.
  • 2026-06-01 disclosure Doosan Robotics disclosed corporate governance report.
  • 2026-05-29 disclosure Doosan Robotics disclosed large enterprise group status report for Q1 2026.
  • 2026-05-15 financial report Doosan Robotics filed quarterly report for Q1 2026.
  • 2026-05-11 disclosure Doosan Robotics is holding an investor relations briefing session.
  • 2026-05-06 disclosure Doosan Robotics is holding an investor relations briefing session.
  • 2026-04-30 partnership Doosan Robotics is pushing for technology cooperation with AI chip giant NVIDIA.
  • 2026-04-30 partnership Doosan Robotics spiked 8.02 percent on news that it is pushing for technology cooperation with NVIDIA.
  • 2026-04-28 financial report Doosan Robotics reports consolidated interim operating results for the period.
  • 2026-04-16 disclosure Doosan Robotics announces advance notice of financial results disclosure.
  • 2026-04-16 disclosure Doosan Robotics is holding an investor relations briefing session.

Patents — 77 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 39
Other 31
Computing 5
Force / torque sensors 1
Imaging / cameras 1

Newest 1 of 77, most recent first — all on Google Patents →

  • 2018-08-09WO2018143607APPARATUS AND METHOD FOR SKILL-BASED ROBOT PROGRAMMING

Products

M0610M1013H2017H2515M0609

EcoPro BMpublicProduct-grade

physical ai · 🇰🇷 South Korea · 15 sources · 0 products · 813 patents

$1.7Brevenue · FY2025 · USD$11.66T mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $574MFY2021: $997MFY2022: $3.6BFY2023: $4.6BFY2024: $1.9BFY2025: $1.7B wins 2024-01-08 · → Samsung SDI physical_ai — click for source events 2026-06-30 · financial — Announced a 1.2 trillion-won rights offering on June 30 to expand its nickel smelting business in Indonesia.2025-12-31 · capacity expansion — Completed a cathode materials plant in Debrecen, Hungary, with an annual production capacity of 54,000 tons to serve the European electric vehicle market in 2025.2025-12-31 · financial — Annual sales surged from 99.8 billion won in 2016 to 2.5 trillion won in 2025, an increase of more than 25-fold.
  • 2026-06-30 financial Announced a 1.2 trillion-won rights offering on June 30 to expand its nickel smelting business in Indonesia.
  • 2025-12-31 capacity expansion Completed a cathode materials plant in Debrecen, Hungary, with an annual production capacity of 54,000 tons to serve the European electric vehicle market in 2025.
  • 2025-12-31 financial Annual sales surged from 99.8 billion won in 2016 to 2.5 trillion won in 2025, an increase of more than 25-fold.
  • 2024-01-08 design-win → Samsung SDI physical_ai source ↗

Patents — 813 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 813

Financials — multi-year, confidence 1.0 (filings)

revenue

$574M '20
$997M '21
$3.6B '22
$4.6B '23
$1.9B '24
$1.7B '25

operating income

$37M '20
$77M '21
$256M '22
$105M '23
$-23M '24
$96M '25

net income

$32M '20
$68M '21
$157M '22
$-6M '23
$-65M '24
$26M '25

Supplies → 1

🇰🇷 Samsung SDI physical_ai → NCA (Nickel Cobalt Aluminum) Cells L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Empyrean TechnologypublicProduct-grade

ai compute · 🇨🇳 China · SZSE: 301269 · 3 sources · 0 products · 31 patents

$196Mrevenue · FY2025 · USD$7.8B mkt cap

EDA (leading CN)

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $61MFY2021: $86MFY2022: $13MFY2023: $149MFY2024: $181MFY2025: $196M wins events

Patents — 31 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 31

Financials — multi-year, confidence 1.0 (filings)

revenue

$23M '18
$37M '19
$61M '20
$86M '21
$13M '22
$149M '23
$181M '24
$196M '25

operating income

$7M '18
$8M '19
$16M '20
$21M '21
$10M '22
$30M '23
$16M '24
$9M '25

net income

$7M '18
$8M '19
$16M '20
$21M '21
$27M '22
$30M '23
$16M '24
$9M '25

Supplies → 4

🇺🇸 Marvell ai_chips L2 50
🇰🇷 Samsung Electronics ai_chips → NPU (Neural Processing Unit) L3 50
🇨🇳 SMIC ai_chips L2 50
🇰🇷 SK hynix ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

EntegrispublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: ENTG · 51 sources · 7 products · 479 patents

$3.2Brevenue · FY2025 · USD$20.5B mkt cap

Filtration, CMP, materials

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $1.9BFY2021: $2.3BFY2022: $3.3BFY2023: $3.5BFY2024: $3.2BFY2025: $3.2B wins 2023-03-06 · → GlobalFoundries ai_chips — click for source2026-05-14 · Taiwan Manufacturing → foundry — click for source2024-11-20 · → NVIDIA ai_chips — click for source events 2026-07-15 · dividend — Entegris, Inc. declared a quarterly cash dividend of $0.10 per share, payable on August 19, 2026 to shareholders of record on July 29, 2026.2026-05-18 · executive change — Sukhi Nagesh has been appointed as Chief Financial Officer, effective May 18, 2026.2025-07-17 · other — On July 17, we opened our new state-of-the-art Korea Technology Center, an opening that also coincided with our 35th year of doing business in Korea.2024-12-31 · capacity expansion — New facility in Kaohsiung, Taiwan has completed qualifications for drums, tubing, deposition materials, and liquid filters, with most remaining critical product qualifications expected by end of 2025.2024-12-31 · capacity expansion — Colorado site received $77 million in funding under the Chips and Science Act with tools moving into facility and customer qualifications expected in second half of 2025.2024-12-31 · regulatory — Latest restrictions on sales to China estimated to result in annual incremental loss of revenue of $30 million to $40 million in 2025.2024-12-31 · executive change — Bill Seymour, VP of IR and Communications, announced his decision to leave Entegris to pursue a new opportunity at the end of Q1.2024-12-31 · financial — Paid down almost $625 million of debt in 2024, with $2 billion of total debt paid down since CMC acquisition close in July 2022.2024-12-31 · financial — Gross debt was $5.7 billion and net debt was approximately $3.7 billion at end of year with gross leverage at 4.3 times and net leverage at 4 times.2024-03-31 · M&A — Divested the pipeline and industrial materials business in early March 2024.
  • 2026-07-15 dividend Entegris, Inc. declared a quarterly cash dividend of $0.10 per share, payable on August 19, 2026 to shareholders of record on July 29, 2026.
  • 2026-05-18 executive change Sukhi Nagesh has been appointed as Chief Financial Officer, effective May 18, 2026.
  • 2026-05-14 design-win Taiwan Manufacturing → foundry source ↗
  • 2025-07-17 other On July 17, we opened our new state-of-the-art Korea Technology Center, an opening that also coincided with our 35th year of doing business in Korea.
  • 2024-12-31 capacity expansion New facility in Kaohsiung, Taiwan has completed qualifications for drums, tubing, deposition materials, and liquid filters, with most remaining critical product qualifications expected by end of 2025.
  • 2024-12-31 capacity expansion Colorado site received $77 million in funding under the Chips and Science Act with tools moving into facility and customer qualifications expected in second half of 2025.
  • 2024-12-31 regulatory Latest restrictions on sales to China estimated to result in annual incremental loss of revenue of $30 million to $40 million in 2025.
  • 2024-12-31 executive change Bill Seymour, VP of IR and Communications, announced his decision to leave Entegris to pursue a new opportunity at the end of Q1.
  • 2024-12-31 financial Paid down almost $625 million of debt in 2024, with $2 billion of total debt paid down since CMC acquisition close in July 2022.
  • 2024-12-31 financial Gross debt was $5.7 billion and net debt was approximately $3.7 billion at end of year with gross leverage at 4.3 times and net leverage at 4 times.
  • 2024-11-20 design-win → NVIDIA ai_chips source ↗
  • 2024-03-31 M&A Divested the pipeline and industrial materials business in early March 2024.
  • 2023-03-06 design-win → GlobalFoundries ai_chips source ↗

Patents — 479 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 471
Other 7
Computing 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.9B '20
$2.3B '21
$3.3B '22
$3.5B '23
$3.2B '24
$3.2B '25

operating income

$395M '20
$552M '21
$480M '22
$499M '23
$534M '24
$456M '25

net income

$295M '20
$409M '21
$209M '22
$181M '23
$293M '24
$236M '25

Sources: ENTG 10-Q 2025-07-30 (acc 0001101302-25-000079) · ENTG 8-K 2026-07-15 (acc 0001101302-26-000139) · ENTG 10-Q 2023-11-02 (acc 0001101302-23-000089) · ENTG 10-Q 2023-08-03 (acc 0001101302-23-000082) · ENTG 10-K 2024-02-15 (acc 0001101302-24-000009) · ENTG 10-Q 2026-04-30 (acc 0001101302-26-000102) · ENTG 10-Q 2024-11-04 (acc 0001101302-24-000074) · ENTG 10-Q 2024-07-31 (acc 0001101302-24-000053) · ENTG 10-K 2023-02-23 (acc 0001101302-23-000021) · ENTG 10-Q 2025-10-30 (acc 0001101302-25-000103)

Buys from ← 1

🇹🇼 Taiwan Manufacturing foundry L2 53

Supplies → 2

🇺🇸 GlobalFoundries ai_chips L2 53
🇺🇸 NVIDIA ai_chips → Data center GPUs / AI accelerators L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

UltraClean SeriesPOCOPall MicroelectronicsEntegris Fluid HandlingAdvanced Materials HandlingFluorowareMicrofilm

EoptolinkpublicProduct-grade

ai compute · 🇨🇳 China · SZSE: 300502 · 21 sources · 0 products · 9 patents

$3.7Brevenue · FY2025 · USD$99.4B mkt cap

Optical modules

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $295MFY2021: $430MFY2022: $490MFY2023: $457MFY2024: $1.3BFY2025: $3.7B wins 2025-11-11 · → NVIDIA optical_modules — click for source2026-04-18 · → Amazon optical_modules — click for source2025-11-11 · → Microsoft optical_modules — click for source events 2026-07-14 · financial — Eoptolink Technology ranked No. 4 on Forbes China's 2026 Best CEOs List, producing optical modules for data broadband, telecommunications, and data center industries.
  • 2026-07-14 financial Eoptolink Technology ranked No. 4 on Forbes China's 2026 Best CEOs List, producing optical modules for data broadband, telecommunications, and data center industries.
  • 2026-04-18 design-win → Amazon optical_modules source ↗
  • 2025-11-11 design-win → NVIDIA optical_modules source ↗
  • 2025-11-11 design-win → Microsoft optical_modules source ↗

Patents — 9 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 9

Financials — multi-year, confidence 1.0 (filings)

revenue

$115M '18
$169M '19
$295M '20
$430M '21
$490M '22
$457M '23
$1.3B '24
$3.7B '25

operating income

$5M '18
$35M '19
$83M '20
$112M '21
$152M '22
$116M '23
$475M '24
$1.6B '25

net income

$5M '18
$31M '19
$73M '20
$97M '21
$134M '22
$101M '23
$420M '24
$1.4B '25

Buys from ← 1

🇺🇸 Broadcom custom_asic L2 50

Supplies → 3

🇺🇸 NVIDIA optical_modules → Data center GPUs / AI accelerators L3 50
🇺🇸 Amazon optical_modules L2 50
🇺🇸 Microsoft optical_modules → Microsoft Azure L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Estun AutomationpublicProduct-grade

physical ai · 🇨🇳 China · SZSE: 002747 · 3 sources · 3 products · 33 patents

$680Mrevenue · FY2025 · USD$4.9B mkt cap

Estun Automation is a Chinese manufacturer of industrial robots and motion control components, including servo drives and motors, based in Nanjing. The company is publicly listed on the Shenzhen Stock Exchange.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $370MFY2021: $446MFY2022: $572MFY2023: $686MFY2024: $591MFY2025: $680M wins 2024-08-06 · → BYD industrial_arm — click for source2025-03-21 · Ningbo Yunsheng → rare_earth_magnets — click for source events
  • 2025-03-21 design-win Ningbo Yunsheng → rare_earth_magnets source ↗
  • 2024-08-06 design-win → BYD industrial_arm source ↗

Patents — 33 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 30
Electric motors 2
Robotics / manipulators 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$221M '18
$229M '19
$370M '20
$446M '21
$572M '22
$686M '23
$591M '24
$680M '25

operating income

$16M '18
$10M '19
$20M '20
$21M '21
$36M '22
$22M '23
$-117M '24
$10M '25

net income

$15M '18
$9M '19
$19M '20
$18M '21
$25M '22
$20M '23
$-119M '24
$7M '25

Buys from ← 1

🇨🇳 Ningbo Yunsheng rare_earth_magnets → EMG Servo Motors L3 50

Supplies → 1

🇨🇳 BYD industrial_arm L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

ER Series Industrial RobotsEMG Servo MotorsEC Series Servo Drives

EVE EnergypublicProduct-grade

physical ai · 🇨🇳 China · SZSE: 300014 · 30 sources · 0 products · 2013 patents

$9.1Brevenue · FY2025 · USD$16.6B mkt cap

EVE Energy is a China-based manufacturer of lithium batteries for electric vehicles, energy storage, and consumer electronics, founded in 2001 and headquartered in Huizhou. It is publicly listed in China.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.2BFY2021: $2.5BFY2022: $5.4BFY2023: $7.2BFY2024: $6.8BFY2025: $9.1B wins 2024-12-26 · → Tesla batteries — click for source events
  • 2024-12-26 design-win → Tesla batteries source ↗

Patents — 2013 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 1966
Other 18
Computing 12
Power electronics 10
Force / torque sensors 4
Robotics / manipulators 3

Financials — multi-year, confidence 1.0 (filings)

revenue

$658M '18
$928M '19
$1.2B '20
$2.5B '21
$5.4B '22
$7.2B '23
$6.8B '24
$9.1B '25

operating income

$92M '18
$237M '19
$285M '20
$456M '21
$518M '22
$715M '23
$693M '24
$464M '25

net income

$86M '18
$220M '19
$244M '20
$451M '21
$516M '22
$599M '23
$601M '24
$611M '25

Supplies → 1

🇺🇸 Tesla batteries → Powerwall L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

FANUC CorporationpublicProduct-grade

physical ai · 🇯🇵 Japan · TSE: 6954 · 46 sources · 2 products · 2142 patents

$5.3Brevenue · FY2026 · USD$38.2B mkt cap

Japanese maker of CNC systems, industrial robots, robomachines and lasers; among the world's top industrial-robot and cobot makers. Founded 1972 (spun off from Fujitsu); HQ Oshino-mura, Yamanashi.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $4.7BFY2021: $3.4BFY2022: $6.5BFY2023: $5.2BFY2024: $4.9BFY2025: $4.9BFY2026: $5.3B wins 2026-07-16 · → NVIDIA industrial_arm — click for source2026-04-11 · NVIDIA → ai_chips — click for source2023-08-09 · ATI Industrial Automation → force_torque — click for source events 2026-01-27 · financial — FANUC stock price was higher in trading activity.2025-04-01 · financial report — Fanuc Corporation reports half-year financial results for fiscal period 2025/04/01-2026/03/31.2025-01-27 · financial — FANUC stock rose due to strong business performance amid broader market buying.2022-03-28 · product launch — FANUC will launch CRX collaborative robots at MODEX 2022.
  • 2026-07-16 reported edge → NVIDIA industrial_arm source ↗
  • 2026-04-11 design-win NVIDIA → ai_chips source ↗
  • 2026-01-27 financial FANUC stock price was higher in trading activity.
  • 2025-04-01 financial report Fanuc Corporation reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2025-01-27 financial FANUC stock rose due to strong business performance amid broader market buying.
  • 2023-08-09 design-win ATI Industrial Automation → force_torque source ↗
  • 2022-03-28 product launch FANUC will launch CRX collaborative robots at MODEX 2022.

Patents — 2142 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 1686
Electric motors 206
Computing 73
Power electronics 45
Gears / reducers 42
Imaging / cameras 38
Force / torque sensors 21
Bearings 17
IMU / navigation 5
Batteries 5
Lidar / ranging 4

Newest 37 of 2142, most recent first — all on Google Patents →

Buys from ← 2

🇺🇸 NVIDIA ai_chips L2 50
🇺🇸 ATI Industrial Automation force_torque → Industrial robots L3 50

Supplies → 1

🇺🇸 NVIDIA industrial_arm L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

CNC systemsIndustrial robots

FormFactor, Inc.publicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: FORM · 31 sources · 6 products · 15 patents

$785Mrevenue · FY2025 · USD$8.3B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $694MFY2021: $770MFY2022: $748MFY2023: $663MFY2024: $764MFY2025: $785M wins 2025-01-09 · → Advantest ai_compute — click for source2026-07-10 · → SK hynix ai_compute — click for source2026-07-10 · → Micron ai_compute — click for source2026-07-10 · → Samsung Electronics ai_compute — click for source events 2026-06-17 · product launch — FormFactor Inc began trading January 2028 options contracts on Nasdaq.2026-06-12 · executive change — B. Riley analyst Craig Ellis upgraded FormFactor stock from Neutral to Buy on June 12 with a price target of $165.2026-06-09 · financial — FormFactor has received increased earnings estimates from analysts over the last 60 days, with Zacks Consensus Estimate for the current quarter rising from 55 cents to 61 cents per share.2025-12-31 · financial — We used about $20 million in cash to acquire Keystone Photonics, a key element of our co-packaged optics product roadmap.2025-12-01 · acquisition — We recently made an important strategic initiative to our optical test capabilities with the December acquisition of Keystone Photonics.2025-10-29 · financial — FormFactor's fourth quarter 2025 guidance projects revenues of $210 million, plus or minus $5 million, with non-GAAP gross margins of 42%, plus or minus 150 basis points.2025-10-29 · financial — FormFactor's third quarter 2025 revenue was $202.7 million with non-GAAP gross margins of 41%, up 250 basis points from 38.5% in Q2 2025, and non-GAAP EPS of $0.33.2025-10-29 · capacity expansion — FormFactor acquired and is developing a manufacturing facility in Farmers Branch, Texas with expected cash expenditures between $140 million and $170 million over the course of 2026, with initial capacity coming online late in 2026 and the majority coming online in 2027.2025-08-12 · executive change — Aric McKinnis became Chief Financial Officer on August 12, 2025.2025-07-29 · financial — FormFactor entered into a new $150 million revolving credit facility agreement.2025-06-02 · capacity expansion — FormFactor purchased a fit-for-purpose brownfield manufacturing facility in Farmers Branch, Texas for approximately $55 million.2025-06-02 · capacity expansion — The Farmers Branch facility acquisition allows FormFactor to rapidly and cost effectively expand process capability and capacity beyond current manufacturing footprint.2025-02-05 · acquisition — FormFactor announced acquisition of 20% stake in FICT Limited, a leading supplier of complex multi-layer organic substrates and printed circuit boards to semiconductor test and high-performance computing customers, for approximately $60 million.2025-01-05 · partnership — FormFactor announced technology partnership and share purchase agreements with Advantest Corporation, the market leader in automated test equipment, building upon multi-year collaboration including FormFactor's 2020 purchase of Advantest probe-card assets.2024-12-30 · financial — HBM revenues for fiscal 2024 totaled $126 million, a nearly $100 million increase from fiscal 2023.2024-12-30 · financial — Q4 2024 revenues were $189.5 million with non-GAAP gross margin of 40.2%; full year 2024 revenues reached $764 million, up 15.2% from $663 million in fiscal 2023.2024-10-30 · financial — FormFactor's third quarter revenue exceeded the outlook range and set an all-time record of $207.9 million.2024-10-30 · partnership — FormFactor is partnering with other suppliers on equipment needed for high volume production as co-packaged optics matures.2024-10-30 · financial — Q4 revenues expected of $190 million, plus or minus $5 million.2024-10-30 · capacity expansion — CapEx expected to be closer to the midpoint of the $35 million to $45 million range for 2024.2024-10-30 · product launch — FormFactor expects to begin HBM4 activity in Q4 with several initial HBM4 designs across multiple DRAM customers.2024-10-30 · acquisition — FormFactor divested its China operations earlier in 2024 and now does business through the company that bought those operations as a distributor.2024-10-30 · financial — DRAM probe-card revenue set a third consecutive quarterly record at $60.2 million in Q3.2024-07-31 · product launch — Customers are deploying FormFactor's turnkey electro-optical measurement systems built on our CM300 and SUMMIT200 engineering probers, together with our proprietary optical probes.2024-07-31 · acquisition — We divested our China operations and then formed an exclusive distributor ship with the purchaser of that business.2024-07-31 · partnership — In co-packaged optics, which is poised to revolutionize chip-to-chip communication in the data center by significantly reducing power consumption at high data rates, we're collaborating with key customers in the early stages of the lab to fab transition from R&D to low-volume pro2024-07-31 · financial — Second quarter HBM revenue is greater than FormFactor's total quarterly DRAM revenue in each quarter of 2023.2024-07-31 · financial — In the first half of 2024 alone, we doubled the HBM revenue we delivered in all of 2023.2024-07-31 · financial — Second quarter revenues were $197.5 million, $2.5 million above the midpoint of our outlook range.2024-07-31 · financial — DRAM probe-card revenue reached record levels with revenue from high-bandwidth memory or HBM doubling for the third consecutive quarter to nearly 75% of our DRAM revenue.2024-07-31 · financial — We expect that our leadership positions in combined electrical and optical test will provide a new growth vector for both our systems and probe-card businesses as silicon photonics matures and moves to high-volume production in the coming years.2024-07-31 · financial — Q3 revenue of $200 million plus or minus $5 million with a slight increase over Q2 coming from DRAM systems.2024-07-31 · financial — FormFactor's second-quarter revenue, non-GAAP gross margin and non-GAAP EPS all exceeded the midpoint of the outlook range we provided in May.

Rolled up across FormFactor + its subsidiaries

  • 2026-07-10 design-win → SK hynix ai_compute source ↗
  • 2026-07-10 design-win → Micron ai_compute source ↗
  • 2026-07-10 design-win → Samsung Electronics ai_compute source ↗
  • 2026-06-17 product launch FormFactor Inc began trading January 2028 options contracts on Nasdaq.
  • 2026-06-12 executive change B. Riley analyst Craig Ellis upgraded FormFactor stock from Neutral to Buy on June 12 with a price target of $165.
  • 2026-06-09 financial FormFactor has received increased earnings estimates from analysts over the last 60 days, with Zacks Consensus Estimate for the current quarter rising from 55 cents to 61 cents per share.
  • 2025-12-31 financial We used about $20 million in cash to acquire Keystone Photonics, a key element of our co-packaged optics product roadmap.
  • 2025-12-01 acquisition We recently made an important strategic initiative to our optical test capabilities with the December acquisition of Keystone Photonics.
  • 2025-10-29 financial FormFactor's fourth quarter 2025 guidance projects revenues of $210 million, plus or minus $5 million, with non-GAAP gross margins of 42%, plus or minus 150 basis points.
  • 2025-10-29 financial FormFactor's third quarter 2025 revenue was $202.7 million with non-GAAP gross margins of 41%, up 250 basis points from 38.5% in Q2 2025, and non-GAAP EPS of $0.33.
  • 2025-10-29 capacity expansion FormFactor acquired and is developing a manufacturing facility in Farmers Branch, Texas with expected cash expenditures between $140 million and $170 million over the course of 2026, with initial capacity coming online late in 2026 and the majority coming online in 2027.
  • 2025-08-12 executive change Aric McKinnis became Chief Financial Officer on August 12, 2025.
  • 2025-07-29 financial FormFactor entered into a new $150 million revolving credit facility agreement.
  • 2025-06-02 capacity expansion FormFactor purchased a fit-for-purpose brownfield manufacturing facility in Farmers Branch, Texas for approximately $55 million.
  • 2025-06-02 capacity expansion The Farmers Branch facility acquisition allows FormFactor to rapidly and cost effectively expand process capability and capacity beyond current manufacturing footprint.
  • 2025-02-05 acquisition FormFactor announced acquisition of 20% stake in FICT Limited, a leading supplier of complex multi-layer organic substrates and printed circuit boards to semiconductor test and high-performance computing customers, for approximately $60 million.
  • 2025-01-09 design-win → Advantest ai_compute source ↗
  • 2025-01-05 partnership FormFactor announced technology partnership and share purchase agreements with Advantest Corporation, the market leader in automated test equipment, building upon multi-year collaboration including FormFactor's 2020 purchase of Advantest probe-card assets.
  • 2024-12-30 financial HBM revenues for fiscal 2024 totaled $126 million, a nearly $100 million increase from fiscal 2023.
  • 2024-12-30 financial Q4 2024 revenues were $189.5 million with non-GAAP gross margin of 40.2%; full year 2024 revenues reached $764 million, up 15.2% from $663 million in fiscal 2023.
  • 2024-10-30 financial FormFactor's third quarter revenue exceeded the outlook range and set an all-time record of $207.9 million.
  • 2024-10-30 partnership FormFactor is partnering with other suppliers on equipment needed for high volume production as co-packaged optics matures.
  • 2024-10-30 financial Q4 revenues expected of $190 million, plus or minus $5 million.
  • 2024-10-30 capacity expansion CapEx expected to be closer to the midpoint of the $35 million to $45 million range for 2024.

Patents — 15 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 9
Computing 5
Robotics / manipulators 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$694M '20
$770M '21
$748M '22
$663M '23
$764M '24
$785M '25

operating income

$84M '20
$98M '21
$55M '22
$83M '23
$65M '24
$64M '25

net income

$79M '20
$84M '21
$51M '22
$82M '23
$70M '24
$54M '25

Supplies → 4

🇯🇵 Advantest ai_compute L2 50
🇰🇷 SK hynix ai_compute → HBM (High Bandwidth Memory) L3 50
🇺🇸 Micron ai_compute → HBM (High-Bandwidth Memory) L3 50
🇰🇷 Samsung Electronics ai_compute → HBM (High Bandwidth Memory) L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

MemoRY Test SolutionsCascade Microtech Test SystemsPowerSiteNanoProbeContactorsProbe Cards

GlobalFoundriespublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: GFS · 62 sources · 4 products · 813 patents

$6.8Brevenue · FY2025 · USD$32.0B mkt cap

Mature-node foundry

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $4.9BFY2021: $6.6BFY2022: $8.1BFY2023: $7.4BFY2024: $6.8BFY2025: $6.8B wins 2026-05-05 · → Navitas foundry — click for source2025-11-12 · → Hyundai Motor foundry — click for source2026-02-11 · Corning → advanced_packaging — click for source2025-11-12 · → Coherent foundry — click for source2025-11-12 · → Qualcomm foundry — click for source2025-11-12 · → NXP Semiconductors foundry — click for source2026-07-07 · Applied Materials → ai_chips — click for source2023-03-06 · Entegris → ai_chips — click for source2025-02-18 · Cadence Design → ai_chips — click for source2025-11-12 · → Infineon foundry — click for source2026-02-25 · Synopsys → ai_chips — click for source2026-07-08 · → Applied Materials foundry — click for source2023-06-10 · Murata Manufacturing → imu — click for source events 2026-07-07 · partnership — GlobalFoundries partnered with Applied Materials on the SENZ integrated ambient visual platform for AI-powered smart glasses.2026-07-01 · financial — GlobalFoundries Inc (GFS) stock is trading at $78.40 with a 0.6% annualized dividend yield and 55% trailing twelve month volatility.2026-06-30 · financial — GlobalFoundries stock surged 123.5% year to date with a P/E ratio of 58.1x, trading below the semiconductor industry average of 75.5x but above its tailored fair P/E of 51.0x.2026-06-25 · product launch — GlobalFoundries developed radiation-hardened chips for BAE Systems designed to operate in space environments.2026-03-01 · partnership — In March, GF announced a partnership with Inova Semiconductors to deliver our robotics control reference platform that combines MIPS open risk 5 compute and mixed-signal technologies with Inova's high-speed communication links.2025-11-01 · M&A — GlobalFoundries acquired InfiniLink to bring valuable state-of-the-art IP and synergetic customer bases for silicon photonics.2025-11-01 · M&A — GlobalFoundries acquired Advanced Micro Foundry (AMF) in November 2025 to accelerate silicon photonics roadmap and broaden customer base.2025-11-01 · M&A — Advanced Micro Foundry was acquired by GlobalFoundries in November of last year.2025-08-01 · M&A — The acquisition of MIPS closed in August 2025.2025-08-01 · M&A — GlobalFoundries acquired MIPS to enable diversified and holistic technology solutions provider with expansive portfolio in physical AI.2025-06-01 · capacity expansion — GlobalFoundries increased commitment to invest $16 billion in the U.S. with plans to expand manufacturing and advanced packaging capabilities in New York and Vermont facilities.2024-07-01 · M&A — GlobalFoundries completed the acquisition of Tagore Technologies' gallium nitride power business, which includes its extensive IP portfolio and its team of GaN engineers, which closed at the beginning of July.2022-01-01 · financial — The U.S. Department of Defense granted GlobalFoundries $117 million in 2022 and $8 million previously to relocate production to Malta.
  • 2026-07-08 design-win → Applied Materials foundry source ↗
  • 2026-07-07 partnership GlobalFoundries partnered with Applied Materials on the SENZ integrated ambient visual platform for AI-powered smart glasses.
  • 2026-07-07 design-win Applied Materials → ai_chips source ↗
  • 2026-07-01 financial GlobalFoundries Inc (GFS) stock is trading at $78.40 with a 0.6% annualized dividend yield and 55% trailing twelve month volatility.
  • 2026-06-30 financial GlobalFoundries stock surged 123.5% year to date with a P/E ratio of 58.1x, trading below the semiconductor industry average of 75.5x but above its tailored fair P/E of 51.0x.
  • 2026-06-25 product launch GlobalFoundries developed radiation-hardened chips for BAE Systems designed to operate in space environments.
  • 2026-05-05 design-win → Navitas foundry source ↗
  • 2026-03-01 partnership In March, GF announced a partnership with Inova Semiconductors to deliver our robotics control reference platform that combines MIPS open risk 5 compute and mixed-signal technologies with Inova's high-speed communication links.
  • 2026-02-25 design-win Synopsys → ai_chips source ↗
  • 2026-02-11 design-win Corning → advanced_packaging source ↗
  • 2025-11-12 design-win → Hyundai Motor foundry source ↗
  • 2025-11-12 design-win → Coherent foundry source ↗
  • 2025-11-12 design-win → Qualcomm foundry source ↗
  • 2025-11-12 design-win → NXP Semiconductors foundry source ↗
  • 2025-11-12 design-win → Infineon foundry source ↗
  • 2025-11-01 M&A GlobalFoundries acquired InfiniLink to bring valuable state-of-the-art IP and synergetic customer bases for silicon photonics.
  • 2025-11-01 M&A GlobalFoundries acquired Advanced Micro Foundry (AMF) in November 2025 to accelerate silicon photonics roadmap and broaden customer base.
  • 2025-11-01 M&A Advanced Micro Foundry was acquired by GlobalFoundries in November of last year.
  • 2025-08-01 M&A The acquisition of MIPS closed in August 2025.
  • 2025-08-01 M&A GlobalFoundries acquired MIPS to enable diversified and holistic technology solutions provider with expansive portfolio in physical AI.
  • 2025-06-01 capacity expansion GlobalFoundries increased commitment to invest $16 billion in the U.S. with plans to expand manufacturing and advanced packaging capabilities in New York and Vermont facilities.
  • 2025-02-18 design-win Cadence Design → ai_chips source ↗
  • 2024-07-01 M&A GlobalFoundries completed the acquisition of Tagore Technologies' gallium nitride power business, which includes its extensive IP portfolio and its team of GaN engineers, which closed at the beginning of July.
  • 2023-06-10 design-win Murata Manufacturing → imu source ↗
  • 2023-03-06 design-win Entegris → ai_chips source ↗
  • 2022-01-01 financial The U.S. Department of Defense granted GlobalFoundries $117 million in 2022 and $8 million previously to relocate production to Malta.

Patents — 813 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 631
Memory 61
Other 61
Computing 56
Lidar / ranging 2
Power electronics 2

Newest 22 of 813, most recent first — all on Google Patents →

  • 2026-07-02US20260188384EXTERNAL PAD ISOLATION POWER SWITCH FOR RRAM SECURITY
  • 2026-07-02US20260189141MULTI-STAGE HIGH VOLTAGE CHARGE PUMP CIRCUIT WITH LOW VOLTAGE DEVICES
  • 2026-06-04US20260155164WORD LINE DRIVER SYSTEM FOR NON-VOLATILE MEMORY STRUCTURE
  • 2026-05-21US20260141950RESISTIVE RANDOM-ACCESS MEMORY STRUCTURE AND METHOD
  • 2026-05-14US20260134912RESISTIVE RANDOM ACCESS MEMORY (RRAM) STRUCTURE AND MULT-STEP MEMORY OPRERATION WITH ALL WORD LINES ACTIVATED
  • 2026-05-14US20260135477LOW LEAKAGE CHARGE/DISCHARGE CIRCUIT
  • 2026-04-30US20260120762WORD LINE CHARGE PUMP CIRCUIT AND MEMORY DEVICE INCLUDING THE SAME
  • 2026-04-23US20260111631MODELING ENERGY CONSUMPTION IN TOOLS
  • 2026-04-16US20260105942Memory Sense Amplifier
  • 2026-04-09US20260101503DUAL-ANTIFUSE DEVICES AND MEMORY STRUCTURES INCLUDING DUAL-ANTIFUSE DEVICES
  • 2026-03-19US20260081587STRUCTURE WITH SWITCHABLE VOLTAGE DIVIDER AND RELATED METHOD
  • 2026-03-12US20260073114ILLUSTRATION GENERATOR FOR INTEGRATED CIRCUIT DESIGN AND METHOD
  • 2026-03-05US20260066889LOW-POWER LOW-AREA DEADTIME GENERATOR
  • 2026-02-12US20260047085MEMORY CELL INCLUDING DUAL-ANTIFUSE DEVICE, MEMORY STRUCTURE, AND OPERATING METHOD
  • 2026-02-05US20260037710MODIFYING INTEGRATED CIRCUIT LAYOUTS IN COMPLIANCE WITH DESIGN RULES
  • 2026-02-05US20260037711MANUFACTURE AND LAYOUT ADJUSTMENT OF INTEGRATED CIRCUITS WITH MARGIN ANALYSIS
  • 2026-01-29US20260030421SYSTEM AND METHOD FOR DEVELOPING AND EVALUATING PROTOTYPE PARAMETERIZED CELLS
  • 2025-12-11US2025378877Resistive random access memory (RRAM) architecture and method
  • 2025-11-13US2025348054ANALYSIS AND MANUFACTURE OF CURVED FEATURES FOR INTEGRATED CIRCUITS
  • 2025-07-31US2025245410METHOD AND SYSTEM EMPLOYING LINEAR DISTANCE MARKER-BASED DESIGN LAYOUT ANALYSIS
  • 2025-07-31US2025246235High voltage column multiplexor
  • 2025-07-24US2025238589INTEGRATED CIRCUIT DESIGN METHOD AND SYSTEM EMPLOYING PARASITIC DIODE ANALYSIS

Financials — multi-year, confidence 1.0 (filings)

revenue

$6.2B '18
$5.8B '19
$4.9B '20
$6.6B '21
$8.1B '22
$7.4B '23
$6.8B '24
$6.8B '25

operating income

$-2523M '18
$-1625M '19
$-1656M '20
$-60M '21
$1.2B '22
$1.1B '23
$-214M '24
$797M '25

net income

$-2702M '18
$-1371M '19
$-1350M '20
$-250M '21
$1.4B '22
$1.0B '23
$-265M '24
$885M '25

Sources: GFS 20-F 2024-04-29 (acc 0001709048-24-000013) · GFS 20-F 2025-03-20 (acc 0001709048-25-000024) · GFS 20-F 2026-02-27 (acc 0001709048-26-000022) · GFS 20-F 2023-04-14 (acc 0001709048-23-000013)

Buys from ← 6

🇺🇸 Corning advanced_packaging L2 50
🇺🇸 Applied Materials ai_chips L2 50
🇺🇸 Entegris ai_chips L2 53
🇺🇸 Cadence Design ai_chips L2 50
🇺🇸 Synopsys ai_chips L2 50
🇯🇵 Murata Manufacturing imu L2 53

Supplies → 8

🇺🇸 Navitas foundry → GaN power integrated circuits (ICs) L3 50
🇰🇷 Hyundai Motor foundry L2 50
🇺🇸 Coherent foundry L2 50
🇺🇸 Qualcomm foundry L2 50
🇯🇵 TDK InvenSense foundry L2 50
🇳🇱 NXP Semiconductors foundry L2 50
🇩🇪 Infineon foundry → Power semiconductors L3 50
🇺🇸 Applied Materials foundry L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

12FDX22FDX14nm FinFET8HP

Harmonic Drive Systems Inc.publicProduct-grade

physical ai · 🇯🇵 Japan · TSE: 6324 · 37 sources · 5 products · 805 patents

$367Mrevenue · FY2026 · USD$3.8B mkt cap

Japanese maker of strain-wave gearing (HarmonicDrive® precision speed reducers) and mechatronics products — rotary/linear actuators, AC servo motors and gear heads. Supplier to robot OEMs, semiconductor equipment and high-precision machinery.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $345MFY2021: $228MFY2022: $351MFY2023: $440MFY2024: $344MFY2025: $343MFY2026: $367M wins 2024-08-07 · → Harmonic Drive actuators_reducers — click for source2026-07-17 · Daido Steel → steel — click for source2024-11-05 · → Boston Dynamics actuators_reducers — click for source2026-07-17 · Sanyo Special Steel → steel — click for source2025-06-30 · → Tesla harmonic_reducer — click for source events 2026-02-01 · listing change — Transferred its TSE listing from the Standard Market to the Prime Market in February 2026.2025-04-01 · financial report — Harmonic Drive Systems reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Rolled up across Harmonic Drive + its subsidiaries

  • 2026-07-17 reported edge Daido Steel → steel source ↗
  • 2026-07-17 reported edge Sanyo Special Steel → steel source ↗
  • 2026-02-01 listing change Transferred its TSE listing from the Standard Market to the Prime Market in February 2026.
  • 2025-06-30 design-win → Tesla harmonic_reducer source ↗
  • 2025-04-01 financial report Harmonic Drive Systems reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2024-11-05 design-win → Boston Dynamics actuators_reducers source ↗
  • 2024-08-07 design-win → Harmonic Drive actuators_reducers source ↗

Patents — 805 CPC-scoped to physical ai (physical-AI-relevant classes)

Gears / reducers 602
Electric motors 75
Bearings 73
Force / torque sensors 27
Other 25
Robotics / manipulators 3

IP chokepoint in: Gears / reducers

Newest 13 of 805, most recent first — all on Google Patents →

Buys from ← 3

🇯🇵 Harmonic Winbell actuators_reducers → HarmonicDrive precision speed reducer L3 50
🇯🇵 Daido Steel steel L2
🇯🇵 Sanyo Special Steel steel L2

Supplies → 2

🇨🇳 Harmonic Drive (Shanghai) harmonic_reducers → Harmonic Gear L3 50
🇺🇸 Tesla harmonic_reducer → Tesla Optimus L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Linear ActuatorHarmonicPlanetary / AccuDrive planetary reducerRotary ActuatorAC servo motors & gear headsHarmonicDrive precision speed reducer

Hesai GrouppublicRelationships + financials

physical ai · 🇨🇳 China · NASDAQ: HSAI · 23 sources · 6 products · 895 patents

$448Mrevenue · FY2025 · USD$2.3B mkt cap

Hesai Group is a China-based, publicly listed lidar sensor manufacturer, founded in 2014, producing the Pandar and QT/XT series for autonomous vehicles and robotics applications.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $61MFY2021: $107MFY2022: $174MFY2023: $264MFY2024: $285MFY2025: $433M wins 2025-11-11 · → Toyota Motor vision — click for source2026-03-24 · → BYD vision — click for source events 2026-07-10 · disclosure — Hesai Group completed a 1-to-8 share subdivision of its Class A and Class B ordinary shares, effective July 10, 2026 on the Hong Kong Stock Exchange. Simultaneously, the ADS ratio changed from 1 ADS per Class B share to 1 ADS per 8 Class B shares, with no new ADSs issued and outs2026-07-10 · disclosure — Hesai Group's share subdivision became effective on July 10, 2026, with corresponding adjustments made to outstanding share options and RSUs.2026-07-08 · disclosure — Hesai Group announced the record date for its 2026 Second Extraordinary General Meeting.2026-07-07 · disclosure — Hesai Group filed a routine monthly return of equity issuer on movements in securities for the month ended June 30, 2026, as required under SEC rules for foreign private issuers.2026-01-01 · capacity expansion — Hesai raised 2026 lidar shipment outlook to between 3 million and 3.5 million units.2025-12-31 · capacity expansion — Hesai is expanding domestic production capacity to two million units by the end of 2025, with new production lines beginning mass production in Q3.2025-12-31 · financial — Hesai achieved industry first full year GAAP net income of RMB 436 million in 2025.2025-12-31 · capacity expansion — Hesai produced over 1,000,000 LiDAR units in 2025 alone and is the first to do so globally.2025-11-01 · product launch — Hesai launched revamped ATX lidar powered by in-house FMC500 500 SoC in November, expected to begin SOP in April 2026.2025-09-30 · financial — Hesai delivered a record quarterly GAAP net income of RMB 256 million in Q3 2025.2025-09-30 · financial — Q3 2025 total shipments reached 441,398 units, up 229% year over year, while net revenue surged 47% to $112 million.2025-09-01 · financial — Hesai successfully listed on the main board of the Hong Kong Stock Exchange in September 2025, raising $614 million after the Green Shoe Option.2025-05-01 · litigation — The US District Court for the District of Delaware officially dismissed Ouster's patent infringement case against Hesai in early May 2025 with no conditions, no financial settlement, and no injunctive relief.2025-05-01 · capacity expansion — Hesai signed a lease for a new factory in Southeast Asia in May 2025, planned to break ground later in 2025 and be operational by late 2026 or early 2027.2025-04-01 · product launch — Hesai launched its Infinity IB LiDAR solution in April 2025, pairing forward-facing long-range ETX LiDAR with FTX blind spot LiDARs.2025-04-01 · product launch — Hesai launched the Infinity I LiDAR solution in April 2025 alongside three next-generation automotive-grade LiDAR sensors in three configurations (IA, IB, IC).2025-03-31 · financial — Hesai's total revenues reached RMB 525.3 million ($752.4 million) in Q1 2025, a 46% year-over-year increase.2025-03-31 · financial — Hesai narrowed its first-quarter net loss by 84% year over year to RMB 70.5 million ($2.4 million) in Q1 2025.2025-02-01 · partnership — In February, BYD, the world's largest EV maker, announced that all its models will feature next-generation ADAS, God's Eyes, making it accessible to everyone.2025-01-01 · product launch — ATX LiDAR, our category-defining product, delivers unbeatable cost performance priced at just $200, with mass production kicking off in Q1 2025.2025-01-01 · capacity expansion — In 2025, we are launching new production lines in Q1, which will begin production in Q3, and by the end of the year, our annualized production capacity is expected to reach 2 million units.2024-12-31 · financial — Hesai Group achieved full year non-GAAP net profit of RMB14 million or USD1.9 million, making it the world's first LiDAR company to achieve full-year non-GAAP net profits.2024-12-31 · financial — In Q4 2024 alone, beyond JT, we shipped approximately 7,000 robotics LiDAR units to L4 customers, powering thousands of autonomous vehicles.2024-12-31 · financial — Hesai Group shipped over 500,000 LiDAR units in 2024, achieving an impressive growth rate of more than doubling each year for 4 consecutive years.2023-12-31 · financial — Hesai captured 37% of the global LiDAR market and 74% share of the global robotaxi LiDAR market in 2023.
  • 2026-07-10 disclosure Hesai Group completed a 1-to-8 share subdivision of its Class A and Class B ordinary shares, effective July 10, 2026 on the Hong Kong Stock Exchange. Simultaneously, the ADS ratio changed from 1 ADS per Class B share to 1 ADS per 8 Class B shares, with no new ADSs issued and outs
  • 2026-07-10 disclosure Hesai Group's share subdivision became effective on July 10, 2026, with corresponding adjustments made to outstanding share options and RSUs.
  • 2026-07-08 disclosure Hesai Group announced the record date for its 2026 Second Extraordinary General Meeting.
  • 2026-07-07 disclosure Hesai Group filed a routine monthly return of equity issuer on movements in securities for the month ended June 30, 2026, as required under SEC rules for foreign private issuers.
  • 2026-03-24 design-win → BYD vision source ↗
  • 2026-01-01 capacity expansion Hesai raised 2026 lidar shipment outlook to between 3 million and 3.5 million units.
  • 2025-12-31 capacity expansion Hesai is expanding domestic production capacity to two million units by the end of 2025, with new production lines beginning mass production in Q3.
  • 2025-12-31 financial Hesai achieved industry first full year GAAP net income of RMB 436 million in 2025.
  • 2025-12-31 capacity expansion Hesai produced over 1,000,000 LiDAR units in 2025 alone and is the first to do so globally.
  • 2025-11-11 design-win → Toyota Motor vision source ↗
  • 2025-11-01 product launch Hesai launched revamped ATX lidar powered by in-house FMC500 500 SoC in November, expected to begin SOP in April 2026.
  • 2025-09-30 financial Hesai delivered a record quarterly GAAP net income of RMB 256 million in Q3 2025.
  • 2025-09-30 financial Q3 2025 total shipments reached 441,398 units, up 229% year over year, while net revenue surged 47% to $112 million.
  • 2025-09-01 financial Hesai successfully listed on the main board of the Hong Kong Stock Exchange in September 2025, raising $614 million after the Green Shoe Option.
  • 2025-05-01 litigation The US District Court for the District of Delaware officially dismissed Ouster's patent infringement case against Hesai in early May 2025 with no conditions, no financial settlement, and no injunctive relief.
  • 2025-05-01 capacity expansion Hesai signed a lease for a new factory in Southeast Asia in May 2025, planned to break ground later in 2025 and be operational by late 2026 or early 2027.
  • 2025-04-01 product launch Hesai launched its Infinity IB LiDAR solution in April 2025, pairing forward-facing long-range ETX LiDAR with FTX blind spot LiDARs.
  • 2025-04-01 product launch Hesai launched the Infinity I LiDAR solution in April 2025 alongside three next-generation automotive-grade LiDAR sensors in three configurations (IA, IB, IC).
  • 2025-03-31 financial Hesai's total revenues reached RMB 525.3 million ($752.4 million) in Q1 2025, a 46% year-over-year increase.
  • 2025-03-31 financial Hesai narrowed its first-quarter net loss by 84% year over year to RMB 70.5 million ($2.4 million) in Q1 2025.
  • 2025-02-01 partnership In February, BYD, the world's largest EV maker, announced that all its models will feature next-generation ADAS, God's Eyes, making it accessible to everyone.
  • 2025-01-01 product launch ATX LiDAR, our category-defining product, delivers unbeatable cost performance priced at just $200, with mass production kicking off in Q1 2025.

Patents — 895 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 866
Electric motors 7
Imaging / cameras 6
Other 6
Power electronics 5
Bearings 2
Computing 1
IMU / navigation 1
Robotics / manipulators 1

Newest 1 of 895, most recent first — all on Google Patents →

  • 2025-02-06WO2025026360SCANNER APPARATUS FOR LIDAR AND LIDAR

Financials — multi-year, confidence 1.0 (filings)

revenue

$61M '20
$107M '21
$174M '22
$264M '23
$285M '24
$433M '25

operating income

$-15M '20
$-39M '21
$-55M '22
$-80M '23
$-28M '24
$24M '25

net income

$-16M '20
$-36M '21
$-44M '22
$-67M '23
$-14M '24
$62M '25

Sources: HSAI 20-F 2026-04-24 (acc 0001104659-26-048025) · HSAI 20-F 2023-04-20 (acc 0001104659-23-047439) · HSAI 20-F 2025-04-01 (acc 0001410578-25-000614) · HSAI 20-F 2024-04-25 (acc 0001104659-24-051452)

Supplies → 2

Toyota Motor vision L2 50
🇨🇳 BYD vision L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Pandar SeriesQT64XT SeriesQT ProQT SeriesXTM

Hewlett Packard EnterprisepublicRelationships + financials

ai compute · 🇺🇸 United States · NYSE: HPE · 48 sources · 12 products · 25 patents

$34.3Brevenue · FY2025 · USD$59.8B mkt cap

Enterprise servers, HPC, and AI infrastructure (GreenLake), plus networking (Aruba; acquiring Juniper). Spun out of Hewlett-Packard in the 2015 split; HP Inc holds the PC/printer business.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $26.9BFY2021: $27.9BFY2022: $28.1BFY2023: $29.1BFY2024: $30.1BFY2025: $34.3B wins 2026-07-11 · Broadcom → custom_asic — click for source2020-09-16 · Intel → merchant_gpu — click for source2023-02-13 · Advanced Micro Devices → merchant_gpu — click for source events 2025-07-02 · M&A — Closing our acquisition of Juniper Networks.2024-08-31 · M&A — At the end of August, we closed our acquisition of Morpheus Data.2024-06-01 · partnership — In June, we jointly announced NVIDIA AI Computing by HPE, a portfolio of codeveloped AI solutions and joint go-to-market integrations that enable enterprises to accelerate adoption of generative AI.
  • 2026-07-11 design-win Broadcom → custom_asic source ↗
  • 2025-07-02 M&A Closing our acquisition of Juniper Networks.
  • 2024-08-31 M&A At the end of August, we closed our acquisition of Morpheus Data.
  • 2024-06-01 partnership In June, we jointly announced NVIDIA AI Computing by HPE, a portfolio of codeveloped AI solutions and joint go-to-market integrations that enable enterprises to accelerate adoption of generative AI.
  • 2023-02-13 design-win Advanced Micro Devices → merchant_gpu source ↗
  • 2020-09-16 design-win Intel → merchant_gpu source ↗

Patents — 25 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 24
Other 1

Newest 24 of 25, most recent first — all on Google Patents →

  • 2026-07-09US20260195276BASEBOARD MANAGEMENT CONTROL USING SHARED MEMORY
  • 2026-07-09US20260195300IDENTIFYING STAGNANT JOURNALS IN A DEDUPLICATION STORAGE SYSTEM
  • 2026-07-09US20260195315NETWORK SWITCH CIRCUITRY WITH IN-MEMORY DATABASE HAVING SEMI-LOCKLESS ATOMIC OPERATIONS
  • 2026-07-09US20260197330UNAUTHORIZED DATA TRANSFER DETECTION
  • 2026-06-25US20260178209STREAMING CONVERSION OF VIRTUAL DISK IMAGES FOR ORCHESTRATION AND MANAGEMENT OF HETEROGENEOUS COMPUTING RESOURCES
  • 2026-06-25US20260178367MULTIPLE NODE SERVERS HAVING DISTRIBUTED MANAGEMENT APPLICATION OPERATING ENVIRONMENTS
  • 2026-06-25US20260178390DISTRIBUTED WORKER FOR ORCHESTRATION AND MANAGEMENT OF HETEROGENEOUS COMPUTING RESOURCES
  • 2026-06-18US20260169773ML-BASED PERFORMANCE OPTIMIZATION FRAMEWORK FOR RUNTIME ENVIRONMENTS ACROSS MULTIPLE PROGRAMMING LANGUAGES
  • 2026-06-18US20260169800LATENCY AND ERROR-HISTORY BASED FABRIC-ATTACHED MEMORY ALLOCATION
  • 2026-06-18US20260169826TAILORING APPLICATION WORKLOAD ACCELERATION
  • 2026-06-18US20260169887Performance Variability Optimization
  • 2026-06-18US20260169898FILTERING TESTS BASED ON TAGS
  • 2026-06-18US20260169924Deduplication of refresh entries in a multi-consumer versioning system
  • 2026-06-18US20260173301CONFIGURABLE POWER INPUT MODULE FOR COMPUTE RACKS
  • 2026-06-11US20260161262SMART PERFORMANCE ANALYSIS AND ANOMALY DETECTION FOR HPC AND AI SYSTEMS
  • 2026-06-11US20260161296DETECTING MEMORY CAPACITY ANOMALIES IN SPARSE DATA ENVIRONMENTS
  • 2026-06-11US20260161309SELF-ADAPTIVE POWER ADJUSTMENT FOR NVME DRIVES
  • 2026-06-11US20260161379UPDATE PACKAGING FOR DISCONNECTED PRIVATE CLOUD
  • 2026-06-11US20260161468RESOURCE REQUEST VALUE GENERATION
  • 2026-06-11US20260161583MULTI-TRAFFIC-CLASS TRACKER ARBITRATION WITH FOCUS AND PRIORITIZED DEALLOCATION
  • 2026-06-11US20260161584ACCELERATED COMPUTATION OF DIRECT MEMORY ACCESS SCATTER CONTEXT FOR GET RESPONSE
  • 2026-06-11US20260161726SOLVING DISCRETE OPTIMIZATION PROBLEMS
  • 2026-05-28US20260147625ORCHESTRATION AND MANAGEMENT OF HETEROGENEOUS COMPUTING RESOURCES
  • 2026-05-28US20260147641REUSABLE BARRIER FOR SYNCHRONIZATION AMONG MULTIPLE PROCESSES

Financials — multi-year, confidence 1.0 (filings)

revenue

$26.9B '20
$27.9B '21
$28.1B '22
$29.1B '23
$30.1B '24
$34.3B '25

operating income

$1.6B '20
$2.2B '21
$1.8B '22
$2.4B '23
$2.4B '24
$1.6B '25

net income

$-322M '20
$3.4B '21
$868M '22
$2.0B '23
$2.6B '24
$57M '25

Buys from ← 5

🇺🇸 Broadcom custom_asic L2 50
🇺🇸 Intel merchant_gpu L2 50
🇺🇸 NVIDIA ai_chips L2 50
Hon Hai Precision Industry Contract manufacturing / assembly of HPE servers (including AI servers) L2 50
🇺🇸 Advanced Micro Devices merchant_gpu L2 50

Supplies → 1

🇺🇸 Skild AI ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

SynergyHPE Cray EXProLiant ServersNimble StorageAruba NetworksPrimeraGreenLakeSimpliVityHPE GreenLakeHPE Private Cloud AIHPE ProLiantApollo Servers

Hiwin TechnologiespublicProduct-grade

physical ai · 🇹🇼 Taiwan · TWSE: 2049 · 1 sources · 5 products · 31 patents

$750Mrevenue · FY2025 · USD$3.4B mkt cap

Hiwin Technologies is a Taiwan-based manufacturer of precision mechanical components, including ballscrews, linear guides, roller screws, and actuators used in automation and robotics. Founded in 1989, it is publicly listed in Taiwan.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $663MFY2021: $849MFY2022: $911MFY2023: $759MFY2024: $758MFY2025: $750M wins 2024-11-29 · → Boston Dynamics roller_screws — click for source events
  • 2024-11-29 design-win → Boston Dynamics roller_screws source ↗

Patents — 31 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 29
Gears / reducers 1
Electric motors 1

Newest 1 of 31, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$977M '18
$656M '19
$663M '20
$849M '21
$911M '22
$759M '23
$758M '24
$750M '25

operating income

$214M '18
$79M '19
$68M '20
$161M '21
$191M '22
$82M '23
$64M '24
$51M '25

net income

$180M '18
$61M '19
$60M '20
$109M '21
$139M '22
$63M '23
$61M '24
$48M '25

Supplies → 1

🇺🇸 Boston Dynamics roller_screws → Spot L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Precision ReducersLinear ActuatorsBallscrewsLinear GuidesRoller Screws

Hua Hong SemiconductorpublicProduct-grade

ai compute · 🇨🇳 China · SSE: 688347 · 12 sources · 3 products · 2 patents

$2.4Brevenue · FY2025 · USD$79.2B mkt cap

Mature-node foundry

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $6.3BFY2021: $1.6BFY2022: $2.5BFY2023: $2.4BFY2024: $2.1BFY2025: $2.4B wins 2026-04-23 · → STMicroelectronics foundry — click for source2025-02-26 · ACM Research → ai_chips — click for source events

Rolled up across Hua Hong + its subsidiaries

  • 2026-04-23 design-win → STMicroelectronics foundry source ↗
  • 2025-02-26 design-win ACM Research → ai_chips source ↗

Patents — 2 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$930M '18
$933M '19
$6.3B '20
$1.6B '21
$2.5B '22
$2.4B '23
$2.1B '24
$2.4B '25

operating income

$186M '18
$118M '19
$-23M '20
$258M '21
$497M '22
$174M '23
$-118M '24
$-80M '25

net income

$183M '18
$162M '19
$649M '20
$1.7B '21
$450M '22
$280M '23
$58M '24
$53M '25

Buys from ← 1

🇺🇸 ACM Research ai_chips L2 50

Supplies → 1

🇨🇭 STMicroelectronics foundry → STM32 Series L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

0.11µm Process Technology55nm Process Technology28nm Process Technology

Hyundai MotorpublicRelationships + financials

physical ai · 🇰🇷 South Korea · KRX: 005380 · 238 sources · 0 products · 3655 patents

$123.5Brevenue · FY2025 · USD$58.0B mkt cap

Owns Boston Dynamics

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026202720282029 rev FY2020: $88.3BFY2021: $102.8BFY2022: $110.6BFY2023: $124.5BFY2024: $128.6BFY2025: $131.1B wins 2025-11-12 · GlobalFoundries → foundry — click for source2025-01-22 · HD Hyundai Robotics → industrial_arm — click for source2024-11-29 · Hiwin → roller_screws — click for source2020-09-28 · → SoftBank humanoid — click for source2024-11-05 · Harmonic Drive L → actuators_reducers — click for source2021-12-16 · → Hyundai Motor humanoid — click for source2026-06-22 · LG Energy Solution → batteries — click for source2025-02-26 · NVIDIA → ai_chips — click for source2023-12-09 · → Hyundai Motor humanoid — click for source events 2028-01-01 · capacity expansion — Starting from 2028, Hyundai Motor is scheduled to utilize Atlas at Hyundai Motor Group Metaplant America in Georgia in the U.S., for manufacturing efficiency and expand its usage to other factories.2026-08-26 · disclosure — Hyundai Motor will hold a 2026 CEO Investor Day on August 26, 2026 at 14:00 KST at Conrad Hotel Yeouido, with in-person and live-streaming attendance for domestic and international analysts, institutional investors, media, and credit rating agencies to present key management stra2026-07-23 · disclosure — Hyundai Motor will hold an investor relations conference call on July 23, 2026 at 14:10 to present Q2 2026 financial results and conduct Q&A with institutional investors and analysts via conference call with simultaneous interpretation services.2026-07-16 · financial — Hyundai Motor fell 2.07 percent to 425,000 won in Seoul trading on July 16, 2026.2026-07-16 · financial — Hyundai Motor was down 2.30% during the market decline.2026-07-16 · litigation — Hyundai Motor's union extended partial strikes from July 20-22 over unresolved wage negotiations after failing to reach agreement in 15 rounds of talks.2026-07-16 · acquisition — Hyundai Motor Group is acquiring SoftBank Group's remaining 9.9% stake in Boston Dynamics for approximately $325 million to achieve full ownership.2026-07-16 · financial — Hyundai Motor fell 2.07 percent to 425,000 won in Seoul trading amid broader market decline.2026-07-16 · acquisition — Hyundai Motor Group acquired SoftBank Group's remaining approximately 10% stake in Boston Dynamics for $325 million, making Boston Dynamics a wholly owned subsidiary.2026-07-16 · financial — Hyundai Motor fell 4.49 percent on the KOSPI on July 16, 2026, during widespread market losses.2026-07-13 · disclosure — Hyundai Motor announced a production halt at all business sites including Ulsan Plant due to partial strikes related to collective bargaining. Production suspension covers 78.77 trillion KRW in sales (42.29% of recent 186.25 trillion KRW total sales), with 2-hour stoppages schedu2026-07-06 · partnership — Hyundai Motor partnered with Boston Dynamics to deploy Atlas robot at FIFA World Cup 2026 and released documentary 'The Training Ground' with BBC StoryWorks.2026-07-01 · financial report — Hyundai Motor reports interim operating results.2026-06-30 · acquisition — Hyundai Motor Group completed full acquisition of Boston Dynamics by purchasing SoftBank's remaining 9.65% stake for $325 million, valuing the company at approximately $3.4 billion.2026-06-30 · financial — Hyundai Motor remained fourth with nearly 1.4 lakh units sold in Q1 FY2026-27.2026-06-30 · disclosure — Hyundai Motor discloses sustainability management report and related matters.2026-06-25 · acquisition — Hyundai Motor is considering acquiring SoftBank's remaining 9.65 percent stake in Boston Dynamics by swapping its US AI research arm (RAI) to achieve full ownership ahead of Boston Dynamics' planned IPO.2026-06-25 · litigation — Hyundai Motor's labor union voted in favor of a potential strike with over 86 percent support, seeking job protections and guaranteed employment related to AI robot deployment.2026-06-25 · acquisition — Hyundai Motor is considering acquiring SoftBank's remaining 9.65 percent stake in Boston Dynamics to gain full ownership ahead of the robotics firm's planned IPO.2026-06-25 · partnership — Hyundai Motor Group plans to gradually deploy Boston Dynamics' Atlas humanoid robots across its major production lines starting from 2028, beginning with Hyundai Motor Group Metaplant America in Georgia.2026-06-23 · financial — Hyundai Motor stock fell 8.43 percent on Tuesday morning.2026-06-22 · financial — Hyundai Motor retreated 3.92 percent in Seoul stock trading amid US-Iran peace negotiations uncertainty.2026-06-22 · financial — Hyundai Motor decreased 5.22 percent to 581,000 won.2026-06-18 · financial — Hyundai Motor is among major holdings in the Kospi 200 Index.2026-06-18 · disclosure — Hyundai Motor is holding an investor relations briefing session.2026-06-10 · financial — Hyundai Motor rose 0.78 percent in Seoul trading on June 10, 2026.2026-06-10 · financial — Hyundai Motor was down 4.07 percent on Seoul stock exchange.2026-06-10 · related party deal — Hyundai Motor purchases other securities from a related party.2026-06-10 · related party deal — Hyundai Motor makes an investment in a related party.2026-06-08 · partnership — Hyundai Motor Group met with Nvidia CEO to discuss demonstrations of MobED mobility platform and potential collaborations.2026-06-04 · financial — Hyundai Motor shed 3.98 percent to 700,000 won on June 4, 2026.2026-06-01 · disclosure — Hyundai Motor discloses corporate governance report.2026-06-01 · disclosure — Hyundai Motor corrects and files large enterprise group status disclosure with first quarter update.2026-06-01 · financial report — Hyundai Motor reports interim operating results.2026-05-29 · disclosure — Hyundai Motor reports on corporate value enhancement plan implementation status for 2025.2026-05-29 · disclosure — Hyundai Motor disclosed large business group status for same-party reporting.2026-05-29 · related party deal — Hyundai Motor purchased other securities from a related party.2026-05-29 · disclosure — Hyundai Motor disclosed large business group status for annual reporting and Q1 2026.2026-05-28 · financial — Top automaker Hyundai Motor gained 2.35 percent on Thursday.2026-05-21 · acquisition — Hyundai Motor corrected disclosure of decision to acquire stocks and investment securities in other companies.2026-05-21 · financial — Hyundai Motor increased 7.77 percent as auto shares moved higher.2026-05-20 · disclosure — Hyundai Motor announced an investor relations meeting.2026-05-18 · disclosure — Hyundai Motor announced an investor relations meeting.2026-05-15 · financial report — Hyundai Motor filed quarterly report for Q1 2026.2026-05-13 · financial — Hyundai Motor went up 1.08 percent in Seoul trading despite broader market losses.2026-05-11 · related party deal — Hyundai Motor purchased other securities from a related party.2026-05-06 · disclosure — Hyundai Motor announced an investor relations meeting.2026-05-04 · financial report — Hyundai Motor disclosed provisional operating results for fair disclosure.2026-04-30 · disclosure — Hyundai Motor issued clarification regarding rumors or media reports.2026-04-29 · disclosure — Hyundai Motor announced an investor relations meeting.2026-04-24 · acquisition — Hyundai Motor decided to acquire stocks and investment securities in other companies.2026-04-23 · dividend — Hyundai Motor closed shareholder registry for cash and in-kind dividend distribution.2026-04-23 · financial report — Hyundai Motor reported consolidated interim operating results.2026-04-23 · disclosure — Hyundai Motor disclosed fair trading voluntary compliance program operations status.2026-04-23 · disclosure — Hyundai Motor disclosed counterparties in financial transactions with affiliated finance companies.2026-04-23 · dividend — Hyundai Motor decided to distribute cash and in-kind dividends to shareholders.2026-04-23 · buyback — Hyundai Motor reported completion of treasury stock acquisition.2026-04-17 · disclosure — Hyundai Motor announced an investor relations briefing event.2026-03-01 · financial — Hyundai Motor Group's ZER01NE invested in Video Rebirth's $80 million seed round in March 2026.2025-10-01 · partnership — Hyundai Motor Group Executive Chair Chung Euisun shared fried chicken and beer with NVIDIA CEO Jensen Huang during his visit to South Korea in October 2025.2024-01-01 · product launch — Hyundai Motor will present its vision for a hydrogen-powered ecosystem and a new automobile strategy driven by software innovations at CES 2024.2023-06-15 · financial — Hyundai Motor Group invested 1.3 trillion won ($1 billion) in mobility and tech startups from 2017 to Q1 2023.2022-05-01 · acquisition — Hyundai Motor launched the AI Institute in May 2022 to serve as the 'Bell Labs of Robotics and AI.'2021-12-16 · product launch — Hyundai unveiled the Mobile Eccentric Droid (MobED), a new mobility platform with independently adjustable wheel heights designed for navigating uneven surfaces.2021-12-05 · product launch — Hyundai unveiled advanced mobility technologies including its self-driving IONIQ 5 and an EV-exclusive platform known as E-GMP.2021-12-05 · product launch — Hyundai unveiled advanced mobility technologies including its self-driving IONIQ 5 and an EV-exclusive platform known as E-GMP.2021-06-22 · acquisition — Hyundai closed its deal for a majority stake in Boston Dynamics.2021-06-01 · acquisition — Hyundai acquired an 80% stake in Boston Dynamics from SoftBank Group for approximately $880 million in June 2021.2021-01-01 · acquisition — Hyundai acquired Boston Dynamics for 1.2 trillion won in 2021.2028-12-31 · capacity expansion — Boston Dynamics aims to scale up manufacturing with South Korean supply chain to produce 30,000 Atlas humanoid robots annually by 2028.2028-01-01 · partnership — Boston Dynamics' humanoid robot Atlas will be deployed at HMG Metaplant America starting in 2028 for parts sequencing and potentially component assembly by 2030.2026-07-17 · acquired by — Boston Dynamics is now fully owned by Hyundai Motor Group, which plans to deploy the company's humanoid robots in its own factories.2026-07-05 · product launch — Boston Dynamics' Atlas robot performed at FIFA World Cup 2026 halftime show on July 5, 2026, delivering match ball and executing goal celebrations.2026-06-30 · other — Boston Dynamics CEO states that America's next 250 years will be built by robots and discusses the need for a national robotics strategy.2026-06-27 · capacity expansion — Boston Dynamics announced $100 million investment in new 323,000-square-foot robotics and AI center at 1601 Trapelo Road in Waltham, Massachusetts, expected to create 1,250 new jobs by 2033.2026-06-25 · acquired by — Boston Dynamics is planned to be acquired in full by Hyundai Motor, with current shareholders absorbing SoftBank's stake according to their ownership percentages.2026-01-05 · product launch — Fifth-generation fully electric Atlas humanoid robot was introduced publicly at CES 2026 on January 5, 2026, and entered commercial production in January 2026 at Waltham, Massachusetts headquarters.2025-07-18 · other — Boston Dynamics is profiled as a sample player in the global mobile robots market forecast report covering 2025-2035.2024-12-24 · product launch — Boston Dynamics' electric Atlas humanoid robot performed a backflip while wearing a Santa suit in a new video demonstration.2024-12-24 · product launch — Boston Dynamics' electric Atlas humanoid robot performed a backflip while wearing a Santa hat in a new video demonstration.2024-11-17 · product launch — Boston Dynamics' Spot robotic dog is being deployed by the US Secret Service for perimeter patrol at Mar-a-Lago.2024-11-17 · product launch — Boston Dynamics' Spot robotic dog is being deployed by the US Secret Service at Mar-a-Lago for security patrol operations.2023-12-22 · partnership — Aaron Saunders from Boston Dynamics discusses foundation models' impact on natural language interfaces and computer vision for robots.2023-12-14 · partnership — Boston Dynamics partnered with NEON Group and its subsidiary ANIMAX to develop fully untethered entertainment robots for immersive storytelling experiences.2023-12-03 · product launch — Boston Dynamics robot dogs (Basia Spot, Omuzana Spot, and Bunny Spot) were trained to paint autonomously as part of Agnieszka Pilat's art installation at the NGV Triennial.2023-09-18 · other — Marc Raibert of Boston Dynamics AI Institute is speaking on the Hardware Stage at TechCrunch Disrupt 2023.2023-09-18 · other — Boston Dynamics AI Institute head Marc Raibert is speaking at TechCrunch Disrupt 2023.2023-06-27 · other — Boston Dynamics is profiled as a company in the service robotics market.2023-01-01 · product launch — Boston Dynamics expanded the applications of its Spot robot in 2023, including remote monitoring and logistics support.2022-09-27 · partnership — Boston Dynamics' Spot robot will be the first to leverage FARO's new Robotics API for integrating reality captured data into virtual jobsites.2022-09-27 · partnership — Boston Dynamics' Spot robot is the first to leverage FARO's new Robotics API for the 4D Construction Progress Management Solution.2022-03-28 · product launch — Boston Dynamics will launch the Stretch Robot at MODEX 2022.2022-01-01 · product launch — Boston Dynamics showcased a quadrupedal robot dog at CES 2022 under Hyundai ownership.2021-12-28 · product launch — Boston Dynamics launched Stretch, a warehouse robot capable of moving 800 heavy boxes per hour with a single arm, gripper with sensors and suction cups, and omnidirectional mobile base.2021-12-21 · product launch — Boston Dynamics released a holiday video featuring its dog-like Spot robot disguised as a present.2021-12-05 · product launch — Hyundai-owned Boston Dynamics presented a four-footed robot called Spot and two-bipedal robots at Seoul Mobility Show 2021.2021-12-05 · product launch — Boston Dynamics presented a four-footed robot called Spot and two-bipedal robots at the Seoul Mobility Show 2021.2021-06-29 · acquired by — Hyundai officially completed its acquisition of Boston Dynamics.2021-06-22 · acquired by — Hyundai acquired an 80 percent stake in Boston Dynamics, valuing the company at $1.1 billion.2021-06-01 · acquired by — Hyundai Motor acquired an 80% stake in Boston Dynamics from SoftBank Group for approximately $880 million in June 2021.2021-06-01 · acquired by — Boston Dynamics acquired by Hyundai Motor Company2020-09-28 · product launch — Boston Dynamics' Spot robot is now on sale to the public.2020-09-25 · other — Boston Dynamics conducted routine mobility tests of its Spot robot in Northern Ontario, Canada.2020-09-17 · product launch — Boston Dynamics plans to announce logistics robot products in 2021 with commercial availability in 2022.2020-03-03 · partnership — Boston Dynamics unveiled a collaboration with OTTO Motors to automate warehouse logistics using heterogeneous robot fleets.2020-01-01 · executive change — Boston Dynamics appointed Rob Playter as its first-ever new CEO in January 2020.

Rolled up across Hyundai Motor + its subsidiaries

  • 2028-12-31 capacity expansion Boston Dynamics Boston Dynamics aims to scale up manufacturing with South Korean supply chain to produce 30,000 Atlas humanoid robots annually by 2028.
  • 2028-01-01 capacity expansion Starting from 2028, Hyundai Motor is scheduled to utilize Atlas at Hyundai Motor Group Metaplant America in Georgia in the U.S., for manufacturing efficiency and expand its usage to other factories.
  • 2028-01-01 partnership Boston Dynamics Boston Dynamics' humanoid robot Atlas will be deployed at HMG Metaplant America starting in 2028 for parts sequencing and potentially component assembly by 2030.
  • 2026-08-26 disclosure Hyundai Motor will hold a 2026 CEO Investor Day on August 26, 2026 at 14:00 KST at Conrad Hotel Yeouido, with in-person and live-streaming attendance for domestic and international analysts, institutional investors, media, and credit rating agencies to present key management stra
  • 2026-07-23 disclosure Hyundai Motor will hold an investor relations conference call on July 23, 2026 at 14:10 to present Q2 2026 financial results and conduct Q&A with institutional investors and analysts via conference call with simultaneous interpretation services.
  • 2026-07-17 acquired by Boston Dynamics Boston Dynamics is now fully owned by Hyundai Motor Group, which plans to deploy the company's humanoid robots in its own factories.
  • 2026-07-16 financial Hyundai Motor fell 2.07 percent to 425,000 won in Seoul trading on July 16, 2026.
  • 2026-07-16 financial Hyundai Motor was down 2.30% during the market decline.
  • 2026-07-16 litigation Hyundai Motor's union extended partial strikes from July 20-22 over unresolved wage negotiations after failing to reach agreement in 15 rounds of talks.
  • 2026-07-16 acquisition Hyundai Motor Group is acquiring SoftBank Group's remaining 9.9% stake in Boston Dynamics for approximately $325 million to achieve full ownership.
  • 2026-07-16 financial Hyundai Motor fell 2.07 percent to 425,000 won in Seoul trading amid broader market decline.
  • 2026-07-16 acquisition Hyundai Motor Group acquired SoftBank Group's remaining approximately 10% stake in Boston Dynamics for $325 million, making Boston Dynamics a wholly owned subsidiary.
  • 2026-07-16 financial Hyundai Motor fell 4.49 percent on the KOSPI on July 16, 2026, during widespread market losses.
  • 2026-07-13 disclosure Hyundai Motor announced a production halt at all business sites including Ulsan Plant due to partial strikes related to collective bargaining. Production suspension covers 78.77 trillion KRW in sales (42.29% of recent 186.25 trillion KRW total sales), with 2-hour stoppages schedu
  • 2026-07-06 partnership Hyundai Motor partnered with Boston Dynamics to deploy Atlas robot at FIFA World Cup 2026 and released documentary 'The Training Ground' with BBC StoryWorks.
  • 2026-07-05 product launch Boston Dynamics Boston Dynamics' Atlas robot performed at FIFA World Cup 2026 halftime show on July 5, 2026, delivering match ball and executing goal celebrations.
  • 2026-07-01 financial report Hyundai Motor reports interim operating results.
  • 2026-06-30 acquisition Hyundai Motor Group completed full acquisition of Boston Dynamics by purchasing SoftBank's remaining 9.65% stake for $325 million, valuing the company at approximately $3.4 billion.
  • 2026-06-30 financial Hyundai Motor remained fourth with nearly 1.4 lakh units sold in Q1 FY2026-27.
  • 2026-06-30 disclosure Hyundai Motor discloses sustainability management report and related matters.
  • 2026-06-22 design-win LG Energy Solution → batteries source ↗
  • 2025-11-12 design-win GlobalFoundries → foundry source ↗
  • 2025-02-26 design-win NVIDIA → ai_chips source ↗
  • 2025-01-22 design-win HD Hyundai Robotics → industrial_arm source ↗
  • 2024-11-29 design-win Hiwin → roller_screws source ↗
  • 2024-11-05 design-win Harmonic Drive L → actuators_reducers source ↗
  • 2023-12-09 design-win → Hyundai Motor humanoid source ↗
  • 2021-12-16 design-win → Hyundai Motor humanoid source ↗
  • 2020-09-28 reported edge → SoftBank humanoid source ↗

Patents — 3655 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 901
Gears / reducers 808
Robotics / manipulators 615
Electric motors 482
Imaging / cameras 322
Lidar / ranging 170
IMU / navigation 129
Power electronics 110
Computing 47
Other 36
Bearings 26
Force / torque sensors 7
Semiconductors 2

Newest 22 of 3655, most recent first — all on Google Patents →

  • 2026-06-25US20260180382MOTOR AND A VEHICLE INCLUDING THE SAME
  • 2026-06-25US20260180409MOTOR, BRUSHLESS EXCITER SYSTEM AND A MOBILITY DEVICE INCLUDING THE SAME
  • 2026-06-25US20260180416ROTATING MACHINE
  • 2026-06-18US20260166664ENGINE HOSE ALIGNMENT DEVICE FOR AUTOMATION OF ENGINE HOSE ASSEMBLY
  • 2026-06-18US20260166713WEARABLE ROBOT
  • 2026-06-18US20260166714GRIPPER OF ROBOT
  • 2026-06-18US20260168477VEHICLE WIND POWER GENERATION SYSTEM
  • 2026-06-04US20260151922DRIVING MODULE
  • 2026-06-04US20260155284SINTERED MAGNET CONTAINING RARE EARTH ELEMENTS
  • 2026-06-04US20260155713MOTOR
  • 2026-05-28US20260145324CHOLESKY FACTORIZATION METHOD FOR SPARSE MATRICES USING UPPER TRIANGULAR TRANSPOSE SOLVE AND APPARATUS THEREFOR
  • 2026-05-28US20260145461WHEEL ASSEMBLY STRUCTURE OF VEHICLE
  • 2026-05-28US20260145513COLUMN-TYPE ELECTRONIC SHIFT OPERATION APPARATUS
  • 2026-05-21US20260137974MUSCLE STRENGTH AID DEVICE
  • 2026-05-21US20260138442AUXILIARY DRIVING APPARATUS FOR FOUR-WHEEL ELECTRIC VEHICLE
  • 2026-05-21US20260138500PART-INTEGRATED MODULE OF A THERMAL MANAGEMENT SYSTEM FOR AN ELECTRIC VEHICLE
  • 2026-05-21US20260138752PROPULSION UNIT
  • 2026-05-21US20260140509APPARATUS AND METHOD FOR PREDICTING ROBOT DELIVERY TIME AND ROBOT DELIVERY PATH BASED ON CROWD ESTIMATION
  • 2026-05-21US20260142532MOTOR COOLING SYSTEM
  • 2026-05-15WO2026101066WIRELESS POWER TRANSMISSION SYSTEM AND WIRELESS POWER CHARGING METHOD USING SAME
  • 2026-05-14US20260135447SYSTEM AND METHOD FOR MANUFACTURING HALBACH ARRAY ROTOR
  • 2026-05-14US20260135452STATOR MANUFACTURING APPARATUS

Buys from ← 6

🇺🇸 GlobalFoundries foundry L2 50
🇺🇸 IonQ quantum L2 50
🇰🇷 HD Hyundai Robotics industrial_arm L2 50
🇺🇸 Boston Dynamics humanoid L2 50
🇺🇸 NVIDIA ai_chips L2 50
🇺🇸 Boston Dynamics humanoid L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

IbidenpublicProduct-grade

ai compute · 🇯🇵 Japan · TSE: 4062 · 26 sources · 5 products · 73 patents

$2.6Brevenue · FY2026 · USD$27.0B mkt cap

ABF/IC substrates

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $2.7BFY2021: $2.0BFY2022: $2.5BFY2023: $2.6BFY2024: $2.3BFY2025: $2.3BFY2026: $2.6B wins 2024-12-30 · → Intel advanced_packaging — click for source2024-12-30 · → NVIDIA advanced_packaging — click for source2024-12-30 · → Samsung Electronics advanced_packaging — click for source2024-12-30 · → Taiwan Manufacturing advanced_packaging — click for source2024-12-30 · → Advanced Micro Devices advanced_packaging — click for source events 2025-04-01 · financial report — Ibiden reported financial results for the first half of fiscal year 173 (April 2025-March 2026).
  • 2025-04-01 financial report Ibiden reported financial results for the first half of fiscal year 173 (April 2025-March 2026).
  • 2024-12-30 design-win → Intel advanced_packaging source ↗
  • 2024-12-30 design-win → NVIDIA advanced_packaging source ↗
  • 2024-12-30 design-win → Samsung Electronics advanced_packaging source ↗
  • 2024-12-30 design-win → Taiwan Manufacturing advanced_packaging source ↗
  • 2024-12-30 design-win → Advanced Micro Devices advanced_packaging source ↗

Patents — 73 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 69
Other 2
Computing 2

Newest 1 of 73, most recent first — all on Google Patents →

  • 2011-10-06WO2011122258SIMULATION DEVICE, SIMULATION SYSTEM, METHOD OF SIMULATION AND PROGRAM

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.6B '19
$2.7B '20
$2.0B '21
$2.5B '22
$2.6B '23
$2.3B '24
$2.3B '25
$2.6B '26

operating income

$91M '19
$181M '20
$238M '21
$436M '22
$535M '23
$293M '24
$313M '25
$412M '26

net income

$30M '19
$104M '20
$158M '21
$254M '22
$321M '23
$194M '24
$221M '25
$423M '26

Sources: イビデン株式会社 — 有価証券報告書-第173期(2025/04/01-2026/03/31) · イビデン株式会社 — 臨時報告書 · イビデン株式会社 — 臨時報告書 · イビデン株式会社 — 臨時報告書 · イビデン株式会社 — 半期報告書-第173期(2025/04/01-2026/03/31) · イビデン株式会社 — 臨時報告書

Supplies → 5

🇺🇸 Intel advanced_packaging L2 50
🇺🇸 NVIDIA advanced_packaging → Blackwell Ultra platform L3 50
🇰🇷 Samsung Electronics advanced_packaging L2 50
🇹🇼 Taiwan Manufacturing advanced_packaging L2 50
🇺🇸 Advanced Micro Devices advanced_packaging → Instinct MI300X L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

BT (Bismaleimide Triazine) Resin SubstratesHigh-Density Interconnect (HDI) SubstratesMulti-layer PCBABF (Ajinomoto Build-up Film) SubstratesCeramic Substrates

Infineon Technologies AGpublicProduct-grade

ai compute · 🇩🇪 Germany · XETRA: IFX · 52 sources · 1 products · 2052 patents

$16.5Brevenue · FY2025 · USD$92.0B mkt cap

German semiconductor maker; world leader in power semiconductors, also automotive/sensors/microcontrollers. No SEC filings (deregistered 2010). Founded 1999 (spun from Siemens); HQ Neubiberg.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $9.8BFY2021: $12.6BFY2022: $16.3BFY2023: $18.7BFY2024: $17.1BFY2025: $16.5B wins 2023-01-12 · Resonac → ai_chips — click for source2025-02-10 · → Amkor ai_chips — click for source2025-02-18 · Arteris → ai_compute — click for source2024-11-20 · → NVIDIA ai_chips — click for source2025-11-12 · GlobalFoundries → foundry — click for source2025-10-27 · Cadence Design → ai_chips — click for source2026-05-06 · Arm → ai_chips — click for source events 2022-12-21 · other — Infineon is analyzed as a company in the IoT Security and Privacy market report.2022-03-09 · other — Infineon Technologies AG is listed as a key market player in the global eSIM market.
  • 2026-05-06 design-win Arm → ai_chips source ↗
  • 2025-11-12 design-win GlobalFoundries → foundry source ↗
  • 2025-10-27 design-win Cadence Design → ai_chips source ↗
  • 2025-02-18 design-win Arteris → ai_compute source ↗
  • 2025-02-10 design-win → Amkor ai_chips source ↗
  • 2024-11-20 design-win → NVIDIA ai_chips source ↗
  • 2023-01-12 design-win Resonac → ai_chips source ↗
  • 2022-12-21 other Infineon is analyzed as a company in the IoT Security and Privacy market report.
  • 2022-03-09 other Infineon Technologies AG is listed as a key market player in the global eSIM market.

Patents — 2052 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 819
Computing 666
Power electronics 299
Memory 148
Lidar / ranging 66
Other 30
Batteries 12
Force / torque sensors 7
Imaging / cameras 4
Electric motors 1

IP chokepoint in: Power electronics

Newest 22 of 2052, most recent first — all on Google Patents →

  • 2026-07-09US20260197149CONFIGURABLE COMMUNICATION DEVICE THAT OPERATES WITH ASYMMETRIC AND SYMMETRIC DATA RATES
  • 2026-06-25US20260178756HIERARCHICALLY CONFIGURED INTERCONNECT-BASED ACCESS MECHANISM
  • 2026-06-18US20260170129SAFETY DEVICE AND METHOD FOR CONTINUOUSLY MONITORING THE FUNCTIONAL SAFETY OF A DIGITAL SIGNAL PROCESSOR
  • 2026-05-07US20260126844SYSTEM ON CHIP POWER MODE MANAGEMENT FOR ORIGINAL EQUIPMENT MANUFACTURERS
  • 2026-03-26US20260086772Montgomery Reduction in Cryptographic Operations
  • 2026-03-26US20260087153Data Processing Device and Method for Performing a Cryptographic Algorithm
  • 2026-03-26US20260088998Modular Reduction for Cryptographic Operations
  • 2026-03-19US20260079632INTEGRATED CIRCUIT
  • 2026-03-05US20260064806ENCRYPTION DEVICE AND METHOD
  • 2026-03-05US20260064861DEVICE, METHOD, AND COMPUTER PROGRAM FOR SECURING DIAGNOSTIC DATA
  • 2026-03-05US20260065986HIDING INFORMATION IN MEMORY CELLS
  • 2026-03-05US20260067057Time-aligning device trace data
  • 2026-03-05US20260067126FAST SERIAL DATA COMMUNICATIONS
  • 2026-02-19US20260050511Systems, methods, and devices for error correction in nonvolatile memories
  • 2026-02-12US20260044341Data Processing Device and Method for Processing Secret Data
  • 2026-02-05US20260038303OPERATION PERFORMANCE BASED ON EYELASH MOVEMENT OF AN IDENTIFIED USER
  • 2025-12-25US2025390221METHODS, DEVICES AND SYSTEMS FOR SERIAL BUS OPERATIONS
  • 2025-12-11US2025378248METHOD FOR RELIABILITY PREDICTION AND ELECTRONIC CIRCUIT
  • 2025-12-04US2025370716SELF-PROVISIONING AND FLEXIBLE HARDWARE ACCELERATOR ARCHITECTURE
  • 2025-12-04US2025370858NON-VOLATILE MEMORY METADATA PROTECTION
  • 2025-12-04US2025370953SERIAL BUS SYSTEM
  • 2025-11-13US2025348601Hierarchically configured interconnect-based access mechanism

Financials — multi-year, confidence 1.0 (filings)

revenue

$9.8B '20
$12.6B '21
$16.3B '22
$18.7B '23
$17.1B '24
$16.5B '25

operating income

$591M '20
$1.5B '21
$3.5B '22
$4.7B '23
$2.4B '24
$2.3B '25

net income

$421M '20
$1.3B '21
$2.5B '22
$3.6B '23
$1.5B '24
$1.2B '25

Buys from ← 6

🇯🇵 Resonac ai_chips → Power semiconductors L3 50
🇺🇸 Arteris ai_compute → Power semiconductors L3 50
🇩🇪 Siltronic ai_chips → Power semiconductors L3 50
🇺🇸 GlobalFoundries foundry → Power semiconductors L3 50
🇺🇸 Cadence Design ai_chips → Power semiconductors L3 50
🇬🇧 Arm ai_chips → Power semiconductors L3 50

Supplies → 2

🇺🇸 Amkor ai_chips L2 50
🇺🇸 NVIDIA ai_chips → Grace L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Power semiconductors

Intel CorporationpublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: INTC · 227 sources · 14 products · 2061 patents

$52.9Brevenue · FY2025 · USD$487.4B mkt cap

Intel Corporation is a US semiconductor company founded in 1968, producing Xeon and Core processors, Gaudi AI accelerators, and Arc/Data Center GPUs for computing and data center markets.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $77.9BFY2021: $79.0BFY2022: $63.1BFY2023: $54.2BFY2024: $53.1BFY2025: $52.9B wins 2026-06-22 · Tokyo Electron → ai_chips — click for source2026-07-12 · Mentee Robotics → physical_ai — click for source2025-10-23 · → Microsoft merchant_gpu — click for source2026-06-04 · Murata Manufacturing → imu — click for source2026-02-12 · Arteris → ai_compute — click for source2026-06-27 · Micron → hbm — click for source2026-05-08 · Applied Materials → ai_chips — click for source2025-10-01 · Tokyo Ohka Kogyo → ai_chips — click for source2026-05-06 · Kokusai Electric → ai_chips — click for source2026-06-01 · Screen → ai_chips — click for source2025-07-30 · → UMC merchant_gpu — click for source2024-12-30 · Ibiden → advanced_packaging — click for source2025-01-30 · Taiwan Manufacturing → foundry — click for source2026-04-23 · → NVIDIA merchant_gpu — click for source2026-07-08 · → SambaNova merchant_gpu — click for source2020-09-16 · → Hewlett Packard Enterprise merchant_gpu — click for source2024-10-31 · → Amazon merchant_gpu — click for source2026-04-23 · SambaNova → accelerators — click for source2025-07-24 · Amkor → osat — click for source2023-08-01 · Vicor → ai_chips — click for source2025-04-08 · AT&S → advanced_packaging — click for source events 2026-07-16 · financial — Intel shares declined 5% in the session.2026-07-16 · financial — Intel stock is down 5% to $98 on July 16, 2026, tied to Xeon and Foundry buildout concerns.2026-07-15 · product launch — Intel Foundry shipped the first high-volume logic product manufactured using High-NA EUV lithography, a subset of Intel Core Ultra Series 3 processors (Panther Lake) built on the 18A process node at Fab D1X in Hillsboro, Oregon.2026-07-13 · financial — Intel shares declined with other semiconductor-related stocks on July 13.2026-07-13 · financial — Intel Corporation (INTC) was trading at $105.91 with 2,684,031 shares traded in pre-market activity on July 13, 2026.2026-07-10 · financial — Stifel raised the price target on Intel Corporation from $75 to $120 on July 10, 2026, while maintaining a Hold rating.2026-07-10 · financial — Intel Corporation (INTC) traded at $110.16 in pre-market session on July 10, 2026, down $2.38.2026-07-06 · financial — HSBC doubled Intel's price target from $100 to $200 on July 6, 2026, citing stronger server CPU outlook and foundry business valuation.2026-07-06 · financial — HSBC raised 2026 CPU shipment growth estimate to 25% from 20% and 2027 estimate from 20% to 30%.2026-07-02 · financial — HSBC doubled its price target on Intel Corporation to $200 from $100 on July 2.2026-06-29 · financial — Cantor Fitzgerald raised Intel's share price target to $150 from $90 on June 29th with a Neutral rating.2026-06-15 · partnership — President Trump announced that Apple and Intel reached an agreement to design and manufacture chips in the U.S.2026-06-05 · partnership — Intel announced a strategic collaboration with Hitachi to advance physical AI, advanced computing, and next-generation digital infrastructure across manufacturing, energy, mobility and other critical industries.2026-06-05 · partnership — Intel announced a strategic collaboration with Hitachi to advance physical AI, advanced computing, and next-generation digital infrastructure across manufacturing, energy, mobility and other critical industries.2026-06-05 · partnership — Intel announced a strategic collaboration with Hitachi to advance physical AI, advanced computing, and next-generation digital infrastructure across manufacturing, energy, mobility and other critical industries.2026-06-05 · partnership — Intel announced a strategic collaboration with Hitachi to advance physical AI, advanced computing, and next-generation digital infrastructure across manufacturing, energy, mobility and other critical industries.2026-06-04 · partnership — Intel Corporation and Foxconn agreed to jointly develop next-generation AI infrastructure and intelligent computing platforms.2026-05-29 · financial — Nancy Pelosi disclosed buying 200 call options of Intel with an expiration date of March 19, 2027 and a strike price of $50 on May 29, 2026.2026-05-13 · financial — Intel plunged 6.82 percent on Wall Street overnight, contributing to broader tech sector losses.2026-04-23 · financial — Intel reported Q1 2026 revenue of $13.58 billion, up 7% year-over-year, with non-GAAP EPS of $0.29 versus $0.13 in the prior-year period, representing a 123% YOY increase.2025-11-30 · other — Intel eliminated 59 Bay Area jobs effective November 30 as part of its stated goal to cut a significant amount of its workforce in 2025.2025-09-18 · partnership — Intel partnered with Nvidia to develop integrated CPU-GPU chips for data centers and laptops using Intel's x86 technology.2025-09-18 · financial — Intel received a $5 billion investment from Nvidia, driving its stock up 23% in Thursday afternoon trading.2025-08-01 · acquisition — The US government converted US$8.9 billion in subsidies into an equity stake, acquiring a 10% stake and becoming Intel's largest shareholder.2025-04-14 · acquisition — Intel announced on April 14 its intention to sell 51% of Altera to Silver Lake Partners for an almost $9 billion valuation, with Intel receiving net cash proceeds of $4.4 billion.2025-03-18 · executive change — Lip-Bu Tan appointed as new CEO of Intel, returning to the company on March 18, 2025, to lead a comprehensive overhaul of manufacturing and AI operations.2025-03-05 · product launch — GraniteShares announced a 2x Long INTC Daily ETF tracking Intel stock performance.2025-01-15 · product launch — Intel launched Core Ultra Series 3 with three SKUs ahead of expectations, exceeding commitment to deliver first SKU by end of 2025.2024-10-01 · product launch — Intel launched Arrow Lake earlier this month bringing AI PC capabilities to desktop platforms with an NPU.2024-10-01 · product launch — Intel launched Gaudi 3 AI accelerator which delivers twice the networking bandwidth and 1.5x the memory bandwidth of its predecessor.2024-10-01 · product launch — Intel launched Xeon 6 processor code-named Granite Rapids which doubles the performance of the prior generation.2024-09-01 · product launch — Intel launched Core Ultra 200V series processors (Lunar Lake) in September at IFA, described as the most efficient family of x86 processors ever created.2024-08-22 · financial — The U.S. government took a 9.9% stake in Intel by purchasing 433.3 million shares at $20.47 per share.2024-08-01 · executive change — President Trump called for Intel CEO Lip-Bu Tan to resign in early August due to ties with the Chinese Communist Party.2024-08-01 · financial — Intel agreed to accept government funding in August to support restructuring.2024-06-18 · partnership — Apple agreed to collaborate with Intel on semiconductor design and manufacturing.2022-12-21 · other — Intel Security Group is analyzed as a company in the IoT Security and Privacy market report.2022-09-13 · other — Intel is mentioned among companies in the Mixed Signal System-on-Chip market competitive landscape.

Rolled up across Intel + its subsidiaries

  • 2026-07-16 financial Intel shares declined 5% in the session.
  • 2026-07-16 financial Intel stock is down 5% to $98 on July 16, 2026, tied to Xeon and Foundry buildout concerns.
  • 2026-07-15 product launch Intel Foundry shipped the first high-volume logic product manufactured using High-NA EUV lithography, a subset of Intel Core Ultra Series 3 processors (Panther Lake) built on the 18A process node at Fab D1X in Hillsboro, Oregon.
  • 2026-07-13 financial Intel shares declined with other semiconductor-related stocks on July 13.
  • 2026-07-13 financial Intel Corporation (INTC) was trading at $105.91 with 2,684,031 shares traded in pre-market activity on July 13, 2026.
  • 2026-07-12 design-win Mentee Robotics → physical_ai source ↗
  • 2026-07-10 financial Stifel raised the price target on Intel Corporation from $75 to $120 on July 10, 2026, while maintaining a Hold rating.
  • 2026-07-10 financial Intel Corporation (INTC) traded at $110.16 in pre-market session on July 10, 2026, down $2.38.
  • 2026-07-08 design-win → SambaNova merchant_gpu source ↗
  • 2026-07-06 financial HSBC doubled Intel's price target from $100 to $200 on July 6, 2026, citing stronger server CPU outlook and foundry business valuation.
  • 2026-07-06 financial HSBC raised 2026 CPU shipment growth estimate to 25% from 20% and 2027 estimate from 20% to 30%.
  • 2026-07-02 financial HSBC doubled its price target on Intel Corporation to $200 from $100 on July 2.
  • 2026-06-29 financial Cantor Fitzgerald raised Intel's share price target to $150 from $90 on June 29th with a Neutral rating.
  • 2026-06-27 design-win Micron → hbm source ↗
  • 2026-06-22 design-win Tokyo Electron → ai_chips source ↗
  • 2026-06-15 partnership President Trump announced that Apple and Intel reached an agreement to design and manufacture chips in the U.S.
  • 2026-06-05 partnership Intel announced a strategic collaboration with Hitachi to advance physical AI, advanced computing, and next-generation digital infrastructure across manufacturing, energy, mobility and other critical industries.
  • 2026-06-05 partnership Intel announced a strategic collaboration with Hitachi to advance physical AI, advanced computing, and next-generation digital infrastructure across manufacturing, energy, mobility and other critical industries.
  • 2026-06-05 partnership Intel announced a strategic collaboration with Hitachi to advance physical AI, advanced computing, and next-generation digital infrastructure across manufacturing, energy, mobility and other critical industries.
  • 2026-06-05 partnership Intel announced a strategic collaboration with Hitachi to advance physical AI, advanced computing, and next-generation digital infrastructure across manufacturing, energy, mobility and other critical industries.
  • 2026-06-04 partnership Intel Corporation and Foxconn agreed to jointly develop next-generation AI infrastructure and intelligent computing platforms.
  • 2026-06-04 design-win Murata Manufacturing → imu source ↗
  • 2026-06-01 design-win Screen → ai_chips source ↗
  • 2026-05-29 financial Nancy Pelosi disclosed buying 200 call options of Intel with an expiration date of March 19, 2027 and a strike price of $50 on May 29, 2026.
  • 2026-05-13 financial Intel plunged 6.82 percent on Wall Street overnight, contributing to broader tech sector losses.
  • 2026-05-08 design-win Applied Materials → ai_chips source ↗
  • 2026-05-06 design-win Kokusai Electric → ai_chips source ↗
  • 2026-04-23 financial Intel reported Q1 2026 revenue of $13.58 billion, up 7% year-over-year, with non-GAAP EPS of $0.29 versus $0.13 in the prior-year period, representing a 123% YOY increase.
  • 2026-04-23 design-win → NVIDIA merchant_gpu source ↗
  • 2026-04-23 design-win SambaNova → accelerators source ↗
  • 2026-02-12 design-win Arteris → ai_compute source ↗
  • 2025-10-23 design-win → Microsoft merchant_gpu source ↗
  • 2025-10-01 design-win Tokyo Ohka Kogyo → ai_chips source ↗
  • 2025-07-30 design-win → UMC merchant_gpu source ↗
  • 2025-07-24 design-win Amkor → osat source ↗
  • 2025-04-08 design-win AT&S → advanced_packaging source ↗
  • 2025-01-30 design-win Taiwan Manufacturing → foundry source ↗
  • 2024-12-30 design-win Ibiden → advanced_packaging source ↗
  • 2024-10-31 design-win → Amazon merchant_gpu source ↗
  • 2023-08-01 design-win Vicor → ai_chips source ↗

Patents — 2061 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 1499
Semiconductors 404
Memory 103
Power electronics 22
Imaging / cameras 13
Other 11
IMU / navigation 3
Robotics / manipulators 3
Lidar / ranging 2
Bearings 1

IP chokepoint in: Computing, Imaging / cameras

Newest 34 of 2061, most recent first — all on Google Patents →

  • 2026-07-09US20260195068PROCESSOR AND METHOD PROVIDING AN IMPROVED ATOMIC OPERATION
  • 2026-07-09US20260195093PROCESSOR AND METHOD PROVIDING LOOKUP TABLES FOR NEURAL NETWORK OPERATIONS
  • 2026-07-09US20260195254PROCESSOR AND METHOD PROVIDING AN IMPROVED MATRIX STORAGE
  • 2026-07-09US20260195292CROSS GPU BARRIERS USING MEMORY SEMANTICS PROTOCOL
  • 2026-07-09US20260195404PROCESSOR, SYSTEM AND METHOD PROVIDING A MECHANISM FOR ACCELERATED AI INTERFERENCE
  • 2026-07-09US20260195405PROCESSOR, SYSTEM AND METHOD PROVIDING LOW PRECISION NUMBER MATRIX MULTIPLICATION
  • 2026-07-09US20260195844VARIABLE REGISTER THREADS WITH NON-CONTIGUOUS ALLOCATIONS
  • 2026-07-02US20260186782MONITORING MEMORY TAG LOAD PERFORMANCE
  • 2026-07-02US20260186822MANAGING WORKLOAD MIGRATION IN A COMPUTING SYSTEM
  • 2026-07-02US20260186846APPARATUS AND METHOD FOR PHASE AWARE RECONFIGURABLE PROCESSOR DESIGN FOR OPTIMIZED PREFILL AND DECODE CLUSTER PERFORMANCE
  • 2026-07-02US20260187004APPARATUS AND METHOD FOR RING INTERCONNECT BANDWIDTH SCALING
  • 2026-07-02US20260187012METHODS FOR PERFORMANCE-OPTIMAL TUNNELING OF PCIE UIO/FLIT-MODE PACKETS
  • 2026-07-02US20260187260MECHANISM TO LIMIT OUT-OF-COMPLIANCE INTRA-DIE COMMUNICATION
  • 2026-07-02US20260188355THERMAL STABILITY FOR HIGH BANDWIDTH AND HIGH CAPACITY MEMORIES
  • 2026-07-02US20260190952SELF-ALIGNED PICK AND PLACE METHODS AND APPARATUSES
  • 2026-06-25US20260178257VIRTUAL SERIALIZATION/DESERIALIZATION DISPLAY SHARING
  • 2026-06-25US20260178329Apparatus and Method for Early Stream Detection in AI Workloads
  • 2026-06-25US20260178335COMMON INDIRECT ADDRESSING FOR EARLY JUMP EXECUTION PIPELINE CLEAR
  • 2026-06-25US20260178408CIRCUITRY FOR RUNTIME ADJUSTMENTS OF WORKLOAD CLASSIFICATION FOR TASK SCHEDULING ON A SYSTEM-ON-A-CHIP WITH HETEROGENEOUS PROCESSING CORES
  • 2026-06-25US20260178438MEMORY CONTROLLER CIRCUIT FOR IMPLICIT MEMORY STREAM ENCRYPTION
  • 2026-06-25US20260178783ELECTROMAGNETIC SIDE-CHANNEL COUNTERMEASURES
  • 2026-06-25US20260180568MULTI-STAGE PHASE INTERPOLATORS
  • 2026-06-18US20260169746DEVICE, METHOD AND SYSTEM FOR CROSS-CLUSTER COMMUNICATION OF OPERAND VALUES
  • 2026-06-18US20260169747TABLE OF COMMON REGISTER VALUES FOR LOWER-COST INJECTION OF PREDICTED DATA VALUES INTO THE PROCESSOR CORE
  • 2026-06-18US20260169748MISALIGNED MEMORY ACCESSES TO AN ADDRESS-SLICED CACHE
  • 2026-06-18US20260169749DEVICE, METHOD AND SYSTEM FOR CONTROLLING MICRO-OPERATION SERIALIZATION WITH RESERVATION STATIONS
  • 2026-06-18US20260169750DEVICE, METHOD AND SYSTEM FOR SPECULATIVE EXECUTION OF A DEPENDENT INSTRUCTION
  • 2026-06-18US20260169818APPARATUS AND METHOD FOR PERFORMING AN ATTENTION OPERATION ON A HETEROGENEOUS PROCESSOR PLATFORM
  • 2026-06-18US20260169829CHUNKY PARTIAL LOAD TO STORE FORWARDING FOR PIPELINE LOADS
  • 2026-06-18US20260169917WRITE-ONCE-READ-MANY CACHE
  • 2026-06-18US20260169921DEVICE, METHOD AND SYSTEM FOR ENABLING A REGION-SPECIFIC PREFETCH FILTER
  • 2026-06-18US20260169923DEVICE, METHOD AND SYSTEM TO PROVIDE OPERAND INFORMATION WITH A BYPASS CACHE AND A PHYSICAL REGISTER FILE
  • 2026-06-18US20260169938ATOMIC COMPUTE REBINDING ENGINE (ACRE)
  • 2026-06-18US20260173931DEVICE STACKING IN INTEGRATED CIRCUIT LAYERS USING HIGH ACCURACY BONDING

Financials — multi-year, confidence 1.0 (filings)

revenue

$77.9B '20
$79.0B '21
$63.1B '22
$54.2B '23
$53.1B '24
$52.9B '25

operating income

$23.7B '20
$19.5B '21
$2.3B '22
$93M '23
$-11678M '24
$-2214M '25

net income

$20.9B '20
$19.9B '21
$8.0B '22
$1.7B '23
$-18756M '24
$-267M '25

Sources: INTC 10-Q 2023-07-28 (acc 0000050863-23-000069) · INTC 10-Q 2025-11-06 (acc 0000050863-25-000179) · INTC 10-K 2025-01-31 (acc 0000050863-25-000009) · INTC 10-Q 2026-04-24 (acc 0000050863-26-000079) · INTC 10-Q 2024-04-26 (acc 0000050863-24-000076) · INTC 10-Q 2024-08-02 (acc 0000050863-24-000124) · INTC 10-K 2026-01-23 (acc 0000050863-26-000011) · INTC 10-Q 2025-07-24 (acc 0000050863-25-000109) · INTC 10-Q 2024-11-01 (acc 0000050863-24-000149) · INTC 10-K 2023-01-27 (acc 0000050863-23-000006)

Buys from ← 19

🇯🇵 Tokyo Electron ai_chips → Gaudi Accelerators L3 53
🇮🇱 Mentee Robotics physical_ai L2 50
🇯🇵 Murata Manufacturing imu L2 53
🇺🇸 Arteris ai_compute → Gaudi Accelerators L3 50
🇺🇸 Micron hbm L2 50
🇺🇸 Applied Materials ai_chips → Gaudi Accelerators L3 53
🇯🇵 Tokyo Ohka Kogyo ai_chips → Intel 7/Intel 4/Intel 20A/Intel 18A L3 50
🇯🇵 Kokusai Electric ai_chips → Gaudi Accelerators L3 53
🇹🇼 UMC foundry L2 50
🇯🇵 Screen ai_chips → Gaudi Accelerators L3 53
🇳🇱 ASML ai_chips → Gaudi Accelerators L3 50
🇯🇵 Ibiden advanced_packaging L2 50
🇹🇼 Taiwan Manufacturing foundry L2 50
🇺🇸 SambaNova accelerators → Xeon Processors L3 50
🇺🇸 Amkor osat L2 50
🇺🇸 Vicor ai_chips → Gaudi Accelerators L3 50
🇩🇪 Siltronic ai_chips L2 50
🇯🇵 Shinko Electric Industries advanced_packaging → Gaudi Accelerators L3 50
🇦🇹 AT&S advanced_packaging → Xeon Processors L3 50

Supplies → 7

🇺🇸 Microsoft merchant_gpu → Microsoft Azure L3 50
🇺🇸 MaxLinear merchant_gpu L2 50
🇹🇼 UMC merchant_gpu L2 50
🇺🇸 NVIDIA merchant_gpu → Data center GPUs / AI accelerators L3 50
🇺🇸 SambaNova merchant_gpu L2 50
🇺🇸 Hewlett Packard Enterprise merchant_gpu L2 50
🇺🇸 Amazon merchant_gpu → Amazon Web Services (AWS) L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Gaudi AcceleratorsD435iXeon ProcessorsD500 SeriesData Center GPU MaxData Center GPU FlexSR300T265L500 SeriesArc GPUsCore ProcessorsD400 SeriesTracking Module T261Intel 7/Intel 4/Intel 20A/Intel 18A

IonQpublicProduct-grade

quantum · 🇺🇸 United States · NYSE: IONQ · 65 sources · 8 products

$130Mrevenue · FY2025 · USD$13.1B mkt cap

Discovered via news_ner (2026-07-08). 3 Better Moonshot Stocks to Buy Instead of SpaceX. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $0MFY2021: $2MFY2022: $11MFY2023: $22MFY2024: $43MFY2025: $130M wins 2026-07-12 · → Microsoft quantum — click for source2026-07-11 · → Amazon quantum — click for source events 2026-03-31 · financial — IonQ delivered $64.7 million of GAAP revenue in Q1 2026, representing 755% year-on-year growth.2026-03-31 · financial — Remaining performance obligations (RPOs) stood at $470 million as of March 31, 2026, representing 554% year-over-year growth.2026-01-31 · acquisition — IonQ announced the largest acquisition agreement in Quantum history to acquire SkyWater Technologies, the leading quantum foundry in the world.2026-01-31 · acquisition — IonQ acquired Seed Innovations, a software classified mission control business, at the end of January 2026.2026-01-01 · acquisition — In January of 2026, IonQ announced its intent to acquire SkyWater, with the transaction expected to close in the second or third quarter of 2026, subject to customary regulatory approvals.2025-12-31 · financial — Remaining performance obligations (RPO) stood at $370 million at the end of 2025 compared to just $77 million at the end of 2024, which is almost a fivefold increase.2025-12-31 · financial — Cash, cash equivalents and investments as of December 31, 2025, were $3.3 billion.2025-12-31 · financial — Fourth quarter 2025 revenues were $61.9 million, growing 429% year-over-year, and full year 2025 revenues reached $130 million with 202% year-on-year growth.2025-10-14 · financial — IonQ closed an additional $2 billion capital raise at $93 per share in October, bringing pro forma cash balance to $3.5 billion as of October 14.2025-09-12 · capacity expansion — IonQ's Tempo system has a computational space approximately 260 million times larger than its current fully commercialized Forte system.2025-08-01 · executive change — Niccolo de Masi was appointed as Chairman of IonQ, and Peter Chapman stepped down from his position.2025-07-09 · financial — Pro forma cash balance as of July 9, 2025, was $1.6 billion.2025-07-09 · financial — IonQ raised $1 billion in an equity offering priced at a 25% premium above the prior trading session close in July 2025.2025-07-01 · acquisition — IonQ completed the acquisition of Capella in July.2025-06-30 · financial — Revenue for Q2 2025 was $20.7 million, beating the high end of guidance by 15%.2025-06-09 · capacity expansion — IonQ is targeting 1,600 logical qubits in 2028 and 80,000 in 2030.2025-04-30 · acquisition — IonQ closed its purchase of a majority stake in ID Quantique on April 30.2025-03-31 · financial — IonQ recognized revenue of $7.6 million in Q1 2025, beating the midpoint of guidance.2025-03-31 · financial — IonQ ended the quarter with just shy of $700 million in cash equivalents.2025-01-01 · acquisition — IonQ has signed a definitive agreement to acquire a controlling stake in ID Quantique, a large global player in quantum networking.2025-01-01 · executive change — The Board has appointed Niccolo de Masi as President and Chief Executive Officer, while Peter Chapman continues as Executive Chair.2025-01-01 · financial — IonQ is launching a $500 million at the market facility to equip IonQ with an even larger war chest.2024-12-31 · financial — IonQ grew full-year bookings by 47% to $95.6 million and nearly doubled revenue, achieving $43.1 million for the year.2024-09-30 · financial — Cash, cash equivalents and investment as of September 30, 2024, were $382.8 million.

Rolled up across IonQ + its subsidiaries

  • 2026-07-12 design-win → Microsoft quantum source ↗
  • 2026-07-11 design-win → Amazon quantum source ↗
  • 2026-03-31 financial IonQ delivered $64.7 million of GAAP revenue in Q1 2026, representing 755% year-on-year growth.
  • 2026-03-31 financial Remaining performance obligations (RPOs) stood at $470 million as of March 31, 2026, representing 554% year-over-year growth.
  • 2026-01-31 acquisition IonQ announced the largest acquisition agreement in Quantum history to acquire SkyWater Technologies, the leading quantum foundry in the world.
  • 2026-01-31 acquisition IonQ acquired Seed Innovations, a software classified mission control business, at the end of January 2026.
  • 2026-01-01 acquisition In January of 2026, IonQ announced its intent to acquire SkyWater, with the transaction expected to close in the second or third quarter of 2026, subject to customary regulatory approvals.
  • 2025-12-31 financial Remaining performance obligations (RPO) stood at $370 million at the end of 2025 compared to just $77 million at the end of 2024, which is almost a fivefold increase.
  • 2025-12-31 financial Cash, cash equivalents and investments as of December 31, 2025, were $3.3 billion.
  • 2025-12-31 financial Fourth quarter 2025 revenues were $61.9 million, growing 429% year-over-year, and full year 2025 revenues reached $130 million with 202% year-on-year growth.
  • 2025-10-14 financial IonQ closed an additional $2 billion capital raise at $93 per share in October, bringing pro forma cash balance to $3.5 billion as of October 14.
  • 2025-09-12 capacity expansion IonQ's Tempo system has a computational space approximately 260 million times larger than its current fully commercialized Forte system.
  • 2025-08-01 executive change Niccolo de Masi was appointed as Chairman of IonQ, and Peter Chapman stepped down from his position.
  • 2025-07-09 financial Pro forma cash balance as of July 9, 2025, was $1.6 billion.
  • 2025-07-09 financial IonQ raised $1 billion in an equity offering priced at a 25% premium above the prior trading session close in July 2025.
  • 2025-07-01 acquisition IonQ completed the acquisition of Capella in July.
  • 2025-06-30 financial Revenue for Q2 2025 was $20.7 million, beating the high end of guidance by 15%.
  • 2025-06-09 capacity expansion IonQ is targeting 1,600 logical qubits in 2028 and 80,000 in 2030.
  • 2025-04-30 acquisition IonQ closed its purchase of a majority stake in ID Quantique on April 30.
  • 2025-03-31 financial IonQ recognized revenue of $7.6 million in Q1 2025, beating the midpoint of guidance.
  • 2025-03-31 financial IonQ ended the quarter with just shy of $700 million in cash equivalents.
  • 2025-01-01 acquisition IonQ has signed a definitive agreement to acquire a controlling stake in ID Quantique, a large global player in quantum networking.

Financials — multi-year, confidence 1.0 (filings)

revenue

$0M '20
$2M '21
$11M '22
$22M '23
$43M '24
$130M '25

operating income

$-16M '20
$-39M '21
$-86M '22
$-158M '23
$-232M '24
$-634M '25

net income

$-15M '20
$-106M '21
$-48M '22
$-158M '23
$-332M '24
$-510M '25

Supplies → 3

🇰🇷 Hyundai Motor quantum L2 50
🇺🇸 Microsoft quantum → Microsoft Azure L3 50
🇺🇸 Amazon quantum L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Synthetic-aperture radar imagingIonQ HarmonyBraketIonQ AriaQuantum positioning, navigation and timing servicesAzure QuantumIonQ Quantum CloudGoogle Cloud Marketplace

JCET GrouppublicRelationships + financials

ai compute · 🇨🇳 China · SSE: 600584 · 3 sources · 7 products · 51 patents

$5.7Brevenue · FY2025 · USD$22.6B mkt cap

OSAT

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $3.9BFY2021: $4.7BFY2022: $5.0BFY2023: $4.2BFY2024: $5.3BFY2025: $5.7B wins 2021-04-08 · → Texas Instruments osat — click for source events
  • 2021-04-08 design-win → Texas Instruments osat source ↗

Patents — 51 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 50
Computing 1

Newest 1 of 51, most recent first — all on Google Patents →

  • 2026-07-02US20260191071METHOD FOR IMPROVING THE REFLOW SOLDERING YIELD OF A CHIP PACKAGE

Financials — multi-year, confidence 1.0 (filings)

revenue

$3.6B '18
$3.4B '19
$3.9B '20
$4.7B '21
$5.0B '22
$4.2B '23
$5.3B '24
$5.7B '25

operating income

$-122M '18
$18M '19
$213M '20
$469M '21
$479M '22
$215M '23
$244M '24
$274M '25

net income

$-142M '18
$13M '19
$189M '20
$437M '21
$478M '22
$217M '23
$224M '24
$231M '25

Buys from ← 1

🇨🇳 SMIC foundry L2 50

Supplies → 2

🇺🇸 Qualcomm osat L2 50
🇺🇸 Texas Instruments osat L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

BGA (Ball Grid Array)FCBGA (Flip Chip BGA)Automotive PackagingQFN (Quad Flat No-Lead)System-in-Package (SiP)High-Density Interconnect (HDI)Chiplet Packaging

JL MAG Rare-EarthpublicProduct-grade

physical ai · 🇨🇳 China · SZSE: 300748 · 5 sources · 0 products · 5 patents

$1.1Brevenue · FY2025 · USD$5.1B mkt cap

Sintered NdFeB magnets

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $357MFY2021: $602MFY2022: $1.1BFY2023: $1.1BFY2024: $1.0BFY2025: $1.1B wins 2026-07-17 · China Rare Earth → physical_ai — click for source2025-09-18 · → Toyota Motor rare_earth_magnets — click for source2026-07-17 · China Northern Rare Earth High-Tech → physical_ai — click for source2026-07-17 · → maxon rare_earth_magnets — click for source2025-09-18 · → BYD rare_earth_magnets — click for source2026-07-17 · → Nidec rare_earth_magnets — click for source2026-07-17 · → Kollmorgen rare_earth_magnets — click for source2025-08-10 · China Northern Rare Earth High-Tech → physical_ai — click for source events
  • 2026-07-17 reported edge China Rare Earth → physical_ai source ↗
  • 2026-07-17 reported edge China Northern Rare Earth High-Tech → physical_ai source ↗
  • 2026-07-17 reported edge → maxon rare_earth_magnets source ↗
  • 2026-07-17 reported edge → Nidec rare_earth_magnets source ↗
  • 2026-07-17 reported edge → Kollmorgen rare_earth_magnets source ↗
  • 2025-09-18 design-win → Toyota Motor rare_earth_magnets source ↗
  • 2025-09-18 design-win → BYD rare_earth_magnets source ↗
  • 2025-08-10 design-win China Northern Rare Earth High-Tech → physical_ai source ↗

Patents — 5 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 3
Robotics / manipulators 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$195M '18
$246M '19
$357M '20
$602M '21
$1.1B '22
$1.1B '23
$1.0B '24
$1.1B '25

operating income

$24M '18
$26M '19
$42M '20
$76M '21
$113M '22
$70M '23
$19M '24
$117M '25

net income

$22M '18
$23M '19
$36M '20
$67M '21
$104M '22
$83M '23
$43M '24
$104M '25

Buys from ← 4

🇨🇳 China Rare Earth physical_ai L2 50
🇨🇳 China Rare Earth physical_ai L2
🇨🇳 China Northern Rare Earth High-Tech physical_ai L2
🇨🇳 China Northern Rare Earth High-Tech physical_ai L2 50

Supplies → 7

Toyota Motor rare_earth_magnets L2 50
🇨🇭 maxon rare_earth_magnets L2
🇨🇳 BYD rare_earth_magnets L2 50
🇺🇸 Tesla rare_earth_magnets → Tesla Optimus L3 50
🇯🇵 Nidec rare_earth_magnets → Precision & servo motors L3
🇯🇵 Nidec rare_earth_magnets → Precision & servo motors L3 50
🇺🇸 Kollmorgen rare_earth_magnets L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

JTEKTpublicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6473 · 8 sources · 8 products · 1445 patents

$12.8Brevenue · FY2026 · USD$4.0B mkt cap

Bearings, steering, machine tools

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $7.7BFY2022: $8.8BFY2023: $10.3BFY2024: $11.7BFY2025: $12.4BFY2026: $12.8B wins 2026-07-17 · Sanyo Special Steel → steel — click for source2026-07-17 · Aichi Steel → steel — click for source events 2025-04-01 · financial report — JTEKT reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2026-07-17 reported edge Sanyo Special Steel → steel source ↗
  • 2026-07-17 reported edge Aichi Steel → steel source ↗
  • 2025-04-01 financial report JTEKT reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Patents — 1445 CPC-scoped to physical ai (physical-AI-relevant classes)

Bearings 529
Gears / reducers 342
Force / torque sensors 151
Electric motors 140
Robotics / manipulators 95
Batteries 88
Power electronics 62
IMU / navigation 20
Lidar / ranging 7
Computing 7
Other 3
Imaging / cameras 1

IP chokepoint in: Bearings

Newest 28 of 1445, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$7.7B '21
$8.8B '22
$10.3B '23
$11.7B '24
$12.4B '25
$12.8B '26

operating income

$98M '21
$250M '22
$318M '23
$441M '24
$253M '25
$165M '26

net income

$5M '21
$127M '22
$211M '23
$248M '24
$90M '25
$80M '26

Sources: 株式会社ジェイテクト — 臨時報告書 · 株式会社ジェイテクト — 臨時報告書 · 株式会社ジェイテクト — 半期報告書-第126期(2025/04/01-2026/03/31) · 株式会社ジェイテクト — 有価証券報告書-第126期(2025/04/01-2026/03/31) · 株式会社ジェイテクト — 臨時報告書

Buys from ← 2

🇯🇵 Sanyo Special Steel steel L2
🇯🇵 Aichi Steel steel L2

Supplies → 1

Toyota Motor robotics L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Machining CentersTapered Roller BearingsMechanical Power SteeringNC Machine ToolsElectric Power Steering (EPS)Grinding MachinesCylindrical Roller BearingsAngular Contact Ball Bearings

Kawasaki Heavy IndustriespublicProduct-grade

physical ai · 🇯🇵 Japan · TSE: 7012 · 54 sources · 7 products · 31 patents

$14.2Brevenue · FY2026 · USD$13.4B mkt cap

Industrial & humanoid robots

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $15.1BFY2021: $9.2BFY2022: $9.2BFY2023: $10.6BFY2024: $12.8BFY2025: $13.1BFY2026: $14.2B wins 2026-07-16 · NVIDIA → ai_chips — click for source2026-07-16 · → NVIDIA industrial_arm — click for source2026-07-16 · NVIDIA → ai_chips — click for source events 2025-04-01 · financial report — Kawasaki Heavy Industries reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2026-07-16 reported edge NVIDIA → ai_chips source ↗
  • 2026-07-16 reported edge → NVIDIA industrial_arm source ↗
  • 2026-07-16 reported edge NVIDIA → ai_chips source ↗
  • 2025-04-01 financial report Kawasaki Heavy Industries reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Patents — 31 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 31

Financials — multi-year, confidence 1.0 (filings)

revenue

$14.4B '19
$15.1B '20
$9.2B '21
$9.2B '22
$10.6B '23
$12.8B '24
$13.1B '25
$14.2B '26

operating income

$577M '19
$571M '20
$-33M '21
$282M '22
$502M '23
$223M '24
$818M '25
$838M '26

net income

$248M '19
$172M '20
$-119M '21
$135M '22
$326M '23
$156M '24
$542M '25
$667M '26

Sources: 川崎重工業株式会社 — 臨時報告書 · 川崎重工業株式会社 — 臨時報告書 · 川崎重工業株式会社 — 臨時報告書 · 川崎重工業株式会社 — 有価証券報告書-第203期(2025/04/01-2026/03/31) · 川崎重工業株式会社 — 半期報告書-第203期(2025/04/01-2026/03/31)

Buys from ← 3

🇯🇵 Sumitomo Heavy Industries planetary_reducers → MOTOMAN L3 50
🇺🇸 NVIDIA ai_chips L2
🇺🇸 NVIDIA ai_chips L2

Supplies → 2

Toyota Motor industrial_arm L2 50
🇺🇸 NVIDIA industrial_arm L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

MOTOMAN-UPMOTOMAN-SDAMOTOMANMOTOMAN-HCMOTOMAN-HCRMOTOMAN-MHMOTOMAN-HC10

Keli Sensing TechnologypublicFinancials only

physical ai · 🇨🇳 China · 1 sources · 0 products

$229Mrevenue · FY2025 · USD$17.9B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $124MFY2021: $152MFY2022: $157MFY2023: $158MFY2024: $191MFY2025: $229M wins events

Financials — multi-year, confidence 1.0 (filings)

revenue

$124M '20
$152M '21
$157M '22
$158M '23
$191M '24
$229M '25

operating income

$37M '20
$43M '21
$45M '22
$56M '23
$48M '24
$65M '25

net income

$33M '20
$37M '21
$39M '22
$46M '23
$39M '24
$50M '25

KnowlespublicFinancials only

physical ai · 🇺🇸 United States · 36 sources · 0 products

$593Mrevenue · FY2025 · USD$3.0B mkt cap

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Microphones and speakers (onboard conversational audio)' for Figure 02 (+2 more). Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $764MFY2021: $868MFY2022: $479MFY2023: $457MFY2024: $554MFY2025: $593M wins events

Financials — multi-year, confidence 1.0 (filings)

revenue

$764M '20
$868M '21
$479M '22
$457M '23
$554M '24
$593M '25

operating income

$48M '20
$118M '21
$91M '22
$49M '23
$57M '24
$78M '25

net income

$7M '20
$150M '21
$-430M '22
$72M '23
$-239M '24
$44M '25

Kobe Steel, Ltd.publicRelationships + financials

- · 🇯🇵 Japan · 1 sources · 0 products

$15.0Brevenue · FY2026 · USD$764.8B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $10.5BFY2022: $12.8BFY2023: $15.2BFY2024: $15.7BFY2025: $15.7BFY2026: $15.0B wins 2026-07-17 · → Nabtesco steel — click for source events
  • 2026-07-17 reported edge → Nabtesco steel source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$10.5B '21
$12.8B '22
$15.2B '23
$15.7B '24
$15.7B '25
$15.0B '26

operating income

$187M '21
$539M '22
$532M '23
$1.1B '24
$977M '25
$800M '26

net income

$143M '21
$370M '22
$447M '23
$674M '24
$740M '25
$577M '26

Supplies → 1

🇯🇵 Nabtesco steel L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Kokusai ElectricpublicProduct-grade

ai compute · 🇯🇵 Japan · TSE: 6525 · 13 sources · 3 products · 1827 patents

$1.4Brevenue · FY2026 · USD$12.7B mkt cap

Batch deposition

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202220232024202520262027 rev FY2022: $1.5BFY2023: $1.5BFY2024: $1.1BFY2025: $1.6BFY2026: $1.6B wins 2026-05-06 · → Intel ai_chips — click for source2026-04-24 · → Micron ai_chips — click for source events 2025-04-01 · financial report — Kokusai Electric reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2026-05-06 design-win → Intel ai_chips source ↗
  • 2026-04-24 design-win → Micron ai_chips source ↗
  • 2025-04-01 financial report Kokusai Electric reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Patents — 1827 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 1703
Computing 93
Other 12
Robotics / manipulators 10
Lidar / ranging 8
Imaging / cameras 1

Newest 18 of 1827, most recent first — all on Google Patents →

  • 2025-07-17US2025232993Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium
  • 2025-03-20WO2025057457MONITORING SYSTEM AND MONITORING METHOD
  • 2024-10-31US2024360552SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
  • 2024-08-08WO2024161677DATA EXPANSION DEVICE, DATA EXPANSION METHOD, AND DATA EXPANSION PROGRAM
  • 2023-03-02WO2023026451OBJECT SEARCH SYSTEM, OBJECT SEARCH DEVICE, OBJECT SEARCH METHOD
  • 2022-09-29WO2022201258SEMICONDUCTOR DEVICE MANUFACTURING METHOD, DISPLAY METHOD, SUBSTRATE TREATMENT DEVICE, AND PROGRAM
  • 2021-09-30WO2021192207METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE TREATMENT DEVICE, AND PROGRAM
  • 2021-09-16WO2021181852TERMINAL DEVICE AND RF POWER SUPPLY DEVICE
  • 2021-03-25WO2021053755SYSTEM, SUBSTRATE PROCESSING DEVICE, AND PROGRAM
  • 2020-09-24WO2020189064SOFTWARE-DEFINED RADIO EQUIPMENT
  • 2020-09-03WO2020174599SOFTWARE-DEFINED RADIO EQUIPMENT
  • 2020-09-03WO2020174916IMAGING SYSTEM
  • 2020-06-25WO2020129176IMAGE PROCESSING SYSTEM, IMAGE PROCESSING METHOD, AND IMAGE PROCESSING PROGRAM
  • 2020-03-26WO2020059004SOFTWARE WIRELESS DEVICE
  • 2020-03-19WO2020053953VERIFICATION SYSTEM AND VERIFICATION SERVER
  • 2020-01-02WO2020003400FACE COLLATION SYSTEM
  • 2019-08-29WO2019163002SOFTWARE WIRELESS DEVICE
  • 2018-12-06WO2018220700NEW LEARNING DATASET GENERATION METHOD, NEW LEARNING DATASET GENERATION DEVICE, AND LEARNING METHOD USING GENERATED LEARNING DATASET

Supplies → 2

🇺🇸 Intel ai_chips → Gaudi Accelerators L3 53
🇺🇸 Micron ai_chips L2 53

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

NEXX PlatformULVAC NEXXAtomic Layer Deposition (ALD) Systems

KUKAsubsidiaryProduct-grade

physical ai · 🇩🇪 Germany · 49 sources · 9 products · 46 patents

Subsidiary of Midea Group

$3.8Brevenue · FY2021 · USD

Industrial robots, automation

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $3.0BFY2021: $3.8B wins 2026-05-06 · Nabtesco → planetary_reducers — click for source events 2023-06-27 · other — KUKA is profiled as a company in the service robotics market.2022-02-01 · executive change — John Bubnikovich, who most recently served as Chief Regional Officer of North America at Kuka Robotics, was appointed CEO of JMP Solutions' newly-created parent company.
  • 2026-05-06 design-win Nabtesco → planetary_reducers source ↗
  • 2023-06-27 other KUKA is profiled as a company in the service robotics market.
  • 2022-02-01 executive change John Bubnikovich, who most recently served as Chief Regional Officer of North America at Kuka Robotics, was appointed CEO of JMP Solutions' newly-created parent company.

Patents — 46 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 27
Robotics / manipulators 16
Computing 1
Bearings 1
Electric motors 1

Newest 6 of 46, most recent first — all on Google Patents →

  • 2026-06-18WO2026124601ROBOTIC ARM STRUCTURE OF ROBOT AND INTERNALLY-MESHING PLANETARY GEAR DEVICE
  • 2026-06-11WO2026118825ROTOR, MOTOR, AND ELECTRIC DEVICE
  • 2026-05-15WO2026098701BEARING DEVICE AND GEAR DEVICE
  • 2026-05-07WO2026091009ROBOT CONTROL SYSTEM
  • 2026-01-08WO2026007115MULTI-POWER RAIL SYSTEM FOR A ROBOT CONTROLLER, ROBOT CONTROLLER COMPRISING THE MULTI-POWER RAIL SYSTEM AND METHOD FOR OPERATING THE MULTI-POWER RAIL SYSTEM
  • 2026-01-02WO2026002379RECALIBRATING AND CONTROLLING A DRIVE OF A ROBOT JOINT

Financials — multi-year, confidence 1.0 (filings)

revenue

$3.4B '16
$4.0B '17
$3.7B '18
$3.7B '19
$3.0B '20
$3.8B '21

operating income

$150M '16
$120M '17
$42M '18
$59M '19
$-126M '20
$95M '21

net income

$99M '16
$101M '17
$15M '18
$11M '19
$-118M '20
$57M '21

Buys from ← 2

🇯🇵 Nabtesco planetary_reducers → KUKA KR CYBERTECH L3 50
🇨🇳 Sunrise Instruments force_torque → KUKA KMR IIWA L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

KUKA KMR IIWAKUKA Sunrise.OSKUKA.SimKUKA SafeRoboticsKUKA KR AGILUSKUKA KR QUANTECKUKA KR IONTECKUKA LBRKUKA KR CYBERTECH

KVH IndustriespublicFinancials only

physical ai · 🇺🇸 United States · 10 sources · 5 products

$111Mrevenue · FY2025 · USD$171M mkt cap

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Fiber optic gyro (FOG) attitude sensor, model KVH-1750' for HUBO. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $159MFY2021: $134MFY2022: $139MFY2023: $132MFY2024: $114MFY2025: $111M wins events 2025-06-30 · M&A — Completed the sale of headquarters facility at the end of June and expects to complete the sale of factory facility in September.2025-01-31 · partnership — Following the launch of OneWeb service at the end of January, KVH is now in discussions with Starlink regarding renewal of prepaid Starlink data pool agreement.2024-12-31 · financial — With more than two thousand three hundred active maritime Starlink terminals at the end of 2024, Starlink is our fastest-growing product line in our history.2024-12-01 · product launch — In December, we launched our new TrackNet Coastal cellular Wi-Fi system, which offers data speeds as fast as three hundred megabits per second and data costs as low as one dollar per gigabyte.2024-10-19 · other — On October 19, the IS-33e satellite operated by Intelsat experienced an anomaly that resulted in loss of service in Europe, Africa, Asia and the Indian Ocean.2024-07-01 · supply deal — Substantial contribution from Starlink data subscriptions, now sold through our bulk data purchase agreement, which went into effect on July 1st.
  • 2025-06-30 M&A Completed the sale of headquarters facility at the end of June and expects to complete the sale of factory facility in September.
  • 2025-01-31 partnership Following the launch of OneWeb service at the end of January, KVH is now in discussions with Starlink regarding renewal of prepaid Starlink data pool agreement.
  • 2024-12-31 financial With more than two thousand three hundred active maritime Starlink terminals at the end of 2024, Starlink is our fastest-growing product line in our history.
  • 2024-12-01 product launch In December, we launched our new TrackNet Coastal cellular Wi-Fi system, which offers data speeds as fast as three hundred megabits per second and data costs as low as one dollar per gigabyte.
  • 2024-10-19 other On October 19, the IS-33e satellite operated by Intelsat experienced an anomaly that resulted in loss of service in Europe, Africa, Asia and the Indian Ocean.
  • 2024-07-01 supply deal Substantial contribution from Starlink data subscriptions, now sold through our bulk data purchase agreement, which went into effect on July 1st.

Financials — multi-year, confidence 1.0 (filings)

revenue

$159M '20
$134M '21
$139M '22
$132M '23
$114M '24
$111M '25

operating income

$-23M '20
$-20M '21
$-6M '22
$-17M '23
$-12M '24
$-11M '25

net income

$-22M '20
$-10M '21
$24M '22
$-15M '23
$-11M '24
$-7M '25

Products

Gyro CompassesMini-VSAT BroadbandFiber Optic Gyro (FOG) SensorsTracPhoneDataVoy

KYBpublicFinancials only

- · 🇯🇵 Japan · 22 sources · 0 products

$3.0Brevenue · FY2026 · USD$170.2B mkt cap

Discovered via bom_teardown (2026-07-13). Atlas BOM: suspension fork and rear shock absorber. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $2.0BFY2022: $2.4BFY2023: $2.7BFY2024: $2.7BFY2025: $2.7BFY2026: $3.0B wins events

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.0B '21
$2.4B '22
$2.7B '23
$2.7B '24
$2.7B '25
$3.0B '26

operating income

$171M '21
$184M '22
$195M '23
$129M '24
$126M '25
$181M '26

net income

$105M '21
$139M '22
$168M '23
$97M '24
$92M '25
$179M '26

Lam ResearchpublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: LRCX · 59 sources · 7 products · 30 patents

$18.4Brevenue · FY2025 · USD$401.4B mkt cap

Etch, deposition

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $10.0BFY2021: $14.6BFY2022: $17.2BFY2023: $17.4BFY2024: $14.9BFY2025: $18.4B wins 2025-08-23 · Taiwan Manufacturing → foundry — click for source2026-06-30 · → Taiwan Manufacturing ai_chips — click for source events 2026-06-30 · product launch — This quarter, we will ship our first Dextro cobot for a deposition product further increasing our ability to create value from our overall installed base more than 100,000 chambers.2026-06-18 · financial — Lam Research is positioned to benefit from the AI capex supercycle as a production technology equipment supplier.2026-03-31 · financial — March quarter revenue came in at $5.84 billion, which was up 9% sequentially and up 24% from the same period in 2025.2026-03-31 · financial — We ended the March quarter with approximately 20,600 regular full-time employees which was an increase of approximately 900 people from the prior quarter.2026-03-31 · financial — Customer Support Business Group generated a record $2.1 billion in revenue in the March quarter, which was up 6% sequentially and up 25% from the same period in 2025.2025-12-31 · financial — In calendar year 2025, revenue was a record coming in at $20.6 billion which is up 27% year over year.2025-12-31 · product launch — Dextro continued to gain momentum in 2025, expanding to cover six different LAM tool types.2025-12-31 · financial — CSBG revenue also reached a record of $7.2 billion.2025-12-31 · capacity expansion — In 2025, we launched state-of-the-art automated warehouses that enable greater production efficiency.2025-12-31 · financial — Gross margin was 49.9%, the highest result as a combined company for the full year since the Novelis merger back in 2012.2025-09-30 · financial — Lam delivered record revenues of $5.3 billion in the September quarter with a gross margin of 50.6% and a record operating margin of 35%.2025-09-01 · partnership — In September, Lam announced a key partnership with JSR Corporation to collaborate on the integration of Ether technology with novel EUV patterning materials and metal oxide resists.2025-06-30 · capacity expansion — we recently achieved a significant milestone of 6,000 installed plating sales.2025-06-30 · product launch — First is our Halo ALD Moly tool, which is ramping at multiple NAND customers this year.2025-06-30 · product launch — Today, we are the only company with ALD Moly tools already in production in foundry/logic.2025-06-30 · financial — SABRE 3D market share in advanced packaging is expected to grow nearly 5 points year-on-year in calendar 2025.2025-06-30 · product launch — our state-of-the-art conductor etch tool Akara, is off to a solid start since its launch earlier this year.2025-06-30 · financial — We expect WFE spending to be in the $105 billion range, up from our prior view of approximately $100 billion, predominantly due to an uptick in domestic China related spending.2025-06-30 · product launch — In the June quarter, Lam expanded our Dextro capabilities to cover 3 additional tool types, and we are accelerating the road map to support more products and more shipments in coming quarters.2025-06-30 · financial — For our 2025 fiscal year, we had record revenue of $18.4 billion and gross margin of 48.8%.2025-06-30 · financial — Revenues and profitability came in at the upper end of our guided ranges with gross margins exceeding 50% for the first time since the merger of Lam and Novellus.2025-03-31 · financial — We delivered a record quarter for foundry revenues.2025-03-31 · capacity expansion — Capital expenditures in the March quarter were $288 million, up $100 million from the December quarter, with a major driver being a purchase of land in India to enable planned lab expansions.2025-03-31 · financial — Gross margin percentage was a record for the company since the Novelis merger.2025-03-31 · financial — Revenue for the March quarter was $4.72 billion, which was an increase of 8% from the prior quarter.2025-01-29 · product launch — Earlier today we announced that our Aether dry-resist solution has achieved a major milestone, having just been selected as the production tool of record for high bandwidth DRAM at a leading memory customer.2024-12-31 · capacity expansion — Our Asia operations continue to ramp very efficiently and in 2024 help drive meaningful improvement in both our responsiveness to rising customer demand and our gross margin.2024-12-31 · financial — For calendar year 2024, CSBG revenue increased 11% to $6.6 billion, exceeding our expectations.2024-12-31 · financial — Calendar 2024 revenue of $16.2 billion and diluted earnings per share of $3.36.2024-12-31 · financial — We delivered 160 basis points of operating margin expansion in calendar 2024, even as we invested heavily in new products and infrastructure to fuel future growth.2024-12-31 · financial — December quarter revenue, gross margin, operating margin, and EPS were all above our guidance midpoints, reflecting strong and consistent operational execution.2024-12-31 · financial — Gross margin came in at 48.2%, which was the highest annual result since Lam merged with Novellus in 2013.2024-12-31 · product launch — Our recently introduced Cryo 3.0 technology is winning at the leading etch, delivering best-in-class results for high-aspect ratio dielectric etch applications on our latest Vantex CX+ product.2024-12-01 · regulatory — In early December, there were some new regulations that came out restricting a handful of customers that certainly impacted us with a forecast from that group of customers of probably $700 million or so that obviously we won't be able to ship to those customers.2024-09-30 · financial — Lam posted a strong September quarter with revenues and earnings per share higher than the midpoint and profitability above the high-end of the guided ranges.2024-09-30 · capacity expansion — Our SABRE 3D revenue has more than doubled this year as both the number of 2.5D and 3D packages and the metal layer count per package has grown.2024-09-30 · financial — Deferred revenue balance at the end of the quarter was $2.05 billion, an increase of $495 million from the June quarter.2024-09-30 · financial — Revenue for the September quarter was $4.17 billion, which was an increase of 8% from the prior quarter.2024-06-18 · financial — Lam Research semiconductor equipment stock rose.
  • 2026-06-30 product launch This quarter, we will ship our first Dextro cobot for a deposition product further increasing our ability to create value from our overall installed base more than 100,000 chambers.
  • 2026-06-30 design-win → Taiwan Manufacturing ai_chips source ↗
  • 2026-06-18 financial Lam Research is positioned to benefit from the AI capex supercycle as a production technology equipment supplier.
  • 2026-03-31 financial March quarter revenue came in at $5.84 billion, which was up 9% sequentially and up 24% from the same period in 2025.
  • 2026-03-31 financial We ended the March quarter with approximately 20,600 regular full-time employees which was an increase of approximately 900 people from the prior quarter.
  • 2026-03-31 financial Customer Support Business Group generated a record $2.1 billion in revenue in the March quarter, which was up 6% sequentially and up 25% from the same period in 2025.
  • 2025-12-31 financial In calendar year 2025, revenue was a record coming in at $20.6 billion which is up 27% year over year.
  • 2025-12-31 product launch Dextro continued to gain momentum in 2025, expanding to cover six different LAM tool types.
  • 2025-12-31 financial CSBG revenue also reached a record of $7.2 billion.
  • 2025-12-31 capacity expansion In 2025, we launched state-of-the-art automated warehouses that enable greater production efficiency.
  • 2025-12-31 financial Gross margin was 49.9%, the highest result as a combined company for the full year since the Novelis merger back in 2012.
  • 2025-09-30 financial Lam delivered record revenues of $5.3 billion in the September quarter with a gross margin of 50.6% and a record operating margin of 35%.
  • 2025-09-01 partnership In September, Lam announced a key partnership with JSR Corporation to collaborate on the integration of Ether technology with novel EUV patterning materials and metal oxide resists.
  • 2025-08-23 design-win Taiwan Manufacturing → foundry source ↗
  • 2025-06-30 capacity expansion we recently achieved a significant milestone of 6,000 installed plating sales.
  • 2025-06-30 product launch First is our Halo ALD Moly tool, which is ramping at multiple NAND customers this year.
  • 2025-06-30 product launch Today, we are the only company with ALD Moly tools already in production in foundry/logic.
  • 2025-06-30 financial SABRE 3D market share in advanced packaging is expected to grow nearly 5 points year-on-year in calendar 2025.
  • 2025-06-30 product launch our state-of-the-art conductor etch tool Akara, is off to a solid start since its launch earlier this year.
  • 2025-06-30 financial We expect WFE spending to be in the $105 billion range, up from our prior view of approximately $100 billion, predominantly due to an uptick in domestic China related spending.
  • 2025-06-30 product launch In the June quarter, Lam expanded our Dextro capabilities to cover 3 additional tool types, and we are accelerating the road map to support more products and more shipments in coming quarters.
  • 2025-06-30 financial For our 2025 fiscal year, we had record revenue of $18.4 billion and gross margin of 48.8%.

Patents — 30 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 17
Computing 12
Memory 1

Newest 13 of 30, most recent first — all on Google Patents →

  • 2026-01-29WO2026024498ERROR RECOVERY SYSTEM FOR SUBSTRATE PROCESSING SYSTEMS
  • 2025-12-04WO2025250914PROCESS NAVIGATOR FOR DOE RESULTS CHECKING IN VIRTUAL FABRICATION PLATFORM
  • 2025-05-15WO2025101963SYSTEMS AND METHODS TO IMPROVE WAFER BOW COMPENSATION EFFICIENCY AND FLATTEN WAFERS TO NEUTRAL BOW
  • 2025-05-01WO2025090383PREDICTING TILT PARAMETERS
  • 2024-10-10WO2024211180PROCESS DIAGNOSIS AND DESIGN USING MULTIVARIATE MODEL
  • 2024-06-13WO2024123509ELECTROMECHANICAL MODELING OF COMPONENTS FOR POWER BOX DESIGN
  • 2022-10-20WO2022221178CONTROL OF SEMICONDUCTOR MANUFACTURING EQUIPMENT IN MIXED REALITY ENVIRONMENTS
  • 2022-07-21WO2022155635GENERATING DIGITAL TWINS OF SEMICONDUCTOR MANUFACTURING EQUIPMENT
  • 2021-07-15WO2021141665AUTOCONFIGURATION OF HARDWARE COMPONENTS OF VARIOUS MODULES OF A SUBSTRATE PROCESSING TOOL
  • 2021-04-29WO2021081213DETERMINATION OF RECIPE FOR MANUFACTURING SEMICONDUCTOR
  • 2020-09-03WO2020176640ION BEAM ETCHING WITH SIDEWALL CLEANING
  • 2020-08-20WO2020167720DATA CAPTURE AND TRANSFORMATION TO SUPPORT DATA ANALYSIS AND MACHINE LEARNING FOR SUBSTRATE MANUFACTURING SYSTEMS
  • 2019-10-10WO2019195481PROCESS SIMULATION MODEL CALIBRATION USING CD-SEM

Financials — multi-year, confidence 1.0 (filings)

revenue

$10.0B '20
$14.6B '21
$17.2B '22
$17.4B '23
$14.9B '24
$18.4B '25

operating income

$2.7B '20
$4.5B '21
$5.4B '22
$5.2B '23
$4.3B '24
$5.9B '25

net income

$2.3B '20
$3.9B '21
$4.6B '22
$4.5B '23
$3.8B '24
$5.4B '25

Sources: LRCX 10-Q 2025-04-25 (acc 0000707549-25-000054) · LRCX 10-K 2024-08-29 (acc 0000707549-24-000106) · LRCX 10-Q 2024-01-29 (acc 0000707549-24-000016) · LRCX 10-K 2023-08-15 (acc 0000707549-23-000102) · LRCX 10-Q 2025-10-24 (acc 0000707549-25-000085) · LRCX 10-Q 2026-04-23 (acc 0000707549-26-000022) · LRCX 10-Q 2025-01-31 (acc 0000707549-25-000014) · LRCX 10-Q 2024-10-28 (acc 0000707549-24-000128) · LRCX 10-Q 2024-04-29 (acc 0000707549-24-000067) · LRCX 10-Q 2023-10-23 (acc 0000707549-23-000115)

Buys from ← 1

🇹🇼 Taiwan Manufacturing foundry L2 53

Supplies → 2

🇹🇼 Taiwan Manufacturing ai_chips L2 50
🇰🇷 Samsung Electronics ai_chips → Exynos AI L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

SpeedFlexCoronusVectorStrikerKiyoVersys

LG Energy SolutionpublicRelationships + financials

physical ai · 🇰🇷 South Korea · KRX: 373220 · 102 sources · 9 products · 2200 patents

$16.0Brevenue · FY2025 · USD$52.7B mkt cap

LG Energy Solution is a South Korean manufacturer of lithium-ion battery cells for electric vehicles and energy storage, producing NCM, NCA, LFP and NCMA chemistries in pouch and cylindrical formats. It was spun off from LG Chem in 2020 and is listed on the Korea Exchange.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $1.2BFY2021: $15.6BFY2022: $19.9BFY2023: $25.8BFY2024: $18.8BFY2025: $16.7B wins 2026-06-22 · → Boston Dynamics batteries — click for source events 2026-07-30 · disclosure — LG Energy Solution will hold an investor relations conference call on July 30, 2026 at 10:00 AM (Korea time) to present Q2 2026 business results, conducted simultaneously in Korean and English via conference call with live webcast available on the company website.2026-07-16 · financial — LG Energy Solution climbed 1.79% while other major stocks declined.2026-06-30 · financial — LG Energy Solution plunged 9.61 percent to 362,000 won on profit-taking.2026-06-30 · financial report — LG Energy Solution reported Q2 2026 (April-June) consolidated revenue of 756.02 billion won and operating profit of 11.33 billion won, representing a 15.3% revenue increase and operating profit turnaround versus Q1 2026; however, excluding North American IRA Tax Credit subsidies 2026-06-29 · disclosure — LG Energy Solution discloses sustainability management report.2026-06-22 · financial — LG Energy Solution dipped 4.7 percent to 385,500 won.2026-06-11 · financial — LG Energy Solution lost 3.76 percent on Seoul stock exchange on June 11, 2026.2026-06-10 · financial — LG Energy Solution gained 1.01 percent in Seoul trading on June 10, 2026.2026-06-10 · financial — LG Energy Solution went down 2.08 percent amid market decline.2026-06-01 · disclosure — LG Energy Solution discloses large enterprise group status for Q1 2026.2026-06-01 · disclosure — LG Energy Solution discloses corporate governance report.2026-05-28 · supply deal — LG Energy Solution clinched a deal to supply energy storage system batteries to a U.S. firm.2026-05-28 · financial — Leading battery maker LG Energy Solution surged 12.65 percent on Thursday.2026-05-26 · disclosure — LG Energy Solution corrects disclosure on disposal of tangible assets by subsidiary.2026-05-14 · financial report — LG Energy Solution files quarterly report for Q1 2026.2026-05-13 · financial — Leading battery maker LG Energy Solution contracted 2.26 percent in Seoul trading.2026-05-12 · financial — LG Energy Solution plunged 5.34 percent to 443,000 won on market pullback.2026-04-30 · financial report — LG Energy Solution corrects consolidated financial statement operating results for Q1 2026.2026-04-30 · financial — LG Energy Solution swung to a net loss in the first quarter due to slowdown of the electric vehicle market.2026-04-29 · disclosure — LG Energy Solution corrects disclosure on disposal of tangible assets by subsidiary.2026-04-28 · related party deal — LG Energy Solution enters into real estate lease with related party.2026-04-28 · disclosure — LG Energy Solution discloses fair trade voluntary compliance program operations.2026-04-22 · financial — Leading battery maker LG Energy Solution rose 1.36 percent as battery shares led market advance on strong first quarter earnings expectations.2026-04-07 · financial report — LG Energy Solution supplements consolidated financial statement operating results for Q1 2026.2026-04-07 · disclosure — LG Energy Solution holds an investor relations briefing session.
  • 2026-07-30 disclosure LG Energy Solution will hold an investor relations conference call on July 30, 2026 at 10:00 AM (Korea time) to present Q2 2026 business results, conducted simultaneously in Korean and English via conference call with live webcast available on the company website.
  • 2026-07-16 financial LG Energy Solution climbed 1.79% while other major stocks declined.
  • 2026-06-30 financial LG Energy Solution plunged 9.61 percent to 362,000 won on profit-taking.
  • 2026-06-30 financial report LG Energy Solution reported Q2 2026 (April-June) consolidated revenue of 756.02 billion won and operating profit of 11.33 billion won, representing a 15.3% revenue increase and operating profit turnaround versus Q1 2026; however, excluding North American IRA Tax Credit subsidies
  • 2026-06-29 disclosure LG Energy Solution discloses sustainability management report.
  • 2026-06-22 financial LG Energy Solution dipped 4.7 percent to 385,500 won.
  • 2026-06-22 design-win → Boston Dynamics batteries source ↗
  • 2026-06-11 financial LG Energy Solution lost 3.76 percent on Seoul stock exchange on June 11, 2026.
  • 2026-06-10 financial LG Energy Solution gained 1.01 percent in Seoul trading on June 10, 2026.
  • 2026-06-10 financial LG Energy Solution went down 2.08 percent amid market decline.
  • 2026-06-01 disclosure LG Energy Solution discloses large enterprise group status for Q1 2026.
  • 2026-06-01 disclosure LG Energy Solution discloses corporate governance report.
  • 2026-05-28 supply deal LG Energy Solution clinched a deal to supply energy storage system batteries to a U.S. firm.
  • 2026-05-28 financial Leading battery maker LG Energy Solution surged 12.65 percent on Thursday.
  • 2026-05-26 disclosure LG Energy Solution corrects disclosure on disposal of tangible assets by subsidiary.
  • 2026-05-14 financial report LG Energy Solution files quarterly report for Q1 2026.
  • 2026-05-13 financial Leading battery maker LG Energy Solution contracted 2.26 percent in Seoul trading.
  • 2026-05-12 financial LG Energy Solution plunged 5.34 percent to 443,000 won on market pullback.
  • 2026-04-30 financial report LG Energy Solution corrects consolidated financial statement operating results for Q1 2026.
  • 2026-04-30 financial LG Energy Solution swung to a net loss in the first quarter due to slowdown of the electric vehicle market.
  • 2026-04-29 disclosure LG Energy Solution corrects disclosure on disposal of tangible assets by subsidiary.

Patents — 2200 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 2048
Other 72
Robotics / manipulators 48
Gears / reducers 9
Electric motors 5
Power electronics 4
Computing 4
Imaging / cameras 4
Force / torque sensors 3
IMU / navigation 2
Lidar / ranging 1

Newest 8 of 2200, most recent first — all on Google Patents →

  • 2026-06-11WO2026121938POUCH CELL ANALYSIS APPARATUS AND POUCH CELL ANALYSIS METHOD USING SAME
  • 2026-01-22WO2026019084LINEAR TRACK SYSTEM
  • 2025-07-03WO2025143774GRIPPER AND METHOD FOR MANUFACTURING BATTERY PACK BY USING SAME
  • 2025-03-06WO2025048156METHOD AND APPARATUS FOR MANUFACTURING POUCH-TYPE BATTERY
  • 2024-08-22WO2024172262RAW MATERIAL INPUT AUTOMATION DEVICE
  • 2024-01-04WO2024005622UNIT CELL TRANSFER SYSTEM
  • 2023-09-14WO2023172013CELL PACKAGING DEVICE
  • 2023-05-19WO2023085631BATTERY MODULE WITH IMPROVED WATERPROOF AND DUSTPROOF PERFORMANCE AND BATTERY PACK INCLUDING SAME

Supplies → 1

🇺🇸 Boston Dynamics batteries L2 58

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Cylindrical cellsNCMA cellsPrismatic cellsEV battery modulesNCM (Nickel Cobalt Manganese) cellsEnergy storage system (ESS) batteriesNCA (Nickel Cobalt Aluminum) cellsLFP (Lithium Iron Phosphate) cellsPouch cells

LG InnotekpublicRelationships + financials

ai compute · 🇰🇷 South Korea · KRX: 011070 · 63 sources · 4 products · 2038 patents

$14.5Brevenue · FY2025 · USD$10.7B mkt cap

Substrates (FC-BGA), optics

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $8.1BFY2021: $13.1BFY2022: $15.2BFY2023: $15.8BFY2024: $15.6BFY2025: $15.4B wins 2026-06-08 · → NVIDIA advanced_packaging — click for source events 2026-07-01 · disclosure — LG Innotek provides advance notice of financial settlement results announcement.2026-06-30 · disclosure — LG Innotek discloses sustainability management report.2026-06-01 · disclosure — LG Innotek discloses corporate governance report.2026-06-01 · disclosure — LG Innotek reports large business group status and Q1 individual company information.2026-05-29 · financial — LG Innotek stock gained 445 percent year-to-date, rising from 267,500 won on January 2 to 1.458 million won by May 29, 2026.2026-05-15 · financial report — LG Innotek files amended quarterly report for Q1 2026.2026-05-14 · financial report — LG Innotek files quarterly report for Q1 2026.2026-05-11 · disclosure — LG Innotek announces investor relations briefing session.2026-04-27 · financial report — LG Innotek reports consolidated interim operating results.
  • 2026-07-01 disclosure LG Innotek provides advance notice of financial settlement results announcement.
  • 2026-06-30 disclosure LG Innotek discloses sustainability management report.
  • 2026-06-08 reported edge → NVIDIA advanced_packaging source ↗
  • 2026-06-01 disclosure LG Innotek discloses corporate governance report.
  • 2026-06-01 disclosure LG Innotek reports large business group status and Q1 individual company information.
  • 2026-05-29 financial LG Innotek stock gained 445 percent year-to-date, rising from 267,500 won on January 2 to 1.458 million won by May 29, 2026.
  • 2026-05-15 financial report LG Innotek files amended quarterly report for Q1 2026.
  • 2026-05-14 financial report LG Innotek files quarterly report for Q1 2026.
  • 2026-05-11 disclosure LG Innotek announces investor relations briefing session.
  • 2026-04-27 financial report LG Innotek reports consolidated interim operating results.

Patents — 2038 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 1043
Power electronics 513
Computing 342
Imaging / cameras 68
Other 22
Lidar / ranging 19
Memory 13
Bearings 7
Electric motors 7
Gears / reducers 4

Newest 16 of 2038, most recent first — all on Google Patents →

  • 2026-06-11WO2026121561POWER SUPPLY DEVICE FOR DETECTING POWER LOSS AND CONTROLLING COOLING FAN
  • 2026-01-29WO2026023814PHOTOVOLTAIC DEVICE HAVING FUNCTION OF DETECTING ARC IN MODULE
  • 2026-01-22WO2026019016DISPLAY PANEL AND ELECTRONIC DEVICE COMPRISING SAME
  • 2026-01-08WO2026010088METHOD FOR UPDATING FIRMWARE OF DEVICE SUPPORTING CLASS A OF LORAWAN AND DEVICE THEREOF
  • 2025-12-11WO2025254357DATA STORAGE DEVICE AND OPERATING METHOD THEREOF
  • 2025-10-23WO2025220918HEAT DISSIPATION MODULE
  • 2025-10-09WO2025211548SYSTEM FOR SWITCHING ARTIFICIAL INTELLIGENCE MODEL OF PHYSICAL MODEL ANALYSIS SIMULATION, AND OPERATING METHOD OF SYSTEM
  • 2025-06-19WO2025127709FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE COMPRISING SAME
  • 2025-06-05WO2025116414AUTOMATIC RECOVERY APPARATUS AND METHOD THROUGH UNDERVOLTAGE DETECTION OF PHYSICAL LAYER DEVICE
  • 2025-05-22WO2025105853WORK PROCESS DIGITIZATION SYSTEM AND OPERATING METHOD THEREOF
  • 2025-03-20WO2025058463DIGITAL KEY SYSTEM
  • 2024-12-26WO2024262853DEVICE HAVING FIRMWARE VERIFICATION FUNCTION
  • 2024-12-05WO2024248500ELASTIC MEMBER AND DISPLAY DEVICE COMPRISING SAME
  • 2024-11-14WO2024232549DIGITAL KEY POSITIONING DEVICE
  • 2024-11-07WO2024228588ELASTIC MEMBER AND DISPLAY DEVICE COMPRISING SAME
  • 2024-11-07WO2024228589ELASTIC MEMBER AND DISPLAY DEVICE COMPRISING SAME

Supplies → 1

🇺🇸 NVIDIA advanced_packaging L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

HDI (High Density Interconnect) SubstratesCamera ModulesFC-BGA (Flip Chip Ball Grid Array)Optical Components

LindepublicRelationships + financials

ai compute · 🇺🇸 United States · NASDAQ: LIN · 64 sources · 0 products · 79 patents

$34.0Brevenue · FY2025 · USD$240.9B mkt cap

Industrial/specialty gases

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $27.2BFY2021: $30.8BFY2022: $33.4BFY2023: $32.9BFY2024: $33.0BFY2025: $34.0B wins 2024-08-02 · → Taiwan Manufacturing ai_chips — click for source2026-07-04 · → Micron ai_chips — click for source events 2026-01-01 · capacity expansion — Linde started up a plant in Brownsville in early January to support rocket propellant demand.2025-12-31 · financial — Annual record levels for EPS, operating cash flow, and operating margins achieved in 2025.2025-12-31 · financial — More than $7 billion returned to shareholders through dividends and share repurchases in 2025.2025-12-31 · other — Signed more than 90 new gas application wins, many for oxyfuel combustion to help customers decarbonize operations.2025-12-31 · financial — Project backlog stands at a record $10 billion, not including over half a billion dollars of investment for rocket propellants to contracted space launch customers.2025-12-31 · other — Increased active low-carbon power sourcing by 23%, enabling 50% of Linde's annual power consumption to be low carbon.2025-12-31 · M&A — Approximately $400 million of bolt-on acquisitions were completed in 2025.2024-12-31 · financial — Full year 2024 operating cash flow ended at $9.4 billion, with almost 60% occurring in the second half.2024-12-31 · M&A — Acquisitions of small tuck-in packaged gas opportunities with 18 signed transactions, with annualized revenues of approximately $200 million.2024-12-31 · financial — The year ended with more than $10 billion in backlog, including a record sale of gas backlog of $7 billion.2024-12-31 · financial — EBIT margins increased 190 basis points to 29.5% for full year 2024.2024-12-31 · capacity expansion — During 2024, Linde set a record for small on-site wins, signing 59 long-term agreements for a total of 64 plants.2024-12-31 · financial — EPS of $3.97 grew 11%, or 13% excluding FX in fourth quarter 2024.2024-12-31 · financial — Fourth quarter 2024 sales of $8.3 billion are flat to prior year and down 1% sequentially.2024-12-31 · financial — Operating profit of $2.5 billion grew 9% and resulted in a 29.9% margin in fourth quarter 2024.2024-12-31 · financial — Linde increased its active low carbon and renewable energy consumption by 19% year-over-year, with over 40% of total power consumption now low carbon based in 2024.
  • 2026-07-04 design-win → Micron ai_chips source ↗
  • 2026-01-01 capacity expansion Linde started up a plant in Brownsville in early January to support rocket propellant demand.
  • 2025-12-31 financial Annual record levels for EPS, operating cash flow, and operating margins achieved in 2025.
  • 2025-12-31 financial More than $7 billion returned to shareholders through dividends and share repurchases in 2025.
  • 2025-12-31 other Signed more than 90 new gas application wins, many for oxyfuel combustion to help customers decarbonize operations.
  • 2025-12-31 financial Project backlog stands at a record $10 billion, not including over half a billion dollars of investment for rocket propellants to contracted space launch customers.
  • 2025-12-31 other Increased active low-carbon power sourcing by 23%, enabling 50% of Linde's annual power consumption to be low carbon.
  • 2025-12-31 M&A Approximately $400 million of bolt-on acquisitions were completed in 2025.
  • 2024-12-31 financial Full year 2024 operating cash flow ended at $9.4 billion, with almost 60% occurring in the second half.
  • 2024-12-31 M&A Acquisitions of small tuck-in packaged gas opportunities with 18 signed transactions, with annualized revenues of approximately $200 million.
  • 2024-12-31 financial The year ended with more than $10 billion in backlog, including a record sale of gas backlog of $7 billion.
  • 2024-12-31 financial EBIT margins increased 190 basis points to 29.5% for full year 2024.
  • 2024-12-31 capacity expansion During 2024, Linde set a record for small on-site wins, signing 59 long-term agreements for a total of 64 plants.
  • 2024-12-31 financial EPS of $3.97 grew 11%, or 13% excluding FX in fourth quarter 2024.
  • 2024-12-31 financial Fourth quarter 2024 sales of $8.3 billion are flat to prior year and down 1% sequentially.
  • 2024-12-31 financial Operating profit of $2.5 billion grew 9% and resulted in a 29.9% margin in fourth quarter 2024.
  • 2024-12-31 financial Linde increased its active low carbon and renewable energy consumption by 19% year-over-year, with over 40% of total power consumption now low carbon based in 2024.
  • 2024-08-02 design-win → Taiwan Manufacturing ai_chips source ↗

Patents — 79 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 38
Other 25
Power electronics 8
Batteries 5
Semiconductors 3

Newest 5 of 79, most recent first — all on Google Patents →

  • 2020-04-30WO2020083521METHOD FOR THE THEORETICAL ANALYSIS OF A PROCESS APPARATUS THROUGH WHICH FLUID FLOWS
  • 2016-05-17US9344235Network managed volumes
  • 2011-07-07WO2011080348DEVICE AND METHOD FOR DETECTING PRESENCE OF AN OBJECT
  • 2011-01-20WO2011006498AN INTERACTIVE SYSTEM AND A METHOD OF ENCODING
  • 2011-01-20WO2011006499AN ENCODING DEVICE AND A METHOD OF ENCODING

Financials — multi-year, confidence 1.0 (filings)

revenue

$27.2B '20
$30.8B '21
$33.4B '22
$32.9B '23
$33.0B '24
$34.0B '25

operating income

$3.3B '20
$5.0B '21
$5.4B '22
$8.0B '23
$8.6B '24
$8.9B '25

net income

$2.5B '20
$3.8B '21
$4.1B '22
$6.2B '23
$6.6B '24
$6.9B '25

Sources: LIN 10-Q 2026-05-01 (acc 0001628280-26-029165) · LIN 10-Q 2025-08-01 (acc 0001628280-25-037164) · LIN 10-Q 2024-08-02 (acc 0001628280-24-034299) · LIN 10-Q 2025-10-31 (acc 0001628280-25-047710) · LIN 10-K 2025-02-26 (acc 0001628280-25-007990) · LIN 10-Q 2025-05-01 (acc 0001628280-25-021379) · LIN 10-Q 2024-10-31 (acc 0001628280-24-044457) · LIN 10-Q 2023-10-26 (acc 0001628280-23-035251) · LIN 10-Q 2023-07-27 (acc 0001628280-23-025878) · LIN 10-Q 2023-04-27 (acc 0001628280-23-013457)

Supplies → 2

🇹🇼 Taiwan Manufacturing ai_chips L2 50
🇺🇸 Micron ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Lotte Energy MaterialspublicRelationships + financials

physical ai · 🇰🇷 South Korea · 1 sources · 0 products

$448Mrevenue · FY2025 · USD$1.82T mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $355MFY2021: $466MFY2022: $490MFY2023: $543MFY2024: $610MFY2025: $449M wins 2024-08-31 · → Samsung SDI physical_ai — click for source events
  • 2024-08-31 design-win → Samsung SDI physical_ai source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$355M '20
$466M '21
$490M '22
$543M '23
$610M '24
$449M '25

operating income

$34M '20
$47M '21
$57M '22
$8M '23
$-44M '24
$-98M '25

net income

$28M '20
$42M '21
$30M '22
$-22M '23
$4M '24
$-102M '25

Supplies → 1

🇰🇷 Samsung SDI physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Marvell TechnologypublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: MRVL · 105 sources · 5 products · 31 patents

$8.2Brevenue · FY2026 · USD$164.9B mkt cap

Marvell Technology is a US semiconductor company producing data infrastructure chips, including custom silicon, PCIe/CXL switching products and optical interconnect technology for data centers. Headquartered in Santa Clara/Wilmington, it was founded in 1995 and is publicly traded.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $3.0BFY2022: $4.5BFY2023: $5.9BFY2024: $5.5BFY2025: $5.8BFY2026: $8.2B wins 2024-12-03 · → Amazon custom_asic — click for source2025-05-29 · → NVIDIA custom_asic — click for source2025-08-28 · → Microsoft custom_asic — click for source2025-02-18 · Cadence Design → ai_chips — click for source events 2026-07-16 · financial — Marvell shares dropped 8% to $189 in Thursday midday trading on July 16, 2026, extending a sharp semiconductor selloff and giving back 31% over the past month amid AI capex slowdown fears.2026-07-16 · financial — Marvell Technology stock fell more than 5% on Thursday amid profit-taking in semiconductor and AI stocks.2026-07-16 · financial — Marvell Technology shares fell 8.4% in afternoon session following TSMC's capital expenditure reset announcement.2026-07-16 · financial — Marvell Technology ADRs fell 9% in the session.2026-07-15 · financial — Marvell Technology stock fell approximately 7.75% in early afternoon trading as semiconductor sector volatility spread following memory chip market turmoil.2026-07-14 · supply deal — Major new design win for Google's 'Merope' LPU projected to generate up to $12 billion over its lifecycle.2026-07-13 · financial — Marvell Technology achieved a 200% stock rally between July 13, 2025 and July 13, 2026, significantly outperforming the S&P 500's 21% return.2026-07-09 · disclosure — Marvell Technology, Inc. filed a prospectus supplement to its automatic shelf registration statement on Form S-3 (Registration No. 333-285742) on July 9, 2026, for the issuance and sale of securities.2025-08-01 · M&A — Marvell completed the divestiture of its automotive Ethernet business to Infineon Technologies AG in a $2.5 billion all-cash transaction.2025-04-08 · financial — Marvell Technology stock more than doubled since the U.S.-Iran ceasefire agreement on April 8.2025-01-01 · financial — Marvell received an upgrade to investment grade credit rating from Fitch in January citing positive outlook on strong operating momentum from robust data center demand.
  • 2026-07-16 financial Marvell shares dropped 8% to $189 in Thursday midday trading on July 16, 2026, extending a sharp semiconductor selloff and giving back 31% over the past month amid AI capex slowdown fears.
  • 2026-07-16 financial Marvell Technology stock fell more than 5% on Thursday amid profit-taking in semiconductor and AI stocks.
  • 2026-07-16 financial Marvell Technology shares fell 8.4% in afternoon session following TSMC's capital expenditure reset announcement.
  • 2026-07-16 financial Marvell Technology ADRs fell 9% in the session.
  • 2026-07-15 financial Marvell Technology stock fell approximately 7.75% in early afternoon trading as semiconductor sector volatility spread following memory chip market turmoil.
  • 2026-07-14 supply deal Major new design win for Google's 'Merope' LPU projected to generate up to $12 billion over its lifecycle.
  • 2026-07-13 financial Marvell Technology achieved a 200% stock rally between July 13, 2025 and July 13, 2026, significantly outperforming the S&P 500's 21% return.
  • 2026-07-09 disclosure Marvell Technology, Inc. filed a prospectus supplement to its automatic shelf registration statement on Form S-3 (Registration No. 333-285742) on July 9, 2026, for the issuance and sale of securities.
  • 2025-08-28 design-win → Microsoft custom_asic source ↗
  • 2025-08-01 M&A Marvell completed the divestiture of its automotive Ethernet business to Infineon Technologies AG in a $2.5 billion all-cash transaction.
  • 2025-05-29 design-win → NVIDIA custom_asic source ↗
  • 2025-04-08 financial Marvell Technology stock more than doubled since the U.S.-Iran ceasefire agreement on April 8.
  • 2025-02-18 design-win Cadence Design → ai_chips source ↗
  • 2025-01-01 financial Marvell received an upgrade to investment grade credit rating from Fitch in January citing positive outlook on strong operating momentum from robust data center demand.
  • 2024-12-03 design-win → Amazon custom_asic source ↗

Patents — 31 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 23
Computing 8

Newest 8 of 31, most recent first — all on Google Patents →

  • 2026-06-25US20260178361METHOD AND SYSTEM FOR COMPREHENSIVE SIMULATION FRAMEWORK
  • 2026-04-23US20260111388METHOD AND SYSTEM FOR FACILITATING CHIPLET COMMUNICATION
  • 2026-03-19US20260079625SHORT BLOCK DATA ACCUMULATION TECHNIQUES
  • 2026-03-19US20260079626MEMORY FREE LIST LATENCY BOUNDING TECHNIQUES
  • 2026-01-29US20260032058COMMUNICATION PROTOCOL FOR MACHINE LEARNING
  • 2025-12-18US2025383882METHOD AND SYSTEM TO SUPPORT DATA STREAMING FOR MATRIX OPERATIONS VIA A MACHINE LEARNING HARDWARE
  • 2025-12-18US2025384001Shared Memory Controller with Direct Memory Access Architecture for On-Chip Memory
  • 2025-12-11US2025378023Hybrid Logical to Physical Address Mapping

Financials — multi-year, confidence 1.0 (filings)

revenue

$3.0B '21
$4.5B '22
$5.9B '23
$5.5B '24
$5.8B '25
$8.2B '26

operating income

$-258M '21
$-348M '22
$238M '23
$-568M '24
$-720M '25
$1.3B '26

net income

$-277M '21
$-421M '22
$-163M '23
$-933M '24
$-885M '25
$2.7B '26

Sources: MRVL 10-Q 2023-05-26 (acc 0001835632-23-000029) · MRVL 10-Q 2024-05-31 (acc 0001835632-24-000063) · MRVL 8-K 2026-07-09 (acc 0001193125-26-299843) · MRVL 10-Q 2024-12-04 (acc 0001835632-24-000200) · MRVL 10-Q 2025-12-03 (acc 0001835632-25-000197) · MRVL 10-K 2023-03-09 (acc 0001835632-23-000013) · MRVL 10-Q 2023-12-01 (acc 0001835632-23-000046) · MRVL 10-K 2026-03-11 (acc 0001835632-26-000011) · MRVL 10-Q 2026-05-28 (acc 0001835632-26-000019) · MRVL 10-Q 2024-08-30 (acc 0001835632-24-000142)

Buys from ← 2

🇨🇳 Empyrean ai_chips L2 50
🇺🇸 Cadence Design ai_chips L2 50

Supplies → 3

🇺🇸 Amazon custom_asic → AWS Trainium L3 50
🇺🇸 NVIDIA custom_asic → Data center GPUs / AI accelerators L3 50
🇺🇸 Microsoft custom_asic → Microsoft Azure L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Ultra Accelerator Link (UALink)Photonic FabricPCIe and CXL switching siliconCXL switching siliconPCIe switching silicon

MaxLinearpublicRelationships + financials

ai compute · 🇺🇸 United States · NASDAQ: MXL · 40 sources · 4 products · 136 patents

$468Mrevenue · FY2025 · USD$6.7B mkt cap

Discovered via news_ner (2026-07-08). Up 102% in 2026, This Chip ETF Mysteriously Avoids Taiwan Semiconductor. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $479MFY2021: $892MFY2022: $1.1BFY2023: $693MFY2024: $361MFY2025: $468M wins 2026-07-11 · Samsung Electronics → ai_chips — click for source2026-07-12 · → ai_compute — click for source2026-07-11 · → Advanced Micro Devices ai_compute — click for source2026-07-11 · → NVIDIA ai_compute — click for source events 2025-09-30 · financial — Total revenue for the third quarter was $126.5 million, up 16% from $108.8 million in the previous quarter and up 56% from $81.1 million in the third quarter of 2024.2025-01-01 · product launch — We have shipped approximately 1 million plus units total of Keystone product across multiple customers into high volume opportunities.2024-12-31 · financial — We exited Q4 of 2024 with approximately $120 million in cash, cash equivalents and restricted cash.2024-12-31 · financial — Total revenue for the fourth quarter was $92.2 million, up 14% from $81.1 million in the previous quarter.2024-11-01 · partnership — At the 2024 Supercomputing Conference in November, we announced a new software defined storage solution in partnership with Quanta to address the needs of AI, high speed computing and other data intensive applications.
  • 2026-07-12 design-win → ai_compute source ↗
  • 2026-07-11 design-win Samsung Electronics → ai_chips source ↗
  • 2026-07-11 design-win → Advanced Micro Devices ai_compute source ↗
  • 2026-07-11 design-win → NVIDIA ai_compute source ↗
  • 2025-09-30 financial Total revenue for the third quarter was $126.5 million, up 16% from $108.8 million in the previous quarter and up 56% from $81.1 million in the third quarter of 2024.
  • 2025-01-01 product launch We have shipped approximately 1 million plus units total of Keystone product across multiple customers into high volume opportunities.
  • 2024-12-31 financial We exited Q4 of 2024 with approximately $120 million in cash, cash equivalents and restricted cash.
  • 2024-12-31 financial Total revenue for the fourth quarter was $92.2 million, up 14% from $81.1 million in the previous quarter.
  • 2024-11-01 partnership At the 2024 Supercomputing Conference in November, we announced a new software defined storage solution in partnership with Quanta to address the needs of AI, high speed computing and other data intensive applications.

Patents — 136 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 108
Power electronics 18
Other 8
Lidar / ranging 1
Semiconductors 1

Newest 17 of 136, most recent first — all on Google Patents →

  • 2026-07-02US20260186552POWER OPTIMIZATION, SCALING, AND TRAFFIC PREDICTION TECHNIQUES FOR AECS AND DSP SYSTEMS
  • 2026-06-25US20260178525HIGH-BANDWIDTH CHIPLET INTERCONNECTS
  • 2026-06-18US20260169515DISTRIBUTED PROCESSING AND SYNCHRONIZATION OF DSPS FOR EFFICIENT CROSSBAR CONTROL AND TRAFFIC HANDLING
  • 2026-06-18US20260169519PMD AND CROSSBAR SYNCHRONIZATION TECHNIQUES FOR FAST RECONFIGURATION AND DATA INTEGRITY
  • 2026-05-21US20260140836AUGMENTED SWITCH CAPACITY, REDUNDANT CROSSBARS, AND FAILOVER MECHANISMS IN CROSSBAR SYSTEMS
  • 2026-05-21US20260141156ANALOG ELECTRICAL CIRCUIT SWITCH ARCHITECTURE
  • 2026-04-16US20260104912METADATA-DRIVEN INTERRUPT MANAGEMENT IN A DATA TRANSFORM ACCELERATOR
  • 2026-03-05WO2026044789LOAD BALANCING IN DATA TRANSFORM ACCELERATOR IN VIRTUALIZATION
  • 2026-02-19US20260050564ADAPTIVE INTERRUPT MANAGEMENT IN A DATA TRANSFORM ACCELERATOR
  • 2026-02-05US20260037489COMPRESSION OF DATA INCLUDING EMBEDDED METADATA
  • 2026-01-22US20260025143CRITICAL PATH TRACKING SYSTEM-ON-CHIP
  • 2025-11-27US2025363065SWITCHING SYSTEM-ON-A-CHIP
  • 2025-11-20US2025355712PACKET PROCESSING OPTIMIZATION
  • 2025-11-20US2025355725PERFORMANCE TUNING OF A DATA TRANSFORM ACCELERATOR
  • 2025-03-06US2025077297LOAD BALANCING IN A DATA TRANSFORM ACCELERATOR
  • 2024-10-10US2024338380DATA TRANSFORM OPERATIONS IN A DATA TRANSFORM ACCELERATOR
  • 2024-08-15US2024273031SECURE PROCESSING IN A DATA TRANSFORM ACCELERATOR

Financials — multi-year, confidence 1.0 (filings)

revenue

$479M '20
$892M '21
$1.1B '22
$693M '23
$361M '24
$468M '25

operating income

$-83M '20
$68M '21
$185M '22
$-16M '23
$-169M '24
$-127M '25

net income

$-99M '20
$42M '21
$125M '22
$-73M '23
$-245M '24
$-137M '25

Buys from ← 5

🇹🇼 Taiwan Manufacturing foundry L2 50
🇺🇸 Intel merchant_gpu L2 50
🇰🇷 Samsung Electronics ai_chips L2 50
ai_compute L2 50
🇹🇼 UMC foundry L2 50

Supplies → 2

🇺🇸 Advanced Micro Devices ai_compute L2 50
🇺🇸 NVIDIA ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Puma series processorsMxL series RF/Mixed-Signal ICsVega series interconnectVideo delivery solutions

MediaTekpublicProduct-grade

ai compute · 🇹🇼 Taiwan · TWSE: 2454 · 59 sources · 8 products · 1824 patents

$18.5Brevenue · FY2025 · USD$166.6B mkt cap

ASIC co-design, SoCs

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $10.0BFY2021: $15.3BFY2022: $17.1BFY2023: $13.5BFY2024: $16.5BFY2025: $18.5B wins 2021-12-17 · → Microsoft networking — click for source2026-07-08 · → Samsung Electronics networking — click for source2025-02-18 · NVIDIA → ai_chips — click for source events 2026-07-09 · product launch — MediaTek Dimensity 8550 Super Platform powers the OPPO Reno16 series smartphones.2026-07-01 · partnership — MediaTek participated as an investor in Oxmiq Labs' $35 million Series A funding round.2026-05-31 · partnership — MediaTek collaborated with NVIDIA on the custom CPU design for RTX Spark, contributing to its best-in-class power efficiency, performance and connectivity.
  • 2026-07-09 product launch MediaTek Dimensity 8550 Super Platform powers the OPPO Reno16 series smartphones.
  • 2026-07-08 design-win → Samsung Electronics networking source ↗
  • 2026-07-01 partnership MediaTek participated as an investor in Oxmiq Labs' $35 million Series A funding round.
  • 2026-05-31 partnership MediaTek collaborated with NVIDIA on the custom CPU design for RTX Spark, contributing to its best-in-class power efficiency, performance and connectivity.
  • 2025-02-18 design-win NVIDIA → ai_chips source ↗
  • 2021-12-17 design-win → Microsoft networking source ↗

Patents — 1824 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 1003
Semiconductors 416
Memory 168
Power electronics 154
Imaging / cameras 71
Other 6
Lidar / ranging 6

Newest 29 of 1824, most recent first — all on Google Patents →

  • 2026-07-09US20260195268Data Processing Method with a Partially Precise Snoop Filter
  • 2026-07-09US20260195516PHYSICAL-AWARE DE-RATING METHOD FOR ADVANCED PROCESS LAYOUT EFFECT
  • 2026-07-02US20260186950METHOD FOR PERFORMING CODE REVIEWING WITH AID OF ARTIFICIAL INTELLIGENCE MODEL
  • 2026-07-02US20260188282METHOD AND ELECTRONIC DEVICE FOR OVERLAPPING A PLURALITY OF IMAGE LAYERS
  • 2026-07-02US20260189752IMAGE QUALITY ENHANCING DEVICE AND IMAGE QUALITY ENHANCING METHOD
  • 2026-06-25US20260178331PROCESSOR FOR PERFORMING FLOW CONTROL OF MULTIPLE TYPES OF INSTRUCTIONS AND METHOD FOR PERFORMING FLOW CONTROL OF MULTIPLE TYPES OF INSTRUCTIONS IN PROCESSOR
  • 2026-06-25US20260179682ELECTRONIC DEVICE WITH HIGH-SPEED ARCHITECTURE
  • 2026-06-18US20260169704METHOD FOR CONVERTING MULTIPLE SCHEDULING SETTINGS OF DIRECTED ACYCLIC GRAPH OF PROGRAMMING MODEL INTO PROGRAM CODE WITH AID OF GRAPHICAL USER INTERFACE
  • 2026-06-18US20260171818CONTROL DEVICE AND OPERATION METHOD THEREOF
  • 2026-06-04US20260154185METHOD FOR PERFORMING UNIT TEST GENERATION WITH AID OF MULTIPLE ARTIFICIAL INTELLIGENCE AGENTS
  • 2026-06-04US20260154540QUANTIZATION-AWARE LORA FINE-TUNING FOR LLM
  • 2026-06-04US20260154806SYSTEM FOR IR DROP PREDICTION OF A PACKAGE DESIGN AND A CHIP PRODUCT PACKAGED IN THE PACKAGE DESIGN
  • 2026-05-28US20260147711INSTRUCTION CACHE, CIRCULAR BUFFER AND METHOD FOR CONTROLLING ACCESS OF INSTRUCTION CACHE
  • 2026-05-28US20260147960THERMAL SIMULATION SYSTEM AND METHOD FOR SYSTEM-ON-CHIP
  • 2026-05-28US20260147970Method and System for Physical-Aware Logic Synthesis
  • 2026-05-21US20260140558POWER CONTROL METHOD AND POWER CONTROL SYSTEM FOR DYNAMICALLY ADJUSTING A POWER TABLE AND REDUCING POWER CONSUMPTION
  • 2026-05-21US20260140883METHOD AND APPARATUS FOR PERFORMING DICTIONARY-BASED LOSSLESS CACHE LINE COMPRESSION BY USING PATTERNS THAT ARE SET WITH THE AID OF ARTIFICIAL INTELLIGENCE
  • 2026-05-14US20260133698DATA MANAGENMENT METHOD, DEVICE AND COMPUTER-READABLE MEDIUM
  • 2026-05-14US20260133738IMAGE ADJUSTMENT METHOD AND RELATED IMAGE DISPLAYING APPARATUS
  • 2026-05-14US20260133741MULTI-PANEL DISPLAY METHOD AND APPARATUS THEREOF
  • 2026-05-14US20260133914DYNAMIC CONTROL DEVICE AND DYNAMIC CONTROL METHOD
  • 2026-05-07US20260127208SYSTEM AND METHOD FOR AN EXTENDABLE LOG ANALYSIS FRAMEWORK UTILIZING LARGE LANGUAGE MODELS
  • 2026-05-07US20260127350FRONT-END-OF-LINE FLOORPLAN OF INTEGRATED CIRCUIT THAT HAS DUMMIES INSERTED BY BLOCKAGE-AIDED DUMMY INSERTION AND RELATED METHOD
  • 2026-05-07US20260127492DATA PROCESSING SYSTEM AND MODEL OPTIMIZATION METHOD
  • 2026-05-07US20260128091STATIC RANDOM ACCESS MEMORY BIT-CELL WITH COMPACT SIZE THAT SUPPORTS BIT-WRITE-MASK FEATURE AND HALF-SELECTION-FREE FEATURE
  • 2026-04-30US20260119123METHOD FOR PERFORMING DIGITAL OPERATIONS WITH AID OF FULL ADDER ARCHITECTURE WITH INPUT/OUTPUT POLARITY INVERSION, AND ASSOCIATED APPARATUS
  • 2026-04-30US20260119430HIGH-EFFICIENCY MAINBAND TRAINING FLOW FOR UNIVERSAL CHIPLET INTERCONNECT EXPRESS
  • 2026-04-30US20260120757STATIC RANDOM ACCESS MEMORY DEVICE WITH PRE-CHARGE CIRCUIT SHARED BETWEEN DATA LINES AND BIT LINES
  • 2026-04-30WO2026086784METHODS FOR ENABLING VIRTUAL PERSONAL ASSISTANT MIXED REALITY SERVICE USING INTEGRATED COMMUNICATION AND COMPUTING

Financials — multi-year, confidence 1.0 (filings)

revenue

$7.9B '18
$8.0B '19
$10.0B '20
$15.3B '21
$17.1B '22
$13.5B '23
$16.5B '24
$18.5B '25

operating income

$540M '18
$733M '19
$1.3B '20
$3.4B '21
$4.0B '22
$2.2B '23
$3.2B '24
$3.2B '25

net income

$691M '18
$747M '19
$1.3B '20
$4.0B '21
$4.0B '22
$2.4B '23
$3.3B '24
$3.2B '25

Buys from ← 2

🇹🇼 UMC foundry L2 50
🇺🇸 NVIDIA ai_chips L2 50

Supplies → 2

🇺🇸 Microsoft networking → Microsoft Azure L3 50
🇰🇷 Samsung Electronics networking L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Dimensity5G RAN PlatformFilogicMT6xxx SeriesPentonicHelioM70 SeriesKompanio

Merck KGaApublicRelationships + financials

ai compute · 🇩🇪 Germany · FWB: MRK · 43 sources · 0 products

$24.1Brevenue · FY2025 · USD$68.1B mkt cap

Electronic materials, resists

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $20.0BFY2021: $22.5BFY2022: $25.5BFY2023: $24.1BFY2024: $22.9BFY2025: $24.1B wins 2023-04-20 · → Texas Instruments ai_chips — click for source events
  • 2023-04-20 design-win → Texas Instruments ai_chips source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$17.5B '18
$18.1B '19
$20.0B '20
$22.5B '21
$25.5B '22
$24.1B '23
$22.9B '24
$24.1B '25

operating income

$2.1B '18
$2.2B '19
$3.6B '20
$5.1B '21
$5.7B '22
$4.6B '23
$5.0B '24
$4.6B '25

net income

$1.3B '18
$1.5B '19
$2.3B '20
$3.5B '21
$3.5B '22
$3.2B '23
$3.2B '24
$3.0B '25

Supplies → 2

🇺🇸 Texas Instruments ai_chips L2 50
🇹🇼 Taiwan Manufacturing ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Microchip TechnologypublicRelationships + financials

ai compute · 🇺🇸 United States · NASDAQ: MCHP · 37 sources · 0 products · 25 patents

$4.7Brevenue · FY2026 · USD$44.4B mkt cap

Discovered via news_ner (2026-07-08). Monolithic Power Systems, Vishay Intertechnology, and Microchip Technology Stocks Trade Up, What You Need To Know. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $5.4BFY2022: $6.8BFY2023: $8.4BFY2024: $7.6BFY2025: $4.4BFY2026: $4.7B wins 2026-07-11 · → NVIDIA ai_compute — click for source events 2026-01-01 · product launch — The first of those products will be introduced to the market in early January.2025-12-31 · capacity expansion — We currently plan to start increasing wafer starts in the December quarter.2025-12-31 · M&A — Microchip has entered into a purchase and sales agreement to sell its Fab 2 wafer fabrication facility located in Tempe, Arizona to a third party, with transaction expected to be completed in December 2025.2025-09-30 · financial — Non-GAAP gross margin was 56.7%, including capacity underutilization charges of $51 million and new inventory reserve charges of $71.8 million.2025-09-30 · financial — Net sales in the September quarter were $1.14 billion, which was up 6% sequentially.2025-09-30 · product launch — We previewed further advancements with the inclusion of AI agents into the AI coding assistant that will be released into the market in September this year.2025-06-30 · financial — Underutilization in our factories in the June quarter was $51.5 million, down from $54.2 million in the March quarter.2025-06-30 · financial — Capital expenditures were $17.9 million in the June quarter, and we expect capital expenditures for fiscal year 2026 to be at or below $100 million.2025-06-30 · financial — Net sales were $1.075 billion, which was up 10.8% sequentially.2025-06-30 · other — We have accrued about $5.5 million from the upside profit to provide a small bonus to our 18,000 employees.2025-06-30 · financial — Non-GAAP net income was $154.7 million, and non-GAAP earnings per diluted share was $0.27.2025-06-30 · financial — The inventory write-off in the June quarter was $77.1 million down from $90.6 million in the March quarter.2025-06-30 · financial — Inventory went down by $124 million sequentially with a target for the whole fiscal year of a $350 million reduction.2025-06-30 · financial — Our total debt decreased by $175 million in the June quarter.2025-03-31 · financial — Our inventory at the end of December 2024 was 266 days. Our inventory at March 31, 2025 was 251 days.2025-03-31 · financial — Net sales in the March quarter were $970.5 million, which was down 5.4% sequentially.2025-03-31 · financial — In the March quarter we completed a $1.485 billion mandatory convertible preferred stock offering with a three-year term.2025-03-31 · capacity expansion — Tempe Fab 2 is now closed. The actions in our other two fabs, namely Fab 4 in Oregon and Fab 5 in Colorado Springs are complete.2025-01-01 · executive change — Brian McCarson joined Microchip in January of this year as Corporate Vice President and Leader of the Data Center Solutions business unit.2024-12-31 · financial — Our inventory balance at December 31, 2024, was $1.356 billion with 266 days of inventory.2024-12-31 · financial — Net sales in the December quarter were $1.026 billion, down 11.8% sequentially and down 41.9% from a year-ago quarter.2024-11-30 · financial — We retired $665.5 million in convertible bonds that matured in November 2024.2024-10-13 · product launch — Microchip announced the industry's first 3-nanometer-based PCIe Gen 6 switch on October 13 to power modern AI infrastructure.2024-09-30 · financial — Net sales in the September quarter were $1.164 billion which was down 6.2% sequentially.2024-09-30 · financial — Since achieving investment grade rating in November 2021, we have returned $4.8 billion of capital to shareholders through the September 2024 quarter, of which $2.4 billion represented shares we purchased, which is about 5% of our shares outstanding.2024-09-30 · financial — In the September quarter, we returned $261 million to shareholders through a combination of $243.7 million in dividends and $17.3 million in stock purchase in the open market.2024-09-30 · litigation — We recently settled an ongoing legal matter with one of our licensees. The impact of this settlement was the release of a $13.3 million accrual, which increased revenue and gross profit by $13.3 million in the September 2024 quarter.2024-09-30 · financial — The total cost impact of the incident was approximately $21.4 million. The majority of this cost is attributed to incremental factory underutilization charges resulting from a cybersecurity incident.2024-09-30 · financial — We expect our net sales for the September quarter to be between $1.12 billion and $1.18 billion.2024-08-20 · executive change — Effective at the close of business on August 20 which is the date of our Annual Shareholders' Meeting, I will transition from Executive Chair to being the Non-Executive Chair of the Board.2024-08-20 · other — On August 20, we announced that a cybersecurity incident had impacted our business operations and on September 4, we announced that this incident was unlikely to materially impact our financial condition or results of operations.2024-07-01 · product launch — In early July, we announced our entry into the 64-bit embedded microprocessor market with a suite of products, developments to address high-performance embedded processing applications, including AI-enabled edge solutions.2024-07-01 · product launch — In July, we expect to announce our entry into the 64-bit embedded microprocessor market with a suite of products, development tools, and other support requirements to address high-performance embedded processing applications, including AI-enabled edge solutions.2024-06-30 · financial — Our adjusted EBITDA in the June quarter was $456.2 million and 36.8% of net sales.2024-06-30 · financial — We had 237 days of inventory at the end of the June quarter which was up 13 days from the prior quarter's levels as a result of a lower dollar value of quarterly cost of goods sold from lower sequential revenue.2024-06-30 · financial — Our inventory balance at June 30, 2024, was $1.308 billion which was down $8 million from the end of the March 2024 quarter.2024-06-30 · financial — Net sales in the June quarter were $1.241 billion which was down 6.4% sequentially.2024-06-30 · financial — Our net debt-to-adjusted EBITDA was 2.02x as of June 30, 2024, up from 1.29x at June 30, 2023.2024-06-30 · financial — Distribution took down their inventory holdings in the June quarter as distribution sell-through was about $85 million higher than distribution sell in.2024-06-30 · financial — Inventory at our distributors in the June quarter was at 43 days which was up 2 days from the prior quarter's level.2024-06-30 · financial — Capital expenditures were $72.9 million in the June quarter.2024-06-30 · financial — Our adjusted free cash flow for the June quarter was $301.3 million.2024-06-30 · financial — We have returned a total of $4.6 billion to shareholders through June 30, 2024, by a combination of dividends and share buybacks.2024-06-30 · financial — These last-time buys represented 19 days of inventory at the end of June.2024-04-01 · M&A — Early in April, we closed our acquisition of Seoul Korea-based VSI, an ADAS and Digital Cockpit Connectivity Pioneer, to extend our Automotive Networking Market leadership.2024-03-31 · financial — Net sales in the March quarter were $1.326 billion, which was down 24.9% sequentially.2024-03-31 · financial — We purchased a record $387.4 million of our stock in the open-market and paid out a record $242.5 million in dividends for a total cash return of $629.9 million.2024-03-31 · financial — For fiscal year 2024, net sales were $7.634 billion and were down 9.5% from net sales in fiscal year 2023.2024-03-31 · financial — FPGA revenue exceeded $679 million and set another record, growing over 22% as compared to fiscal 2023.2024-03-31 · financial — Our inventory balance at March 31st, 2024 was $1.316 billion with 224 days of inventory at the end of the March quarter.2024-03-31 · financial — Capital expenditures were $40.1 million in the March quarter and $285.1 million for fiscal year 2024.2024-03-01 · M&A — Last month, we closed our acquisition of Neuronix AI Labs, whose innovative software technology enhances AI-enabled intelligent edge solutions and increases neural networking capabilities.2024-02-28 · executive change — A month ago, we appointed Rich Simoncic as Chief Operating Officer.2024-01-01 · regulatory — We announced a preliminary memorandum of terms in early January 2024 and supported the completion of diligence by March.
  • 2026-07-11 design-win → NVIDIA ai_compute source ↗
  • 2026-01-01 product launch The first of those products will be introduced to the market in early January.
  • 2025-12-31 capacity expansion We currently plan to start increasing wafer starts in the December quarter.
  • 2025-12-31 M&A Microchip has entered into a purchase and sales agreement to sell its Fab 2 wafer fabrication facility located in Tempe, Arizona to a third party, with transaction expected to be completed in December 2025.
  • 2025-09-30 financial Non-GAAP gross margin was 56.7%, including capacity underutilization charges of $51 million and new inventory reserve charges of $71.8 million.
  • 2025-09-30 financial Net sales in the September quarter were $1.14 billion, which was up 6% sequentially.
  • 2025-09-30 product launch We previewed further advancements with the inclusion of AI agents into the AI coding assistant that will be released into the market in September this year.
  • 2025-06-30 financial Underutilization in our factories in the June quarter was $51.5 million, down from $54.2 million in the March quarter.
  • 2025-06-30 financial Capital expenditures were $17.9 million in the June quarter, and we expect capital expenditures for fiscal year 2026 to be at or below $100 million.
  • 2025-06-30 financial Net sales were $1.075 billion, which was up 10.8% sequentially.
  • 2025-06-30 other We have accrued about $5.5 million from the upside profit to provide a small bonus to our 18,000 employees.
  • 2025-06-30 financial Non-GAAP net income was $154.7 million, and non-GAAP earnings per diluted share was $0.27.
  • 2025-06-30 financial The inventory write-off in the June quarter was $77.1 million down from $90.6 million in the March quarter.
  • 2025-06-30 financial Inventory went down by $124 million sequentially with a target for the whole fiscal year of a $350 million reduction.
  • 2025-06-30 financial Our total debt decreased by $175 million in the June quarter.
  • 2025-03-31 financial Our inventory at the end of December 2024 was 266 days. Our inventory at March 31, 2025 was 251 days.
  • 2025-03-31 financial Net sales in the March quarter were $970.5 million, which was down 5.4% sequentially.
  • 2025-03-31 financial In the March quarter we completed a $1.485 billion mandatory convertible preferred stock offering with a three-year term.
  • 2025-03-31 capacity expansion Tempe Fab 2 is now closed. The actions in our other two fabs, namely Fab 4 in Oregon and Fab 5 in Colorado Springs are complete.
  • 2025-01-01 executive change Brian McCarson joined Microchip in January of this year as Corporate Vice President and Leader of the Data Center Solutions business unit.
  • 2024-12-31 financial Our inventory balance at December 31, 2024, was $1.356 billion with 266 days of inventory.

Patents — 25 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 23
Memory 2

Newest 25, most recent first — all on Google Patents →

  • 2026-07-09US20260194955METHOD AND APPARATUS FOR LIMITING RE-RUSH CURRENT IN A POWER SUPPLY UNIT (PSU) USING A BATTERY BACKUP UNIT (BBU)
  • 2026-07-09US20260195256SYSTEM AND METHOD TO PROVISION STORAGE USING NON-CONTIGUOUS STORAGE SPACE
  • 2026-07-02US20260186962ADAPTIVE ERROR RATE BASED GARBAGE COLLECTION TO INCREASE DRIVE RELIABILITY AND LIFESPAN
  • 2026-07-02US20260186993Device and Method for Synchronized Memory
  • 2026-07-02WO2026142753ADAPTIVE ERROR RATE BASED GARBAGE COLLECTION TO INCREASE DRIVE RELIABILITY AND LIFESPAN
  • 2026-07-02WO2026142858DEVICE AND METHOD FOR SYNCHRONIZED MEMORY
  • 2026-06-25WO2026133164TOUCH SENSOR FOR USER AUTHENTICATION AND METHOD OF USING SAME
  • 2026-06-18US20260170110TOUCH SENSOR FOR USER AUTHENTICATION AND METHOD OF USING SAME
  • 2026-06-11WO2026122171PASS THROUGH VOLTAGE ADJUSTMENT TO COMPENSATE FOR CROSS-TEMPERATURE EFFECTS
  • 2026-06-11WO2026122244DETERMINING AN OPERATIONAL LIMIT FOR A TRANSISTOR DEVICE WITH AGING RECOVERY
  • 2026-06-11WO2026122258DETERMINING AN OPERATIONAL LIMIT FOR A TRANSISTOR DEVICE BASED ON GATE OXIDE FAILURE
  • 2026-06-04US20260153999PASS THROUGH VOLTAGE ADJUSTMENT TO COMPENSATE FOR CROSS-TEMPERATURE EFFECTS
  • 2026-06-04US20260155193SYSTEM AND METHOD FOR WORDLINE GROUP-BASED MACHINE LEARNING MODELS
  • 2026-05-28US20260147484SYSTEM FIRMWARE ALGORITHM TO REDUCE READ ERRORS IN CASES OF CROSS-TEMPERATURE USING BACKGROUND DUMMY READ OPERATIONS
  • 2026-05-28US20260147486SYSTEM FIRMWARE SOLUTION TO IMPROVE QUALITY OF SERVICE (QOS) OF OPEN BLOCKS IN NAND FLASH DEVICES BY REDUCING VPASSR
  • 2026-05-21WO2026106786INTEGRATED GUI DESIGN METHOD AND SYSTEM
  • 2026-05-14US20260133766INTEGRATED GUI DESIGN METHOD AND SYSTEM
  • 2026-05-07US20260127118ADAPTIVE STEP DELAY IN PERIPHERAL TRIGGER GENERATOR
  • 2026-05-07WO2026095979ADAPTIVE STEP DELAY IN PERIPHERAL TRIGGER GENERATOR
  • 2026-04-30US20260118421I3C ERROR STATES TEST STRATEGY
  • 2026-04-23US20260111088CAPACITIVE TOUCH SENSOR INCLUDING FORCE REGIONS FOR FORCE DETECTION, AND RELATED METHODS, APPARATUSES, AND SYSTEMS
  • 2026-04-16US20260107100SYSTEMS AND METHODS FOR SOUND-BASED MONITORING OF A SPACE
  • 2026-04-16WO2026080099SYSTEM AND METHODS FOR ADAPTIVE ENUMERATION OF PCIe DEVICES
  • 2026-04-09US20260099255CONSERVATION OF OVER PROVISIONING IN A MEMORY DEVICE
  • 2026-04-09WO2026075688DEVICE AND METHODS FOR AN INTEGRATED HAPTIC DRIVER

Financials — multi-year, confidence 1.0 (filings)

revenue

$5.4B '21
$6.8B '22
$8.4B '23
$7.6B '24
$4.4B '25
$4.7B '26

operating income

$998M '21
$1.8B '22
$3.1B '23
$2.6B '24
$296M '25
$490M '26

net income

$349M '21
$1.3B '22
$2.2B '23
$1.9B '24
$0M '25
$202M '26

Supplies → 1

🇺🇸 NVIDIA ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Micron TechnologypublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: MU · 301 sources · 14 products · 2066 patents

$37.4Brevenue · FY2025 · USD$963.6B mkt cap

HBM, DRAM, NAND

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $21.4BFY2021: $27.7BFY2022: $30.8BFY2023: $15.5BFY2024: $25.1BFY2025: $37.4B wins 2026-06-27 · → Intel hbm — click for source2025-02-10 · → Astera Labs hbm — click for source2026-04-24 · Kokusai Electric → ai_chips — click for source2026-01-21 · Advantest → ai_chips — click for source2025-07-10 · Taiwan Manufacturing → foundry — click for source2026-07-01 · → Amazon hbm — click for source2025-03-20 · → Samsung Electronics hbm — click for source2025-10-29 · Tokyo Electron → ai_chips — click for source2020-01-22 · ACM Research → ai_chips — click for source2026-07-10 · FormFactor → ai_compute — click for source2026-07-01 · → Microsoft hbm — click for source2026-06-19 · Murata Manufacturing → imu — click for source2026-07-04 · Linde → ai_chips — click for source events 2026-07-17 · financial — Micron Technology stock dropped over 5% during Thursday's market selloff in AI chip-related stocks.2026-07-16 · financial — Micron Technology shares declined 6% in the session.2026-07-15 · financial — Micron Technology stock fell 11.2% around 1:30 p.m. ET amid memory chip sector volatility triggered by South Korean regulatory action.2026-07-15 · financial — Micron shares dropped 8% to $903.50 on China competition fears, following a blowout June earnings print with FQ3 2026 revenue of $41.46 billion up 346% year-over-year.2026-07-13 · financial — Micron Technology shares fell along with other semiconductor-related stocks amid investor risk-aversion.2026-07-12 · financial — Memory chip shortage continues to exist according to latest earnings report.2026-07-09 · capacity expansion — Micron announced a massive expansion of its domestic manufacturing, raising its planned U.S. investment to $250 billion through 2035.2026-07-09 · supply deal — Micron committed $500 million in strategic financing for GlobalWafers to expand a 300-millimeter raw silicon wafer facility in Sherman, Texas, with a 10-year supply agreement.2026-07-09 · capacity expansion — Micron intends to invest up to $3 billion to expand its U.S. production network and secure materials for AI-driven demand for memory chips.2026-07-09 · supply deal — Micron signed a 10-year deal to buy silicon wafers from GlobalWafers.2026-07-09 · supply deal — Micron is loaning GlobalWafers $500 million to help build its 300mm raw silicon wafer manufacturing facility in Sherman, Texas.2026-07-09 · supply deal — Micron signed a 10-year deal to buy wafers from GlobalWafers.2026-07-09 · capacity expansion — Micron is investing up to $3 billion to strengthen the U.S. semiconductor supply chain ecosystem.2026-07-09 · financial — Micron announced it is investing up to $3 billion to strengthen the U.S. semiconductor supply chain ecosystem.2026-07-07 · financial — Micron stock is down nearly $350 billion since June 25, 2026.2026-07-07 · litigation — Advanced Memory Technologies, LLC v. Micron Technology, Inc. — patent dispute regarding the 830 Patent in District Court, D. Idaho.2026-07-05 · capacity expansion — Micron has started production at the emerging Sanand semiconductor cluster in Gujarat.2026-07-04 · capacity expansion — Micron Technology has established an Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand GIDC in Gujarat, which was inaugurated by Prime Minister Narendra Modi and is now operational.2026-07-04 · capacity expansion — Micron Technology has established an Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand GIDC in Gujarat, which was inaugurated by Prime Minister Narendra Modi and is now operational.2026-06-29 · litigation — A class-action lawsuit filed in late June accused Micron and competitors Samsung and SK Hynix of conspiring to fix prices by limiting the production of certain memory chips.2026-06-25 · financial — Micron reported stronger-than-expected earnings that lifted semiconductor shares and triggered a buy-side sidecar on the Kospi.2026-06-24 · financial — Micron Technology released quarterly results and forecast that both exceeded expectations, driving gains in semiconductor shares.2026-06-10 · financial — Micron fell 1.4 percent in US trading on June 10, 2026.2026-06-09 · financial — Micron surged 9.87 percent on sentiment that AI-related sector fundamentals remain strong.2026-06-02 · litigation — Micron Technology, Inc. sues Netlist, Inc. for patent infringement regarding 830 Patent.2026-05-28 · financial — In fiscal Q3 2026 ended May 28, Micron earned $25.11 per share non-GAAP, up over 1,200% from $1.91 one year earlier, with revenue increasing 346% to $41.46 billion.2026-05-27 · financial — Chipmaker Micron surged 19 percent to hit $1 trillion in market value for the first time.2026-05-13 · financial — Micron dipped 3.61 percent on Wall Street overnight.2026-04-01 · litigation — Netlist, Inc. sues Micron Technology, Inc. for patent infringement.2026-03-06 · litigation — Netlist Inc sues Micron Technology, Inc. for patent infringement.2026-02-28 · capacity expansion — Micron Technology's $2.75 billion Assembly, Testing, Marking and Packaging (ATMP) plant in Sanand was inaugurated on February 28, 2026, manufacturing DRAM and NAND flash memory products.2026-02-01 · capacity expansion — Micron's Sanand chip packaging plant opened in February 2026, becoming the first semiconductor packaging venture to begin commercial production in India.2026-01-01 · capacity expansion — Micron Technology established an Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand GIDC in Gujarat, which was inaugurated and is now operational.2025-05-01 · capacity expansion — Micron Technology announced expansion of a semiconductor factory with US support.2025-04-08 · financial — Micron Technology stock more than doubled since the U.S.-Iran ceasefire agreement on April 8.2025-03-05 · product launch — GraniteShares announced a 2x Long MU Daily ETF tracking Micron Technology stock performance.2024-06-22 · financial — Micron Technology stock rose following multiple analyst target price increases.2024-06-18 · financial — Micron Technology stock rose along with other semiconductor-related stocks.2024-02-01 · capacity expansion — Micron's Sanand facility began operations in February as India's first packaging plant under the India Semiconductor Mission.
  • 2026-07-17 financial Micron Technology stock dropped over 5% during Thursday's market selloff in AI chip-related stocks.
  • 2026-07-16 financial Micron Technology shares declined 6% in the session.
  • 2026-07-15 financial Micron Technology stock fell 11.2% around 1:30 p.m. ET amid memory chip sector volatility triggered by South Korean regulatory action.
  • 2026-07-15 financial Micron shares dropped 8% to $903.50 on China competition fears, following a blowout June earnings print with FQ3 2026 revenue of $41.46 billion up 346% year-over-year.
  • 2026-07-13 financial Micron Technology shares fell along with other semiconductor-related stocks amid investor risk-aversion.
  • 2026-07-12 financial Memory chip shortage continues to exist according to latest earnings report.
  • 2026-07-10 design-win FormFactor → ai_compute source ↗
  • 2026-07-09 capacity expansion Micron announced a massive expansion of its domestic manufacturing, raising its planned U.S. investment to $250 billion through 2035.
  • 2026-07-09 supply deal Micron committed $500 million in strategic financing for GlobalWafers to expand a 300-millimeter raw silicon wafer facility in Sherman, Texas, with a 10-year supply agreement.
  • 2026-07-09 capacity expansion Micron intends to invest up to $3 billion to expand its U.S. production network and secure materials for AI-driven demand for memory chips.
  • 2026-07-09 supply deal Micron signed a 10-year deal to buy silicon wafers from GlobalWafers.
  • 2026-07-09 supply deal Micron is loaning GlobalWafers $500 million to help build its 300mm raw silicon wafer manufacturing facility in Sherman, Texas.
  • 2026-07-09 supply deal Micron signed a 10-year deal to buy wafers from GlobalWafers.
  • 2026-07-09 capacity expansion Micron is investing up to $3 billion to strengthen the U.S. semiconductor supply chain ecosystem.
  • 2026-07-09 financial Micron announced it is investing up to $3 billion to strengthen the U.S. semiconductor supply chain ecosystem.
  • 2026-07-07 financial Micron stock is down nearly $350 billion since June 25, 2026.
  • 2026-07-07 litigation Advanced Memory Technologies, LLC v. Micron Technology, Inc. — patent dispute regarding the 830 Patent in District Court, D. Idaho.
  • 2026-07-05 capacity expansion Micron has started production at the emerging Sanand semiconductor cluster in Gujarat.
  • 2026-07-04 capacity expansion Micron Technology has established an Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand GIDC in Gujarat, which was inaugurated by Prime Minister Narendra Modi and is now operational.
  • 2026-07-04 capacity expansion Micron Technology has established an Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand GIDC in Gujarat, which was inaugurated by Prime Minister Narendra Modi and is now operational.
  • 2026-07-04 design-win Linde → ai_chips source ↗
  • 2026-07-01 design-win → Amazon hbm source ↗
  • 2026-07-01 design-win → Microsoft hbm source ↗
  • 2026-06-29 litigation A class-action lawsuit filed in late June accused Micron and competitors Samsung and SK Hynix of conspiring to fix prices by limiting the production of certain memory chips.
  • 2026-06-27 design-win → Intel hbm source ↗
  • 2026-06-19 design-win Murata Manufacturing → imu source ↗
  • 2026-04-24 design-win Kokusai Electric → ai_chips source ↗
  • 2026-01-21 design-win Advantest → ai_chips source ↗
  • 2025-10-29 design-win Tokyo Electron → ai_chips source ↗
  • 2025-07-10 design-win Taiwan Manufacturing → foundry source ↗
  • 2025-03-20 design-win → Samsung Electronics hbm source ↗
  • 2025-02-10 design-win → Astera Labs hbm source ↗
  • 2020-01-22 design-win ACM Research → ai_chips source ↗

Patents — 2066 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 1103
Memory 741
Semiconductors 215
Power electronics 6
Lidar / ranging 1

Newest 66 of 2066, most recent first — all on Google Patents →

  • 2026-07-09US20260195178Allocation of Memory from a Memory Space of a Memory Sub-System to Access a Storage Space of the Memory Sub-System
  • 2026-07-09US20260195214OFF-DIE ERROR CORRECTION FOR MEMORY DEVICES
  • 2026-07-09US20260195260Allocation of Memory from a Memory Space of a Memory Sub-System in Response to a Request to Access a Storage Space of the Memory Sub-System
  • 2026-07-09US20260195261Release of Resources Allocated and/or Used in Accessing a Storage Space of a Memory Sub-System
  • 2026-07-09US20260196257MULTIPLE PASS TRAINING PROCEDURES
  • 2026-07-09US20260196259HEALTH SCAN OF A MEMORY DEVICE USING A CODE WORD ERROR RATE MACHINE LEARNING MODEL
  • 2026-07-09US20260196260COLD MEMORY TRACKING FOR POWER SAVING ON CXL DEVICES
  • 2026-07-09US20260196261THREE-DIMENSIONAL DYNAMIC RAM WORD LINE COMB STRUCTURE
  • 2026-07-09US20260196270PROGRAM PULSE OVERDRIVE FOR PERFORMANCE GAIN IN A MEMORY DEVICE
  • 2026-07-09US20260196276MEMORY DEVICE RELIABILITY VIA READ NOISE CANCELLATION
  • 2026-07-09US20260196280SELECTIVE BLOCK RETIREMENT FOR A MEMORY DEVICE
  • 2026-07-02US20260186651EXPANDED LOG STORAGE CAPACITY IN A MEMORY SUB-SYSTEM
  • 2026-07-02US20260186653STORING AND RETRIEVING CHECKPOINT VALUES USING DELTA COMPUTATION AND COMPRESSION
  • 2026-07-02US20260186659REORDERED PAGE MAPPING FOR TRIPLE LEVEL MEMORY CELLS
  • 2026-07-02US20260186693REFRESH TRIGGERS TO STABILIZE READ OPERATION PERFORMANCE
  • 2026-07-02US20260186701DYNAMIC BUFFER ALLOCATION
  • 2026-07-02US20260186707Sub Block Access via Storage Access Commands and Memory Access Instructions
  • 2026-07-02US20260186710DEDICATED INTERFACE FOR FOLDING DATA FROM VOLATILE MEMORY (VM) DIES TO STACKED NON-VOLATILE MEMORY (NVM) DIE
  • 2026-07-02US20260186711TRANSFER COMMAND POWER GATING WITHIN A MEMORY SYSTEM
  • 2026-07-02US20260186891DYNAMIC ERROR CORRECTION SCHEMES FOR MEMORY SYSTEMS
  • 2026-07-02US20260186895MULTI BIT CORRECTION BASED RAS FOR MEMORY DEVICES
  • 2026-07-02US20260186919DEDICATED CHANNELS FOR DATA TRANSMISSION
  • 2026-07-02US20260186963COMBINED NON-VOLATILE MEMORY (NVM) AND DYNAMIC RANDOM ACCESS MEMORY (DRAM) DEVICE
  • 2026-07-02US20260186965DEVICE CONFIGURATION BY A SAMPLE DEVICE
  • 2026-07-02US20260186973INCREASED FILE LOADS USING FILE BASED OPTIMIZATION AND PREFETCH WITHIN A MEMORY SYSTEM
  • 2026-07-02US20260186974PHYSICAL PREFETCH
  • 2026-07-02US20260186979ADDRESS TRANSLATION FOR COMBINED NON-VOLATILE MEMORY (NVM) AND DYNAMIC RANDOM ACCESS MEMORY (DRAM) DEVICE
  • 2026-07-02US20260186982METADATA FOR INDICATION OF ACCESS AUTHORIZATION IN A MEMORY SYSTEM
  • 2026-07-02US20260186987Memory Sub-System Operable with Multiple Connections for Concurrent Storage Access Communications and Memory Access Communications
  • 2026-07-02US20260186988BUFFER CHIP FOR ROUTING COMMAND/ADDRESS AND DATA SIGNALS TO A STACK OF MEMORY DIES WITHIN A MEMORY SYSTEM
  • 2026-07-02US20260188361Clock Gating Circuitry
  • 2026-07-02US20260188395RETAINING DATA DURING LOW-POWER EVENTS
  • 2026-07-02US20260188397INNER AND BOUNDARY WORD LINE READ OFFSETS
  • 2026-07-02US20260188398DETECTING COMPLETE PROGRAMMING IN ALL LEVEL PROGRAMMING
  • 2026-07-02US20260188408ADAPTIVE SLEW RATE CONTROL ACCORDING TO PROCESS AND TEMPERATURE
  • 2026-07-02US20260188413COMBINATIONAL ERROR CONTROL COMPONENTS IN STACKED MEMORY SYSTEMS
  • 2026-06-25US20260178203STATUS POLLING PARAMETER ADJUSTMENT BASED ON DEVICE TEMPERATURE
  • 2026-06-25US20260178211DEBUG REPORTING BY A MEMORY SYSTEM
  • 2026-06-25US20260178219USING UNRELIABLE MEMORY DIES FOR ACCESS OPERATIONS
  • 2026-06-25US20260178220DATA TRANSFER SIGNALING FOR MEMORY ARRAY OPERATIONS
  • 2026-06-25US20260178221BLOCK AND DIE FAMILY VARIATION MANAGEMENT TECHNIQUE FOR A MEMORY SUB-SYSTEM
  • 2026-06-25US20260178230TECHNIQUES FOR A SEQUENTIAL WRITE PROTECTION MODE IN A MEMORY SYSTEM
  • 2026-06-25US20260178231INTERLEAVED SEQUENTIAL READ OPERATIONS FOR MEMORY SYSTEMS
  • 2026-06-25US20260178432STREAMLINED SYSTEM MANAGEMENT BUS TRACING FOR ERROR DETECTION
  • 2026-06-25US20260178439MEMORY SYSTEM REPAIR OPERATIONS
  • 2026-06-25US20260178440DYNAMIC RECONFIGURATION OF ERROR CONTROL OPERATIONS
  • 2026-06-25US20260178442DYNAMIC ERROR CONTROL FOR COMPRESSED MEMORY
  • 2026-06-25US20260178561FILE UPDATE FREQUENCY INDICATIONS FOR MEMORY OPERATIONS
  • 2026-06-25US20260179658MEMORY DEVICE INCLUDING STACKED CONDUCTIVE CONTACTS
  • 2026-06-25US20260179659MEMORY DEVICE INCLUDING CONDUCTIVE STRUCTURES AND LANDING STRUCTURES
  • 2026-06-25US20260179678MEMORY DEVICE SENSE AMPLIFIER WITH BALANCED LOCAL VOLTAGE GENERATION CIRCUITRY
  • 2026-06-25US20260179688DYNAMIC WORDLINE START VOLTAGE COMPUTATION
  • 2026-06-25US20260179706ERROR REDUCTION TECHNIQUES FOR MEMORY SYSTEMS
  • 2026-06-25US20260181857APPARATUS INCLUDING MIM CAPACITORS AND CHARGE PUMP CIRCUIT
  • 2026-06-18US20260169855ADAPTIVE STICKY READ USING BFEA BINS
  • 2026-06-18US20260169875CXL FAIL VISIBILITY MODE
  • 2026-06-18US20260169922RELIABILITY AVAILABILITY SERVICEABILITY SOLUTIONS FOR COMPUTE EXPRESS LINK DEVICES WITH REDUCED OVERPROVISIONING
  • 2026-06-18US20260171178SELECT GATE SCANNING USING FAILED BIT COUNT
  • 2026-06-18US20260172014DUTY CYCLE ADJUST WITH INDEPENDENT RISING AND FALLING EDGE CONTROL
  • 2026-06-18US20260173392FERROELECTRIC NOR MEMORY ARCHITECTURES
  • 2026-06-18US20260173396FERROELECTRIC NOR MEMORY ARCHITECTURES
  • 2026-06-11US20260161293SYSTEMS AND METHODS FOR NON-TARGET RANK REFRESH OPERATION IN MULTI-RANK MEMORY SYSTEM
  • 2026-06-11US20260161545Customization of bandwidth of a Logical Memory Device Attached to a Host Processor over a Compute Express Link Fabric
  • 2026-06-11US20260162753APPARATUSES AND METHODS FOR REDUNDANCY INFORMATION FOR MEMORY WITH MULTIPLE STORAGE MODES
  • 2026-06-11US20260162754APPARATUSES AND METHODS FOR REDUNDANCY INFORMATION FOR MEMORY WITH MULTIPLE STORAGE MODES
  • 2026-06-11US20260162756APPARATUSES AND METHODS FOR REDUNDANCY INFORMATION FOR MEMORY WITH MULTIPLE STORAGE MODES

Buys from ← 9

🇩🇪 Siltronic ai_chips L2 50
🇯🇵 Kokusai Electric ai_chips L2 53
🇯🇵 Advantest ai_chips → HBM (High-Bandwidth Memory) L3 50
🇹🇼 Taiwan Manufacturing foundry L2 65
🇯🇵 Tokyo Electron ai_chips L2 53
🇺🇸 ACM Research ai_chips L2 50
🇺🇸 FormFactor ai_compute → HBM (High-Bandwidth Memory) L3 50
🇯🇵 Murata Manufacturing imu L2 65
🇺🇸 Linde ai_chips L2 50

Supplies → 6

🇺🇸 Intel hbm L2 50
🇺🇸 Astera Labs hbm L2 50
🇺🇸 Amazon hbm L2 50
🇺🇸 NVIDIA hbm → Data center GPUs / AI accelerators L3 50
🇰🇷 Samsung Electronics hbm → HBM (High Bandwidth Memory) L3 50
🇺🇸 Microsoft hbm → Microsoft Azure L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

1ß (1-beta) DRAM nodeHBM (High-Bandwidth Memory)High-Bandwidth Memory (HBM)LPDDRCrucial® brandLPDDR (Low-Power DRAM)NORCrucial® brand productsDDR5Micron® brand1β (1-beta) DRAM nodeCrucial®NAND1γ (1-gamma) DRAM node

Microsoft CorporationpublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: MSFT · 1542 sources · 1 products · 279 patents

$7.4Brevenue · FY2025 · USD$2.98T mkt cap

US software & cloud company; major AI-compute buyer (Azure) and a named SK hynix memory customer. Founded 1975; HQ Redmond, WA.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $143.0BFY2021: $168.1BFY2022: $198.3BFY2023: $211.9BFY2024: $245.1BFY2025: $281.7B wins 2025-10-23 · Intel → merchant_gpu — click for source2021-12-17 · MediaTek → networking — click for source2026-06-25 · Broadcom → custom_asic — click for source2025-08-28 · NVIDIA → ai_gpu — click for source2026-07-16 · → Arm ai_compute — click for source2026-07-12 · IonQ → quantum — click for source2026-01-28 · SK hynix → hbm — click for source2026-05-05 · Astera Labs → switch_silicon — click for source2026-07-11 · Taiwan Manufacturing → foundry — click for source2025-08-28 · Marvell → custom_asic — click for source2026-05-06 · Arm → ai_chips — click for source2026-02-03 · Advanced Micro Devices → merchant_gpu — click for source2025-11-11 · Eoptolink → optical_modules — click for source2026-07-01 · Micron → hbm — click for source events 2026-06-24 · litigation — Richner Communications, Inc. sues Microsoft Corporation for copyright infringement.2026-06-22 · partnership — Microsoft finalized a 20-year deal to supply power to a new, planned Texas data center using natural gas supplied by Chevron.2026-04-30 · financial — Microsoft reported stronger-than-expected revenue in the first quarter of 2026.2026-04-30 · financial — Microsoft reported stronger-than-expected revenue in the first quarter of 2026.2026-04-30 · financial — Microsoft reported stronger-than-expected first quarter 2026 earnings.2025-05-06 · partnership — Microsoft partnered with the National FFA Organization to expand FarmBeats for Students, a program integrating smart sensors, data science and AI for precision agriculture education.2025-05-06 · product launch — Microsoft expanded FarmBeats for Students program nationally to all 50 states, providing free classroom kits with smart sensors and AI curriculum to 185 middle and high schools.2025-04-30 · financial — Microsoft will publish fiscal year 2025 third-quarter financial results after the close of the market on Wednesday, April 30, 2025.2025-04-30 · financial — Microsoft announced that fiscal year 2025 third-quarter financial results are available on its Investor Relations website.2025-03-31 · financial — Microsoft reported FY25 Q3 revenue of $70.1 billion, up 13% year-over-year, with operating income of $32.0 billion up 16% and net income of $25.8 billion up 18%.2025-03-31 · financial — Microsoft returned $9.7 billion to shareholders in the form of dividends and share repurchases in Q3 fiscal year 2025.2025-03-31 · financial — Microsoft Cloud revenue reached $42.4 billion, up 20% year-over-year, driven by Azure and other cloud services revenue growth of 33%.2025-03-11 · financial — Microsoft's board of directors declared a quarterly dividend of $0.83 per share, payable June 12, 2025.2025-03-05 · product launch — GraniteShares announced a 2x Long MSFL Daily ETF tracking Microsoft stock performance.2025-03-03 · product launch — Microsoft unveiled Microsoft Dragon Copilot, the first unified voice AI assistant for clinical workflow combining Dragon Medical One and DAX Copilot capabilities for healthcare.2025-02-21 · regulatory — Microsoft received notice of an unsolicited mini-tender offer by TRC Capital Investment Corporation to purchase up to 300,000 shares at $391.00 per share.2024-12-31 · financial — Microsoft Cloud surpassed $40 billion in revenue for the first time, up 21% year-over-year.2024-12-31 · financial — Commercial remaining performance obligation increased to $298 billion, up 34% and 36% in constant currency.2024-12-31 · financial — Commercial bookings increased 67% and 75% in constant currency driven by Azure commitments from OpenAI.2024-12-31 · capacity expansion — Capital expenditures including finance leases were $22.6 billion this quarter with quarterly spend in Q3 and Q4 expected to remain at similar levels.2024-12-31 · executive change — Brett Iversen is moving to a new role as Head of Americas sales finance team and Jonathan Neilson is returning to Investor Relations to lead the team.2024-12-31 · financial — AI business surpassed an annual revenue run rate of $13 billion up 175% year-over-year.2024-06-22 · financial — Microsoft stock faced selling pressure as a hyperscale cloud operator amid concerns about intensifying AI development competition.2022-12-21 · other — Microsoft is analyzed as a company in the IoT Security and Privacy market report.
  • 2026-07-16 design-win → Arm ai_compute source ↗
  • 2026-07-12 design-win IonQ → quantum source ↗
  • 2026-07-11 design-win Taiwan Manufacturing → foundry source ↗
  • 2026-07-01 design-win Micron → hbm source ↗
  • 2026-06-25 design-win Broadcom → custom_asic source ↗
  • 2026-06-24 litigation Richner Communications, Inc. sues Microsoft Corporation for copyright infringement.
  • 2026-06-22 partnership Microsoft finalized a 20-year deal to supply power to a new, planned Texas data center using natural gas supplied by Chevron.
  • 2026-05-06 design-win Arm → ai_chips source ↗
  • 2026-05-05 design-win Astera Labs → switch_silicon source ↗
  • 2026-04-30 financial Microsoft reported stronger-than-expected revenue in the first quarter of 2026.
  • 2026-04-30 financial Microsoft reported stronger-than-expected revenue in the first quarter of 2026.
  • 2026-04-30 financial Microsoft reported stronger-than-expected first quarter 2026 earnings.
  • 2026-02-03 design-win Advanced Micro Devices → merchant_gpu source ↗
  • 2026-01-28 design-win SK hynix → hbm source ↗
  • 2025-11-11 design-win Eoptolink → optical_modules source ↗
  • 2025-10-23 design-win Intel → merchant_gpu source ↗
  • 2025-08-28 design-win NVIDIA → ai_gpu source ↗
  • 2025-08-28 design-win Marvell → custom_asic source ↗
  • 2025-05-06 partnership Microsoft partnered with the National FFA Organization to expand FarmBeats for Students, a program integrating smart sensors, data science and AI for precision agriculture education.
  • 2025-05-06 product launch Microsoft expanded FarmBeats for Students program nationally to all 50 states, providing free classroom kits with smart sensors and AI curriculum to 185 middle and high schools.
  • 2025-04-30 financial Microsoft will publish fiscal year 2025 third-quarter financial results after the close of the market on Wednesday, April 30, 2025.
  • 2025-04-30 financial Microsoft announced that fiscal year 2025 third-quarter financial results are available on its Investor Relations website.
  • 2025-03-31 financial Microsoft reported FY25 Q3 revenue of $70.1 billion, up 13% year-over-year, with operating income of $32.0 billion up 16% and net income of $25.8 billion up 18%.
  • 2025-03-31 financial Microsoft returned $9.7 billion to shareholders in the form of dividends and share repurchases in Q3 fiscal year 2025.
  • 2025-03-31 financial Microsoft Cloud revenue reached $42.4 billion, up 20% year-over-year, driven by Azure and other cloud services revenue growth of 33%.
  • 2025-03-11 financial Microsoft's board of directors declared a quarterly dividend of $0.83 per share, payable June 12, 2025.
  • 2025-03-05 product launch GraniteShares announced a 2x Long MSFL Daily ETF tracking Microsoft stock performance.
  • 2025-03-03 product launch Microsoft unveiled Microsoft Dragon Copilot, the first unified voice AI assistant for clinical workflow combining Dragon Medical One and DAX Copilot capabilities for healthcare.
  • 2025-02-21 regulatory Microsoft received notice of an unsolicited mini-tender offer by TRC Capital Investment Corporation to purchase up to 300,000 shares at $391.00 per share.
  • 2024-12-31 financial Microsoft Cloud surpassed $40 billion in revenue for the first time, up 21% year-over-year.
  • 2024-12-31 financial Commercial remaining performance obligation increased to $298 billion, up 34% and 36% in constant currency.
  • 2024-12-31 financial Commercial bookings increased 67% and 75% in constant currency driven by Azure commitments from OpenAI.
  • 2024-12-31 capacity expansion Capital expenditures including finance leases were $22.6 billion this quarter with quarterly spend in Q3 and Q4 expected to remain at similar levels.
  • 2021-12-17 design-win MediaTek → networking source ↗

Patents — 279 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 258
Other 13
Imaging / cameras 3
Robotics / manipulators 3
Memory 1
Semiconductors 1

Newest 52 of 279, most recent first — all on Google Patents →

  • 2026-07-09US20260195197SYNCHRONIZATION BLOCK
  • 2026-07-09US20260195207ROOT CAUSE ANALYSIS FOR ANOMALY JOBS
  • 2026-07-09US20260195331EFFICIENT RETRIEVAL AND RANKING WITH LARGE LANGUAGE MODELS
  • 2026-07-09US20260195396DUAL MODAL INTERNET SEARCH SYSTEM
  • 2026-07-09US20260195410METHODS FOR SOLVING MANY-BODY QUANTUM SYSTEM PROBLEMS
  • 2026-07-09US20260195458VULNERABILITY DETECTION AND MANAGEMENT
  • 2026-07-09US20260196991TRUE RANDOM NUMBER GENERATORS INCLUDING RING OSCILLATOR CIRCUITS LEVERAGING FREQUENCY AND PHASE COLLAPSE EVENTS
  • 2026-07-02US20260186523PROGRAMMABLE MEMORY ASSIST
  • 2026-07-02US20260186543LIQUID WIRE
  • 2026-07-02US20260186814DYNAMIC ON-DEMAND VIRTUAL PRIVATE NETWORK BROKERING FOR SOFTWARE ENDPOINT
  • 2026-07-02US20260186818THERMAL AND POWER AWARE VIRTUAL MACHINE PLACEMENT AND REQUEST ROUTING IN A DATA CENTER
  • 2026-07-02US20260186828CROSS-AGENT CONTEXT MANAGEMENT FOR MULTI-AGENT SYSTEM
  • 2026-07-02US20260186838TASK-BASED OFFLOAD PROCESSING
  • 2026-07-02US20260186870CUSTOMIZABLE DIGITAL CONTENT PROCESSING WORKFLOWS USING USER-DEFINED CONFIGURATION FILES
  • 2026-07-02US20260186885DETECTING PERFORMANCE ANOMALIES AFFECTING PRODUCTION WORKLOADS
  • 2026-07-02US20260186888RULE-BASED AUTOMATED REMEDIATION OF RESOURCES IN DATA CENTERS
  • 2026-07-02US20260187041UNSUPERVISED ERROR DETECTION IN DATA TABLES USING SEMANTIC-DOMAIN CONSTRAINTS
  • 2026-07-02US20260187080GENERATIVE SEARCH RESULTS DOCUMENTS BASED ON ENHANCED SEARCH RESULTS USING GENERATIVE ARTIFICIAL INTELLIGENCE (AI) MODELS
  • 2026-07-02US20260187186ENABLING PARALLEL VARIABLE-RATE COMPRESSION AND DECOMPRESSION OF VALUES OF A TENSOR
  • 2026-07-02US20260187230INCIDENT DATA MANAGEMENT FOR COMPUTING ENVIRONMENTS
  • 2026-07-02US20260187242SYSTEM AND METHOD FOR CREATING SOFTWARE COMPONENTS CAPABLE OF SHARING STATE ACROSS THREADS IN A THREAD-ISOLATED EXECUTION ENVIRONMENT
  • 2026-07-02US20260187345AUTOMATED INSIGHTS IN NOTE APPLICATIONS
  • 2026-07-02US20260187355GUIDED MACHINE LEARNING MODEL CONVERSATION DEFINITION
  • 2026-07-02US20260187524TECHNIQUES FOR DETECTING EMERGING PATTERNS IN DATA USED FOR MACHINE LEARNING MODEL-BASED DECISIONS
  • 2026-07-02US20260187527TUNING ANOMALY DETECTION CONDITIONS
  • 2026-07-02US20260187551RESPONSE WORKFLOW ORCHESTRATION WITH AUTONOMOUS TASK ASSIGNMENT
  • 2026-07-02US20260187745EMBEDDING A DIGITAL WATERMARK IN STYLUS PEN INK
  • 2026-07-02US20260189498CROSS-AGENT EVENT MANAGEMENT FOR MULTI-AGENT SYSTEM
  • 2026-07-02US20260189536SECURE EXECUTION OF AN AI MODEL ON A NEURAL PROCESSING UNIT OF A CLIENT DEVICE
  • 2026-07-02US20260189557MACHINE LEARNING AGENT WITH SEMANTIC ENTITLEMENT
  • 2026-07-02US20260189558MACHINE LEARNING SYSTEM WITH ENTITLEMENT DOMAINS
  • 2026-07-02US20260189570LIMITING ACCESS PRIVILEGES TO PROVIDE SECURE GROUP-BASED ACCESS TO ELECTRONIC APPLICATIONS
  • 2026-06-25US20260178027EXECUTING A COLLABORATION SESSION FOR AI AGENT CONTROL OF A ROBOTIC DEVICE
  • 2026-06-25US20260178028EXECUTING A COLLABORATION SESSION FOR HUMAN TELEOPERATION OF A ROBOTIC DEVICE PARTICIPANT
  • 2026-06-25US20260178182DROP TRAY ENGINE(S) FOR PROVIDING A USER-BASED DRAG-AND-DROP ACTION EXPERIENCE
  • 2026-06-25US20260178283COLLABORATIVE LANGUAGE MODELS IN NOTEBOOK ENVIRONMENTS
  • 2026-06-25US20260178360ADAPTIVE WEB TASK EXECUTION USING EMBEDDING-BASED RECORD MATCHING
  • 2026-06-25US20260178406DYNAMIC MODALITY-SPECIFIC RESOURCE ALLOCATION IN MODEL-AS-A-SERVICE PLATFORM
  • 2026-06-25US20260178407MODALITY-SPECIFIC TRAFFIC CLASSIFICATION IN MODEL-AS-A-SERVICE PLATFORM
  • 2026-06-25US20260178436LOCAL INTERFACE ERROR RECOVERY FOR NODE-TO-NODE TRANSFERS IN MESH NETWORK ON AN INTEGRATED CIRCUIT (IC) AND RELATED METHODS
  • 2026-06-25US20260178466CONTEXT-AWARE STATIC CODE ANALYSIS
  • 2026-06-25US20260178581COMBINING REASONING AND EXPLICIT GRAPH WALKS IN MULTI-DOMAIN QUERIES
  • 2026-06-25US20260178625MULTIMODAL MODEL CUSTOMIZATION AND ORCHESTRATION
  • 2026-06-25US20260178827APPLICATION INTEGRATION VIA MULTIMODAL GENERATIVE MODEL-ASSISTED WEB BROWSING
  • 2026-06-25US20260178837REAL-TIME EVALUATION FRAMEWORK FOR AI-BASED ASSISTANTS IN COLLABORATIVE ENVIRONMENTS
  • 2026-06-25US20260179046CHANGE MANAGEMENT ANALYSIS USING ORGANIZATIONAL NETWORK ANALYSIS METRICS
  • 2026-06-25US20260179611AI-POWERED CONTEXTUAL LIVE QUESTION AND ANSWER WHEN RENDERING PRE-PRODUCED AUDIO CONTENT
  • 2026-06-25US20260180928BUILD AND VALIDATION OF CHATBOT SCHEMA USING MACHINE LEARNING
  • 2026-06-25US20260181031EXECUTING A COLLABORATION SESSION FOR HUMAN, ROBOTIC DEVICE, AND AI AGENT PARTICIPANTS
  • 2026-06-18US20260169695INTEGRATED LOGIC CIRCUIT WITH FUSED MULTIPLIER AND ADDER (FMA) OR FUSED MULTIPLIER AND ACCUMULATOR (FMAC) INTEGRATED WITH FUNCTION EVALUATION LOGIC
  • 2026-06-18US20260169815GEO-DISTRIBUTED LANGUAGE MODEL TRAINING
  • 2026-06-18US20260170723VISUAL CONTENT REDACTION FOR CONTENT CAPTURES

Financials — multi-year, confidence 1.0 (filings)

revenue

$125.8B '19
$143.0B '20
$168.1B '21
$198.3B '22
$211.9B '23
$245.1B '24
$281.7B '25

operating income

$43.0B '19
$53.0B '20
$69.9B '21
$83.4B '22
$88.5B '23
$109.4B '24
$128.5B '25

net income

$39.2B '19
$44.3B '20
$61.3B '21
$72.7B '22
$72.4B '23
$88.1B '24
$101.8B '25

Sources: MSFT 10-K 2024-07-30 (acc 0000950170-24-087843) · Microsoft Corporation Form 10-K (accession 0000950170-23-0… · MSFT 10-Q 2026-04-29 (acc 0001193125-26-191507) · MSFT 10-Q 2024-04-25 (acc 0000950170-24-048288) · Microsoft Corporation Form 10-K (accession 0001564590-22-0… · MSFT 10-K 2025-07-30 (acc 0000950170-25-100235) · Microsoft Corporation Form 10-K (accession 0000950170-24-0… · MSFT 10-Q 2025-04-30 (acc 0000950170-25-061046) · MSFT 10-Q 2024-10-30 (acc 0000950170-24-118967) · MSFT 10-Q 2024-01-30 (acc 0000950170-24-008814)

Buys from ← 15

🇺🇸 Intel merchant_gpu → Microsoft Azure L3 50
🇹🇼 MediaTek networking → Microsoft Azure L3 50
🇺🇸 Broadcom custom_asic → Microsoft Azure L3 50
🇺🇸 NVIDIA ai_gpu → Microsoft Azure L3 85
🇩🇪 Bosch Sensortec imu → Microsoft Azure L3 50
🇺🇸 IonQ quantum → Microsoft Azure L3 50
🇰🇷 SK hynix hbm → Microsoft Azure L3 60
🇺🇸 Astera Labs switch_silicon → Microsoft Azure L3 50
🇹🇼 Taiwan Manufacturing foundry → Microsoft Azure L3 50
🇺🇸 Marvell custom_asic → Microsoft Azure L3 50
🇬🇧 Arm ai_chips → Microsoft Azure L3 50
🇺🇸 Advanced Micro Devices merchant_gpu → Microsoft Azure L3 50
🇨🇳 Eoptolink optical_modules → Microsoft Azure L3 50
🇺🇸 Synopsys ai_chips → Microsoft Azure L3 50
🇺🇸 Micron hbm → Microsoft Azure L3 50

Supplies → 2

🇬🇧 Arm ai_compute L2
🇨🇳 Orbbec ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Microsoft Azure

Midea GrouppublicRelationships + financials

physical ai · 🇨🇳 China · SZSE: 000333 · 21 sources · 6 products · 1132 patents

$67.8Brevenue · FY2025 · USD$92.9B mkt cap

Owns KUKA; appliances

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $42.0BFY2021: $53.0BFY2022: $50.9BFY2023: $55.3BFY2024: $60.0BFY2025: $67.8B wins 2025-07-03 · → Panasonic oem — click for source2026-05-06 · Nabtesco → planetary_reducers — click for source events 2026-07-14 · financial — Midea ranked No. 5 on Forbes China's 2026 Best CEOs List with chairman Fang Hongbo holding a $1.8 billion fortune and shares gaining more than 15% in the past year.2023-06-27 · other — KUKA is profiled as a company in the service robotics market.2022-02-01 · executive change — John Bubnikovich, who most recently served as Chief Regional Officer of North America at Kuka Robotics, was appointed CEO of JMP Solutions' newly-created parent company.

Rolled up across Midea + its subsidiaries

  • 2026-07-14 financial Midea ranked No. 5 on Forbes China's 2026 Best CEOs List with chairman Fang Hongbo holding a $1.8 billion fortune and shares gaining more than 15% in the past year.
  • 2026-05-06 design-win Nabtesco → planetary_reducers source ↗
  • 2025-07-03 design-win → Panasonic oem source ↗
  • 2023-06-27 other KUKA KUKA is profiled as a company in the service robotics market.
  • 2022-02-01 executive change KUKA John Bubnikovich, who most recently served as Chief Regional Officer of North America at Kuka Robotics, was appointed CEO of JMP Solutions' newly-created parent company.

Patents — 1132 CPC-scoped to physical ai (physical-AI-relevant classes)

Power electronics 377
Electric motors 219
Robotics / manipulators 166
Gears / reducers 91
Bearings 58
Imaging / cameras 55
Lidar / ranging 42
Batteries 33
Force / torque sensors 27
Other 22
IMU / navigation 21
Computing 21

Newest 2 of 1132, most recent first — all on Google Patents →

  • 2026-06-18WO2026124071MOTOR ASSEMBLY AND CT TUBE
  • 2026-01-15WO2026011544PANEL ASSEMBLY OF AIR CONDITIONER OUTDOOR UNIT, AIR CONDITIONER OUTDOOR UNIT, AND AIR CONDITIONER

Financials — multi-year, confidence 1.0 (filings)

revenue

$39.4B '18
$40.2B '19
$42.0B '20
$53.0B '21
$50.9B '22
$55.3B '23
$60.0B '24
$67.8B '25

operating income

$3.4B '18
$3.7B '19
$4.6B '20
$3.9B '21
$4.4B '22
$5.2B '23
$5.7B '24
$6.8B '25

net income

$3.1B '18
$3.5B '19
$4.0B '20
$4.2B '21
$4.4B '22
$5.0B '23
$5.7B '24
$6.5B '25

Supplies → 1

🇯🇵 Panasonic oem L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

KUKA RobotsMidea Microwave OvensMidea RefrigeratorsMidea Water HeatersMidea Air ConditionersMidea Washing Machines

Monolithic Power SystemspublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: MPWR · 61 sources · 6 products · 456 patents

$2.8Brevenue · FY2025 · USD$64.1B mkt cap

Power management for GPUs

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $845MFY2021: $1.2BFY2022: $1.8BFY2023: $1.8BFY2024: $2.2BFY2025: $2.8B wins events 2026-03-31 · financial — MPS achieved record quarterly revenue of $804 million, 7% higher than the fourth quarter of 2025 and 26% higher than the first quarter of 2025.2025-12-31 · financial — Non-enterprise data end markets grew by over 40% year-over-year in 2025.2025-12-31 · financial — Q4 2025 record quarterly revenue of $751.2 million, 1.9% above Q3 2025 and 20.8% higher than Q4 2024.2025-12-31 · financial — For three years ending December 2025, returned over 72% of free cash flow to stockholders through share repurchases and dividends.2025-12-31 · capacity expansion — By the end of the year, we will have half of that capacity outside of China, half of it inside.2025-12-31 · financial — Full-year 2025 revenue of $2.8 billion, up 26.4% from 2024.2025-12-31 · financial — Automotive segment grew 43% year over year in 2025.2025-03-20 · product launch — MPS showcased innovation across robotics, automotive, data center, building automation, medical and audio at March 20 Investor Day.2024-12-31 · financial — For the three years ending December 2024, Monolithic Power Systems, Inc. has returned 86% of its free cash flow to shareholders through share repurchases and dividends paid.
  • 2026-03-31 financial MPS achieved record quarterly revenue of $804 million, 7% higher than the fourth quarter of 2025 and 26% higher than the first quarter of 2025.
  • 2025-12-31 financial Non-enterprise data end markets grew by over 40% year-over-year in 2025.
  • 2025-12-31 financial Q4 2025 record quarterly revenue of $751.2 million, 1.9% above Q3 2025 and 20.8% higher than Q4 2024.
  • 2025-12-31 financial For three years ending December 2025, returned over 72% of free cash flow to stockholders through share repurchases and dividends.
  • 2025-12-31 capacity expansion By the end of the year, we will have half of that capacity outside of China, half of it inside.
  • 2025-12-31 financial Full-year 2025 revenue of $2.8 billion, up 26.4% from 2024.
  • 2025-12-31 financial Automotive segment grew 43% year over year in 2025.
  • 2025-03-20 product launch MPS showcased innovation across robotics, automotive, data center, building automation, medical and audio at March 20 Investor Day.
  • 2024-12-31 financial For the three years ending December 2024, Monolithic Power Systems, Inc. has returned 86% of its free cash flow to shareholders through share repurchases and dividends paid.

Patents — 456 CPC-scoped to ai compute (physical-AI-relevant classes)

Power electronics 278
Other 85
Semiconductors 65
Computing 21
Memory 6
Batteries 1

IP chokepoint in: Power electronics

Newest 2 of 456, most recent first — all on Google Patents →

  • 2026-04-16US20260107552THROUGH-HOLE Z-AXIS POWER DELIVERY MODULE
  • 2024-10-03US2024333024INTEGRATED CIRCUIT WITH FAULT REPORTING STRUCTURE

Financials — multi-year, confidence 1.0 (filings)

revenue

$845M '20
$1.2B '21
$1.8B '22
$1.8B '23
$2.2B '24
$2.8B '25

operating income

$159M '20
$262M '21
$527M '22
$482M '23
$539M '24
$729M '25

net income

$164M '20
$242M '21
$438M '22
$427M '23
$1.6B '24
$622M '25

Sources: MPWR 10-K 2026-02-27 (acc 0001437749-26-006113) · MPWR 10-Q 2025-05-05 (acc 0001437749-25-014522) · MPWR 10-Q 2024-08-02 (acc 0001437749-24-024477) · MPWR 10-Q 2024-05-03 (acc 0001437749-24-014648) · MPWR 10-Q 2026-05-04 (acc 0001437749-26-014647) · MPWR 10-Q 2023-08-04 (acc 0001437749-23-022148) · MPWR 10-Q 2023-11-08 (acc 0001437749-23-030929) · MPWR 10-Q 2023-05-05 (acc 0001437749-23-012797) · MPWR 10-K 2023-02-24 (acc 0001437749-23-004540) · MPWR 10-K 2025-03-03 (acc 0001437749-25-005903)

Supplies → 1

🇺🇸 NVIDIA ai_chips → Blackwell Ultra platform L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

MP6974MPQ7000MPM54674MP2856MP6975MP2888

Moons' ElectricpublicFinancials only

physical ai · 🇨🇳 China · 1 sources · 0 products

$405Mrevenue · FY2025 · USD$25.0B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $327MFY2021: $401MFY2022: $436MFY2023: $374MFY2024: $357MFY2025: $405M wins events

Financials — multi-year, confidence 1.0 (filings)

revenue

$327M '20
$401M '21
$436M '22
$374M '23
$357M '24
$405M '25

operating income

$35M '20
$45M '21
$42M '22
$22M '23
$11M '24
$8M '25

net income

$30M '20
$41M '21
$37M '22
$21M '23
$12M '24
$9M '25

MP MaterialspublicRelationships + financials

physical ai · 🇺🇸 United States · 44 sources · 2 products

$275Mrevenue · FY2025 · USD$8.1B mkt cap

Discovered via news_counterparty (2026-07-12). News (Trump trades free markets for semiconductor self-sufficiency) — supplier: The US Defense Department spent US$400 million to acquire a 7.5% stake in rare e. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $134MFY2021: $332MFY2022: $528MFY2023: $253MFY2024: $204MFY2025: $276M wins 2026-07-17 · → Vacuumschmelze physical_ai — click for source2026-07-12 · → Tesla physical_ai — click for source events 2026-12-31 · capacity expansion — I expect continued progress towards reaching our 500 tonne per month run rate by the end of this year.2026-03-31 · financial — We ended the quarter with $1.7 billion of cash and short-term investments on the balance sheet.2026-01-31 · financial — MP Materials received an additional $32 million prepayment from Apple earned in the fourth quarter and received earlier this month for expansion of both recycling and magnet capacity.2025-12-31 · capacity expansion — MP Materials exceeded 50,000 metric tons of REO produced in 2025, another record annual performance.2025-12-31 · financial — MP Materials' Magnetics segment generated $8.4 million of adjusted EBITDA in the fourth quarter, bringing full year Magnetics EBITDA to $26.4 million.2025-12-31 · product launch — MP Materials achieved its target of producing its first magnets on commercial scale equipment at its Independence facility late last year.2025-12-31 · financial — MP Materials generated $40.3 million of adjusted segment EBITDA in Materials for the fourth quarter.2025-12-31 · capacity expansion — MP Materials doubled NdPr oxide output to 2,599 metric tons in 2025 and exited the year at an annualized run rate of nearly 4,000 metric tons of separated NdPr oxide.2025-07-01 · partnership — Since the July 2025 agreement signing, MP Materials' Mountain Pass team has had a highly productive engagement with Apple on the recycling effort and finalized process design.
  • 2026-12-31 capacity expansion I expect continued progress towards reaching our 500 tonne per month run rate by the end of this year.
  • 2026-07-17 reported edge → Vacuumschmelze physical_ai source ↗
  • 2026-07-12 reported edge → Tesla physical_ai source ↗
  • 2026-03-31 financial We ended the quarter with $1.7 billion of cash and short-term investments on the balance sheet.
  • 2026-01-31 financial MP Materials received an additional $32 million prepayment from Apple earned in the fourth quarter and received earlier this month for expansion of both recycling and magnet capacity.
  • 2025-12-31 capacity expansion MP Materials exceeded 50,000 metric tons of REO produced in 2025, another record annual performance.
  • 2025-12-31 financial MP Materials' Magnetics segment generated $8.4 million of adjusted EBITDA in the fourth quarter, bringing full year Magnetics EBITDA to $26.4 million.
  • 2025-12-31 product launch MP Materials achieved its target of producing its first magnets on commercial scale equipment at its Independence facility late last year.
  • 2025-12-31 financial MP Materials generated $40.3 million of adjusted segment EBITDA in Materials for the fourth quarter.
  • 2025-12-31 capacity expansion MP Materials doubled NdPr oxide output to 2,599 metric tons in 2025 and exited the year at an annualized run rate of nearly 4,000 metric tons of separated NdPr oxide.
  • 2025-07-01 partnership Since the July 2025 agreement signing, MP Materials' Mountain Pass team has had a highly productive engagement with Apple on the recycling effort and finalized process design.

Financials — multi-year, confidence 1.0 (filings)

revenue

$134M '20
$332M '21
$528M '22
$253M '23
$204M '24
$276M '25

operating income

$-35M '20
$165M '21
$327M '22
$-18M '23
$-169M '24
$-123M '25

net income

$-22M '20
$135M '21
$289M '22
$24M '23
$-65M '24
$-86M '25

Supplies → 2

🇩🇪 Vacuumschmelze physical_ai L2
🇺🇸 Tesla physical_ai L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Separated Rare Earth OxidesRare Earth Elements (REE) Extraction and Processing

Murata ManufacturingpublicRelationships + financials

ai compute · 🇯🇵 Japan · TSE: 6981 · 39 sources · 8 products · 2030 patents

$12.2Brevenue · FY2026 · USD$85.6B mkt cap

Discovered via news_counterparty (2026-07-12). News (How tiny capacitors became the latest AI - driven investor d) — competitor: Murata Manufacturing leads the global MLCC market alongside Samsung Electro-Me. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $10.0BFY2022: $11.2BFY2023: $10.4BFY2024: $10.1BFY2025: $11.4BFY2026: $12.2B wins 2026-04-29 · → Texas Instruments imu — click for source2026-06-04 · → Intel imu — click for source2026-06-19 · → Micron imu — click for source2023-06-10 · → GlobalFoundries imu — click for source2026-05-20 · → NVIDIA imu — click for source events
  • 2026-06-19 design-win → Micron imu source ↗
  • 2026-06-04 design-win → Intel imu source ↗
  • 2026-05-20 design-win → NVIDIA imu source ↗
  • 2026-04-29 design-win → Texas Instruments imu source ↗
  • 2023-06-10 design-win → GlobalFoundries imu source ↗

Patents — 2030 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 889
Power electronics 719
Computing 302
Force / torque sensors 41
Memory 28
Electric motors 25
Robotics / manipulators 8
Batteries 7
Lidar / ranging 4
Imaging / cameras 3
IMU / navigation 2
Gears / reducers 2

Newest 30 of 2030, most recent first — all on Google Patents →

  • 2026-05-21WO2026105518SLIDE CLUTCH MECHANISM
  • 2026-04-23WO2026083818SPLIT CORE, ANNULAR CORE AND METHOD FOR MANUFACTURING SAME, AND ROTATING ELECTRICAL MACHINE
  • 2026-04-09WO2026074772PROCESSING SYSTEM AND GENERATION METHOD
  • 2026-04-09WO2026074773OPERATION PATH DESIGN SYSTEM AND OPERATION PATH DESIGN METHOD
  • 2026-03-26WO2026063024CONVEYANCE SYSTEM
  • 2026-03-12WO2026053596VIBRATION MOTOR
  • 2026-03-12WO2026053614VIBRATION MOTOR
  • 2025-11-20WO2025239262VIBRATION MOTOR
  • 2025-09-18WO2025192119POSITION CONTROL METHOD AND CONVEYANCE DEVICE
  • 2025-09-18WO2025192341YOKE-INTEGRATED BONDED MAGNET AND METHOD FOR MANUFACTURING SAME, ROTOR MEMBER, AND ROTATING ELECTRIC MACHINE
  • 2025-07-24WO2025154580VIBRATION MOTOR
  • 2025-05-01WO2025089183MAGNETIC CORE AND METHOD FOR MANUFACTURING SAME, MAGNETIC CORE WITH COIL, AND ROTARY ELECTRIC MACHINE
  • 2025-03-06WO2025047230MAGNETIC CORE AND METHOD FOR MANUFACTURING SAME, MAGNETIC CORE WITH COIL, AND ROTARY ELECTRIC MACHINE
  • 2025-02-13WO2025033374LINEAR VIBRATION MOTOR AND METHOD FOR MANUFACTURING LINEAR VIBRATION MOTOR
  • 2024-10-17WO2024214703SUCTION HEAD AND CONVEYANCE DEVICE
  • 2024-10-17WO2024214741ILLUSORY FORCE SENSATION PRESENTING APPARATUS
  • 2024-10-10WO2024209775CHUCK, LOADER DEVICE, AND MACHINE TOOL
  • 2024-09-06WO2024181096STATOR AND ROTARY ELECTRIC MACHINE
  • 2024-08-22WO2024171937STATOR MEMBER, DYNAMO-ELECTRIC MACHINE, AND METHOD FOR MANUFACTURING STATOR MEMBER
  • 2024-08-08WO2024162206VIBRATION GENERATING DEVICE
  • 2024-08-02WO2024157740ROTATING ELECTRIC MACHINE
  • 2024-07-25WO2024154569STATOR AND MOTOR
  • 2024-07-04WO2024143340MAGNETIC BODY CORE, MAGNETIC BODY CORE WITH COIL, AND ROTARY ELECTRIC MACHINE
  • 2024-06-13WO2024122405MAGNETIC MATERIAL CORE, STATOR ASSEMBLY, ROTARY ELECTRIC MACHINE, AND BRUSHLESS MOTOR
  • 2024-06-13WO2024122406MAGNETIC CORE, ROTARY ELECTRIC MACHINE, AND BRUSHLESS MOTOR
  • 2024-06-13WO2024122407MAGNETIC-BODY CORE AND ROTATING ELECTRIC MACHINE
  • 2024-06-13WO2024122408MAGNETIC BODY CORE, COIL-PROVIDED MAGNETIC BODY CORE, ROTARY ELECTRIC MACHINE, AND BRUSHLESS MOTOR
  • 2024-05-02WO2024089933ROTOR MEMBER, ROTOR, ROTARY ELECTRIC MECHANISM, BRUSHLESS MOTOR, AND METHOD FOR MANUFACTURING ROTOR MEMBER
  • 2024-04-04WO2024070630CONVEYANCE DEVICE AND STORAGE DEVICE
  • 2024-02-15WO2024034515AUTOMATIC CONVEYING VEHICLE

Financials — multi-year, confidence 1.0 (filings)

revenue

$10.0B '21
$11.2B '22
$10.4B '23
$10.1B '24
$11.4B '25
$12.2B '26

operating income

$2.0B '21
$2.6B '22
$1.8B '23
$1.6B '24
$1.8B '25
$1.9B '26

net income

$1.5B '21
$1.9B '22
$1.5B '23
$1.1B '24
$1.5B '25
$1.6B '26

Sources: 株式会社村田製作所 — 臨時報告書 · 株式会社村田製作所 — 臨時報告書 · 株式会社村田製作所 — 臨時報告書 · 株式会社村田製作所 — 半期報告書-第90期(2025/04/01-2026/03/31) · 株式会社村田製作所 — 臨時報告書 · 株式会社村田製作所 — 有価証券報告書-第90期(2025/04/01-2026/03/31)

Supplies → 5

🇺🇸 Texas Instruments imu L2 65
🇺🇸 Intel imu L2 53
🇺🇸 Micron imu L2 65
🇺🇸 GlobalFoundries imu L2 53
🇺🇸 NVIDIA imu L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

GYC SeriesSCH SeriesSCC SeriesGCC SeriesGCM SeriesMA SeriesMLCC (Multilayer Ceramic Capacitor)GRM Series

NabtescopublicProduct-grade

physical ai · 🇯🇵 Japan · TSE: 6268 · 5 sources · 6 products · 995 patents

$2.1Brevenue · FY2025 · USD$3.4B mkt cap

Nabtesco Corporation is a Japanese manufacturer of precision reduction gears, including RV reducers used in industrial robot joints, alongside actuation systems for aircraft and railway equipment. Headquartered in Tokyo, it was formed in 2003 through the merger of Teijin Seiki and Nabco.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $1.7BFY2021: $1.8BFY2022: $1.9BFY2023: $2.1BFY2024: $1.9BFY2025: $2.1B wins 2026-07-17 · Kobe Steel → steel — click for source2026-05-04 · → ABB Robotics planetary_reducers — click for source2026-05-06 · → KUKA planetary_reducers — click for source2026-07-17 · Sanyo Special Steel → steel — click for source events 2025-01-01 · financial report — Nabtesco reported financial results for the first half of fiscal year 23 (January-June 2025).
  • 2026-07-17 reported edge Kobe Steel → steel source ↗
  • 2026-07-17 reported edge Sanyo Special Steel → steel source ↗
  • 2026-05-06 design-win → KUKA planetary_reducers source ↗
  • 2026-05-04 design-win → ABB Robotics planetary_reducers source ↗
  • 2025-01-01 financial report Nabtesco reported financial results for the first half of fiscal year 23 (January-June 2025).

Patents — 995 CPC-scoped to physical ai (physical-AI-relevant classes)

Gears / reducers 640
Bearings 97
Robotics / manipulators 79
Electric motors 49
Power electronics 47
Force / torque sensors 34
Other 25
Imaging / cameras 17
IMU / navigation 6
Computing 1

IP chokepoint in: Bearings, Gears / reducers

Newest 7 of 995, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.7B '20
$1.8B '21
$1.9B '22
$2.1B '23
$1.9B '24
$2.1B '25

operating income

$139M '20
$182M '21
$105M '22
$97M '23
$86M '24
$139M '25

net income

$126M '20
$399M '21
$58M '22
$90M '23
$67M '24
$105M '25

Sources: ナブテスコ株式会社 — 臨時報告書 · ナブテスコ株式会社 — 有価証券報告書-第23期(2025/01/01-2025/12/31) · ナブテスコ株式会社 — 臨時報告書 · ナブテスコ株式会社 — 半期報告書-第23期(2025/01/01-2025/06/30)

Buys from ← 2

🇯🇵 Kobe Steel steel L2
🇯🇵 Sanyo Special Steel steel L2

Supplies → 2

🇨🇭 ABB Robotics planetary_reducers → IRB 6700 L3 53
🇩🇪 KUKA planetary_reducers → KUKA KR CYBERTECH L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

RV-E SeriesRV-H SeriesSuperHDRV ReducerHarmonic DriveCSF

Nachi-FujikoshipublicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6474 · 8 sources · 5 products · 178 patents

$1.5Brevenue · FY2025 · USD$786M mkt cap

Robots, bearings, hydraulics

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $1.2BFY2021: $1.4BFY2022: $1.6BFY2023: $1.6BFY2024: $1.5BFY2025: $1.5B wins events 2026-11-30 · financial report — Nachi-Fujikoshi Corp. files interim financial report for fiscal period ending November 30, 2026.2024-12-01 · financial report — Nachi-Fujikoshi filed a half-year financial report for fiscal period 143 (December 1, 2024 - November 30, 2025).
  • 2026-11-30 financial report Nachi-Fujikoshi Corp. files interim financial report for fiscal period ending November 30, 2026.
  • 2024-12-01 financial report Nachi-Fujikoshi filed a half-year financial report for fiscal period 143 (December 1, 2024 - November 30, 2025).

Patents — 178 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 100
Bearings 27
Other 22
Gears / reducers 11
Batteries 9
Lidar / ranging 5
Electric motors 2
Force / torque sensors 2

Newest 8 of 178, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.3B '18
$2.3B '19
$1.2B '20
$1.4B '21
$1.6B '22
$1.6B '23
$1.5B '24
$1.5B '25

operating income

$139M '18
$122M '19
$42M '20
$91M '21
$105M '22
$73M '23
$44M '24
$65M '25

net income

$81M '18
$76M '19
$15M '20
$92M '21
$75M '22
$46M '23
$22M '24
$35M '25

Sources: 株式会社不二越 — 臨時報告書 · 株式会社不二越 — 有価証券報告書-第143期(2024/12/01-2025/11/30) · 株式会社不二越 — 半期報告書-第144期(2025/12/01-2026/11/30) · 株式会社不二越 — 臨時報告書 · 株式会社不二越 — 半期報告書-第143期(2024/12/01-2025/11/30)

Supplies → 1

Toyota Motor industrial_arm L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Hydraulic EquipmentRolling BearingsSC SeriesRV ReducersMD Series

Navitas SemiconductorpublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: NVTS · 50 sources · 5 products · 265 patents

$46Mrevenue · FY2025 · USD$2.9B mkt cap

Navitas Semiconductor is a US semiconductor company specializing in gallium nitride (GaN) power ICs and silicon carbide (SiC) devices for power conversion in chargers, data centers and EVs. Founded in 2014, it is publicly traded and headquartered in Torrance, California.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $12MFY2021: $24MFY2022: $38MFY2023: $80MFY2024: $83MFY2025: $46M wins 2026-05-05 · GlobalFoundries → foundry — click for source2025-08-04 · → Delta Electronics ai_chips — click for source2026-05-05 · Taiwan Manufacturing → foundry — click for source events 2026-07-08 · litigation — On July 8, 2026, Navitas Semiconductor Corporation issued a press release regarding a patent infringement complaint filed by Wolfspeed against the Company.2026-03-31 · product launch — Introduced new industry-leading Gen 5 GeneSiC technology based on patented Trench-assisted planar architecture, and released 1.2 kV Gen 5 SiC product in March tailored in packages to address higher power density DCDC and ACDC unit in PSU application.2026-03-31 · financial — Q1 2026 revenue of $8.6 million increased 18% sequentially, compared to $7.3 million in Q4 2025 and $14.0 million in Q1 2025.2026-03-31 · financial — Q1 2026 gross margin improved to 39.0% from 38.7% in prior quarter and 38.1% in Q1 2025.2026-03-31 · product launch — Released industry-leading 20-kilowatt 800-volt to 6-volt DC-DC platform using latest 8x8 60-volt GaNFast aiming at 97.5% efficiency, formally unveiled in March at GDC and showcased at NVIDIA MGX.2026-03-31 · executive change — Tonya Stevens appointed as new CFO, joining in late March 2026, bringing 30 years of semiconductor financial leadership including 17 years at Intel and 7 years at Lattice Semiconductor.2026-03-31 · financial — Cash and cash equivalents at end of Q1 2026 were $221 million compared to $237 million at end of Q4 2025, with no outstanding debt.2026-02-09 · product launch — Navitas announced a breakthrough 10-kilowatt DC-DC design platform employing advanced 650-volt and 100-volt GaNFast FETs with 98.5% peak efficiency.2025-11-20 · partnership — Navitas announced a long-term strategic technology and manufacturing partnership with GlobalFoundries to accelerate GaN technology design and manufacturing in the United States.2025-11-01 · financial — Navitas completed a private placement of common stock in November with net proceeds of approximately $96 million.2025-03-12 · product launch — Navitas plans a major technology announcement coming up on March 12 which will be the company's first ever global online launch event.2024-12-31 · financial — GaN business grew over 50% in 2024 to an all-time high with revenues coming from mobile, consumer, appliance and the initial ramp up of data centers.2024-12-31 · other — In Q4, the company disengaged with a silicon carbide distributor, resulting in a one-time $11.6 million expense related to an inventory reserve and bad debt.2024-12-31 · financial — Cash and cash equivalents at quarter end were $87 million and the company continues to carry no debt.2024-12-31 · financial — Navitas completed 2024 with an all-time high of $83 million in revenue.2024-12-31 · financial — Navitas completed 2024 with an extraordinary $450 million of design wins, which reflects lifetime revenues of new customer programs.
  • 2026-07-08 litigation On July 8, 2026, Navitas Semiconductor Corporation issued a press release regarding a patent infringement complaint filed by Wolfspeed against the Company.
  • 2026-05-05 design-win GlobalFoundries → foundry source ↗
  • 2026-05-05 design-win Taiwan Manufacturing → foundry source ↗
  • 2026-03-31 product launch Introduced new industry-leading Gen 5 GeneSiC technology based on patented Trench-assisted planar architecture, and released 1.2 kV Gen 5 SiC product in March tailored in packages to address higher power density DCDC and ACDC unit in PSU application.
  • 2026-03-31 financial Q1 2026 revenue of $8.6 million increased 18% sequentially, compared to $7.3 million in Q4 2025 and $14.0 million in Q1 2025.
  • 2026-03-31 financial Q1 2026 gross margin improved to 39.0% from 38.7% in prior quarter and 38.1% in Q1 2025.
  • 2026-03-31 product launch Released industry-leading 20-kilowatt 800-volt to 6-volt DC-DC platform using latest 8x8 60-volt GaNFast aiming at 97.5% efficiency, formally unveiled in March at GDC and showcased at NVIDIA MGX.
  • 2026-03-31 executive change Tonya Stevens appointed as new CFO, joining in late March 2026, bringing 30 years of semiconductor financial leadership including 17 years at Intel and 7 years at Lattice Semiconductor.
  • 2026-03-31 financial Cash and cash equivalents at end of Q1 2026 were $221 million compared to $237 million at end of Q4 2025, with no outstanding debt.
  • 2026-02-09 product launch Navitas announced a breakthrough 10-kilowatt DC-DC design platform employing advanced 650-volt and 100-volt GaNFast FETs with 98.5% peak efficiency.
  • 2025-11-20 partnership Navitas announced a long-term strategic technology and manufacturing partnership with GlobalFoundries to accelerate GaN technology design and manufacturing in the United States.
  • 2025-11-01 financial Navitas completed a private placement of common stock in November with net proceeds of approximately $96 million.
  • 2025-08-04 design-win → Delta Electronics ai_chips source ↗
  • 2025-03-12 product launch Navitas plans a major technology announcement coming up on March 12 which will be the company's first ever global online launch event.
  • 2024-12-31 financial GaN business grew over 50% in 2024 to an all-time high with revenues coming from mobile, consumer, appliance and the initial ramp up of data centers.
  • 2024-12-31 other In Q4, the company disengaged with a silicon carbide distributor, resulting in a one-time $11.6 million expense related to an inventory reserve and bad debt.
  • 2024-12-31 financial Cash and cash equivalents at quarter end were $87 million and the company continues to carry no debt.
  • 2024-12-31 financial Navitas completed 2024 with an all-time high of $83 million in revenue.
  • 2024-12-31 financial Navitas completed 2024 with an extraordinary $450 million of design wins, which reflects lifetime revenues of new customer programs.

Patents — 265 CPC-scoped to ai compute (physical-AI-relevant classes)

Power electronics 213
Semiconductors 28
Other 21
Computing 2
Electric motors 1

Newest 1 of 265, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$12M '20
$24M '21
$38M '22
$80M '23
$83M '24
$46M '25

operating income

$-19M '20
$-68M '21
$-124M '22
$-118M '23
$-131M '24
$-108M '25

net income

$-19M '20
$-153M '21
$74M '22
$-145M '23
$-85M '24
$-117M '25

Sources: NVTS 10-Q 2026-05-05 (acc 0001628280-26-030524) · NVTS 10-K 2026-02-27 (acc 0001821769-26-000007) · NVTS 10-Q 2025-11-03 (acc 0001821769-25-000214) · NVTS 8-K 2026-07-08 (acc 0001104659-26-081576) · NVTS 10-Q 2023-11-09 (acc 0001821769-23-000176) · NVTS 10-Q 2025-05-09 (acc 0001821769-25-000068) · NVTS 10-Q 2024-08-05 (acc 0001821769-24-000094) · NVTS 10-Q 2023-08-14 (acc 0001821769-23-000133) · NVTS 10-Q 2023-05-15 (acc 0001821769-23-000090) · NVTS 10-K 2025-03-19 (acc 0001821769-25-000021)

Buys from ← 2

🇺🇸 GlobalFoundries foundry → GaN power integrated circuits (ICs) L3 50
🇹🇼 Taiwan Manufacturing foundry → GaN power integrated circuits (ICs) L3 50

Supplies → 1

🇹🇼 Delta Electronics ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

GaN power integrated circuits (ICs)SiC diodesDigital isolatorsHigh-speed silicon system controllersSiC MOSFETs

NichiconpublicFinancials only

physical ai · 🇯🇵 Japan · 1 sources · 0 products · 29 patents

$1.0Brevenue · FY2026 · USD$216.9B mkt cap

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Electrolytic Capacitors (bus)' for EMG Servo Motors. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $714MFY2022: $875MFY2023: $1.1BFY2024: $1.1BFY2025: $1.1BFY2026: $1.0B wins events

Patents — 29 CPC-scoped to physical ai (physical-AI-relevant classes)

Power electronics 25
Batteries 4

Financials — multi-year, confidence 1.0 (filings)

revenue

$714M '21
$875M '22
$1.1B '23
$1.1B '24
$1.1B '25
$1.0B '26

operating income

$9M '21
$40M '22
$78M '23
$55M '24
$31M '25
$38M '26

net income

$11M '21
$49M '22
$48M '23
$51M '24
$36M '25
$39M '26

Nidec CorporationpublicProduct-grade

physical ai · 🇯🇵 Japan · TSE: 6594 · 18 sources · 1 products · 2254 patents

$16.1Brevenue · FY2025 · USD$17.5B mkt cap

World's largest comprehensive electric-motor maker (precision, automotive, industrial). Relevant here for servo/precision motors in robotics; broader business spans HDD/automotive/appliance motors. Founded 1973 (as Nippon Densan); HQ Kyoto.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $14.1BFY2021: $15.3BFY2022: $17.1BFY2023: $16.5BFY2024: $1.3BFY2025: $16.0B wins 2026-07-17 · Proterial → rare_earth_magnets — click for source2026-07-17 · JL MAG Rare-Earth → rare_earth_magnets — click for source2025-06-30 · → Tesla actuator_motor — click for source events 2026-02-26 · governance — Accounting scandal (early 2026) triggered credit downgrades, delayed financial results and delisting risk; founder Shigenobu Nagamori resigned as Chairman Emeritus on 2026-02-26, with CEO Mitsuya Kishida consolidating Chairman/President/CEO roles.2025-04-01 · financial report — Nidec reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2026-07-17 reported edge Proterial → rare_earth_magnets source ↗
  • 2026-07-17 reported edge JL MAG Rare-Earth → rare_earth_magnets source ↗
  • 2026-02-26 governance Accounting scandal (early 2026) triggered credit downgrades, delayed financial results and delisting risk; founder Shigenobu Nagamori resigned as Chairman Emeritus on 2026-02-26, with CEO Mitsuya Kishida consolidating Chairman/President/CEO roles.
  • 2025-06-30 design-win → Tesla actuator_motor source ↗
  • 2025-04-01 financial report Nidec reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Patents — 2254 CPC-scoped to physical ai (physical-AI-relevant classes)

Electric motors 1795
Gears / reducers 168
Power electronics 128
Other 56
Robotics / manipulators 34
Imaging / cameras 33
Bearings 16
Batteries 12
Computing 6
Lidar / ranging 3
IMU / navigation 3

IP chokepoint in: Electric motors

Newest 24 of 2254, most recent first — all on Google Patents →

Buys from ← 3

🇯🇵 Proterial rare_earth_magnets → Precision & servo motors L3
🇨🇳 JL MAG Rare-Earth rare_earth_magnets → Precision & servo motors L3
🇨🇳 JL MAG Rare-Earth rare_earth_magnets → Precision & servo motors L3 50

Supplies → 1

🇺🇸 Tesla actuator_motor → Tesla Optimus L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Precision & servo motors

Ningbo Tuopu Group Co., Ltd.publicProduct-grade

physical ai · 🇨🇳 China · SSE: 601689 · 3 sources · 0 products · 41 patents

$4.4Brevenue · FY2025 · USD$13.0B mkt cap

Ningbo Tuopu Group Co., Ltd. is a China-based auto parts manufacturer producing NVH systems, chassis components, and lightweight and thermal-management parts for automotive and EV OEMs.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $963MFY2021: $1.7BFY2022: $2.4BFY2023: $2.9BFY2024: $3.9BFY2025: $4.4B wins 2025-06-30 · → Tesla rotary_actuator — click for source events
  • 2025-06-30 design-win → Tesla rotary_actuator source ↗

Patents — 41 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 28
Electric motors 5
Force / torque sensors 3
Batteries 3
Bearings 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$963M '20
$1.7B '21
$2.4B '22
$2.9B '23
$3.9B '24
$4.4B '25

operating income

$104M '20
$169M '21
$292M '22
$366M '23
$506M '24
$451M '25

net income

$93M '20
$150M '21
$251M '22
$317M '23
$444M '24
$411M '25

Supplies → 1

🇺🇸 Tesla rotary_actuator → Tesla Optimus L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Ningbo YunshengpublicProduct-grade

physical ai · 🇨🇳 China · SSE: 600366 · 2 sources · 0 products · 34 patents

$806Mrevenue · FY2025 · USD$1.9B mkt cap

Ningbo Yunsheng is a China-based manufacturer of permanent magnet materials, including NdFeB magnets used in motors and industrial automation equipment. It is publicly listed in China.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $354MFY2021: $555MFY2022: $945MFY2023: $792MFY2024: $744MFY2025: $806M wins 2025-02-19 · → AgiBot rare_earth_magnets — click for source2024-01-12 · → Panasonic rare_earth_magnets — click for source2024-01-12 · → BYD rare_earth_magnets — click for source2026-07-17 · China Northern Rare Earth High-Tech → physical_ai — click for source2025-03-21 · → Estun Automation rare_earth_magnets — click for source2024-01-12 · → Schaeffler rare_earth_magnets — click for source events
  • 2026-07-17 reported edge China Northern Rare Earth High-Tech → physical_ai source ↗
  • 2025-03-21 design-win → Estun Automation rare_earth_magnets source ↗
  • 2025-02-19 design-win → AgiBot rare_earth_magnets source ↗
  • 2024-01-12 design-win → Panasonic rare_earth_magnets source ↗
  • 2024-01-12 design-win → BYD rare_earth_magnets source ↗
  • 2024-01-12 design-win → Schaeffler rare_earth_magnets source ↗

Patents — 34 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 30
Electric motors 4

Financials — multi-year, confidence 1.0 (filings)

revenue

$307M '18
$282M '19
$354M '20
$555M '21
$945M '22
$792M '23
$744M '24
$806M '25

operating income

$14M '18
$5M '19
$33M '20
$93M '21
$55M '22
$-46M '23
$10M '24
$54M '25

net income

$14M '18
$4M '19
$26M '20
$77M '21
$53M '22
$-33M '23
$14M '24
$49M '25

Buys from ← 1

🇨🇳 China Northern Rare Earth High-Tech physical_ai L2

Supplies → 5

🇨🇳 AgiBot rare_earth_magnets → Yuanzheng L3 50
🇯🇵 Panasonic rare_earth_magnets L2 50
🇨🇳 BYD rare_earth_magnets L2 50
🇨🇳 Estun Automation rare_earth_magnets → EMG Servo Motors L3 50
🇩🇪 Schaeffler rare_earth_magnets → Magnetic Couplings L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Ningbo Zhongda Leader Intelligent Transmission Co., Ltd.publicFinancials only

physical ai · 🇨🇳 China · SZSE: 300811 · 1 sources · 0 products

$266Mrevenue · FY2025 · USD

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $73MFY2021: $107MFY2022: $158MFY2023: $171MFY2024: $246MFY2025: $266M wins events

Financials — multi-year, confidence 1.0 (filings)

revenue

$73M '20
$107M '21
$158M '22
$171M '23
$246M '24
$266M '25

operating income

$19M '20
$21M '21
$32M '22
$44M '23
$63M '24
$71M '25

net income

$16M '20
$18M '21
$29M '22
$38M '23
$56M '24
$62M '25

Nippon Chemi-ConpublicFinancials only

physical ai · 🇯🇵 Japan · 1 sources · 0 products · 89 patents

$842Mrevenue · FY2026 · USD$80.9B mkt cap

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Electrolytic Capacitors (bulk storage)' for EC Series Servo Drives. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $682MFY2022: $864MFY2023: $996MFY2024: $928MFY2025: $755MFY2026: $842M wins events

Patents — 89 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 74
Power electronics 7
Imaging / cameras 6
Lidar / ranging 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$682M '21
$864M '22
$996M '23
$928M '24
$755M '25
$842M '26

operating income

$18M '21
$54M '22
$80M '23
$58M '24
$23M '25
$21M '26

net income

$13M '21
$-75M '22
$14M '23
$-131M '24
$0M '25
$15M '26

Nippon SteelpublicFinancials only

physical ai · 🇯🇵 Japan · 20 sources · 7 products · 1322 patents

$61.9Brevenue · FY2026 · USD$3.03T mkt cap

Parent (created for subsidiary mapping).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $29.7BFY2022: $41.9BFY2023: $49.1BFY2024: $54.6BFY2025: $53.5BFY2026: $61.9B wins 2026-07-17 · → INA physical_ai — click for source2026-07-17 · → SKF physical_ai — click for source events

Rolled up across Nippon Steel + its subsidiaries

  • 2026-07-17 reported edge → INA physical_ai source ↗
  • 2026-07-17 reported edge → SKF physical_ai source ↗

Patents — 1322 CPC-scoped to physical ai (physical-AI-relevant classes)

Electric motors 840
Batteries 248
Bearings 119
Power electronics 32
Robotics / manipulators 19
Gears / reducers 16
Computing 14
Other 14
Imaging / cameras 9
Lidar / ranging 8
Force / torque sensors 2
IMU / navigation 1

Newest 46 of 1322, most recent first — all on Google Patents →

  • 2026-02-12WO2026034317ROTOR CORE, ROTOR, AND ROTATING ELECTRICAL MACHINE
  • 2026-02-05WO2026028925STATOR CORE, ROTARY ELECTRICAL MACHINE, AND PRESSURIZING JIG
  • 2025-12-18WO2025258668MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR LAMINATED CORE
  • 2025-11-06WO2025229787NON-ORIENTED ELECTROMAGNETIC STEEL SHEET, MOTOR CORE, AND MOTOR
  • 2025-11-06WO2025230003NON-ORIENTED ELECTROMAGNETIC STEEL SHEET, MOTOR CORE, AND MOTOR
  • 2025-10-30WO2025225728ELECTRIC POWER GENERATION DEVICE
  • 2025-10-16WO2025216279LAMINATED CORE, ROTARY ELECTRIC MACHINE, PRESSURIZING JIG, AND METHOD FOR MANUFACTURING LAMINATED CORE
  • 2025-10-16WO2025216282ROTOR CORE, ROTOR, ROTARY ELECTRICAL MACHINE, AND PRESSURIZING JIG
  • 2025-10-09WO2025210987METHOD FOR MANUFACTURING LAMINATED CORE AND APPARATUS FOR MANUFACTURING LAMINATED CORE
  • 2025-10-02WO2025203924TOOL CLEANING DEVICE
  • 2025-08-28WO2025177695ACTUATION SYSTEM
  • 2025-08-28WO2025178061NON-ORIENTED ELECTRICAL STEEL SHEET, MOTOR CORE, AND MOTOR
  • 2025-08-14WO2025169977PROCESSING DEVICE, PROCESSING METHOD, PROGRAM, AND CORE
  • 2025-07-31WO2025159168NON-ORIENTED ELECTROMAGNETIC STEEL SHEET, ROTOR CORE, STATOR CORE, AND MOTOR
  • 2025-05-22WO2025105482LAMINATED IRON CORE MANUFACTURING APPARATUS AND MANUFACTURING METHOD
  • 2025-05-22WO2025105483MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR LAMINATED IRON CORE
  • 2025-05-22WO2025105484MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR LAMINATED IRON CORE
  • 2025-05-22WO2025105485LAYERED IRON CORE MANUFACTURING DEVICE AND MANUFACTURING METHOD
  • 2025-05-22WO2025105487DEVICE FOR MANUFACTURING LAMINATED CORE AND METHOD FOR MANUFACTURING LAMINATED CORE
  • 2025-05-22WO2025105488DEVICE FOR MANUFACTURING LAMINATED CORE AND METHOD FOR MANUFACTURING LAMINATED CORE
  • 2025-04-03WO2025070576COATING COMPOSITION FOR LAMINATED STEEL SHEET
  • 2025-04-03WO2025070594ELECTROMAGNETIC STEEL SHEET WITH ADHESIVE COATING FILM, LAMINATED CORE, AND MANUFACTURING METHOD OF SAME
  • 2025-04-03WO2025070598ELECTROMAGNETIC STEEL SHEET WITH ADHESIVE COATING FILM, LAMINATED CORE, AND MANUFACTURING METHODS FOR THOSE PRODUCTS
  • 2025-04-03WO2025070613ELECTROMAGNETIC STEEL SHEET HAVING ADHESIVE COATING, LAMINATED CORE, AND METHOD FOR MANUFACTURING SAME
  • 2025-04-03WO2025070622ELECTRICAL STEEL SHEET WITH ADHESIVE COATING FILM, LAMINATED CORE, AND METHODS FOR MANUFACTURING THOSE
  • 2025-04-03WO2025070626ELECTROMAGNETIC STEEL SHEET WITH ADHESIVE COATING FILM, LAMINATED CORE, AND MANUFACTURING METHOD THEREFOR
  • 2025-04-03WO2025070628ELECTROMAGNETIC STEEL SHEET WITH ADHESIVE COATING, LAMINATED CORE, AND METHOD FOR MANUFACTURING SAME
  • 2024-12-05WO2024247957LAMINATED CORE, AND MANUFACTURING APPARATUS AND MANUFACTURING METHOD THEREFOR
  • 2024-12-05WO2024247958APPARATUS AND METHOD FOR MANUFACTURING LAMINATED CORE
  • 2024-10-10WO2024209804ROTOR CORE, ROTOR, ROTARY ELECTRIC MACHINE, AND METHOD FOR DESIGNING ROTOR CORE
  • 2024-10-10WO2024210032ROTOR CORE, ROTOR, ROTARY ELECTRIC MACHINE, AND DESIGN METHOD FOR ROTOR CORE
  • 2024-10-10WO2024210210NONORIENTED ELECTROMAGNETIC STEEL SHEET, CORE, AND ROTARY ELECTRIC MACHINE
  • 2024-09-19WO2024190617LAMINATED CORE, ROTARY ELECTRIC MACHINE, AND MANUFACTURING METHOD FOR LAMINATED CORE
  • 2024-08-08WO2024161485EDDY CURRENT-TYPE SPEED REDUCER
  • 2024-06-20WO2024127862ROTOR, ROTOR CORE, INDUCTION MOTOR, AND DESIGN METHOD FOR INDUCTION MOTOR
  • 2024-06-06WO2024116347EDDY-CURRENT-TYPE REDUCTION GEAR ROTOR AND METHOD FOR MANUFACTURING EDDY-CURRENT-TYPE REDUCTION GEAR ROTOR
  • 2024-03-14WO2024053364LAMINATED IRON CORE MANUFACTURING METHOD, MANUFACTURING DEVICE, LAMINATED IRON CORE, AND ROATING ELECTRIC MACHINE
  • 2024-03-14WO2024053732LAMINATED CORE AND METHOD FOR MANUFACTURING LAMINATED CORE
  • 2024-02-29WO2024043157METHOD FOR PRODUCING LAMINATED CORE, PRODUCTION DEVICE OF LAMINATED CORE, LAMINATED CORE, AND ROTATING ELECTRIC MACHINE
  • 2023-10-26WO2023203693EDDY CURRENT-TYPE SPEED REDUCER
  • 2023-10-12WO2023195464LAMINATED CORE
  • 2023-10-12WO2023195465LAMINATED CORE
  • 2023-10-05WO2023190460STATOR CORE, STATOR CORE MANUFACTURING METHOD, AND ROTARY ELECTRIC MACHINE
  • 2023-10-05WO2023190621NON-ORIENTED ELECTROMAGNETIC STEEL SHEET AND MOTOR CORE
  • 2023-09-21WO2023176865NON-ORIENTED ELECTROMAGNETIC STEEL SHEET, MOTOR CORE, AND METHODS FOR PRODUCING SAME
  • 2023-09-14WO2023171645LAMINATED CORE, ROTOR, AND METHOD FOR MANUFACTURING LAMINATED CORE

Financials — multi-year, confidence 1.0 (filings)

revenue

$29.7B '21
$41.9B '22
$49.1B '23
$54.6B '24
$53.5B '25
$61.9B '26

operating income

$592M '21
$4.2B '22
$4.4B '23
$4.0B '24
$3.4B '25
$2.8B '26

net income

$-200M '21
$3.9B '22
$4.3B '23
$3.4B '24
$2.2B '25
$106M '26

Products

Stainless SteelElectrical SteelSpecial SteelSteel Sheets and CoilsWire RodsHigh-Strength SteelSteel Pipes and Tubes

NSK Ltd.publicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6471 · 5 sources · 8 products · 2030 patents

$5.6Brevenue · FY2026 · USD$3.3B mkt cap

Bearings, ballscrews, linear

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $4.6BFY2022: $5.3BFY2023: $5.8BFY2024: $4.9BFY2025: $5.2BFY2026: $6.1B wins 2026-07-17 · Daido Steel → steel — click for source2026-07-17 · Sanyo Special Steel → steel — click for source events 2025-04-01 · financial report — NSK Ltd. reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2026-07-17 reported edge Daido Steel → steel source ↗
  • 2026-07-17 reported edge Sanyo Special Steel → steel source ↗
  • 2025-04-01 financial report NSK Ltd. reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Patents — 2030 CPC-scoped to physical ai (physical-AI-relevant classes)

Bearings 1086
Gears / reducers 598
Force / torque sensors 141
Electric motors 109
Power electronics 39
Robotics / manipulators 25
Computing 14
Other 8
IMU / navigation 8
Imaging / cameras 2

IP chokepoint in: Bearings, Robotics / manipulators

Newest 26 of 2030, most recent first — all on Google Patents →

  • 2026-06-04WO2026116150REVERSE INPUT CUTOFF CLUTCH, TORQUE TRANSMISSION DEVICE, AND METHOD FOR ADJUSTING TENSION OF SAME
  • 2026-05-21WO2026105639BALL SCREW AND SEAL MEMBER FOR BALL SCREW
  • 2026-05-15WO2026100131BALL SCREW DEVICE
  • 2026-05-07WO2026094898BALL SCREW
  • 2026-04-30WO2026088497METHOD FOR MANUFACTURING SCREW SHAFT FOR BALL SCREW
  • 2026-04-30WO2026088612NUT FOR BALL SCREW DEVICE AND METHOD FOR MANUFACTURING SAME
  • 2026-04-16WO2026079363DRIVE WHEEL AND CART
  • 2026-04-09WO2026074832BALL SCREW DEVICE
  • 2026-04-09WO2026074861PINION SHAFT, ELECTRIC POWER STEERING DEVICE, AND METHOD FOR MANUFACTURING PINION SHAFT
  • 2026-03-26WO2026062960BALL SCREW
  • 2026-03-05WO2026048378BALL SCREW DEVICE
  • 2026-02-12WO2026033928BALL SCREW AND METHOD FOR MANUFACTURING NUT FOR BALL SCREW
  • 2026-01-29WO2026023291RACK SHAFT AND STEERING GEAR UNIT
  • 2025-12-26WO2025262994CLUTCH DEVICE
  • 2025-12-11WO2025254159EV UNIT
  • 2025-11-27WO2025243800BALL SCREW
  • 2025-11-13WO2025234345BALL SCREW
  • 2025-10-30WO2025225246BALL SCREW DEVICE
  • 2025-10-30WO2025225656ROTARY SUPPORT DEVICE AND SUPPORT MECHANISM POSITION ADJUSTMENT MECHANISM FOR SHAFT SUPPORT DEVICE
  • 2025-10-30WO2025225657ROTATION SUPPORT DEVICE, AND SUPPORT MECHANISM POSITION ADJUSTMENT MECHANISM FOR SHAFT SUPPORT DEVICE
  • 2025-10-30WO2025225658ROTATION SUPPORT DEVICE, AND SUPPORT MECHANISM POSITION ADJUSTMENT MECHANISM FOR SHAFT SUPPORT DEVICE
  • 2025-10-23WO2025220730TWO-STAGE TRANSMISSION AND ELECTRIC VEHICLE DRIVE DEVICE
  • 2025-09-18WO2025192564RACK BAR AND STEERING DEVICE
  • 2025-09-12WO2025186865ACTUATOR FOR VEHICLE
  • 2025-09-12WO2025186866ACTUATOR FOR VEHICLE
  • 2025-09-12WO2025186874ELECTRIC POWER STEERING DEVICE

Financials — multi-year, confidence 1.0 (filings)

revenue

$4.6B '21
$5.3B '22
$5.8B '23
$4.9B '24
$5.2B '25
$6.1B '26

operating income

$5M '21
$154M '22
$195M '23
$150M '24
$187M '25
$258M '26

net income

$2M '21
$102M '22
$113M '23
$53M '24
$70M '25
$152M '26

Sources: 日本精工株式会社 — 臨時報告書 · 日本精工株式会社 — 有価証券報告書-第165期(2025/04/01-2026/03/31) · 日本精工株式会社 — 半期報告書-第165期(2025/04/01-2026/03/31) · 日本精工株式会社 — 臨時報告書

Buys from ← 2

🇯🇵 Daido Steel steel L2
🇯🇵 Sanyo Special Steel steel L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Deep Groove Ball BearingsAngular Contact Ball BearingsSpindle MotorsLinear GuidesTapered Roller BearingsCylindrical Roller BearingsBall ScrewsRoller Screws

NTN CorporationpublicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6472 · 7 sources · 8 products · 34 patents

$5.1Brevenue · FY2026 · USD$1.3B mkt cap

Precision bearings

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $6.0BFY2021: $3.5BFY2022: $4.0BFY2023: $5.7BFY2024: $5.8BFY2025: $5.4BFY2026: $5.1B wins 2023-08-16 · → Toyota Motor robotics — click for source events 2025-04-01 · financial report — NTN Corporation reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2025-04-01 financial report NTN Corporation reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2023-08-16 design-win → Toyota Motor robotics source ↗

Patents — 34 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 12
Bearings 10
Robotics / manipulators 7
Gears / reducers 3
Electric motors 2

Newest 18 of 34, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$6.6B '19
$6.0B '20
$3.5B '21
$4.0B '22
$5.7B '23
$5.8B '24
$5.4B '25
$5.1B '26

operating income

$243M '19
$69M '20
$-19M '21
$72M '22
$127M '23
$174M '24
$151M '25
$206M '26

net income

$-63M '19
$-405M '20
$-72M '21
$45M '22
$64M '23
$65M '24
$-156M '25
$86M '26

Sources: NTN株式会社 — 臨時報告書 · NTN株式会社 — 臨時報告書 · NTN株式会社 — 半期報告書-第127期(2025/04/01-2026/03/31) · NTN株式会社 — 有価証券報告書-第127期(2025/04/01-2026/03/31) · NTN株式会社 — 臨時報告書 · NTN株式会社 — 臨時報告書

Supplies → 1

Toyota Motor robotics L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Tapered Roller BearingsThrust Ball BearingsCylindrical Roller BearingsAngular Contact Ball BearingsSpherical Roller BearingsDeep Groove Ball BearingsAutomotive BearingsNeedle Roller Bearings

NVIDIA CorporationpublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: NVDA · 598 sources · 18 products · 2061 patents

$215.9Brevenue · FY2026 · USD$5.02T mkt cap

Designer of GPUs and AI accelerators; the dominant AI-compute chip vendor and the connective hub of the launch set (buys HBM from SK hynix; invested in Figure AI). Founded 1993; HQ Santa Clara, CA.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202020212022202320242025202620272028 rev FY2020: $10.9BFY2021: $16.7BFY2022: $26.9BFY2023: $27.0BFY2024: $60.9BFY2025: $130.5BFY2026: $215.9B wins 2023-04-20 · Shinko Electric Industries → advanced_packaging — click for source2020-01-31 · → Covariant ai_chips — click for source2026-06-08 · LG Innotek → advanced_packaging — click for source2024-08-06 · → Figure AI ai_gpu — click for source2026-07-11 · Microchip → ai_compute — click for source2026-06-22 · NXP Semiconductors → compute — click for source2026-06-22 · → Agility Robotics ai_chips — click for source2026-05-06 · Coherent → optical_modules — click for source2025-09-03 · Credo → switch_silicon — click for source2025-08-26 · → Galbot ai_chips — click for source2025-08-28 · → Microsoft ai_gpu — click for source2025-02-26 · Taiwan Manufacturing → foundry — click for source2026-06-01 · → SK hynix ai_chips — click for source2026-07-16 · FANUC → industrial_arm — click for source2025-05-10 · → Standard Bots ai_chips — click for source2022-02-24 · → Tata Sons ai_chips — click for source2026-06-22 · Texas Instruments → compute — click for source2026-07-01 · Zhongji InnoLight → optical_modules — click for source2025-11-11 · Eoptolink → optical_modules — click for source2026-05-05 · Astera Labs → switch_silicon — click for source2025-05-28 · Hon Hai Precision Industry → AI supercomputers — click for source2024-12-30 · Ibiden → advanced_packaging — click for source2026-04-23 · Intel → merchant_gpu — click for source2026-01-21 · Advantest → ai_chips — click for source2025-05-29 · Marvell → custom_asic — click for source2026-04-23 · STMicroelectronics → imu — click for source2026-05-06 · Arm → ai_chips — click for source2025-10-09 · → Figure AI ai_chips — click for source2026-04-11 · → FANUC ai_chips — click for source2025-07-29 · Corning → advanced_packaging — click for source2024-11-20 · Infineon → ai_chips — click for source2025-02-18 · → MediaTek ai_chips — click for source2025-08-27 · → Siemens EDA ai_chips — click for source2024-03-18 · → Apptronik ai_chips — click for source2026-06-08 · Samsung Electronics → ai_chips — click for source2026-07-16 · → Kawasaki Heavy Industries ai_chips — click for source2026-07-16 · → Yaskawa Electric ai_chips — click for source2026-07-16 · Kawasaki Heavy Industries → industrial_arm — click for source2025-02-26 · → Hyundai Motor ai_chips — click for source2025-05-01 · Cadence Design → ai_chips — click for source2026-07-16 · → Kawasaki Heavy Industries ai_chips — click for source2025-03-18 · SK hynix → hbm — click for source2025-05-20 · Wonik Robotics → physical_ai — click for source2026-06-30 · → Tesla ai_chips — click for source2025-08-20 · Analog Devices → imu — click for source2026-06-01 · → Delta Electronics ai_chips — click for source2026-07-11 · MaxLinear → ai_compute — click for source2026-07-17 · → SoftBank ai_chips — click for source2026-07-16 · Yaskawa Electric → industrial_arm — click for source2023-08-01 · Vicor → ai_chips — click for source2025-08-28 · → Amazon ai_gpu — click for source2026-05-20 · Murata Manufacturing → imu — click for source2024-11-20 · Entegris → ai_chips — click for source events 2027-04-01 · capacity expansion — A 140-megawatt AI factory will be constructed around 27,500 Rubin chips on the site of a former Sharp factory in Sakai, Osaka Prefecture, with construction beginning in April 2027.2026-07-16 · partnership — Nvidia will offer technological support for Toyota's Woven City project and cooperate with Hitachi Ltd. to develop a system that integrates and controls entire factories and power plants.2026-07-16 · other — NVIDIA CEO Jensen Huang dined at a yakiton restaurant in Tokyo's Kanda district and met with executives from major Japanese materials companies to strengthen ties.2026-07-16 · product launch — CEO Jensen Huang declared that Vera Rubin AI accelerator system is already in production with giant amounts of production incoming.2026-07-16 · partnership — Nvidia and Fujitsu will consider businesses in various sectors such as factories, retail and logistics with Fanuc Corp., Yaskawa Electric Corp. and Kawasaki Heavy Industries Ltd.2026-07-16 · partnership — Nvidia partnered with Japanese companies including FANUC and Yaskawa Electric to advance the development of robotics and AI.2026-07-16 · partnership — Nvidia announced plans to expand collaboration with Japanese companies including Toyota Motor Corp., Fujitsu Ltd., and others on advanced AI and robotics implementation.2026-07-16 · supply deal — Nvidia will provide advanced graphics processing units to Noetra Corp., a new company established by Japanese firms to develop domestic artificial intelligence technology.2026-07-16 · financial — NVIDIA shares fell 3% in the session.2026-07-15 · product launch — Nvidia unveiled Jetson Thor T3000 and T2000 compute modules based on Jetson AGX Thor architecture for robotics and edge AI applications.2026-07-13 · financial — NVIDIA fell among Dow index components on July 13 amid broader semiconductor sector weakness.2026-07-07 · financial — NVIDIA continues to see unprecedented data center demand and serves as a highly liquid cash register for global technology funds during the market sell-off.2026-06-28 · executive change — NVIDIA appointed Nicholas Parker as Executive Vice President, Worldwide Field Operations, effective August 24, 2026, with an annual base salary of $1,000,000, sign-on bonus of $5,000,000, target variable compensation of $1,500,000, RSU equity grant of $35,000,000, and performance2026-06-26 · financial — NVIDIA shares were mentioned among major stocks tracked in cautious Canadian trading on June 26, 2026.2026-06-24 · other — NVIDIA announced it will hold its 2026 Annual Meeting of Stockholders online on Wednesday, June 24, at 9 a.m. PT.2026-06-23 · product launch — NVIDIA announced BioNeMo Agent Toolkit with tools for agents to accelerate scientific discovery.2026-06-23 · product launch — NVIDIA announced BioNeMo Agent Toolkit, a comprehensive suite of domain-specific tools and skills for agentic life sciences workflows spanning biology, chemistry, genomics and drug discovery.2026-06-22 · product launch — NVIDIA announced Halos for Robotics, the industry's first full-stack safety system for physical AI.2026-06-22 · product launch — NVIDIA announced Halos for Robotics, the industry's first full-stack safety system for physical AI, extending autonomous vehicle safety to robotics applications.2026-06-22 · capacity expansion — NVIDIA announced that a record 35 NVIDIA AI HPC supercomputers are in development across Europe, with 800 AI exaflops deployed or announced since last year.2026-06-22 · product launch — NVIDIA announced the Vera Rubin platform, a rack-scale supercomputer delivering 7 exaflops of AI for science and 5 petaflops of native FP64 performance.2026-06-22 · litigation — S.A. Jamendo sues Nvidia Corporation for copyright infringement.2026-06-10 · financial — NVIDIA was down 0.2 percent in US trading on June 10, 2026.2026-06-10 · financial — AI chip giant Nvidia dipped 3.73 percent in US trading on June 10, 2026.2026-06-09 · financial — NVIDIA gained 1.73 percent as AI chip giant benefited from sector confidence.2026-06-08 · partnership — Nvidia announced a long-term partnership with SK Group spanning joint development of chips and AI infrastructure expansion.2026-06-08 · partnership — NVIDIA and SK hynix entered into a multi-year technology partnership to advance next-generation memory technologies for artificial intelligence factories.2026-06-08 · product launch — Vera Rubin is now in full production and scheduled to begin deliveries in the third quarter of 2026.2026-06-07 · partnership — NVIDIA and SK Group announced plans to pursue joint research to codevelop next-generation AI factory architecture, extending their collaboration beyond infrastructure deployment.2026-06-07 · partnership — NVIDIA announced a partnership with NAVER to build AI factories on the NVIDIA DSX platform at gigawatt scale starting with 55 megawatts expansion at GAK Sejong data center in South Korea.2026-06-07 · partnership — NVIDIA and SK hynix announced a multiyear technology partnership to advance next-generation memory for AI factories and accelerate semiconductor design and manufacturing.2026-06-07 · partnership — NVIDIA and SK Telecom announced plans to build a gigawatt-scale AI Cloud in Korea using the NVIDIA DSX platform, with the first AI factory coming online in 2027.2026-06-06 · partnership — NVIDIA CEO Jensen Huang is visiting Korea to discuss cooperation with Korean business leaders in AI chips, high-bandwidth memory, data centers, autonomous driving and robotics.2026-06-06 · partnership — Nvidia CEO Jensen Huang is set to visit Korea to discuss collaboration with Korean partners in physical AI and robotics.2026-06-02 · partnership — Nvidia CEO Jensen Huang expressed interest in investing in Korea's robotics industry and planned to visit Korea.2026-06-02 · product launch — NVIDIA CEO Jensen Huang unveiled a new AI processor designed to run local agentic AI applications on personal computers.2026-06-01 · partnership — Nvidia CEO Jensen Huang is set to visit Korea to coordinate on physical AI collaboration with Korean partners including Samsung Electronics, SK hynix, Hyundai Motor Group, LG Group, and Doosan Group.2026-05-31 · product launch — NVIDIA Nemotron 3 Ultra, a 550-billion-parameter mixture-of-experts model, was unveiled delivering up to 5x faster inference and up to 30% lower cost compared with open frontier models.2026-05-31 · regulatory — The U.S. Department of Commerce in late May decided to take steps to halt NVIDIA's most advanced AI chip shipments to Chinese firms outside China.2026-05-31 · product launch — NVIDIA released a major collection of open source physical AI skills and tools spanning Omniverse, Cosmos, Alpamayo and Metropolis for robotics, autonomous vehicles, vision AI and industrial digital twins.2026-05-31 · partnership — NVIDIA announced deployment of NVIDIA-powered AI agents across Taiwan's leading medical centers in collaboration with Foxconn and Taiwan medical institutions.2026-05-31 · product launch — NVIDIA introduced new physical and agentic AI technologies including NemoClaw, NVIDIA Isaac for Healthcare, and Agent-Ready Rheo blueprint to scale Foxconn's healthcare ecosystem in Taiwan.2026-05-31 · product launch — NVIDIA announced new DOCA security innovations for NVIDIA Vera BlueField-4 STX, defining a new class of secure-by-design storage for agentic AI factories.2026-05-31 · product launch — NVIDIA announces DGX Station for Windows, the world's most powerful deskside AI supercomputer powered by the NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip, coming in Q4 2026.2026-05-31 · product launch — NVIDIA introduced AlpaGym, an open-source high-throughput closed-loop reinforcement learning framework for autonomous vehicle training.2026-05-31 · partnership — NVIDIA announced that TSMC is using NVIDIA accelerated computing and AI to advance semiconductor design and manufacturing across lithography, transistor simulation, process control, and wafer inspection.2026-05-31 · product launch — NVIDIA unveiled NVIDIA RTX Spark, a new superchip that reinvents Windows PCs for the era of personal AI agents.2026-05-31 · product launch — NVIDIA announced the NVIDIA DRIVE Hyperion robotaxi-ready platform, a level 4-ready platform combining NVIDIA DRIVE AGX in-vehicle compute, NVIDIA Halos OS, and NVIDIA DRIVE AV software for autonomous driving.2026-05-31 · product launch — NVIDIA unveiled Vera, a new CPU designed for AI agents with 1.8x faster task completion compared to x86 CPUs, now in full production.2026-05-31 · product launch — NVIDIA launched Alpamayo 2 Super, a 34-billion-parameter reasoning-based vision language action model for autonomous vehicle development.2026-05-31 · partnership — NVIDIA and Microsoft partnered to deliver a robust, secure Windows platform for on-device agents with new Windows security primitives and NVIDIA OpenShell runtime.2026-05-31 · product launch — NVIDIA announced OmniDreams, a generative world model for photorealistic closed-loop autonomous vehicle scenario generation.2026-05-31 · partnership — NVIDIA and Microsoft collaborate to develop DGX Station for Windows with NVIDIA OpenShell and Windows security primitives for autonomous agent deployment.2026-05-31 · product launch — NVIDIA announced the NVIDIA Isaac GR00T Reference Humanoid Robot, an open humanoid robot reference design built on NVIDIA Jetson Thor and the NVIDIA Isaac GR00T open development platform.2026-05-31 · product launch — NVIDIA announced new NVIDIA Agent Toolkit software including NemoClaw blueprints, Nemotron models, OpenShell secure runtime and CUDA-X libraries with agent skills.2026-05-31 · partnership — NVIDIA and Microsoft are collaborating to deliver a native Windows experience for personal agents with new security primitives and NVIDIA OpenShell.2026-05-31 · partnership — NVIDIA launched the NVIDIA Cosmos Coalition with leading AI labs and robotics leaders including Agile Robots, Black Forest Labs, Generalist, LTX, Runway and Skild AI.2026-05-31 · product launch — NVIDIA launched Cosmos 3, an open world foundation model for physical AI built on a mixture-of-transformers architecture.2026-05-20 · financial — We are announcing an $80 billion share repurchase authorization which is in addition to the $39 billion remaining on our current plan.2026-05-20 · capacity expansion — In Q1, we increased total supply inclusive of inventory purchase commitments on prepaids to $145 billion.2026-05-20 · financial — We generated record free cash flow of $49 billion, up from $35 billion in Q4.2026-05-20 · financial — Total revenue of $82 billion was up 85% year over year and 20% sequentially.2026-05-20 · financial — We are increasing our quarterly dividend from $0.01 to $0.25 per share.2026-05-20 · financial — Data center revenue of $75 billion was up 92% year over year and 21% sequentially.2026-05-20 · financial — We have visibility to nearly $20 billion in total CPU revenue this year.2026-05-20 · financial — NVIDIA posted non-GAAP EPS of $1.87 versus $1.77 expected, on revenue of $81.61B, up 85.2% year over year in Q1 FY2027.2026-05-20 · financial — Nvidia forecast second-quarter revenue above Wall Street expectations and announced an $80 billion share repurchase program.2026-05-20 · product launch — We are on track to commence production shipments of VeraRubin in the second half of this year starting in Q3.2026-05-20 · partnership — We have deepened our collaboration with Anthropic and are delighted to be a strategic partner to expand their compute capacity.2026-05-20 · financial — Total revenue is expected to be $91 billion, plus or minus 2% for Q2.2026-05-20 · partnership — Our partnership with Uber will power the robotaxi fleet across nearly 30 cities and 4 continents by 2028.2026-05-14 · other — NVIDIA CEO joined US President Donald Trump's business delegation to Beijing.2026-05-11 · litigation — MonolithIC 3D Inc. sues NVIDIA Corporation for patent infringement regarding 830 Patent.2026-03-30 · litigation — MonolithIC 3D Inc. sues Nvidia Corporation for patent infringement regarding 830 Patent.2026-03-26 · litigation — Beaulier sues NVIDIA Corporation for copyright infringement.2026-03-01 · partnership — Nvidia announced a strategic partnership with Nebius and agreed to invest $2 billion for approximately 8.3% ownership stake, providing AI processors for Nebius to deploy over 5 gigawatts of data center capacity by 2030.2026-03-01 · financial — Nvidia invested $2 billion in Marvell Technology in March 2026.2026-03-01 · partnership — Nvidia announced a strategic partnership with Marvell covering custom AI chips, NVLink Fusion-compatible networking, optical interconnects, and silicon photonics.2026-01-16 · financial — Nancy Pelosi exercised 50 call options of Nvidia on January 16, 2026 for 5,000 NVDA shares.2025-12-31 · financial — Nvidia's share of training market exceeded 90% in 2025, with inference share between 60% and 75%.2025-10-01 · partnership — Announced a strategic collaboration with Suzuki in October where we will integrate Fuzitsu's CPUs and NVIDIA Corporation GPUs via NVLink Fusion.2025-10-01 · financial — Nvidia's share of China's high-end AI chip market plummeted from 95% to virtually zero as of October 2025.2025-10-01 · supply deal — Nvidia announced plans to supply 260,000 graphics processing units to Korea during a previous visit by CEO Jensen Huang in October 2025.2025-09-18 · financial — Nvidia will invest $5 billion in Intel as part of a strategic partnership.2025-09-18 · partnership — Nvidia announced a $5 billion investment in Intel and partnership to develop chips based on Intel's x86 microprocessor standard.2025-09-01 · partnership — NVIDIA announced it would invest US$5 billion in Intel and use the company's CPUs in its own products.2025-06-30 · financial — NVIDIA has $4.3 billion invested in six artificial intelligence stocks as of June 30, 2025.2025-05-28 · financial — NVIDIA recognized $4.6 billion in H20 revenue in Q1 prior to April 9 export controls.2025-05-28 · partnership — NVIDIA announced a partnership with Yam Brands to bring NVIDIA Corporation AI to 500 of its restaurants this year, expanding to 61,000 restaurants over time.2025-05-28 · partnership — NVIDIA is partnering with Foxconn to construct a million-square-foot factory in Houston to build AI supercomputers.2025-05-28 · product launch — Sampling of GB300 systems began earlier this month at the major CSPs, and production shipments are expected to commence later this quarter.2025-05-28 · financial — NVIDIA recognized a $4.5 billion charge as it wrote down inventory and purchase obligations tied to H20 orders received prior to April 9.2025-04-09 · regulatory — On April 9, the US government issued new export controls on H20, NVIDIA's data center GPU designed specifically for the China market.2025-03-05 · product launch — GraniteShares announced 2x Long NVDA and 2x Short NVDA Daily ETFs tracking NVIDIA stock performance.2025-02-26 · product launch — Blackwell delivered $11 billion of revenue in Q4, the fastest product ramp in the company's history.2025-02-26 · capacity expansion — NVIDIA has 350 plants manufacturing the one and a half million components that go into each Blackwell rack.2025-02-26 · partnership — Cisco announced integrating Spectrum X into their networking portfolio to help enterprises build AI infrastructure.2025-02-26 · product launch — Blackwell Ultra is set to launch in the second half of this year.2024-12-24 · M&A — Nvidia announced a non-exclusive licensing agreement with Groq, with Groq's founder Jonathan Ross and top engineering staff joining Nvidia while Groq continues to operate independently.2024-08-28 · partnership — We announced a new NVIDIA AI foundry service to supercharge generative AI for the world's enterprises with Meta's Llama 3.1, collection of models.2024-08-28 · product launch — Our Ethernet for AI revenue, which includes our Spectrum-X end-to-end Ethernet platform, doubled sequentially with hundreds of customers adopting our Ethernet offerings.2024-08-28 · financial — Revenue of $30 billion was up 15% sequentially and up 122% year-on-year.2024-08-28 · product launch — We announced NIM agent Blueprints, a catalog of customizable reference applications that include a full suite of software for building and deploying enterprise generative AI applications.2024-08-28 · financial — Total revenue is expected to be $32.5 billion, plus or minus 2% for the third quarter.2024-08-28 · product launch — Blackwell production ramp is scheduled to begin in the fourth quarter and continue into fiscal year '26.2024-08-28 · partnership — Spectrum-X is being adopted by CSPs, GPU cloud providers, and enterprise, including X-AI to connect the largest GPU compute cluster in the world.2024-08-28 · financial — Data center revenue of $26.3 billion was a record, up 16% sequentially and up 154% year-on-year.2024-08-28 · product launch — NVIDIA H200 platform began ramping in Q2, shipping to large CSPs, consumer Internet, and enterprise company.2024-08-28 · financial — We expect our software, SaaS and support revenue to approach a $2 billion annual run rate exiting this year.2024-08-28 · financial — Our Board of Directors recently approved a $50 billion share repurchase authorization to add to our remaining $7.5 billion of authorization at the end of Q2.2024-08-28 · financial — We believe sovereign AI revenue will reach low-double-digit billions this year.2024-08-28 · capacity expansion — In Q4, we expect to ship several billion dollars in Blackwell revenue.2024-08-28 · partnership — Japan's National Institute of Advanced Industrial Science and Technology is building its AI bridging cloud infrastructure 3.0 supercomputer with NVIDIA.2024-07-01 · financial — NVIDIA's market capitalization exceeded $4 trillion in July.2024-06-18 · financial — NVIDIA stock received buying interest on the market.2024-03-01 · financial — NVIDIA CEO Jensen Huang made a $2 billion investment in Marvell Technology in March.2023-12-31 · product launch — NVIDIA's H800 chip was specially made for the Chinese market before the U.S. banned its exports in late 2023.2023-12-22 · partnership — Deepu Talla from Nvidia discusses generative AI's transformative impact on robotics simulation, design, and robot programming.2023-10-01 · financial — Nvidia took a $1bn stake in Nokia.2023-09-18 · other — NVIDIA executive John Spitzer is speaking at TechCrunch Disrupt 2023 about AI in movies and games.2023-09-18 · other — John Spitzer from NVIDIA is participating in an AI Stage session about AI in movies, games and creativity at TechCrunch Disrupt 2023.2022-10-04 · partnership — Leopard Imaging works closely with NVIDIA as an Elite Partner to develop embedded vision systems for robotics, edge AI, industrial machine vision, and autonomous machines applications.2022-09-20 · product launch — Leopard Imaging launched LI-XAVIER-BOX-GMSL2 powered by NVIDIA Jetson AGX Xavier edge AI platform for automation applications.2022-09-20 · product launch — Leopard Imaging launched LI-XAVIER-BOX-GMSL2 powered by NVIDIA Jetson AGX Xavier edge AI platform for robotics, edge AI, industrial machine vision, and autonomous machines applications.2022-09-13 · other — NVIDIA is mentioned among companies in the Mixed Signal System-on-Chip market competitive landscape.2022-03-22 · product launch — Nvidia will host GTC Keynote on March 22, 2022 where CEO Jensen Huang will showcase new products and technology.2022-03-01 · M&A — Nvidia acquired Excelero, a provider of high-performance software-defined storage, in March 2022.2022-02-16 · financial — Nvidia posted strong fourth-quarter earnings on Feb. 16 that beat analysts' expectations, with revenue rising 61% to $26.91 billion in fiscal 2022 and adjusted EPS jumping 78%.2022-01-31 · financial — In fiscal 2022, Nvidia's revenue rose 61% as its adjusted EPS increased 78%.2022-01-05 · product launch — NVIDIA's Jetson Edge AI and Isaac Robotics Platforms are being leveraged by Leopard Imaging for advanced imaging solutions.2022-01-01 · M&A — Nvidia acquired Bright Computing, a leader in software for managing high-performance computing, in early January 2022.2021-12-03 · litigation — The FTC filed a lawsuit against NVIDIA on December 3 to halt its $40 billion acquisition of Arm Holdings.2021-11-01 · partnership — NVIDIA announced support for Leopard Imaging's Hawk 3D Depth stereo camera on NVIDIA Isaac Robotics and Jetson platforms.2021-02-01 · product launch — NVIDIA launched its most affordable desktop GPU with ray tracing, the GeForce RTX 3060, delivering twice the raster performance and 10x the ray tracing performance compared to GeForce GTX 1060.2021-02-01 · product launch — NVIDIA launched the GeForce RTX 3060, an affordable desktop GPU with ray tracing capabilities offering twice the raster performance and 10x the ray tracing performance compared to GeForce GTX 1060.2021-02-01 · product launch — NVIDIA launched its most affordable desktop GPU with ray tracing, the GeForce RTX 3060, delivering twice the raster performance and 10x the ray tracing performance compared to GeForce GTX 1060.2021-01-31 · financial — Nvidia's revenue and adjusted EPS soared 53% and 73%, respectively, in fiscal 2021.2021-01-31 · financial — Nvidia's data center revenue surged 124% to $6.7 billion, or 40% of its top line, in fiscal 2021, with total revenue rising 53% to $16.7 billion.2020-09-01 · M&A — NVIDIA acquired Arm Holdings for $40 billion to create a premier computing company for artificial intelligence and expand innovation.2020-09-01 · M&A — Nvidia announced a blockbuster deal to acquire Arm Holdings for $40 billion in September 2020, with regulators currently reviewing the deal.2020-09-01 · M&A — NVIDIA acquired Arm Holdings for $40 billion, creating a premier computing company for artificial intelligence and combining NVIDIA's AI computing platform with Arm's ecosystem.2020-09-01 · M&A — Nvidia announced a blockbuster deal to acquire Arm Holdings for $40 billion in September 2020, with regulators currently reviewing the deal.2020-09-01 · M&A — NVIDIA acquired Arm Holdings for $40 billion to create a premier computing company for artificial intelligence and expand innovation by combining NVIDIA's AI computing platform with Arm's vast ecosystem.
  • 2027-04-01 capacity expansion A 140-megawatt AI factory will be constructed around 27,500 Rubin chips on the site of a former Sharp factory in Sakai, Osaka Prefecture, with construction beginning in April 2027.
  • 2026-07-17 reported edge → SoftBank ai_chips source ↗
  • 2026-07-16 partnership Nvidia will offer technological support for Toyota's Woven City project and cooperate with Hitachi Ltd. to develop a system that integrates and controls entire factories and power plants.
  • 2026-07-16 other NVIDIA CEO Jensen Huang dined at a yakiton restaurant in Tokyo's Kanda district and met with executives from major Japanese materials companies to strengthen ties.
  • 2026-07-16 product launch CEO Jensen Huang declared that Vera Rubin AI accelerator system is already in production with giant amounts of production incoming.
  • 2026-07-16 partnership Nvidia and Fujitsu will consider businesses in various sectors such as factories, retail and logistics with Fanuc Corp., Yaskawa Electric Corp. and Kawasaki Heavy Industries Ltd.
  • 2026-07-16 partnership Nvidia partnered with Japanese companies including FANUC and Yaskawa Electric to advance the development of robotics and AI.
  • 2026-07-16 partnership Nvidia announced plans to expand collaboration with Japanese companies including Toyota Motor Corp., Fujitsu Ltd., and others on advanced AI and robotics implementation.
  • 2026-07-16 supply deal Nvidia will provide advanced graphics processing units to Noetra Corp., a new company established by Japanese firms to develop domestic artificial intelligence technology.
  • 2026-07-16 financial NVIDIA shares fell 3% in the session.
  • 2026-07-16 reported edge FANUC → industrial_arm source ↗
  • 2026-07-16 reported edge → Kawasaki Heavy Industries ai_chips source ↗
  • 2026-07-16 reported edge → Yaskawa Electric ai_chips source ↗
  • 2026-07-16 reported edge Kawasaki Heavy Industries → industrial_arm source ↗
  • 2026-07-16 reported edge → Kawasaki Heavy Industries ai_chips source ↗
  • 2026-07-16 reported edge Yaskawa Electric → industrial_arm source ↗
  • 2026-07-15 product launch Nvidia unveiled Jetson Thor T3000 and T2000 compute modules based on Jetson AGX Thor architecture for robotics and edge AI applications.
  • 2026-07-13 financial NVIDIA fell among Dow index components on July 13 amid broader semiconductor sector weakness.
  • 2026-07-11 design-win Microchip → ai_compute source ↗
  • 2026-07-11 design-win MaxLinear → ai_compute source ↗
  • 2026-07-07 financial NVIDIA continues to see unprecedented data center demand and serves as a highly liquid cash register for global technology funds during the market sell-off.
  • 2026-07-01 design-win Zhongji InnoLight → optical_modules source ↗
  • 2026-06-30 design-win → Tesla ai_chips source ↗
  • 2026-06-28 executive change NVIDIA appointed Nicholas Parker as Executive Vice President, Worldwide Field Operations, effective August 24, 2026, with an annual base salary of $1,000,000, sign-on bonus of $5,000,000, target variable compensation of $1,500,000, RSU equity grant of $35,000,000, and performance
  • 2026-06-26 financial NVIDIA shares were mentioned among major stocks tracked in cautious Canadian trading on June 26, 2026.
  • 2026-06-24 other NVIDIA announced it will hold its 2026 Annual Meeting of Stockholders online on Wednesday, June 24, at 9 a.m. PT.
  • 2026-06-23 product launch NVIDIA announced BioNeMo Agent Toolkit with tools for agents to accelerate scientific discovery.
  • 2026-06-23 product launch NVIDIA announced BioNeMo Agent Toolkit, a comprehensive suite of domain-specific tools and skills for agentic life sciences workflows spanning biology, chemistry, genomics and drug discovery.
  • 2026-06-22 product launch NVIDIA announced Halos for Robotics, the industry's first full-stack safety system for physical AI.
  • 2026-06-22 product launch NVIDIA announced Halos for Robotics, the industry's first full-stack safety system for physical AI, extending autonomous vehicle safety to robotics applications.
  • 2026-06-22 capacity expansion NVIDIA announced that a record 35 NVIDIA AI HPC supercomputers are in development across Europe, with 800 AI exaflops deployed or announced since last year.
  • 2026-06-22 design-win NXP Semiconductors → compute source ↗
  • 2026-06-22 design-win → Agility Robotics ai_chips source ↗
  • 2026-06-22 design-win Texas Instruments → compute source ↗
  • 2026-06-08 reported edge LG Innotek → advanced_packaging source ↗
  • 2026-06-08 design-win Samsung Electronics → ai_chips source ↗
  • 2026-06-01 design-win → SK hynix ai_chips source ↗
  • 2026-06-01 design-win → Delta Electronics ai_chips source ↗
  • 2026-05-20 design-win Murata Manufacturing → imu source ↗
  • 2026-05-06 design-win Coherent → optical_modules source ↗

Patents — 2061 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 1899
Memory 34
Imaging / cameras 32
IMU / navigation 22
Lidar / ranging 21
Semiconductors 20
Power electronics 13
Other 11
Robotics / manipulators 4
Batteries 3
Force / torque sensors 2

IP chokepoint in: Computing

Newest 38 of 2061, most recent first — all on Google Patents →

  • 2026-07-09US20260192196IMAGE RENDERING WITH MULTIPLE VIEWS USING NEURAL NETWORK-BASED IMAGE GENERATION
  • 2026-07-09US20260194411NON-CONTACT LEAK DETECTION
  • 2026-07-09US20260194946RACK POWER ARCHITECTURE
  • 2026-07-09US20260194956DYNAMIC POWER OPTIMIZATION FOR HIGH-SPEED INTERCONNECTS USING MACHINE LEARNING
  • 2026-07-09US20260195131PREVENTING PERFORMANCE OF CONDITIONAL INSTRUCTIONS
  • 2026-07-09US20260195132OCCASIONALLY YIELDING CONTROL TO OTHER THREADS
  • 2026-07-09US20260195198PREVENTING INSTRUCTIONS FROM BEING PERFORMED
  • 2026-07-09US20260197003DYNAMIC LEVEL VOLTAGE SHIFTER CIRCUIT FOR INTEGRATED CIRCUITS
  • 2026-07-02US20260186546TIME-BASED POWER SOURCE SWITCHING TO SUPPORT HYBRID POWER BOOST FUNCTIONALITY
  • 2026-07-02US20260186865NATURAL LANGUAGE INTERFACE FOR INTERACTING WITH DISPARATE APPLICATION PROGRAMMING INTERFACE SYSTEMS AND APPLICATIONS
  • 2026-07-02US20260187127SCORING LONG INPUTS FOR LARGE MULTIMODAL MODELS
  • 2026-07-02US20260187328SHAPE OVERLAP DETECTION FOR GENERATIVE LAYOUT DESIGN
  • 2026-07-02US20260187330SIGNED DISTANCE FIELDS FOR GENERATIVE CIRCUIT LAYOUT DESIGN
  • 2026-07-02US20260187332SIGNED DISTANCE FIELDS FOR GENERATIVE CIRCUIT LAYOUT DESIGN
  • 2026-07-02US20260187363GENERATIVE AI-BASED MULTI-AGENT SYSTEM FOR OPERATIONS CENTER SYSTEMS AND APPLICATIONS
  • 2026-07-02US20260189770GENERATIVE AI-BASED MULTI-AGENT SYSTEM FOR VIDEO MANAGEMENT SYSTEMS AND APPLICATIONS
  • 2026-07-02US20260190099APPLICATION PROGRAMMING INTERFACE TO INDENTIFY FREQUENCY ALLOCATIONS
  • 2026-06-25US20260178513FAST AND SECURE MEMORY ADDRESS TRANSLATION IN A VIRTUAL MACHINE COMPUTING SYSTEM
  • 2026-06-25US20260178642ENHANCED AI-BASED AUDIO-VISUAL PROCESSING
  • 2026-06-25US20260179680READ PATH BIT-LINE PRECHARGE ARCHITECTURE FOR MULTI-VOLTAGE RAM
  • 2026-06-18US20260169514DIFFERENTIABLE SENSITIVITY-BASED SKEW SCHEDULING FRAMEWORK FOR TIMING OPTIMIZATION
  • 2026-06-18US20260169547HINT-BASED POWER CONSUMPTION STATE MANAGEMENT OF A COMMUNICATION INTERFACE
  • 2026-06-18US20260169817DYNAMICALLY ASSIGNING NEURAL NETWORKS TO DIFFERENT HARDWARE
  • 2026-06-18US20260169821REAL-TIME FORECASTING AND ADAPTIVE SCALING OF DISTRIBUTED WORKERS USING ARTIFICIAL INTELLIGENCE
  • 2026-06-18US20260169828INTELLIGENT RESOURCE AND THERMAL MANAGEMENT USING ARTIFICIAL INTELLIGENCE FOR PERFORMANCE OPTIMIZATION
  • 2026-06-18US20260169932GRAY CODING MECHANISM TO REDUCE METAL USAGE
  • 2026-06-18US20260170081ACCELERATING MATRIX MULTIPLICATION
  • 2026-06-18US20260170215LEARNING LIBRARY CELL REPRESENTATIONS IN VECTOR SPACE
  • 2026-06-18US20260170228MULTIMODAL MODEL POST TRAINING
  • 2026-06-18US20260170236ENSEMBLES OF EDITOR MODELS FOR CORRECTION OF LANGUAGE PROCESSING OUTPUTS
  • 2026-06-18US20260170269MULTIMODAL MODEL POST TRAINING
  • 2026-06-18US20260172139PSEUDO-RANDOM BIT SEQUENCE (PRBS) ERROR CORRECTION IN A NOISY CHANNEL
  • 2026-06-11US20260161402MEMORY ADDRESSING
  • 2026-06-11US20260161442EFFICIENT EXECUTION OF DEPENDENT TASKS
  • 2026-06-11US20260161481APPLICATION PROGRAMMING INTERFACE TO INDICATE PROCESSOR ACTIVITY
  • 2026-06-11US20260161732SYSTEM AND METHOD OF EMULATING DATA TYPES
  • 2026-06-11US20260162654MULTILINGUAL AUTOMATIC SPEECH RECOGNITION
  • 2026-06-11US20260163752FACILITATING EFFICIENT MANAGEMENT OF LIVE MEETINGS

Financials — multi-year, confidence 1.0 (filings)

revenue

$11.7B '19
$10.9B '20
$16.7B '21
$26.9B '22
$27.0B '23
$60.9B '24
$130.5B '25
$215.9B '26

operating income

$3.8B '19
$2.8B '20
$4.5B '21
$10.0B '22
$4.2B '23
$33.0B '24
$81.5B '25
$130.4B '26

net income

$4.1B '19
$2.8B '20
$4.3B '21
$9.8B '22
$4.4B '23
$29.8B '24
$72.9B '25
$120.1B '26

Sources: NVDA 10-K 2023-02-24 (acc 0001045810-23-000017) · NVDA 10-Q 2025-11-19 (acc 0001045810-25-000230) · NVIDIA Corporation Form 10-K (accession 0001045810-25-0000… · MonolithIC 3D Inc. v. NVIDIA Corporation — District Court,… · NVDA 10-Q 2023-11-21 (acc 0001045810-23-000227) · NVIDIA Corporation Form 10-K (accession 0001045810-22-0000… · NVDA 8-K 2026-07-02 (acc 0001045810-26-000060) · NVIDIA Corporation Form 10-K (accession 0001045810-23-0000… · NVIDIA Corporation Form 10-K (accession 0001045810-21-0000… · NVDA 10-Q 2023-05-26 (acc 0001045810-23-000093)

Buys from ← 39

🇯🇵 Shinko Electric Industries advanced_packaging → Data center GPUs / AI accelerators L3 50
🇹🇼 Taiwan Manufacturing foundry → Grace L3 50
🇰🇷 LG Innotek advanced_packaging L2
🇺🇸 Microchip ai_compute L2 50
🇳🇱 NXP Semiconductors compute → NVIDIA DRIVE L3 50
🇺🇸 Coherent optical_modules → Data center GPUs / AI accelerators L3 50
🇺🇸 Credo switch_silicon → Data center GPUs / AI accelerators L3 50
🇹🇼 Taiwan Manufacturing foundry → Grace L3 95
🇯🇵 FANUC industrial_arm L2
🇺🇸 Texas Instruments compute → NVIDIA DRIVE L3 50
🇺🇸 Astera Labs switch_silicon → NVIDIA B200 L3 50
🇨🇳 Zhongji InnoLight optical_modules → Data center GPUs / AI accelerators L3 50
🇨🇳 Eoptolink optical_modules → Data center GPUs / AI accelerators L3 50
🇺🇸 Astera Labs switch_silicon → NVIDIA B200 L3 50
Hon Hai Precision Industry AI supercomputers → Data center GPUs / AI accelerators L3 50
🇯🇵 Ibiden advanced_packaging → Blackwell Ultra platform L3 50
🇺🇸 Intel merchant_gpu → Data center GPUs / AI accelerators L3 50
🇯🇵 Advantest ai_chips → Data center GPUs / AI accelerators L3 50
🇺🇸 Marvell custom_asic → Data center GPUs / AI accelerators L3 50
🇨🇭 STMicroelectronics imu → Data center GPUs / AI accelerators L3 50
🇺🇸 Micron hbm → Data center GPUs / AI accelerators L3 50
🇬🇧 Arm ai_chips → Grace CPU L3 50
🇹🇼 Taiwan Manufacturing foundry → Grace L3 50
🇺🇸 Corning advanced_packaging → Data center GPUs / AI accelerators L3 50
🇰🇷 SK hynix hbm → Blackwell Ultra platform L3 50
🇩🇪 Infineon ai_chips → Grace L3 50
🇺🇸 Monolithic Power ai_chips → Blackwell Ultra platform L3 50
🇰🇷 Samsung Electronics ai_chips L2 50
🇯🇵 Kawasaki Heavy Industries industrial_arm L2
🇺🇸 Cadence Design ai_chips → Data center GPUs / AI accelerators L3 50
🇰🇷 SK hynix hbm → Blackwell Ultra platform L3 90
🇰🇷 Wonik Robotics physical_ai → Omniverse L3 50
🇺🇸 Analog Devices imu → Omniverse L3 50
🇺🇸 MaxLinear ai_compute L2 50
🇯🇵 Yaskawa Electric industrial_arm L2
🇺🇸 Vicor ai_chips → Data center GPUs / AI accelerators L3 50
🇹🇼 Unimicron advanced_packaging → Blackwell Ultra platform L3 50
🇯🇵 Murata Manufacturing imu L2 50
🇺🇸 Entegris ai_chips → Data center GPUs / AI accelerators L3 50

Supplies → 27

🇺🇸 Covariant ai_chips L2 50
🇺🇸 Figure AI ai_gpu → Figure 02 L3 70
🇺🇸 Agility Robotics ai_chips → Digit L3 50
🇨🇳 Galbot ai_chips L2 50
🇺🇸 Microsoft ai_gpu → Microsoft Azure L3 85
🇰🇷 SK hynix ai_chips L2 50
🇺🇸 Standard Bots ai_chips L2 50
Tata Sons ai_chips L2 50
🇮🇱 Mentee Robotics ai_chips L2 50
🇨🇳 Orbbec ai_chips → Femto Mega L3 50
🇺🇸 Skild AI ai_chips L2 50
🇺🇸 Hewlett Packard Enterprise ai_chips L2 50
🇺🇸 Figure AI ai_chips → Figure 02 L3 50
🇯🇵 FANUC ai_chips L2 50
🇳🇴 1X ai_chips → NEO L3 50
🇩🇪 Bosch Rexroth ai_chips L2 50
🇹🇼 MediaTek ai_chips L2 50
🇩🇪 Siemens EDA ai_chips L2 50
🇺🇸 Apptronik ai_chips → Apollo L3 50
🇯🇵 Kawasaki Heavy Industries ai_chips L2
🇯🇵 Yaskawa Electric ai_chips L2
🇰🇷 Hyundai Motor ai_chips L2 50
🇯🇵 Kawasaki Heavy Industries ai_chips L2
🇺🇸 Tesla ai_chips → Tesla Optimus L3 50
🇹🇼 Delta Electronics ai_chips L2 50
SoftBank ai_chips L2
🇺🇸 Amazon ai_gpu → Amazon EC2 L3 75

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Blackwell architectureDPUCUDAGrace CPUOmniverseDynamoNVIDIA DRIVENVIDIA AI EnterpriseDPU (Data Processing Unit)CosmosNVIDIA B200Tensor Core GPUClaraNemotronGraceNVIDIA NemotronBlackwell Ultra platformData center GPUs / AI accelerators

NXP SemiconductorspublicProduct-grade

physical ai · 🇳🇱 Netherlands · NASDAQ: NXPI · 46 sources · 12 products · 18 patents

$12.3Brevenue · FY2025 · USD$68.3B mkt cap

MCUs, motor control

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027202820292030 rev FY2020: $8.6BFY2021: $11.1BFY2022: $13.2BFY2023: $13.3BFY2024: $12.6BFY2025: $12.3B wins 2025-02-04 · SMIC → foundry — click for source2026-06-22 · → NVIDIA compute — click for source2025-11-12 · GlobalFoundries → foundry — click for source2026-02-12 · Arteris → ai_compute — click for source2025-07-22 · Taiwan Manufacturing → foundry — click for source events 2029-12-31 · capacity expansion — Phase 1 of the VSMC joint venture fab will support 130 nanometers to 40 nanometer mixed signal power management and analog products, with Phase 1 producing 55,000 wafers per month when fully operational in 2029.2026-07-16 · financial — NXP Semiconductors shares fell 3.6% in afternoon trading session.2026-01-01 · M&A — STMicroelectronics announced the closure of NXP's MEMS sensor business acquisition, with NXP receiving $900 million in gross proceeds and recognizing a onetime gain of approximately $630 million.2025-06-30 · partnership — NXP has equity accounted foundry joint ventures under construction with VSMC and ESMC, paying $50 million into VSMC and $16 million into ESMC in Q2 2025.2025-06-30 · M&A — NXP closed the acquisition of TTTech Auto in the second quarter of 2025.2025-06-30 · supply deal — NXP paid $35 million towards capacity access fees related to TSMC in Q2 2025.2025-02-10 · M&A — NXP announced the intention to acquire Kinara for $307 million, an industry leader in high-performance, energy efficient, and programmable neural processes.2025-01-01 · M&A — NXP announced intention to acquire TT Tech Auto, a division of TT Tech, a privately held software company based in Austria, for $625 million.2024-12-15 · M&A — NXP announced intention to acquire Aviva Links for $243 million, a Silicon Valley startup focused on multi-gigabit automotive connectivity technology based on ASA-MLE standard.2024-08-29 · financial — NXP Board authorized an increase of buyback capacity to purchase an additional $2 billion with total balance of $2.64 billion at end of Q3.2024-06-05 · partnership — NXP formed a 60-40 manufacturing joint venture with Vanguard International Semiconductor to build a 300 millimeter fab in Singapore.2023-08-01 · partnership — NXP's participation in the TSMC-led joint venture in Europe was announced in August 2023.2022-03-09 · other — NXP Semiconductors is listed as a key market player in the global eSIM market.
  • 2029-12-31 capacity expansion Phase 1 of the VSMC joint venture fab will support 130 nanometers to 40 nanometer mixed signal power management and analog products, with Phase 1 producing 55,000 wafers per month when fully operational in 2029.
  • 2026-07-16 financial NXP Semiconductors shares fell 3.6% in afternoon trading session.
  • 2026-06-22 design-win → NVIDIA compute source ↗
  • 2026-02-12 design-win Arteris → ai_compute source ↗
  • 2026-01-01 M&A STMicroelectronics announced the closure of NXP's MEMS sensor business acquisition, with NXP receiving $900 million in gross proceeds and recognizing a onetime gain of approximately $630 million.
  • 2025-11-12 design-win GlobalFoundries → foundry source ↗
  • 2025-07-22 design-win Taiwan Manufacturing → foundry source ↗
  • 2025-06-30 partnership NXP has equity accounted foundry joint ventures under construction with VSMC and ESMC, paying $50 million into VSMC and $16 million into ESMC in Q2 2025.
  • 2025-06-30 M&A NXP closed the acquisition of TTTech Auto in the second quarter of 2025.
  • 2025-06-30 supply deal NXP paid $35 million towards capacity access fees related to TSMC in Q2 2025.
  • 2025-02-10 M&A NXP announced the intention to acquire Kinara for $307 million, an industry leader in high-performance, energy efficient, and programmable neural processes.
  • 2025-02-04 design-win SMIC → foundry source ↗
  • 2025-01-01 M&A NXP announced intention to acquire TT Tech Auto, a division of TT Tech, a privately held software company based in Austria, for $625 million.
  • 2024-12-15 M&A NXP announced intention to acquire Aviva Links for $243 million, a Silicon Valley startup focused on multi-gigabit automotive connectivity technology based on ASA-MLE standard.
  • 2024-08-29 financial NXP Board authorized an increase of buyback capacity to purchase an additional $2 billion with total balance of $2.64 billion at end of Q3.
  • 2024-06-05 partnership NXP formed a 60-40 manufacturing joint venture with Vanguard International Semiconductor to build a 300 millimeter fab in Singapore.
  • 2023-08-01 partnership NXP's participation in the TSMC-led joint venture in Europe was announced in August 2023.
  • 2022-03-09 other NXP Semiconductors is listed as a key market player in the global eSIM market.

Patents — 18 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 18

Financials — multi-year, confidence 1.0 (filings)

revenue

$8.6B '20
$11.1B '21
$13.2B '22
$13.3B '23
$12.6B '24
$12.3B '25

operating income

$418M '20
$2.6B '21
$3.8B '22
$3.7B '23
$3.4B '24
$3.0B '25

net income

$52M '20
$1.9B '21
$2.8B '22
$2.8B '23
$2.5B '24
$2.0B '25

Sources: NXPI 10-Q 2023-07-25 (acc 0001413447-23-000059) · NXPI 10-Q 2025-07-24 (acc 0001413447-25-000106) · NXPI 10-Q 2025-04-29 (acc 0001413447-25-000031) · NXPI 10-Q 2024-04-30 (acc 0001413447-24-000038) · NXPI 10-Q 2025-10-28 (acc 0001413447-25-000120) · NXPI 10-K 2023-03-01 (acc 0001413447-23-000006) · NXPI 10-Q 2026-04-28 (acc 0001413447-26-000034) · NXPI 10-K 2025-02-20 (acc 0001413447-25-000019) · NXPI 10-Q 2023-11-07 (acc 0001413447-23-000107) · NXPI 10-Q 2024-07-23 (acc 0001413447-24-000072)

Buys from ← 4

🇨🇳 SMIC foundry L2 50
🇺🇸 GlobalFoundries foundry L2 50
🇺🇸 Arteris ai_compute → Neural Processing Units (NPUs) L3 50
🇹🇼 Taiwan Manufacturing foundry L2 50

Supplies → 1

🇺🇸 NVIDIA compute → NVIDIA DRIVE L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

NPU (Neural Processing Units)Radar SystemsIn-vehicle Networking (IVN)Automotive SerDes Alliance (ASA) compliant in-vehicle connectivity solutionsASA (Automotive SerDes Alliance) in-vehicle connectivity solutionsS32 MCUNeural Processing Units (NPUs)RF Power AmplifiersDiscrete Neural Processing Units (NPUs)Secure Car Access ProcessorsIn-vehicle Infotainment (IVI)Automotive SerDes Alliance (ASA) compliant in-vehicle connectivity

OmniVisionpublicRelationships + financials

physical ai · 🇨🇳 China · SSE: 603501 · 10 sources · 8 products · 57 patents

$4.0Brevenue · FY2025 · USD$18.5B mkt cap

CMOS image sensors

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $2.9BFY2021: $3.7BFY2022: $3.0BFY2023: $3.1BFY2024: $3.8BFY2025: $4.0B wins events

Patents — 57 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 50
Imaging / cameras 6
Power electronics 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.5B '18
$2.0B '19
$2.9B '20
$3.7B '21
$3.0B '22
$3.1B '23
$3.8B '24
$4.0B '25

operating income

$34M '18
$114M '19
$436M '20
$739M '21
$192M '22
$99M '23
$484M '24
$681M '25

net income

$22M '18
$67M '19
$400M '20
$662M '21
$146M '22
$82M '23
$491M '24
$597M '25

Buys from ← 5

🇹🇭 Alphatec Packaging ai_compute L2 50
🇰🇷 Samsung Electronics ai_chips L2 50
🇯🇵 Toppan Printing ai_compute L2 50
🇹🇼 Taiwan Manufacturing foundry L2 50
🇹🇼 Powerchip foundry L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

OV13 SeriesOV16 SeriesOV48 SeriesOV8 SeriesOV12 SeriesOV5 SeriesOvisionProOV64 Series

Omron (Adept)publicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6645 · 5 sources · 0 products · 2 patents

$4.7Brevenue · FY2026 · USD$6.4B mkt cap

Industrial robots, AMRs

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $4.0BFY2022: $4.7BFY2023: $5.4BFY2024: $5.1BFY2025: $4.9BFY2026: $4.7B wins events

Patents — 2 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$4.0B '21
$4.7B '22
$5.4B '23
$5.1B '24
$4.9B '25
$4.7B '26

operating income

$385M '21
$550M '22
$620M '23
$212M '24
$333M '25
$370M '26

net income

$267M '21
$378M '22
$455M '23
$50M '24
$100M '25
$175M '26

Buys from ← 1

🇨🇳 Dobot industrial_arm L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

OrbbecpublicProduct-grade

physical ai · 🇨🇳 China · STAR: 688322 · 1 sources · 8 products · 151 patents

$139Mrevenue · FY2025 · USD

3D depth cameras

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $38MFY2021: $70MFY2022: $52MFY2023: $53MFY2024: $83MFY2025: $139M wins events

Patents — 151 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 78
Imaging / cameras 47
Other 13
IMU / navigation 8
Robotics / manipulators 3
Computing 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$38M '20
$70M '21
$52M '22
$53M '23
$83M '24
$139M '25

operating income

$-99M '20
$-56M '21
$-53M '22
$-39M '23
$-9M '24
$18M '25

net income

$-91M '20
$-46M '21
$-43M '22
$-41M '23
$-9M '24
$19M '25

Buys from ← 3

🇺🇸 NVIDIA ai_chips → Femto Mega L3 50
🇺🇸 Microsoft ai_compute L2 50
🇹🇼 Taiwan Manufacturing foundry L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

DaBaiFemto MegaAstraAstra ProPerseeGeminiAstra StereoFemto

Panasonic CorporationpublicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6752 · 6 sources · 0 products · 1518 patents

$49.7Brevenue · FY2026 · USD$57.5B mkt cap

Panasonic Corporation is a Japanese electronics and industrial conglomerate producing batteries, consumer electronics, and automotive and industrial components; founded in 1918 as Matsushita Electric Industrial and now operating under holding company Panasonic Holdings.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $41.2BFY2022: $45.6BFY2023: $51.6BFY2024: $52.3BFY2025: $52.1BFY2026: $49.7B wins 2025-07-03 · Midea → oem — click for source2024-01-12 · Ningbo Yunsheng → rare_earth_magnets — click for source2025-02-05 · Qualcomm → compute — click for source2026-07-12 · → Tesla physical_ai — click for source events 2025-04-01 · financial report — Panasonic Holdings reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Rolled up across Panasonic + its subsidiaries

  • 2026-07-12 design-win → Tesla physical_ai source ↗
  • 2025-07-03 design-win Midea → oem source ↗
  • 2025-04-01 financial report Panasonic Energy Panasonic Holdings reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2025-02-05 design-win Qualcomm → compute source ↗
  • 2024-01-12 design-win Ningbo Yunsheng → rare_earth_magnets source ↗

Patents — 1518 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 1044
Imaging / cameras 192
Lidar / ranging 79
Electric motors 49
Robotics / manipulators 47
IMU / navigation 34
Power electronics 31
Computing 18
Bearings 11
Gears / reducers 7
Force / torque sensors 6

Financials — multi-year, confidence 1.0 (filings)

revenue

$41.2B '21
$45.6B '22
$51.6B '23
$52.3B '24
$52.1B '25
$49.7B '26

operating income

$3.5B '21
$2.2B '22
$1.8B '23
$2.2B '24
$5.5B '25
$2.8B '26

net income

$1.0B '21
$1.6B '22
$1.6B '23
$2.7B '24
$2.3B '25
$1.2B '26

Buys from ← 2

🇨🇳 Midea oem L2 50
🇨🇳 Ningbo Yunsheng rare_earth_magnets L2 50

Supplies → 1

🇺🇸 Tesla physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Panasonic EnergypublicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6752 · 19 sources · 4 products · 1117 patents

Subsidiary of Panasonic Corporation

$49.6Brevenue · FY2026 · USD$57.5B mkt cap

Li-ion cells

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $41.3BFY2022: $45.5BFY2023: $51.6BFY2024: $52.3BFY2025: $55.5BFY2026: $53.5B wins 2025-02-05 · Qualcomm → compute — click for source events 2025-04-01 · financial report — Panasonic Holdings reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2025-04-01 financial report Panasonic Holdings reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2025-02-05 design-win Qualcomm → compute source ↗

Patents — 1117 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 1059
Other 50
Power electronics 7
Computing 1

Buys from ← 1

🇺🇸 Qualcomm compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

UR18650PFNCR18650GANCR18650B

POSCO Future MpublicProduct-grade

physical ai · 🇰🇷 South Korea · 2 sources · 0 products · 536 patents

$2.0Brevenue · FY2025 · USD$14.05T mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.1BFY2021: $1.3BFY2022: $2.2BFY2023: $3.2BFY2024: $2.5BFY2025: $2.0B wins events

Patents — 536 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 530
Gears / reducers 3
Force / torque sensors 2
Imaging / cameras 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.1B '20
$1.3B '21
$2.2B '22
$3.2B '23
$2.5B '24
$2.0B '25

operating income

$41M '20
$81M '21
$110M '22
$24M '23
$1M '24
$14M '25

net income

$20M '20
$90M '21
$78M '22
$19M '23
$-142M '24
$22M '25

Supplies → 1

🇰🇷 Samsung SDI physical_ai → NCA (Nickel Cobalt Aluminum) Cells L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

PowerchippublicRelationships + financials

ai compute · 🇹🇼 Taiwan · TWSE: 6770 · 4 sources · 0 products · 52 patents

$1.5Brevenue · FY2025 · USD$9.1B mkt cap

Foundry, DRAM

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $1.4BFY2021: $2.0BFY2022: $2.4BFY2023: $1.4BFY2024: $1.4BFY2025: $1.5B wins 2024-09-26 · → Tata Electronics foundry — click for source events 2026-06-30 · financial — Powerchip Semiconductor Manufacturing completed a global depositary share offering in June.
  • 2026-06-30 financial Powerchip Semiconductor Manufacturing completed a global depositary share offering in June.
  • 2024-09-26 design-win → Tata Electronics foundry source ↗

Patents — 52 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 28
Memory 12
Semiconductors 12

Newest 3 of 52, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$254M '18
$1.2B '19
$1.4B '20
$2.0B '21
$2.4B '22
$1.4B '23
$1.4B '24
$1.5B '25

operating income

$36M '18
$-68M '19
$170M '20
$715M '21
$860M '22
$-97M '23
$-248M '24
$-298M '25

net income

$32M '18
$-86M '19
$117M '20
$496M '21
$672M '22
$-51M '23
$-211M '24
$-243M '25

Supplies → 2

🇨🇳 OmniVision foundry L2 50
🇮🇳 Tata Electronics foundry L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Powertech TechnologypublicProduct-grade

ai compute · 🇹🇼 Taiwan · TWSE: 6239 · 1 sources · 0 products · 234 patents

$2.4Brevenue · FY2025 · USD$6.6B mkt cap

Memory + logic packaging/test

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $2.4BFY2021: $2.6BFY2022: $2.8BFY2023: $2.2BFY2024: $2.3BFY2025: $2.4B wins events

Patents — 234 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 181
Other 50
Robotics / manipulators 2
Memory 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.3B '18
$2.2B '19
$2.4B '20
$2.6B '21
$2.8B '22
$2.2B '23
$2.3B '24
$2.4B '25

operating income

$326M '18
$304M '19
$360M '20
$455M '21
$487M '22
$251M '23
$292M '24
$251M '25

net income

$208M '18
$189M '19
$207M '20
$276M '21
$292M '22
$249M '23
$209M '24
$172M '25

Supplies → 2

🇰🇷 SK hynix osat → HBM (High Bandwidth Memory) L3 50
🇰🇷 Samsung Electronics osat → HBM (High Bandwidth Memory) L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Primarius TechnologiespublicRelationships + financials

ai compute · 🇨🇳 China · STAR: 688206 · 1 sources · 0 products · 15 patents

$71Mrevenue · FY2025 · USD

EDA (device modeling)

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $20MFY2021: $29MFY2022: $41MFY2023: $49MFY2024: $62MFY2025: $71M wins events

Patents — 15 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 12
Other 3

Newest 12 of 15, most recent first — all on Google Patents →

  • 2025-07-03WO2025139749CIRCUIT SIMULATION VERIFICATION METHOD AND APPARATUS, AND ELECTRONIC DEVICE AND STORAGE MEDIUM
  • 2025-07-03WO2025139758VOLTAGE CONVERSION METHOD AND APPARATUS IN ANALOG CIRCUIT, ELECTRONIC DEVICE AND STORAGE MEDIUM
  • 2025-07-03WO2025139827CONTAINER DEVICE AND SYSTEM FOR CONTAINERIZED APPLICATION MANAGEMENT, AND RELATED PRODUCT
  • 2025-06-26WO2025130756CIRCUIT MODEL SIMULATION METHOD AND DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM
  • 2025-06-19WO2025124166DEEP LEARNING-BASED MODEL SIMULATION PREDICTION METHOD AND SYSTEM
  • 2025-06-05WO2025113620AUTOMATIC MODEL PARAMETER SELECTION METHOD AND SYSTEM BASED ON HIDDEN MARKOV
  • 2024-05-23WO2024103551TRANSIENT SIMULATION WAVEFORM STORAGE METHOD AND SYSTEM, AND DEVICE AND READABLE MEDIUM
  • 2024-03-28WO2024060452METHOD AND SYSTEM FOR AUTOMATICALLY EXTRACTING SIGNAL PATH, AND DEVICE AND STORAGE MEDIUM
  • 2024-03-28WO2024060453MODEL PARAMETER EXTRACTION METHOD OF INTEGRATED CIRCUIT DEVICE, DEVICE AND STORAGE MEDIUM
  • 2024-03-28WO2024060454PARAMETER CALCULATION ASSISTANCE METHOD AND SYSTEM, DEVICE, AND STORAGE MEDIUM
  • 2023-11-09WO2023213094DYNAMIC DATA AREA SELECTION METHOD, SYSTEM AND DEVICE APPLIED TO INTEGRATED CIRCUIT DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM
  • 2023-11-02WO2023207184DATA SELECTION METHOD, SYSTEM AND APPARATUS FOR EXTRACTING DEVICE MODEL PARAMETERS OF INTEGRATED CIRCUIT

Financials — multi-year, confidence 1.0 (filings)

revenue

$20M '20
$29M '21
$41M '22
$49M '23
$62M '24
$71M '25

operating income

$4M '20
$4M '21
$7M '22
$-9M '23
$-15M '24
$6M '25

net income

$4M '20
$4M '21
$7M '22
$-8M '23
$-14M '24
$5M '25

Supplies → 1

🇰🇷 Samsung Electronics ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

ProterialpublicProduct-grade

physical ai · 🇯🇵 Japan · 7 sources · 10 products · 448 patents

$5.8Brevenue · FY2022 · USD

NdFeB magnets, specialty materials

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $5.4BFY2021: $4.7BFY2022: $5.8B wins 2026-07-17 · → Yaskawa Electric rare_earth_magnets — click for source2026-07-17 · → Nidec rare_earth_magnets — click for source events 2026-06-23 · capacity expansion — Proterial India approved for rare earth magnet manufacturing unit with combined investment of Rs 3,500 crore.2026-06-18 · capacity expansion — Proterial India received approval for a ₹2,250 crore advanced materials investment project in Andhra Pradesh.2026-06-17 · capacity expansion — Proterial will invest ₹2,250 crore to establish a rare earth permanent magnet manufacturing facility in Andhra Pradesh producing 1.2 ktpa of NdFeB magnets.2026-06-16 · capacity expansion — Proterial will set up a rare earth permanent magnet manufacturing facility in Andhra Pradesh, India with an investment of ₹2,250 crore to produce 1.2 kilo tonnes per annum of sintered neodymium-iron-boron magnets.2026-06-16 · capacity expansion — Proterial is investing ₹2,250 crore to establish a rare earth permanent magnet manufacturing facility in Andhra Pradesh with capacity of 1.2 kilotonnes per annum of sintered neodymium-iron-boron magnets.
  • 2026-07-17 reported edge → Yaskawa Electric rare_earth_magnets source ↗
  • 2026-07-17 reported edge → Nidec rare_earth_magnets source ↗
  • 2026-06-23 capacity expansion Proterial India approved for rare earth magnet manufacturing unit with combined investment of Rs 3,500 crore.
  • 2026-06-18 capacity expansion Proterial India received approval for a ₹2,250 crore advanced materials investment project in Andhra Pradesh.
  • 2026-06-17 capacity expansion Proterial will invest ₹2,250 crore to establish a rare earth permanent magnet manufacturing facility in Andhra Pradesh producing 1.2 ktpa of NdFeB magnets.
  • 2026-06-16 capacity expansion Proterial will set up a rare earth permanent magnet manufacturing facility in Andhra Pradesh, India with an investment of ₹2,250 crore to produce 1.2 kilo tonnes per annum of sintered neodymium-iron-boron magnets.
  • 2026-06-16 capacity expansion Proterial is investing ₹2,250 crore to establish a rare earth permanent magnet manufacturing facility in Andhra Pradesh with capacity of 1.2 kilotonnes per annum of sintered neodymium-iron-boron magnets.

Patents — 448 CPC-scoped to physical ai (physical-AI-relevant classes)

Electric motors 149
Batteries 146
Force / torque sensors 84
Other 22
Bearings 18
Robotics / manipulators 15
Power electronics 10
Imaging / cameras 3
IMU / navigation 1

Newest 10 of 448, most recent first — all on Google Patents →

  • 2025-12-18WO2025258617METHOD FOR MANUFACTURING MAGNETIC WEDGE
  • 2025-12-11WO2025253907POLAR ANISOTROPIC MAGNET, METHOD FOR MANUFACTURING SAME, AND PERMANENT MAGNET SYNCHRONOUS MOTOR COMPRISING SAID POLAR ANISOTROPIC MAGNET
  • 2025-01-23US2025030294ROTATING ELECTRICAL MACHINE WIRING COMPONENT, ROTATING ELECTRICAL MACHINE WIRING COMPONENT-CONNECTION STRUCTURE, AND ROTATING ELECTRICAL MACHINE ASSEMBLY MANUFACTURING METHOD
  • 2025-01-23US2025030295Rotating electrical machine wiring component and rotating electrical machine wiring component manufacturing method
  • 2024-02-15WO2024034009METHOD FOR MANUFACTURING MAGNETIC WEDGE, MAGNETIC WEDGE, STATOR FOR ROTATING ELECTRIC MACHINE, AND ROTATING ELECTRIC MACHINE
  • 2023-09-14WO2023171103ROTARY ELECTRIC MACHINE
  • 2023-07-27WO2023140179THREE-PHASE COIL STRUCTURE AND LINEAR MOTOR
  • 2023-07-27WO2023140303LAMINATED MAGNETIC MEMBER AND METHOD FOR MANUFACTURING LAMINATED MAGNETIC MEMBER
  • 2023-06-22WO2023112829SINGLE-PHASE ROTARY ELECTRIC MACHINE, AND VACUUM CLEANER, ELECTRIC AIRCRAFT, AND ELECTRIC MACHINE TO WHICH SINGLE-PHASE ROTARY ELECTRIC MACHINE IS APPLIED
  • 2023-04-13WO2023058736MAGNETIC WEDGE, DYNAMO-ELECTRIC MACHINE, AND METHOD FOR MANUFACTURING MAGNETIC WEDGE

Financials — multi-year, confidence 1.0 (filings)

revenue

$5.4B '20
$4.7B '21
$5.8B '22

operating income

$-241M '20
$-303M '21
$164M '22

net income

$-232M '20
$-260M '21
$74M '22

Supplies → 2

🇯🇵 Yaskawa Electric rare_earth_magnets L2
🇯🇵 Nidec rare_earth_magnets → Precision & servo motors L3

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Ferrite MagnetsRare Earth MagnetsSoft Magnetic MaterialsHard Disk Drive (HDD) ComponentsSamarium Cobalt (SmCo) MagnetsNeodymium (NdFeB) MagnetsMagnetic AlloysMagnetic Materials for MotorsMotor MagnetsFerrite Magnets

QualcommpublicProduct-grade

physical ai · 🇺🇸 United States · NASDAQ: QCOM · 163 sources · 7 products · 2112 patents

$44.3Brevenue · FY2025 · USD$179.8B mkt cap

Qualcomm is a US semiconductor and wireless technology company, founded in 1985, known for Snapdragon system-on-chip platforms used in smartphones, PCs (Snapdragon X Elite/Plus), and robotics (Snapdragon RB3 Gen 2).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $23.5BFY2021: $33.6BFY2022: $44.2BFY2023: $35.8BFY2024: $39.0BFY2025: $44.3B wins 2025-02-05 · → Amazon compute — click for source2026-04-29 · → Figure AI compute — click for source2025-11-12 · GlobalFoundries → foundry — click for source2026-04-29 · → Samsung Electronics compute — click for source2024-10-31 · → STMicroelectronics compute — click for source2025-02-05 · → Panasonic Energy compute — click for source2026-06-23 · Samsung Electro-Mechanics → advanced_packaging — click for source2026-07-07 · Applied Materials → ai_chips — click for source events 2026-07-20 · product launch — Motorola Edge 70 Max smartphone launched with Snapdragon 8 Gen 5 chipset.2026-07-07 · partnership — Qualcomm Technologies partnered with Applied Materials on the SENZ integrated ambient visual platform for AI-powered smart glasses.2026-06-30 · M&A — Qualcomm's reported $8 billion to $10 billion acquisition deal with Tenstorrent is not currently in talks, according to Tenstorrent CEO Jim Keller.2026-06-25 · M&A — Qualcomm announced an all-stock acquisition of Modular for approximately $3.9 billion.2026-06-24 · M&A — Qualcomm is set to acquire AI startup Modular in an all-stock deal worth nearly $4 billion.2026-06-24 · M&A — Qualcomm agreed to buy AI startup Modular in an all-stock deal valued at nearly $4 billion.2026-06-24 · M&A — Qualcomm agreed to buy AI startup Modular in an all-stock deal valued at nearly $4 billion.2026-06-17 · product launch — Qualcomm Technologies Inc. launched the Snapdragon Scalable Turnkey AI-Ready Toolkit (START) to support brands in bringing their own personal AI devices to market, beginning with smart glasses.2026-06-15 · M&A — Qualcomm is in talks for the acquisition of AI chip design startup Tenstorrent for a transaction valued at $8 billion to $10 billion.2026-06-05 · litigation — Redstone Logics LLC sues Qualcomm Inc. for patent infringement regarding 830 Patent.2025-09-01 · product launch — Qualcomm unveiled Snapdragon X2 Elite and X2 Elite Extreme platforms for premium laptops.2025-09-01 · partnership — Qualcomm and Google announced expanded partnership including integration of Google Gemini models to Snapdragon Digital Chassis solutions.2025-09-01 · product launch — Qualcomm introduced Snapdragon 8 Elite Gen 5 mobile platform for next-generation flagship AI smartphones equipped with third-generation Oryon CPU.2025-04-23 · partnership — Qualcomm announced new collaborations with Visteon and PATEO to create next generation AI intelligent cockpit solutions based on Snapdragon Cockpit Elite.2025-04-23 · partnership — Qualcomm is collaborating with Disa SV to jointly deliver a suite of pre integrated ADAS solutions that support L1 and L2 plus functions.2025-03-05 · product launch — GraniteShares announced a 2x Short QCOM Daily ETF tracking Qualcomm stock performance.2025-02-24 · product launch — Qualcomm announced its X85 5G platform, the world's most advanced AI powered modem 2 antenna system delivering substantial improvements in speed, efficiency, coverage and power consumption.2025-02-05 · partnership — Qualcomm announced new collaborations with Alps Alpine, Amazon, Google, Leapmotor, Mahindra, and Hyundai Mobis, which will use Snapdragon digital chassis solutions.2025-02-05 · product launch — Qualcomm announced its newest compute platform, the Snapdragon X, specifically designed to address PCs in the $600 price range.2025-02-05 · supply deal — Qualcomm recently signed Transsion to a long-term 4G license to go along with the 5G license signed in the last fiscal year.2025-02-05 · partnership — Qualcomm expanded partnerships with Panasonic Automotive Systems, Garmin, and Desay SV to utilize the Snapdragon Cockpit Elite platform.2025-02-05 · partnership — Microsoft announced it is bringing NPU optimized versions of DeepSeek-R1 directly to Copilot+ PCs beginning with the Qualcomm Snapdragon X series.2025-02-05 · financial — Qualcomm delivered record revenues of $11.7 billion and non-GAAP earnings per share of $3.41 in fiscal Q1.2025-02-05 · partnership — The first device available for purchase later this year will be built by Samsung and powered by the Snapdragon XR platform, announced by Google for Android XR.2025-02-05 · partnership — Samsung Galaxy S25 series of smartphones will be powered by the Snapdragon 8 Elite for Galaxy globally.2025-02-05 · partnership — Qualcomm's new collaboration with Hyundai Mobis will combine the Snapdragon Ride Flex system on chip and the Snapdragon Ride automated driving stack with Hyundai Mobis cutting edge software and sensors.2025-02-05 · regulatory — ARM recently notified Qualcomm that it was withdrawing its October 22nd, 2024 notice of breach and indicated that it has no current plan to terminate the Qualcomm Architecture License Agreement.2025-02-05 · partnership — Qualcomm's first wave partners for new AI on-prem appliance and inference suite platforms include Honeywell and IBM.2024-12-01 · litigation — The jury's verdict vindicated Qualcomm's CPU innovations and affirmed that Qualcomm's contract with Arm provides a license for Qualcomm's products containing proprietary Oryon CPUs in industries such as smartphones, automotive, next generation PCs, IoT, and data center.2024-06-18 · product launch — Copilot+ PCs powered exclusively by Snapdragon X Series platforms became available for purchase on June 18.2024-05-07 · regulatory — Our license to export products to Huawei, which was set to expire in late calendar '24 was revoked on May 7.2022-09-13 · other — Qualcomm is mentioned among companies in the Mixed Signal System-on-Chip market competitive landscape.2022-05-12 · product launch — Qualcomm announced the Robotics RB6 Platform development kit at its 5G summit for drones, delivery robots, and collaborative robotic systems.
  • 2026-07-20 product launch Motorola Edge 70 Max smartphone launched with Snapdragon 8 Gen 5 chipset.
  • 2026-07-07 partnership Qualcomm Technologies partnered with Applied Materials on the SENZ integrated ambient visual platform for AI-powered smart glasses.
  • 2026-07-07 design-win Applied Materials → ai_chips source ↗
  • 2026-06-30 M&A Qualcomm's reported $8 billion to $10 billion acquisition deal with Tenstorrent is not currently in talks, according to Tenstorrent CEO Jim Keller.
  • 2026-06-25 M&A Qualcomm announced an all-stock acquisition of Modular for approximately $3.9 billion.
  • 2026-06-24 M&A Qualcomm is set to acquire AI startup Modular in an all-stock deal worth nearly $4 billion.
  • 2026-06-24 M&A Qualcomm agreed to buy AI startup Modular in an all-stock deal valued at nearly $4 billion.
  • 2026-06-24 M&A Qualcomm agreed to buy AI startup Modular in an all-stock deal valued at nearly $4 billion.
  • 2026-06-23 design-win Samsung Electro-Mechanics → advanced_packaging source ↗
  • 2026-06-17 product launch Qualcomm Technologies Inc. launched the Snapdragon Scalable Turnkey AI-Ready Toolkit (START) to support brands in bringing their own personal AI devices to market, beginning with smart glasses.
  • 2026-06-15 M&A Qualcomm is in talks for the acquisition of AI chip design startup Tenstorrent for a transaction valued at $8 billion to $10 billion.
  • 2026-06-05 litigation Redstone Logics LLC sues Qualcomm Inc. for patent infringement regarding 830 Patent.
  • 2026-04-29 design-win → Figure AI compute source ↗
  • 2026-04-29 design-win → Samsung Electronics compute source ↗
  • 2025-11-12 design-win GlobalFoundries → foundry source ↗
  • 2025-09-01 product launch Qualcomm unveiled Snapdragon X2 Elite and X2 Elite Extreme platforms for premium laptops.
  • 2025-09-01 partnership Qualcomm and Google announced expanded partnership including integration of Google Gemini models to Snapdragon Digital Chassis solutions.
  • 2025-09-01 product launch Qualcomm introduced Snapdragon 8 Elite Gen 5 mobile platform for next-generation flagship AI smartphones equipped with third-generation Oryon CPU.
  • 2025-04-23 partnership Qualcomm announced new collaborations with Visteon and PATEO to create next generation AI intelligent cockpit solutions based on Snapdragon Cockpit Elite.
  • 2025-04-23 partnership Qualcomm is collaborating with Disa SV to jointly deliver a suite of pre integrated ADAS solutions that support L1 and L2 plus functions.
  • 2025-03-05 product launch GraniteShares announced a 2x Short QCOM Daily ETF tracking Qualcomm stock performance.
  • 2025-02-24 product launch Qualcomm announced its X85 5G platform, the world's most advanced AI powered modem 2 antenna system delivering substantial improvements in speed, efficiency, coverage and power consumption.
  • 2025-02-05 partnership Qualcomm announced new collaborations with Alps Alpine, Amazon, Google, Leapmotor, Mahindra, and Hyundai Mobis, which will use Snapdragon digital chassis solutions.
  • 2025-02-05 product launch Qualcomm announced its newest compute platform, the Snapdragon X, specifically designed to address PCs in the $600 price range.
  • 2025-02-05 supply deal Qualcomm recently signed Transsion to a long-term 4G license to go along with the 5G license signed in the last fiscal year.
  • 2025-02-05 design-win → Amazon compute source ↗
  • 2025-02-05 design-win → Panasonic Energy compute source ↗
  • 2024-10-31 design-win → STMicroelectronics compute source ↗

Patents — 2112 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 1083
Imaging / cameras 745
Other 73
Computing 62
Power electronics 57
IMU / navigation 57
Robotics / manipulators 29
Electric motors 4
Batteries 2

IP chokepoint in: Computing

Newest 8 of 2112, most recent first — all on Google Patents →

  • 2026-01-22US20260023389PREDICTING OBJECT MOTION IN A MULTIDIMENSIONAL ENVIRONMENT USING MACHINE LEARNING MODELS
  • 2024-11-28WO2024242759AFFORDANCE-BASED CONTROL SYSTEM
  • 2024-11-21US2024383132GEOMETRIC ALGEBRA TRANSFORMERS
  • 2024-11-21US2024383143AFFORDANCE-DRIVEN MODULAR REINFORCEMENT LEARNING
  • 2024-11-21WO2024238018AFFORDANCE-DRIVEN MODULAR REINFORCEMENT LEARNING
  • 2024-06-27US2024209843SCALABLE VOXEL BLOCK SELECTION
  • 2024-04-04WO2024072605SYSTEM AND PROCESS FOR DECONFOUNDED IMITATION LEARNING
  • 2023-07-27WO2023137744METHODS OF CAMERA-TO-ROBOTIC DEVICE CALIBRATION

Financials — multi-year, confidence 1.0 (filings)

revenue

$23.5B '20
$33.6B '21
$44.2B '22
$35.8B '23
$39.0B '24
$44.3B '25

operating income

$6.3B '20
$9.8B '21
$15.9B '22
$7.8B '23
$10.1B '24
$12.4B '25

net income

$5.2B '20
$9.0B '21
$12.9B '22
$7.2B '23
$10.1B '24
$5.5B '25

Sources: Redstone Logics LLC v. Qualcomm Inc. — District Court, W.D… · QCOM 10-Q 2025-07-30 (acc 0000804328-25-000045) · QCOM 10-K 2024-11-06 (acc 0000804328-24-000075) · QCOM 10-Q 2026-02-04 (acc 0000804328-26-000017) · QCOM 10-K 2023-11-01 (acc 0000804328-23-000055) · QCOM 10-Q 2023-08-02 (acc 0000804328-23-000043) · QCOM 10-Q 2024-07-31 (acc 0000804328-24-000056) · QCOM 10-Q 2025-02-05 (acc 0000804328-25-000011) · QCOM 10-Q 2026-04-29 (acc 0000804328-26-000061) · QCOM 10-Q 2023-05-03 (acc 0000804328-23-000023)

Buys from ← 8

🇺🇸 Amkor osat L2 50
🇺🇸 GlobalFoundries foundry L2 50
🇨🇭 STMicroelectronics imu → Snapdragon Robot RB3 Gen 2 L3 50
🇮🇳 Tata Electronics ai_compute L2 50
🇨🇳 JCET osat L2 50
🇰🇷 Samsung Electro-Mechanics advanced_packaging L2 50
🇰🇷 Samsung Electronics ai_chips L2 50
🇺🇸 Applied Materials ai_chips L2 50

Supplies → 5

🇺🇸 Amazon compute L2 50
🇺🇸 Figure AI compute → Figure 03 L3 50
🇰🇷 Samsung Electronics compute → Exynos AI L3 50
🇨🇭 STMicroelectronics compute → STM32 Series L3 50
🇯🇵 Panasonic Energy compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Qualcomm Kryo CPUSnapdragon 8 Gen 3Snapdragon Robot RB3 Gen 2Adreno GPUHexagon ProcessorSnapdragon X PlusSnapdragon X Elite

Rainbow RoboticspublicProduct-grade

physical ai · 🇰🇷 South Korea · KRX: 277810 · 61 sources · 3 products · 119 patents

$24Mrevenue · FY2025 · USD

Rainbow Robotics is a South Korea-based robotics company, spun off from KAIST, known for its HUBO humanoid robot series and collaborative industrial robots. It is publicly listed on the KOSDAQ exchange.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $5MFY2021: $8MFY2022: $11MFY2023: $12MFY2024: $14MFY2025: $24M wins 2024-02-21 · Schaeffler → roller_screws — click for source2024-07-27 · D-Robotics → ai_compute — click for source events 2026-06-18 · disclosure — Rainbow Robotics announced a shareholders meeting convocation.2026-05-21 · disclosure — Rainbow Robotics sets shareholder register closure period or reference date.2026-05-20 · disclosure — Rainbow Robotics convenes an extraordinary shareholders meeting.2026-05-15 · financial report — Rainbow Robotics files quarterly report for Q1 2026.2024-04-30 · capacity expansion — Rainbow Robotics is investing 29,472,660,000 KRW (22.6% of equity of 130,656,200,153 KRW) in new facility construction comprising a company headquarters and manufacturing facility in Sejong Special Self-Governing City, with investment period from May 16, 2024 to March 27, 2026.
  • 2026-06-18 disclosure Rainbow Robotics announced a shareholders meeting convocation.
  • 2026-05-21 disclosure Rainbow Robotics sets shareholder register closure period or reference date.
  • 2026-05-20 disclosure Rainbow Robotics convenes an extraordinary shareholders meeting.
  • 2026-05-15 financial report Rainbow Robotics files quarterly report for Q1 2026.
  • 2024-07-27 reported edge D-Robotics → ai_compute source ↗
  • 2024-04-30 capacity expansion Rainbow Robotics is investing 29,472,660,000 KRW (22.6% of equity of 130,656,200,153 KRW) in new facility construction comprising a company headquarters and manufacturing facility in Sejong Special Self-Governing City, with investment period from May 16, 2024 to March 27, 2026.
  • 2024-02-21 design-win Schaeffler → roller_screws source ↗

Patents — 119 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 76
Electric motors 21
Other 19
Lidar / ranging 3

Newest 11 of 119, most recent first — all on Google Patents →

  • 2026-03-05WO2026049345DUAL ARM ROBOT TEACHING SYSTEM HAVING MULTIPLE TEACHING MODES
  • 2026-02-19WO2026038664ROBOT COLLISION DETECTION CONTROL METHOD AND APPARATUS FOR PERFORMING SAME
  • 2025-10-30WO2025225824METHOD FOR DETERMINING MOVING PATH OF MOBILE ROBOT, AND MOBILE ROBOT PERFORMING SAME
  • 2025-10-30WO2025225825DIVIDING MAPPING METHOD AND APPARATUS FOR MAP GENERATION, AND MOBILE ROBOT USING THE SAME
  • 2025-10-30WO2025225826TURNTABLE LIFTING DEVICE AND ROBOT COMPRISING SAME
  • 2025-05-30WO2025110843METHOD OF PROVIDING COLLISION RISK INFORMATION BY USING ROBOT MOTION SIMULATION, AND APPARATUS FOR PERFORMING SAME
  • 2025-04-17WO2025079912MAPPING AND LOCALIZATION METHOD FOR ROBOT, AND MOBILE ROBOT USING SAME
  • 2025-04-17WO2025079913METHOD FOR GENERATING PATH OF ROBOT, AND MOBILE ROBOT USING SAME
  • 2025-04-17WO2025079914PATH FINDING METHOD FOR OPERATING MULTIPLE ROBOTS, AND SERVER FOR PERFORMING SAME
  • 2025-04-17WO2025080065MOBILE ROBOT
  • 2025-01-02WO2025005770MAGNETIC TOOL CHANGER

Buys from ← 2

🇩🇪 Schaeffler roller_screws → HUBO L3 50
🇨🇳 D-Robotics ai_compute L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

HUBO 2DRC-HUBOHUBO

ResonacpublicProduct-grade

ai compute · 🇯🇵 Japan · TSE: 4004 · 10 sources · 3 products · 694 patents

$8.3Brevenue · FY2025 · USD$15.5B mkt cap

Packaging materials, CMP slurry

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $6.0BFY2021: $8.7BFY2022: $8.6BFY2023: $8.0BFY2024: $9.2BFY2025: $9.0B wins 2023-01-12 · → Infineon ai_chips — click for source2026-03-04 · → Taiwan Manufacturing ai_chips — click for source events 2025-01-01 · financial report — Resonac Holdings reported financial results for the first half of fiscal year 117 (2025).
  • 2026-03-04 design-win → Taiwan Manufacturing ai_chips source ↗
  • 2025-01-01 financial report Resonac Holdings reported financial results for the first half of fiscal year 117 (2025).
  • 2023-01-12 design-win → Infineon ai_chips source ↗

Patents — 694 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 515
Computing 169
Memory 5
Batteries 4
Other 1

Newest 30 of 694, most recent first — all on Google Patents →

  • 2026-06-18WO2026127095MODEL GENERATION SYSTEM, EVALUATION SYSTEM, MODEL GENERATION METHOD, AND MODEL GENERATION PROGRAM
  • 2026-05-15WO2026100582DESIGN ASSISTANCE DEVICE, PROGRAM, AND DESIGN ASSISTANCE METHOD
  • 2026-05-07WO2026094117HEAT DISSIPATION ANALYSIS DEVICE, METHOD, PROGRAM, AND MATERIAL SELECTION METHOD
  • 2026-05-07WO2026094750INFORMATION PROCESSING DEVICE, DATABASE GENERATION METHOD, AND DATABASE GENERATION PROGRAM
  • 2026-04-30WO2026088539PROOFREADING DEVICE, DOCUMENT RECOGNITION SYSTEM, PROOFREADING METHOD, AND PROGRAM
  • 2026-04-02WO2026069485DESIGN ASSITANCE DEVICE, DESIGN ASSITANCE METHOD, AND DESIGN ASSITANCE PROGRAM
  • 2025-11-27WO2025244067INFORMATION PROCESSING DEVICE, PROGRAM, AND INFORMATION PROCESSING SYSTEM
  • 2025-11-13WO2025234397INFORMATION PROCESSING DEVICE, PROGRAM, AND INFORMATION PROCESSING SYSTEM
  • 2025-10-02WO2025205606DESIGN SUPPORT DEVICE, DESIGN SUPPORT METHOD, AND PROGRAM
  • 2025-08-14WO2025169826RANDOM NUMBER GENERATION DEVICE, DESIGN SUPPORT DEVICE, RANDOM NUMBER GENERATION METHOD, AND PROGRAM
  • 2025-07-31WO2025158875SEARCH SYSTEM, SEARCH METHOD, AND SEARCH PROGRAM
  • 2025-06-26WO2025134488RETRIEVAL DEVICE, RETRIEVAL METHOD AND PROGRAM
  • 2025-06-26WO2025134931DATA REGISTRATION DEVICE, DATA RETRIEVAL DEVICE, PROGRAM, AND DATA REGISTRATION RETRIEVAL SYSTEM
  • 2025-06-05WO2025115444DATA MANAGEMENT SYSTEM, DATA MANAGEMENT METHOD, AND DATA MANAGEMENT PROGRAM
  • 2025-05-08WO2025094860INFORMATION PROCESSING DEVICE, DISPLAY SYSTEM, DISPLAY METHOD, AND DISPLAY PROGRAM
  • 2025-04-24WO2025083854DESIGN SUPPORT DEVICE, DESIGN SUPPORT METHOD, AND DESIGN SUPPORT PROGRAM
  • 2025-04-10WO2025075181MATERIAL SELECTION ASSISTANCE DEVICE, METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD CORE, AND CIRCUIT BOARD
  • 2025-03-27WO2025063180DESIGN SUPPORT DEVICE, DESIGN SUPPORT METHOD, PROGRAM, AND DESIGN SUPPORT SYSTEM
  • 2025-03-27WO2025063242TWO-DIMENSIONAL MODEL GENERATION METHOD, TWO-DIMENSIONAL MODEL GENERATION DEVICE, AND PROGRAM
  • 2025-03-13WO2025052556SIMULATION DEVICE, METHOD, PROGRAM, MATERIAL SELECTION METHOD, MANUFACTURING METHOD, AND PHOTOSENSITIVE INSULATING MATERIAL
  • 2025-03-06WO2025046863DATA STRUCTURE, DATA MANAGEMENT SYSTEM, DATA MANAGEMENT METHOD, AND DATA MANAGEMENT PROGRAM
  • 2025-02-27WO2025041441MODEL CREATION METHOD, PROGRAM, AND INFORMATION PROCESSING DEVICE
  • 2024-06-13WO2024122070ESTIMATED VALUE DISPLAY DEVICE, METHOD, AND PROGRAM
  • 2024-05-30WO2024111603INFORMATION PROCESSING DEVICE, PROGRAM, AND INFERENCE METHOD
  • 2024-05-23WO2024106299MIXING DESIGN ASSISTANCE DEVICE, PROGRAM, AND MIXING DESIGN ASSISTANCE METHOD
  • 2024-03-28WO2024062861INFORMATION SEARCH DEVICE, METHOD, AND PROGRAM
  • 2024-03-14WO2024053115SIMULATION METHOD, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
  • 2024-02-01WO2024024596CHARACTERISTICS PREDICTION DEVICE, CHARACTERISTICS PREDICTION METHOD, AND PROGRAM
  • 2024-02-01WO2024024957DESIGN ASSISTANCE DEVICE, DESIGN ASSISTANCE METHOD, AND DESIGN ASSISTANCE PROGRAM
  • 2023-11-16WO2023219037PREDICTION DEVICE, MATERIAL DESIGN SYSTEM, PREDICTION METHOD, AND PREDICTION PROGRAM

Financials — multi-year, confidence 1.0 (filings)

revenue

$6.0B '20
$8.7B '21
$8.6B '22
$8.0B '23
$9.2B '24
$9.0B '25

operating income

$-120M '20
$537M '21
$380M '22
$-110M '23
$589M '24
$312M '25

net income

$-470M '20
$-75M '21
$200M '22
$-40M '23
$486M '24
$194M '25

Sources: 株式会社レゾナック・ホールディングス — 有価証券報告書-第117期(2025/01/01-2025/12/31) · 株式会社レゾナック・ホールディングス — 臨時報告書 · 株式会社レゾナック・ホールディングス — 臨時報告書 · 株式会社レゾナック・ホールディングス — 半期報告書-第117期(2025/01/01-2025/12/31)

Supplies → 2

🇩🇪 Infineon ai_chips → Power semiconductors L3 50
🇹🇼 Taiwan Manufacturing ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

CMP SlurryPackaging MaterialsAlumina (Al2O3)

RoboSensepublicRelationships + financials

physical ai · 🇨🇳 China · HKEX: 2498 · 11 sources · 7 products · 24 patents

$279Mrevenue · FY2025 · USD$1.3B mkt cap

LiDAR, perception

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $25MFY2021: $49MFY2022: $78MFY2023: $166MFY2024: $244MFY2025: $280M wins 2026-03-05 · → BYD vision — click for source events

Patents — 24 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 24

Financials — multi-year, confidence 1.0 (filings)

revenue

$25M '20
$49M '21
$78M '22
$166M '23
$244M '24
$280M '25

operating income

$-9M '20
$-24M '21
$-91M '22
$-139M '23
$-81M '24
$-58M '25

net income

$-33M '20
$-257M '21
$-311M '22
$-639M '23
$-71M '24
$-21M '25

Supplies → 1

🇨🇳 BYD vision L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

RS-HeliosRS-BpearlRS-LiDAR-32RS-LiDAR-64RS-LiDAR-16RS-LiDAR-128RS-Ruby

RockchippublicProduct-grade

ai compute · 🇨🇳 China · 17 sources · 0 products

$651Mrevenue · FY2025 · USD$87.7B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $275MFY2021: $402MFY2022: $300MFY2023: $315MFY2024: $464MFY2025: $651M wins 2026-07-01 · → UBTech Robotics ai_compute — click for source events
  • 2026-07-01 design-win → UBTech Robotics ai_compute source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$275M '20
$402M '21
$300M '22
$315M '23
$464M '24
$651M '25

operating income

$47M '20
$90M '21
$38M '22
$12M '23
$90M '24
$165M '25

net income

$47M '20
$89M '21
$44M '22
$20M '23
$88M '24
$154M '25

Supplies → 1

🇨🇳 UBTech Robotics ai_compute → Walker Pro L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Samsung Electro-MechanicspublicProduct-grade

ai compute · 🇰🇷 South Korea · KRX: 009150 · 116 sources · 4 products · 38 patents

$8.0Brevenue · FY2025 · USD$62.6B mkt cap

ABF substrates, MLCC

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $6.6BFY2021: $8.5BFY2022: $7.3BFY2023: $6.8BFY2024: $7.6BFY2025: $8.0B wins 2024-07-22 · → Advanced Micro Devices advanced_packaging — click for source2026-06-22 · → Samsung Electronics advanced_packaging — click for source2026-06-23 · → Qualcomm advanced_packaging — click for source2025-04-16 · → BYD advanced_packaging — click for source events 2026-07-30 · financial report — Samsung Electro-Mechanics announced advance notice of financial results disclosure for the fiscal quarter ended June 30, 2026 (April 1 – June 30, 2026), with results scheduled to be publicly disclosed on July 30, 2026.2026-07-30 · disclosure — Samsung Electro-Mechanics will hold an investor relations conference call on July 30, 2026 at 13:30 to present Q2 2026 operating results and conduct Q&A with institutional investors, individual investors, and analysts via conference call with concurrent webcast.2026-07-10 · financial — Samsung Electro-Mechanics added 3.95 percent in Seoul trading on Friday.2026-07-05 · financial — Samsung Electro-Mechanics experienced net sales of 124.5 billion won by the National Pension Service during portfolio rebalancing in July 2026.2026-07-02 · related party deal — Samsung Electro-Mechanics announces decision to acquire stocks and investment securities in other entities.2026-07-02 · disclosure — Samsung Electro-Mechanics discloses future business and management plans.2026-06-30 · disclosure — Samsung Electro-Mechanics discloses sustainability management report.2026-06-30 · related party deal — Samsung Electro-Mechanics concludes single-buyer sales and supply contract.2026-06-23 · financial — Samsung Electro-Mechanics stock declined 8.57 percent on Tuesday morning.2026-06-23 · financial — Samsung Electro-Mechanics stock dropped 10.68 percent to 1.99 million won during the Kospi market decline on June 23, 2026.2026-06-22 · financial — Samsung Electro-Mechanics lost 1.85 percent to 2.23 million won.2026-06-22 · financial — Samsung Electro-Mechanics fell 0.93 percent in Seoul stock trading amid US-Iran peace negotiations uncertainty.2026-06-18 · financial — Samsung Electro-Mechanics stock jumped 8.27 percent to 2.2 million won on June 18, 2026.2026-06-18 · financial — Samsung Electro-Mechanics is among major holdings in the Kospi 200 Index.2026-06-15 · related party deal — Samsung Electro-Mechanics disclosed a related-party transaction for goods and services with affiliates.2026-06-11 · financial — Samsung Electro-Mechanics dipped 4.54 percent on Seoul stock exchange on June 11, 2026.2026-06-10 · financial — Samsung Electro-Mechanics slipped 4.67 percent amid market decline.2026-06-10 · financial — Samsung Electro-Mechanics slipped 1.62 percent in Seoul trading on June 10, 2026.2026-06-04 · financial — Samsung Electro-Mechanics lost 5.35 percent to 1,716,000 won on June 4, 2026.2026-06-01 · disclosure — Samsung Electro-Mechanics disclosed large enterprise group status for Q1 2026.2026-06-01 · disclosure — Samsung Electro-Mechanics filed its corporate governance report.2026-06-01 · disclosure — Samsung Electro-Mechanics reported changes in major shareholder stock ownership.2026-05-29 · financial — Samsung Electro-Mechanics stock gained 688 percent year-to-date, rising from 270,000 won on January 2 to 2.127 million won by May 29, 2026.2026-05-28 · financial — Samsung Electro-Mechanics climbed 4.91 percent in trading.2026-05-28 · financial — Samsung Electro-Mechanics went up 2.02 percent on Thursday.2026-05-27 · financial — Samsung Electro-Mechanics rose 3.69 percent to 1.63 million won.2026-05-20 · other — Samsung Electro-Mechanics announced a single sales or supply contract execution.2026-05-20 · supply deal — Samsung Electro-Mechanics announced a 1.5 trillion won silicon capacitor supply contract with a large global company for use in AI server GPU and high-bandwidth memory packages.2026-05-15 · financial report — Samsung Electro-Mechanics filed its quarterly report for Q1 2026.2026-05-13 · financial — Samsung Electro-Mechanics gained 1.77 percent in Seoul trading.2026-05-12 · financial — Samsung Electro-Mechanics surged 6.44 percent to 958,000 won during market decline.2026-05-04 · financial — Samsung Electro-Mechanics soared 10.34 percent to 918,000 won as electronic components affiliate benefited from chip rally.2026-05-04 · disclosure — Samsung Electro-Mechanics reported changes in major shareholder stock ownership.2026-05-01 · financial — Samsung Electro-Mechanics is considering raising prices for multilayer ceramic capacitors (MLCCs) by approximately 5% to 10% due to tightening supply from AI infrastructure demand.2026-04-30 · related party deal — Samsung Electro-Mechanics disclosed an investment in a related party.2026-04-30 · financial — Samsung Electro-Mechanics surged 3.63 percent following strong earnings.2026-04-30 · financial report — Samsung Electro-Mechanics disclosed preliminary consolidated operating results for April 2026.2026-04-24 · financial — Samsung Electro-Mechanics' stock jumped 93.37 percent between March 31 and April 24, 2026, reaching a market capitalization of 58.93 trillion won.2026-04-10 · disclosure — Samsung Electro-Mechanics announced an investor relations briefing session.2026-04-10 · disclosure — Samsung Electro-Mechanics provided advance notice of year-end financial results announcement.2026-04-06 · disclosure — Samsung Electro-Mechanics reported changes in major shareholder stock ownership.
  • 2026-07-30 financial report Samsung Electro-Mechanics announced advance notice of financial results disclosure for the fiscal quarter ended June 30, 2026 (April 1 – June 30, 2026), with results scheduled to be publicly disclosed on July 30, 2026.
  • 2026-07-30 disclosure Samsung Electro-Mechanics will hold an investor relations conference call on July 30, 2026 at 13:30 to present Q2 2026 operating results and conduct Q&A with institutional investors, individual investors, and analysts via conference call with concurrent webcast.
  • 2026-07-10 financial Samsung Electro-Mechanics added 3.95 percent in Seoul trading on Friday.
  • 2026-07-05 financial Samsung Electro-Mechanics experienced net sales of 124.5 billion won by the National Pension Service during portfolio rebalancing in July 2026.
  • 2026-07-02 related party deal Samsung Electro-Mechanics announces decision to acquire stocks and investment securities in other entities.
  • 2026-07-02 disclosure Samsung Electro-Mechanics discloses future business and management plans.
  • 2026-06-30 disclosure Samsung Electro-Mechanics discloses sustainability management report.
  • 2026-06-30 related party deal Samsung Electro-Mechanics concludes single-buyer sales and supply contract.
  • 2026-06-23 financial Samsung Electro-Mechanics stock declined 8.57 percent on Tuesday morning.
  • 2026-06-23 financial Samsung Electro-Mechanics stock dropped 10.68 percent to 1.99 million won during the Kospi market decline on June 23, 2026.
  • 2026-06-23 design-win → Qualcomm advanced_packaging source ↗
  • 2026-06-22 financial Samsung Electro-Mechanics lost 1.85 percent to 2.23 million won.
  • 2026-06-22 financial Samsung Electro-Mechanics fell 0.93 percent in Seoul stock trading amid US-Iran peace negotiations uncertainty.
  • 2026-06-22 design-win → Samsung Electronics advanced_packaging source ↗
  • 2026-06-18 financial Samsung Electro-Mechanics stock jumped 8.27 percent to 2.2 million won on June 18, 2026.
  • 2026-06-18 financial Samsung Electro-Mechanics is among major holdings in the Kospi 200 Index.
  • 2026-06-15 related party deal Samsung Electro-Mechanics disclosed a related-party transaction for goods and services with affiliates.
  • 2026-06-11 financial Samsung Electro-Mechanics dipped 4.54 percent on Seoul stock exchange on June 11, 2026.
  • 2026-06-10 financial Samsung Electro-Mechanics slipped 4.67 percent amid market decline.
  • 2026-06-10 financial Samsung Electro-Mechanics slipped 1.62 percent in Seoul trading on June 10, 2026.
  • 2026-06-04 financial Samsung Electro-Mechanics lost 5.35 percent to 1,716,000 won on June 4, 2026.
  • 2026-06-01 disclosure Samsung Electro-Mechanics disclosed large enterprise group status for Q1 2026.
  • 2025-04-16 design-win → BYD advanced_packaging source ↗
  • 2024-07-22 design-win → Advanced Micro Devices advanced_packaging source ↗

Patents — 38 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 38

Supplies → 4

🇺🇸 Advanced Micro Devices advanced_packaging → Instinct MI300X L3 50
🇰🇷 Samsung Electronics advanced_packaging L2 50
🇺🇸 Qualcomm advanced_packaging L2 50
🇨🇳 BYD advanced_packaging L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

ABF (Ajinomoto Build-up Film) SubstratesFan-Out Wafer Level Packaging (FOWLP) SubstratesHigh-Density Interconnect (HDI) SubstratesMLCC (Multilayer Ceramic Capacitors)

Samsung Electronics Co., Ltd.publicProduct-grade

ai compute · 🇰🇷 South Korea · KRX: 005930 · 299 sources · 4 products · 3917 patents

$225.6Brevenue · FY2025 · USD$1.15T mkt cap

Samsung Electronics Co., Ltd. is a South Korean electronics company producing memory chips, HBM, foundry services, and Exynos processors, alongside consumer electronics; founded in 1969.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $201.1BFY2021: $244.3BFY2022: $234.6BFY2023: $198.2BFY2024: $220.8BFY2025: $234.8B wins 2026-07-08 · MediaTek → networking — click for source2024-01-09 · SUMCO → ai_chips — click for source2026-04-29 · Qualcomm → compute — click for source2026-04-28 · Robotera → humanoid — click for source2025-07-28 · → Tesla foundry — click for source2025-10-27 · Cadence Design → ai_chips — click for source2026-06-22 · Samsung Electro-Mechanics → advanced_packaging — click for source2026-07-13 · → Tesla ai_chips — click for source2026-07-11 · → MaxLinear ai_chips — click for source2026-07-14 · → Tesla ai_chips — click for source2025-02-26 · Synopsys → ai_chips — click for source2026-07-12 · Arteris → ai_compute — click for source2025-03-20 · Micron → hbm — click for source2024-12-30 · Ibiden → advanced_packaging — click for source2025-11-05 · Arm → ai_chips — click for source2026-06-08 · → NVIDIA ai_chips — click for source2025-11-06 · Tokyo Ohka Kogyo → ai_chips — click for source2026-07-10 · FormFactor → ai_compute — click for source2026-01-21 · Advantest → ai_chips — click for source2025-06-29 · → Applied Materials ai_chips — click for source events 2027-01-01 · product launch — Samsung may introduce a Galaxy S27 Pro smartphone in early 2027 with either Qualcomm Snapdragon 8 Elite Gen 6 or Samsung Exynos 2700 processor depending on market.2026-07-16 · financial — Samsung Electronics plunged 8.77 percent to 255,000 won in Seoul trading on July 16, 2026.2026-07-16 · financial — Samsung Electronics fell 8.9% amid the broader chipmaker selloff.2026-07-16 · financial — Samsung Electronics plunged 9.03 percent on the KOSPI on July 16, 2026, amid tech stock losses driven by Middle East tensions and AI valuation concerns.2026-07-16 · financial — Samsung Electronics plunged 8.77 percent to 255,000 won in Seoul trading due to technology sector losses amid Middle East tensions.2026-07-16 · financial — Samsung Electronics fell 7.33% in Seoul trading on July 16, 2026.2026-07-16 · financial — Samsung Electronics fell nearly nine percent amid chip-related stock selloff.2026-07-15 · regulatory — South Korean regulators warned about leveraged ETFs tracking Samsung, with 2x leveraged products approved in late May growing to over $9 billion.2026-07-13 · related party deal — Samsung Electronics decided to distribute 1,132,477 common shares valued at ₩285,000 per share (total ₩322.76 billion) to 928 executives and employees as long-term performance incentives on July 13, 2026, using treasury shares held within distributable earnings.2026-07-13 · buyback — Samsung Electronics disposed of 1,132,477 treasury shares on July 13, 2026, at 254,500 KRW per share, generating total proceeds of 288,215,396,500 KRW through three brokers (Samsung Securities, KB Securities, and Shinhan Investment & Securities). Post-disposal, Samsung held 79,872026-07-10 · financial — Samsung Electronics advanced 2.16 percent in Seoul trading on Friday.2026-07-08 · financial — Samsung Electronics reported the best quarter in its history but shares fell 6.25 per cent on July 8, 2026, due to investor concerns about memory competition.2026-07-08 · buyback — Samsung Electronics disposed of 1,083,434 treasury shares to employees on July 8, 2026, at 277,500 KRW per share, generating total proceeds of 300,652,935,000 KRW through three brokers (Samsung Securities, KB Securities, and Shinhan Investment & Securities).2026-07-07 · litigation — Samsung Electronics Co., Ltd. v. Netlist, Inc. — patent dispute regarding the 830 Patent in District Court, D. Delaware.2026-07-07 · financial — Samsung reported operating profit estimates of $59 billion and sales of $113 billion but the announcement failed to impress investors.2026-07-07 · financial — Samsung Electronics announced 2026 Q2 preliminary earnings results on the morning of July 7, which triggered significant selling pressure on Korean and Japanese equity markets.2026-07-07 · financial — Samsung Electronics issued record forward operating profit guidance but experienced an 8% stock price drop alongside the broader KOSPI index sell-off.2026-07-06 · litigation — Netlist Inc v. Samsung Electronics Co., Ltd. — patent dispute regarding the 830 Patent in District Court, E.D. Texas.2026-07-05 · financial — Samsung Electronics was the biggest net sale by the National Pension Service at 212.5 billion won during portfolio rebalancing in July 2026.2026-07-02 · litigation — Cerinet USA sues Samsung Electronics America, Inc. for patent infringement regarding 830 Patent.2026-07-01 · partnership — Samsung Catalyst Fund co-led Oxmiq Labs' $35 million Series A funding round.2026-06-30 · financial — Samsung Electronics rose 3.41 percent to 334,000 won on tech gains.2026-06-26 · financial — Samsung Electronics fell more than 9 percent during Friday's trading session amid semiconductor sell-off.2026-06-25 · financial — Samsung Electronics jumped 4.99 percent in Seoul trading following Micron's strong earnings report.2026-06-24 · litigation — Signal Point Networks, LLC alleges Samsung Electronics infringed patent 830.2026-06-24 · litigation — Mare Infinitus Technologies LLC alleges Samsung Electronics infringed patent 830.2026-06-23 · financial — Samsung Electronics stock dropped approximately 12 percent to 310,000 won during the Kospi market decline on June 23, 2026.2026-06-23 · financial — Samsung Electronics stock fell 4.95 percent on Tuesday morning as part of a tech-heavy market decline.2026-06-22 · financial — Samsung Electronics dropped 0.14 percent to 353,500 won.2026-06-22 · financial — Samsung Electronics sank 2.68 percent in Seoul stock trading amid US-Iran peace negotiations uncertainty.2026-06-18 · financial — Samsung Electronics stock jumped 4.62 percent to 362,500 won on June 18, 2026.2026-06-18 · financial — Samsung Electronics is among major holdings in the Kospi 200 Index and has been a strong performer in Korea's AI-driven stock rally.2026-06-11 · financial — Samsung Electronics shed 3.47 percent on Seoul stock exchange on June 11, 2026.2026-06-10 · financial — Samsung Electronics opened trading 2.8 percent lower on June 10, 2026, tracking US tech losses.2026-06-10 · financial — Samsung Electronics slid 5.36 percent lower on Seoul stock exchange amid US-Iran tensions and tech sector losses.2026-06-09 · litigation — Estech Systems IP, LLC alleges Samsung Electronics infringed patent 830.2026-06-09 · financial — Samsung Electronics jumped 8.97 percent to 322,000 won on AI confidence and bargain hunting in semiconductor stocks.2026-06-09 · M&A — Samsung Electronics invested $175 million in Element Biosciences' Series E financing round and became the company's largest shareholder.2026-06-08 · partnership — Samsung Electronics discussed cooperations on high-bandwidth memory 4 and foundry business with Nvidia, with plans for closer joint technology development.2026-06-08 · litigation — Netlist, Inc. alleges Samsung Electronics infringed patent 830.2026-06-05 · financial — Samsung Electronics decreased 6.69 percent in trading on the Korea Composite Stock Price Index.2026-06-04 · financial — Samsung Electronics stock fell 2.5 percent to 351,500 won on June 4, 2026.2026-06-02 · financial — Samsung Electronics rose 3.3 percent to a fresh record high of 360,500 won on AI optimism.2026-06-02 · financial — Samsung Electronics closed at 360,500 won, up 3.3 percent from the previous session.2026-06-02 · litigation — Samsung Electronics alleges Netlist, Inc. infringed patent 830.2026-05-28 · financial — Samsung Electronics dipped 1.87 percent on Thursday amid AI rally pause.2026-05-28 · financial — Samsung Electronics dipped 2.12 percent in trading as foreign investors unloaded shares following recent tech-led rally.2026-05-28 · partnership — Samsung Foundry continues close collaboration with Synopsys on design technology co-optimization (DTCO) initiatives across advanced process nodes.2026-05-27 · financial — Samsung Electronics climbed 2.68 percent to 307,000 won in Seoul trading.2026-05-21 · financial — Samsung Electronics surged 6.07 percent as market top-cap on improved investor sentiment.2026-05-21 · other — Samsung Electronics reached a tentative agreement with its labor union, easing concerns over a major strike scheduled to begin Thursday.2026-05-21 · financial — Samsung Electronics reached a tentative wage agreement with its labor union that includes a special bonus tied to semiconductor division performance, with payouts calculated at 10.5 percent of business performance benchmarks with no upper limit, paid entirely in company stock for2026-05-14 · financial — Samsung Electronics stock climbed 1.76 percent on the Korea Composite Stock Price Index.2026-05-13 · financial — Samsung Electronics slid 5.29 percent in trading as investors expressed concerns over potential labor strikes and profit-taking after a record-breaking run.2026-05-12 · financial — Samsung Electronics closed 2.28 percent lower at 279,000 won as the Kospi fell on profit-taking sentiment.2026-05-04 · financial — Samsung Electronics jumped 5.44 percent to 232,500 won as chip giant led semiconductor rally.2026-04-30 · financial — Samsung Electronics posted record quarterly earnings in the first three months of 2026.2026-04-30 · financial — Samsung Electronics posted record quarterly earnings in the first three months of 2026.2026-04-30 · financial — Samsung Electronics posted record quarterly earnings in the first three months of 2026.2026-04-22 · financial — Samsung Electronics and SK hynix were offloaded by investors for bargain hunting following ceasefire extension announcement.2026-03-01 · capacity expansion — Samsung's Taylor, Texas fab began receiving process chemicals from supplier ENF Technology's Kyle, Texas plant and tested EUV lithography equipment.2025-12-31 · financial — Samsung Electronics device solutions division chip business workforce came to 78,064 employees as of end of 2025, slightly down from 78,699.2025-10-01 · partnership — Samsung Electronics Executive Chairman Lee Jae-yong shared fried chicken and beer with NVIDIA CEO Jensen Huang during his visit to South Korea in October 2025.2025-01-01 · partnership — Samsung disclosed a 2025 foundry supply agreement valued at approximately 22.7 trillion won ($15.1 billion) with Tesla for next-generation AI chips.2024-07-07 · partnership — Lee Jae-yong and Han Jin-man attended the Sun Valley Conference to expand foundry collaborations with major clients.2024-01-01 · product launch — Samsung Electronics will deliver a keynote on Samsung's AI vision at CES 2024.2023-04-30 · executive change — Samsung Electronics Vice President Yoon Joon-oh was appointed a director of Rainbow Robotics in April.2023-03-31 · M&A — Samsung Electronics acquired a 10.22 percent stake in Rainbow Robotics in January and bought an additional 4.77 percent stake in March for a combined 86.8 billion won.
  • 2027-01-01 product launch Samsung may introduce a Galaxy S27 Pro smartphone in early 2027 with either Qualcomm Snapdragon 8 Elite Gen 6 or Samsung Exynos 2700 processor depending on market.
  • 2026-07-16 financial Samsung Electronics plunged 8.77 percent to 255,000 won in Seoul trading on July 16, 2026.
  • 2026-07-16 financial Samsung Electronics fell 8.9% amid the broader chipmaker selloff.
  • 2026-07-16 financial Samsung Electronics plunged 9.03 percent on the KOSPI on July 16, 2026, amid tech stock losses driven by Middle East tensions and AI valuation concerns.
  • 2026-07-16 financial Samsung Electronics plunged 8.77 percent to 255,000 won in Seoul trading due to technology sector losses amid Middle East tensions.
  • 2026-07-16 financial Samsung Electronics fell 7.33% in Seoul trading on July 16, 2026.
  • 2026-07-16 financial Samsung Electronics fell nearly nine percent amid chip-related stock selloff.
  • 2026-07-15 regulatory South Korean regulators warned about leveraged ETFs tracking Samsung, with 2x leveraged products approved in late May growing to over $9 billion.
  • 2026-07-14 design-win → Tesla ai_chips source ↗
  • 2026-07-13 related party deal Samsung Electronics decided to distribute 1,132,477 common shares valued at ₩285,000 per share (total ₩322.76 billion) to 928 executives and employees as long-term performance incentives on July 13, 2026, using treasury shares held within distributable earnings.
  • 2026-07-13 buyback Samsung Electronics disposed of 1,132,477 treasury shares on July 13, 2026, at 254,500 KRW per share, generating total proceeds of 288,215,396,500 KRW through three brokers (Samsung Securities, KB Securities, and Shinhan Investment & Securities). Post-disposal, Samsung held 79,87
  • 2026-07-13 design-win → Tesla ai_chips source ↗
  • 2026-07-12 design-win Arteris → ai_compute source ↗
  • 2026-07-11 design-win → MaxLinear ai_chips source ↗
  • 2026-07-10 financial Samsung Electronics advanced 2.16 percent in Seoul trading on Friday.
  • 2026-07-10 design-win FormFactor → ai_compute source ↗
  • 2026-07-08 financial Samsung Electronics reported the best quarter in its history but shares fell 6.25 per cent on July 8, 2026, due to investor concerns about memory competition.
  • 2026-07-08 buyback Samsung Electronics disposed of 1,083,434 treasury shares to employees on July 8, 2026, at 277,500 KRW per share, generating total proceeds of 300,652,935,000 KRW through three brokers (Samsung Securities, KB Securities, and Shinhan Investment & Securities).
  • 2026-07-08 design-win MediaTek → networking source ↗
  • 2026-07-07 litigation Samsung Electronics Co., Ltd. v. Netlist, Inc. — patent dispute regarding the 830 Patent in District Court, D. Delaware.
  • 2026-07-07 financial Samsung reported operating profit estimates of $59 billion and sales of $113 billion but the announcement failed to impress investors.
  • 2026-07-07 financial Samsung Electronics announced 2026 Q2 preliminary earnings results on the morning of July 7, which triggered significant selling pressure on Korean and Japanese equity markets.
  • 2026-07-07 financial Samsung Electronics issued record forward operating profit guidance but experienced an 8% stock price drop alongside the broader KOSPI index sell-off.
  • 2026-07-06 litigation Netlist Inc v. Samsung Electronics Co., Ltd. — patent dispute regarding the 830 Patent in District Court, E.D. Texas.
  • 2026-07-05 financial Samsung Electronics was the biggest net sale by the National Pension Service at 212.5 billion won during portfolio rebalancing in July 2026.
  • 2026-07-02 litigation Cerinet USA sues Samsung Electronics America, Inc. for patent infringement regarding 830 Patent.
  • 2026-06-22 design-win Samsung Electro-Mechanics → advanced_packaging source ↗
  • 2026-06-08 design-win → NVIDIA ai_chips source ↗
  • 2026-04-29 design-win Qualcomm → compute source ↗
  • 2026-04-28 reported edge Robotera → humanoid source ↗
  • 2026-01-21 design-win Advantest → ai_chips source ↗
  • 2025-11-06 design-win Tokyo Ohka Kogyo → ai_chips source ↗
  • 2025-11-05 design-win Arm → ai_chips source ↗
  • 2025-10-27 design-win Cadence Design → ai_chips source ↗
  • 2025-07-28 design-win → Tesla foundry source ↗
  • 2025-06-29 design-win → Applied Materials ai_chips source ↗
  • 2025-03-20 design-win Micron → hbm source ↗
  • 2025-02-26 design-win Synopsys → ai_chips source ↗
  • 2024-12-30 design-win Ibiden → advanced_packaging source ↗
  • 2024-01-09 design-win SUMCO → ai_chips source ↗

Patents — 3917 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 2642
Semiconductors 577
Memory 452
Imaging / cameras 132
Power electronics 51
Bearings 15
Other 9
Lidar / ranging 8
Electric motors 8
Batteries 7
Force / torque sensors 7
IMU / navigation 4
Gears / reducers 3
Robotics / manipulators 2

IP chokepoint in: Computing, Memory

Newest 72 of 3917, most recent first — all on Google Patents →

  • 2026-07-09US20260194929DISTRIBUTED VOLTAGE REGULATING CIRCUIT, METHOD OF OPERATING DISTRIBUTED VOLTAGE REGULATING CIRCUIT, AND SYSTEM-ON-CHIP INCLUDING DISTRIBUTED VOLTAGE REGULATING CIRCUIT
  • 2026-07-09US20260194933SENSOR DEVICE AND DISPLAY APPARATUS INCLUDING THE SAME
  • 2026-07-09US20260194988ELECTRONIC APPARATUS AND METHOD FOR CONTROLLING ELECTRONIC APPARATUS
  • 2026-07-09US20260195008ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
  • 2026-07-09US20260195042APPARATUS AND METHOD TO IMPROVE QUALITY OF SERVICE (QoS) IN A STORAGE DEVICE
  • 2026-07-09US20260195060ELECTRONIC SYSTEM AND METHOD OF COMPRESSING SORTED STRING TABLES
  • 2026-07-09US20260195074MEMORY EXPANDER, OPERATING METHOD OF MEMORY EXPANDER, AND COMPUTING SYSTEM
  • 2026-07-09US20260195137PROCESSOR INCLUDING RESPONSE HANDLING BLOCK, OPERATION METHOD THEREOF, AND SYSTEM INCLUDING THE SAME
  • 2026-07-09US20260195150ELECTRONIC DEVICE FOR EXECUTING PLURALITY OF APPLICATIONS IN FOREGROUND
  • 2026-07-09US20260195255STORAGE DEVICE
  • 2026-07-09US20260195293MULTIPROCESSOR APPARATUS PERFORMING COLLECTIVE OPERATION, PROCESSING APPARATUS AND OPERATING METHOD OF PROCESSING APPARATUS
  • 2026-07-09US20260195384METHOD AND DEVICE WITH QUESTION-ANSWERING MODEL TRAINING
  • 2026-07-09US20260195645METHOD, DEVICE, AND APPARATUS WITH MULTI-MODAL BASE MODEL TRAINING
  • 2026-07-09US20260195946METHOD FOR DISPLAYING AN IMAGE AND ELECTRONIC DEVICE FOR THE IMAGE
  • 2026-07-09US20260196252SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
  • 2026-07-09US20260196262MEMORY DEVICE INCLUDING PLURALITY OF MEMORY CELLS
  • 2026-07-09US20260196263SENSE AMPLIFIER AND MEMORY DEVICE INCLUDING THE SAME
  • 2026-07-09US20260196268COMPUTING BIT CELL, DEVICE INCLUDING THE SAME AND METHOD OF OPERATION THEREOF
  • 2026-07-09US20260196272MEMORY DEVICE, STORAGE DEVICE INCLUDING THE SAME, AND OPERATING METHOD THEREOF
  • 2026-07-09US20260196289MEMORY DEVICE AND MEMORY MODULE
  • 2026-07-09US20260197986SEMICONDUCTOR MEMORY DEVICE
  • 2026-07-09US20260198200DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
  • 2026-07-02US20260182916WEARABLE DEVICE FOR MEASURING LOCAL IMPEDANCE AND AREA IMPEDANCE USING MULTIPLE ELECTRODES AND CONTROL METHOD THEREOF
  • 2026-07-02US20260186657STORAGE CONTROLLER AND STORAGE DEVICE INCLUDING THE SAME
  • 2026-07-02US20260186666BUFFER CHIP, A MEMORY SYSTEM INCLUDING THE BUFFER CHIP AND A METHOD FOR OPERATING THE MEMORY SYSTEM
  • 2026-07-02US20260186675METHOD AND DEVICE WITH MEMORY MANAGEMENT
  • 2026-07-02US20260186687OPERATION METHODS OF STORAGE CONTROLLER AND STORAGE DEVICE INCLUDING STORAGE CONTROLLER, AND STORAGE SYSTEM INCLUDING STORAGE DEVICE
  • 2026-07-02US20260186690STORAGE CONTROLLER AND METHOD OF OPERATING THE SAME
  • 2026-07-02US20260186700MEMORY CONTROLLER, OPERATING METHOD OF MEMORY CONTROLLER, AND STORAGE DEVICE COMPRISING MEMORY CONTROLLER
  • 2026-07-02US20260186708MEMORY CONTROLLER, METHOD OF OPERATING THE SAME, AND SYSTEM INCLUDING THE SAME
  • 2026-07-02US20260186841METHOD OF EXECUTING PROGRAM USING PLURALITY OF HARDWARE RESOURCES AND ELECTRONIC DEVICE FOR PERFORMING THE METHOD
  • 2026-07-02US20260186906METHOD FOR OPERATING SERVER CONTROLLER, SERVER CONTROLLER AND STORAGE SERVER
  • 2026-07-02US20260186970MULTI-NODE COMPUTING SYSTEM WITH MEMORY COHERENCE MANAGEMENT METHOD
  • 2026-07-02US20260186994OPERATION METHOD OF STORAGE CONTROLLER CONFIGURED TO CONTROL NONVOLATILE MEMORY DEVICE
  • 2026-07-02US20260187143METHOD OF GENERATING SEARCH KEYWORD FOR VIDEO CONTENT, AND ELECTRONIC DEVICE PERFORMING THE METHOD
  • 2026-07-02US20260187283METHOD AND APPARATUS WITH VIRTUAL DATA GENERATION
  • 2026-07-02US20260187316SEMICONDUCTOR 3D STRUCTURE GENERATING DEVICE AND OPERATION METHOD THEREOF
  • 2026-07-02US20260187364METHOD AND APPARATUS WITH LANGUAGE INPUT PROCESSING
  • 2026-07-02US20260187379METHOD AND APPARATUS WITH EVENT EXTRACTION
  • 2026-07-02US20260188149PROJECTION DEVICE AND OPERATING METHOD THEREOF
  • 2026-07-02US20260188357MEMORY DEVICES
  • 2026-07-02US20260188381MULTI-CHIP PACKAGE AND MEMORY SYSTEM
  • 2026-07-02US20260188385NAND FLASH MEMORY DEVICE AND OPERATING METHOD THEREOF
  • 2026-07-02US20260188412SEMICONDUCTOR DEVICE AND METHOD
  • 2026-07-02US20260189624METHOD OF TRANSMITTING DATA BY ELECTRONIC DEVICE TO SERVER AND SYSTEM THEREFOR
  • 2026-06-25US20260178110ELECTRONIC DEVICE COMPRISING CONTROL CIRCUITRY TO REDUCE STANDBY POWER AND METHOD THEREOF
  • 2026-06-25US20260178120DISPLAY DEVICE AND OPERATING METHOD THEREOF
  • 2026-06-25US20260178129METHOD OF CONTROLLING ELECTRONIC DEVICE BY USING WEARABLE DEVICE, AND WEARABLE DEVICE PERFORMING THE METHOD
  • 2026-06-25US20260178215STORAGE SYSTEM HAVING ADAPTIVE CHANNEL CONFIGURATION AND OPERATING METHOD OF STORAGE CONTROLLER
  • 2026-06-25US20260178232STORAGE DEVICE, METHOD OF OPERATING THE STORAGE DEVICE, AND SYSTEM FOR TIME SYNCHRONIZATION-BASED COMMAND SCHEDULING
  • 2026-06-25US20260178265ELECTRONIC DEVICE, METHOD, AND NON-TRANSITORY STORAGE MEDIUM FOR EDITING AUDIO
  • 2026-06-25US20260178274PROCESSOR AND METHOD WITH ACCELERATOR ACCESS CONTROL
  • 2026-06-25US20260178340METHOD AND DEVICE FOR AUTOMATICALLY INTEGRATING HARDWARE BASED ON CONFIGURATION FILE
  • 2026-06-25US20260178384ELECTRONIC DEVICE AND METHOD WITH TASK ALLOCATION
  • 2026-06-25US20260178472METHOD AND ELECTRONIC DEVICE WITH TRAINING MODEL DATA PROCESSING
  • 2026-06-25US20260178481MEMORY CONTROLLER, STORAGE DEVICE INCLUDING THE SAME, AND OPERATING METHOD THEREOF
  • 2026-06-25US20260178517CXL DEVICE AND SYSTEM
  • 2026-06-25US20260178580ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF
  • 2026-06-25US20260178594APPARATUS AND METHOD WITH VISUAL QUESTION ANSWERING
  • 2026-06-25US20260178640ELECTRONIC DEVICE FOR PROVIDING CONTENT SEARCH FOR SENTENCE-LIKE UTTERANCES AND OPERATING METHOD THEREOF
  • 2026-06-25US20260178651METHOD AND APPARATUS FOR DATA GENERATION
  • 2026-06-25US20260178656ELECTRONIC DEVICE, METHOD, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM TO GENERATE MEDIA COLLECTION INCLUDING MEDIA CONTENTS
  • 2026-06-25US20260178738ELECTRONIC DEVICE, METHOD, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM TO RESTORE STATE OF FIRMWARE PROGRAM
  • 2026-06-25US20260178814COMPUTING DEVICE AND VERIFICATION METHOD FOR PERFORMING VERIFICATION ON LAYOUT OF INTEGRATED CIRCUITS
  • 2026-06-25US20260178863MULTIMODAL REAL-TIME SIMULTANEOUS SCAN
  • 2026-06-25US20260179690MEMORY DEVICE AND METHOD OF OPERATING THE SAME
  • 2026-06-25US20260179694VOLTAGE GENERATOR, MEMORY DEVICE AND STORAGE DEVICE COMPRISING THE SAME
  • 2026-06-25US20260179711SEMICONDUCTOR MEMORY DEVICE INCLUDING ONE-TIME PROGRAMMABLE MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME
  • 2026-06-25US20260179715STORAGE CONTROLLER PERFORMING ODT TRAINING, METHOD OF OPERATING THE SAME, AND METHOD OF OPERATING STORAGE SYSTEM INCLUDING THE SAME
  • 2026-06-25US20260181365ELECTRONIC DEVICE AND METHOD FOR CONTROLLING THE SAME
  • 2026-06-25US20260181854SEMICONDUCTOR DEVICES
  • 2026-06-25US20260181855SEMICONDUCTOR DEVICE COMPRISING A 2-TRANSISTOR (2T) MEMORY CELL AND METHOD OF MANUFACTURING THE SAME

Buys from ← 21

🇨🇳 Primarius ai_chips L2 50
🇹🇼 MediaTek networking L2 50
🇯🇵 SUMCO ai_chips → HBM (High Bandwidth Memory) L3 50
🇺🇸 Qualcomm compute → Exynos AI L3 50
🇨🇳 Robotera humanoid L2
🇺🇸 Cadence Design ai_chips → NPU (Neural Processing Unit) L3 50
🇰🇷 Samsung Electro-Mechanics advanced_packaging L2 50
🇨🇳 Empyrean ai_chips → NPU (Neural Processing Unit) L3 50
🇺🇸 Synopsys ai_chips → NPU (Neural Processing Unit) L3 50
🇺🇸 Arteris ai_compute L2 50
🇺🇸 Micron hbm → HBM (High Bandwidth Memory) L3 50
🇯🇵 Ibiden advanced_packaging L2 50
🇨🇭 STMicroelectronics imu L2 50
🇺🇸 Lam Research ai_chips → Exynos AI L3 50
🇬🇧 Arm ai_chips → Exynos AI L3 50
🇯🇵 Tokyo Ohka Kogyo ai_chips → HBM (High Bandwidth Memory) L3 50
🇹🇼 Powertech osat → HBM (High Bandwidth Memory) L3 50
🇺🇸 FormFactor ai_compute → HBM (High Bandwidth Memory) L3 50
🇯🇵 Advantest ai_chips → HBM (High Bandwidth Memory) L3 50
🇯🇵 TDK InvenSense imu L2 50
🇩🇪 Siltronic ai_chips → HBM (High Bandwidth Memory) L3 50

Supplies → 8

🇺🇸 Tesla foundry → Tesla Optimus L3 80
🇨🇳 OmniVision ai_chips L2 50
🇺🇸 Tesla ai_chips → Full Self-Driving (FSD) (Supervised) L3 50
🇺🇸 MaxLinear ai_chips L2 50
🇺🇸 Tesla ai_chips → Tesla Optimus L3 50
🇺🇸 NVIDIA ai_chips L2 50
🇺🇸 Applied Materials ai_chips L2 53
🇺🇸 Qualcomm ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Memory solutions for AINPU (Neural Processing Unit)HBM (High Bandwidth Memory)Exynos AI

Samsung SDIpublicProduct-grade

physical ai · 🇰🇷 South Korea · KRX: 006400 · 83 sources · 7 products · 2050 patents

$8.9Brevenue · FY2025 · USD$22.6B mkt cap

Li-ion cells

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $9.6BFY2021: $11.8BFY2022: $15.6BFY2023: $16.4BFY2024: $12.2BFY2025: $9.3B wins 2024-08-31 · Lotte Energy Materials → physical_ai — click for source2024-01-08 · EcoPro BM → physical_ai — click for source events 2026-07-30 · disclosure — Samsung SDI will hold an investor relations conference call on July 30, 2026 at 14:00 to discuss Q2 2026 operating results and outlook, conducted via conference call with simultaneous Korean and English webcasting.2026-07-02 · disclosure — Samsung SDI disclosed future business and management plans.2026-06-30 · related party deal — Samsung SDI decided on a monetary loan transaction.2026-06-30 · disclosure — Samsung SDI disclosed sustainability management report and related matters.2026-06-30 · financial — Samsung SDI sank 4.88 percent to 487,000 won following battery share retreat.2026-06-11 · financial — Samsung SDI went down 5.14 percent on Seoul stock exchange on June 11, 2026.2026-06-10 · disclosure — Samsung SDI filed notification of change in major shareholder stock ownership.2026-06-10 · financial — Samsung SDI went down 0.58 percent in Seoul trading on June 10, 2026.2026-06-01 · disclosure — Samsung SDI disclosed corporate governance report.2026-06-01 · disclosure — Samsung SDI disclosed large conglomerate status and quarterly individual company information.2026-05-28 · financial — Samsung SDI rose 3.97 percent on Thursday.2026-05-28 · financial — Samsung SDI jumped 7.14 percent on strength in battery and auto shares sector.2026-05-15 · financial report — Samsung SDI filed quarterly report for Q1 2026.2026-05-13 · financial — Samsung SDI pulled back 3.34 percent in Seoul trading.2026-05-12 · financial — Samsung SDI nosedived 8.04 percent to 629,000 won amid market decline.2026-05-11 · disclosure — Samsung SDI filed notification of change in major shareholder stock ownership.2026-04-28 · financial report — Samsung SDI reports consolidated interim operating results.2026-04-28 · related party deal — Samsung SDI reported a gift transaction to a related party.2026-04-22 · financial — Samsung SDI gained 2.17 percent as battery shares led market advance on strong first quarter earnings expectations.2026-04-14 · disclosure — Samsung SDI announces investor relations briefing session.
  • 2026-07-30 disclosure Samsung SDI will hold an investor relations conference call on July 30, 2026 at 14:00 to discuss Q2 2026 operating results and outlook, conducted via conference call with simultaneous Korean and English webcasting.
  • 2026-07-02 disclosure Samsung SDI disclosed future business and management plans.
  • 2026-06-30 related party deal Samsung SDI decided on a monetary loan transaction.
  • 2026-06-30 disclosure Samsung SDI disclosed sustainability management report and related matters.
  • 2026-06-30 financial Samsung SDI sank 4.88 percent to 487,000 won following battery share retreat.
  • 2026-06-11 financial Samsung SDI went down 5.14 percent on Seoul stock exchange on June 11, 2026.
  • 2026-06-10 disclosure Samsung SDI filed notification of change in major shareholder stock ownership.
  • 2026-06-10 financial Samsung SDI went down 0.58 percent in Seoul trading on June 10, 2026.
  • 2026-06-01 disclosure Samsung SDI disclosed corporate governance report.
  • 2026-06-01 disclosure Samsung SDI disclosed large conglomerate status and quarterly individual company information.
  • 2026-05-28 financial Samsung SDI rose 3.97 percent on Thursday.
  • 2026-05-28 financial Samsung SDI jumped 7.14 percent on strength in battery and auto shares sector.
  • 2026-05-15 financial report Samsung SDI filed quarterly report for Q1 2026.
  • 2026-05-13 financial Samsung SDI pulled back 3.34 percent in Seoul trading.
  • 2026-05-12 financial Samsung SDI nosedived 8.04 percent to 629,000 won amid market decline.
  • 2026-05-11 disclosure Samsung SDI filed notification of change in major shareholder stock ownership.
  • 2026-04-28 financial report Samsung SDI reports consolidated interim operating results.
  • 2026-04-28 related party deal Samsung SDI reported a gift transaction to a related party.
  • 2026-04-22 financial Samsung SDI gained 2.17 percent as battery shares led market advance on strong first quarter earnings expectations.
  • 2026-04-14 disclosure Samsung SDI announces investor relations briefing session.
  • 2024-08-31 design-win Lotte Energy Materials → physical_ai source ↗
  • 2024-01-08 design-win EcoPro BM → physical_ai source ↗

Patents — 2050 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 1962
Other 66
Computing 11
Power electronics 4
IMU / navigation 3
Robotics / manipulators 3
Imaging / cameras 1

IP chokepoint in: Batteries

Newest 2 of 2050, most recent first — all on Google Patents →

  • 2026-03-19US20260081199APPARATUS AND METHOD FOR MANUFACTURING SECONDARY BATTERY
  • 2025-07-31US2025246708HEAT TRANSFER DEVICE AND SECONDARY BATTERY INCLUDING THE HEAT TRANSFER DEVICE

Buys from ← 3

🇰🇷 POSCO Future M physical_ai → NCA (Nickel Cobalt Aluminum) Cells L3 50
🇰🇷 Lotte Energy Materials physical_ai L2 50
🇰🇷 EcoPro BM physical_ai → NCA (Nickel Cobalt Aluminum) Cells L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

NCA (Nickel Cobalt Aluminum) CellsEV Battery ModulesEnergy Storage Systems (ESS)LFP (Lithium Iron Phosphate) CellsPrismatic CellsPouch CellsNCM (Nickel Cobalt Manganese) Cells

Sandvik ABpublicRelationships + financials

- · 🇸🇪 Sweden · 1 sources · 0 products

$12.5Brevenue · FY2025 · USD$424.1B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $9.0BFY2021: $10.3BFY2022: $11.6BFY2023: $13.1BFY2024: $12.7BFY2025: $12.5B wins 2026-07-17 · → SKF steel — click for source events
  • 2026-07-17 reported edge → SKF steel source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$9.0B '20
$10.3B '21
$11.6B '22
$13.1B '23
$12.7B '24
$12.5B '25

operating income

$1.2B '20
$2.0B '21
$1.9B '22
$2.3B '23
$1.9B '24
$2.2B '25

net income

$905M '20
$1.5B '21
$1.2B '22
$1.6B '23
$1.3B '24
$1.5B '25

Supplies → 1

🇸🇪 SKF steel L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Sanyo Special Steel Co., Ltd.publicRelationships + financials

- · 🇯🇵 Japan · 1 sources · 0 products

$2.2Brevenue · FY2024 · USD$149.5B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $1.6BFY2021: $1.3BFY2022: $2.2BFY2023: $2.4BFY2024: $2.2B wins 2026-07-17 · → JTEKT steel — click for source2026-07-17 · → Nabtesco steel — click for source2026-07-17 · → Harmonic Drive steel — click for source2026-07-17 · → THK steel — click for source2026-07-17 · → NSK steel — click for source events
  • 2026-07-17 reported edge → JTEKT steel source ↗
  • 2026-07-17 reported edge → Nabtesco steel source ↗
  • 2026-07-17 reported edge → Harmonic Drive steel source ↗
  • 2026-07-17 reported edge → THK steel source ↗
  • 2026-07-17 reported edge → NSK steel source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.6B '20
$1.3B '21
$2.2B '22
$2.4B '23
$2.2B '24

operating income

$-9M '20
$-34M '21
$132M '22
$175M '23
$70M '24

net income

$-23M '20
$-42M '21
$94M '22
$128M '23
$56M '24

Supplies → 5

🇯🇵 JTEKT steel L2
🇯🇵 Nabtesco steel L2
🇯🇵 Harmonic Drive steel L2
🇯🇵 THK steel L2
🇯🇵 NSK steel L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

SchaefflerpublicProduct-grade

physical ai · 🇩🇪 Germany · FWB: SHA · 10 sources · 7 products · 2735 patents

$26.9Brevenue · FY2025 · USD$3.5B mkt cap

Schaeffler AG is a German industrial and automotive supplier producing bearings and precision components under the FAG and INA brands, along with linear guides and actuation systems. Founded in 1946 and headquartered in Herzogenaurach, it is publicly listed.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $14.4BFY2021: $15.9BFY2022: $18.1BFY2023: $18.7BFY2024: $20.8BFY2025: $26.9B wins 2026-07-17 · Ovako → physical_ai — click for source2024-11-14 · Agility Robotics → humanoid — click for source2024-02-21 · → Rainbow Robotics roller_screws — click for source2026-05-15 · Agility Robotics → humanoid — click for source2026-07-16 · → NEURA Robotics roller_screws — click for source2024-11-14 · Agility Robotics → humanoid — click for source2024-01-12 · Ningbo Yunsheng → rare_earth_magnets — click for source events 2026-07-07 · other — Schaeffler participated in IAA MOBILITY 2025 and pre-registered for IAA MOBILITY 2027.

Rolled up across Schaeffler + its subsidiaries

  • 2026-07-17 reported edge Ovako → physical_ai source ↗
  • 2026-07-16 reported edge → NEURA Robotics roller_screws source ↗
  • 2026-07-07 other Schaeffler participated in IAA MOBILITY 2025 and pre-registered for IAA MOBILITY 2027.
  • 2026-05-15 design-win Agility Robotics → humanoid source ↗
  • 2024-11-14 reported edge Agility Robotics → humanoid source ↗
  • 2024-11-14 reported edge Agility Robotics → humanoid source ↗
  • 2024-02-21 design-win → Rainbow Robotics roller_screws source ↗
  • 2024-01-12 design-win Ningbo Yunsheng → rare_earth_magnets source ↗

Patents — 2735 CPC-scoped to physical ai (physical-AI-relevant classes)

Electric motors 1089
Gears / reducers 775
Bearings 408
Batteries 211
Power electronics 114
Robotics / manipulators 52
Force / torque sensors 29
Other 26
Lidar / ranging 25
IMU / navigation 5
Computing 1

IP chokepoint in: Bearings, Electric motors, Gears / reducers, Robotics / manipulators

Newest 11 of 2735, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$14.8B '16
$15.8B '17
$16.3B '18
$16.5B '19
$14.4B '20
$15.9B '21
$18.1B '22
$18.7B '23
$20.8B '24
$26.9B '25

operating income

$1.8B '16
$1.8B '17
$1.6B '18
$1.4B '19
$0M '20
$0M '21
$0M '22
$0M '23
$1.6B '24
$736M '25

net income

$951M '16
$1.1B '17
$1.0B '18
$489M '19
$-489M '20
$865M '21
$637M '22
$335M '23
$-723M '24
$-485M '25

Buys from ← 4

🇺🇸 Agility Robotics humanoid L2
🇺🇸 Agility Robotics humanoid L2 50
🇺🇸 Agility Robotics humanoid L2
🇨🇳 Ningbo Yunsheng rare_earth_magnets → Magnetic Couplings L3 50

Supplies → 2

🇰🇷 Rainbow Robotics roller_screws → HUBO L3 50
🇩🇪 NEURA Robotics roller_screws → 4NE-1 L3

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

INALinear GuidesActuation SystemsMagnetic CouplingsFAGVibration DampersRoller Screws

Screen HoldingspublicProduct-grade

ai compute · 🇯🇵 Japan · TSE: 7735 · 21 sources · 0 products · 2031 patents

$4.0Brevenue · FY2026 · USD$19.2B mkt cap

Cleaning/track

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $3.0BFY2021: $2.0BFY2022: $2.5BFY2023: $2.8BFY2024: $3.1BFY2025: $3.9BFY2026: $4.0B wins 2026-06-01 · → Intel ai_chips — click for source events 2025-04-01 · financial report — SCREEN Holdings reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2026-06-01 design-win → Intel ai_chips source ↗
  • 2025-04-01 financial report SCREEN Holdings reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Patents — 2031 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 1607
Computing 319
Robotics / manipulators 48
Imaging / cameras 30
Other 22
Force / torque sensors 2
IMU / navigation 2
Bearings 1

Newest 9 of 2031, most recent first — all on Google Patents →

  • 2026-07-02US20260184089PRINTING APPARATUS AND PRINTING SYSTEM
  • 2025-11-27WO2025243849PRINTING SYSTEM, MAINTENANCE SYSTEM, REMOTE MAINTENANCE SYSTEM FOR PRINTING DEVICE, COMPUTER PROGRAM, RECORDING MEDIUM, AND REMOTE MAINTENANCE METHOD FOR PRINTING DEVICE
  • 2025-09-25US2025298556VALIDITY VERIFICATION METHOD FOR PRINT DATA AND PRINTING SYSTEM
  • 2025-01-09US2025013406PRINT DATA GENERATION DEVICE AND PRINT DATA GENERATION METHOD
  • 2024-12-05WO2024247598WORK ASSISTANCE METHOD AND WORK ASSISTANCE SYSTEM
  • 2024-12-05WO2024247625WORK ASSISTANCE METHOD AND WORK ASSISTANCE SYSTEM
  • 2024-10-31WO2024225263DATA PROCESSING METHOD, DEVICE, AND MACHINE DEVICE
  • 2024-08-22US2024281033SCREEN PROTECTOR WITH ENGRAVED IMAGE
  • 2024-07-04WO2024142814WORK ASSISTING METHOD AND WORK ASSISTING SYSTEM

Financials — multi-year, confidence 1.0 (filings)

revenue

$3.3B '19
$3.0B '20
$2.0B '21
$2.5B '22
$2.8B '23
$3.1B '24
$3.9B '25
$4.0B '26

operating income

$267M '19
$116M '20
$231M '21
$378M '22
$566M '23
$580M '24
$891M '25
$814M '26

net income

$163M '19
$46M '20
$93M '21
$281M '22
$354M '23
$434M '24
$653M '25
$611M '26

Sources: 株式会社SCREENホールディングス — 半期報告書-第85期(2025/04/01-2026/03/31) · 株式会社SCREENホールディングス — 臨時報告書 · 株式会社SCREENホールディングス — 有価証券報告書-第85期(2025/04/01-2026/03/31) · 株式会社SCREENホールディングス — 臨時報告書

Supplies → 1

🇺🇸 Intel ai_chips → Gaudi Accelerators L3 53

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Shin-Etsu ChemicalpublicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 4063 · 17 sources · 5 products · 576 patents

$15.9Brevenue · FY2026 · USD$81.9B mkt cap

Rare-earth magnets; silicon wafers

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $14.2BFY2021: $9.2BFY2022: $12.8BFY2023: $20.8BFY2024: $14.9BFY2025: $15.8BFY2026: $15.9B wins 2026-07-17 · → Yaskawa Electric rare_earth_magnets — click for source events 2025-04-01 · financial report — Shin-Etsu Chemical reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2026-07-17 reported edge → Yaskawa Electric rare_earth_magnets source ↗
  • 2025-04-01 financial report Shin-Etsu Chemical reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Patents — 576 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 489
Other 46
Electric motors 19
Lidar / ranging 7
Force / torque sensors 6
Bearings 6
Semiconductors 2
Robotics / manipulators 1

Newest 3 of 576, most recent first — all on Google Patents →

  • 2013-11-21WO2013171960HEAT CONDUCTIVE SHEET SUPPLYING BODY AND HEAT CONDUCTIVE SHEET SUPPLYING METHOD
  • 2011-03-17WO2011030409ROTOR FOR PERMANENT MAGNET TYPE ROTARY MACHINE
  • 2009-03-19WO2009034990PERMANENT MAGNET ROTATING MACHINE

Financials — multi-year, confidence 1.0 (filings)

revenue

$14.4B '19
$14.2B '20
$9.2B '21
$12.8B '22
$20.8B '23
$14.9B '24
$15.8B '25
$15.9B '26

operating income

$3.6B '19
$3.7B '20
$2.4B '21
$4.2B '22
$6.1B '23
$4.3B '24
$4.9B '25
$4.2B '26

net income

$2.8B '19
$2.9B '20
$1.8B '21
$3.1B '22
$4.4B '23
$3.2B '24
$3.5B '25
$3.2B '26

Sources: 信越化学工業株式会社 — 有価証券報告書-第149期(2025/04/01-2026/03/31) · 信越化学工業株式会社 — 半期報告書-第149期(2025/04/01-2026/03/31) · 信越化学工業株式会社 — 臨時報告書 · 信越化学工業株式会社 — 臨時報告書

Supplies → 1

🇯🇵 Yaskawa Electric rare_earth_magnets L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Samarium Cobalt MagnetsNeodymium MagnetsPolycrystalline SiliconSilicon WafersRare Earth Magnetic Materials

Shinko Electric IndustriespublicProduct-grade

ai compute · 🇯🇵 Japan · TSE: 6967 · 1 sources · 5 products · 34 patents

$1.3Brevenue · FY2025 · USD$4.9B mkt cap

IC substrates

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $914MFY2021: $1.2BFY2022: $2.4BFY2023: $2.1BFY2024: $1.3BFY2025: $1.3B wins 2023-04-20 · → NVIDIA advanced_packaging — click for source2023-04-20 · → Advanced Micro Devices advanced_packaging — click for source events
  • 2023-04-20 design-win → NVIDIA advanced_packaging source ↗
  • 2023-04-20 design-win → Advanced Micro Devices advanced_packaging source ↗

Patents — 34 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 31
Computing 3

Newest 3 of 34, most recent first — all on Google Patents →

  • 2003-03-18US6535222Method of preparing masking layer
  • 1999-08-10US5936642Parallel graphic processing system using a network
  • 1999-01-28WO9904354A LICENSE MANAGEMENT SYSTEM

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.3B '18
$1.3B '19
$914M '20
$1.2B '21
$2.4B '22
$2.1B '23
$1.3B '24
$1.3B '25

operating income

$44M '18
$44M '19
$20M '20
$144M '21
$440M '22
$473M '23
$153M '24
$156M '25

net income

$33M '18
$23M '19
$25M '20
$170M '21
$324M '22
$336M '23
$129M '24
$110M '25

Supplies → 3

🇺🇸 NVIDIA advanced_packaging → Data center GPUs / AI accelerators L3 50
🇺🇸 Advanced Micro Devices advanced_packaging → Instinct MI300X L3 50
🇺🇸 Intel advanced_packaging → Gaudi Accelerators L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

High-frequency SubstratesHigh-Density Interconnect (HDI) SubstratesFlip-Chip SubstratesABF SubstratesBT Substrates

Shuanghuan DrivelinepublicRelationships + financials

physical ai · 🇨🇳 China · SZSE: 002472 · 2 sources · 0 products · 11 patents

$1.3Brevenue · FY2025 · USD$4.7B mkt cap

Shuanghuan Driveline is a China-based manufacturer of precision gears and driveline components, including transmission systems used in automotive and industrial automation applications. It is publicly listed in China.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $542MFY2021: $795MFY2022: $1.0BFY2023: $1.2BFY2024: $1.3BFY2025: $1.3B wins 2026-05-26 · → ABB Robotics planetary_reducers — click for source events
  • 2026-05-26 design-win → ABB Robotics planetary_reducers source ↗

Patents — 11 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 11

Financials — multi-year, confidence 1.0 (filings)

revenue

$477M '18
$468M '19
$542M '20
$795M '21
$1.0B '22
$1.2B '23
$1.3B '24
$1.3B '25

operating income

$33M '18
$15M '19
$13M '20
$59M '21
$92M '22
$139M '23
$178M '24
$222M '25

net income

$30M '18
$11M '19
$8M '20
$48M '21
$86M '22
$120M '23
$151M '24
$186M '25

Supplies → 1

🇨🇭 ABB Robotics planetary_reducers L2 53

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

SiemenspublicFinancials only

physical ai · 🇩🇪 Germany · 35 sources · 0 products · 2000 patents

$90.2Brevenue · FY2025 · USD$206.5B mkt cap

Parent (created for subsidiary mapping).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $63.2BFY2021: $71.2BFY2022: $82.3BFY2023: $85.6BFY2024: $86.8BFY2025: $90.2B wins 2025-08-27 · NVIDIA → ai_chips — click for source2025-05-06 · Advanced Micro Devices → merchant_gpu — click for source events 2026-05-31 · product launch — Siemens is integrating NVIDIA NemoClaw and OpenShell into Fuse EDA AI Agent for chip design and circuit board system design.

Rolled up across Siemens + its subsidiaries

  • 2026-05-31 product launch Siemens EDA Siemens is integrating NVIDIA NemoClaw and OpenShell into Fuse EDA AI Agent for chip design and circuit board system design.
  • 2025-08-27 design-win NVIDIA → ai_chips source ↗
  • 2025-05-06 design-win Advanced Micro Devices → merchant_gpu source ↗

Patents — 2000 CPC-scoped to physical ai (physical-AI-relevant classes)

Power electronics 573
Electric motors 553
Robotics / manipulators 377
Batteries 166
Lidar / ranging 87
Imaging / cameras 74
Computing 64
Force / torque sensors 32
IMU / navigation 27
Bearings 26
Gears / reducers 10
Semiconductors 7
Other 4

Financials — multi-year, confidence 1.0 (filings)

revenue

$63.2B '20
$71.2B '21
$82.3B '22
$85.6B '23
$86.8B '24
$90.2B '25

operating income

$5.4B '20
$7.6B '21
$8.5B '22
$10.8B '23
$10.9B '24
$10.4B '25

net income

$4.6B '20
$6.0B '21
$4.3B '22
$9.1B '23
$9.5B '24
$11.0B '25

SiltronicpublicProduct-grade

ai compute · 🇩🇪 Germany · FWB: WAF · 7 sources · 4 products · 134 patents

$1.5Brevenue · FY2025 · USD$2.8B mkt cap

Silicon wafers

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.4BFY2021: $1.7BFY2022: $2.1BFY2023: $1.7BFY2024: $1.6BFY2025: $1.5B wins events

Patents — 134 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 129
Robotics / manipulators 5

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.7B '18
$1.4B '19
$1.4B '20
$1.7B '21
$2.1B '22
$1.7B '23
$1.6B '24
$1.5B '25

operating income

$588M '18
$334M '19
$220M '20
$375M '21
$568M '22
$250M '23
$136M '24
$-38M '25

net income

$441M '18
$253M '19
$184M '20
$300M '21
$411M '22
$199M '23
$72M '24
$-79M '25

Supplies → 5

🇺🇸 Micron ai_chips L2 50
🇹🇼 Taiwan Manufacturing ai_chips L2 50
🇩🇪 Infineon ai_chips → Power semiconductors L3 50
🇺🇸 Intel ai_chips L2 50
🇰🇷 Samsung Electronics ai_chips → HBM (High Bandwidth Memory) L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

150mm Silicon Wafers300mm Silicon WafersHyperpure Silicon Wafers200mm Silicon Wafers

SK hynix Inc.publicProduct-grade

ai compute · 🇰🇷 South Korea · KRX: 000660 · 344 sources · 2 products · 2098 patents

$64.4Brevenue · FY2025 · USD$881.9B mkt cap

South Korean memory-chip maker; global HBM leader (~57-62% share) and key supplier to NVIDIA. Founded 1983 (as Hyundai Electronics), into SK Group 2012. HQ Icheon, Gyeonggi.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $27.0BFY2021: $37.5BFY2022: $34.5BFY2023: $25.1BFY2024: $48.5BFY2025: $68.3B wins 2026-06-01 · NVIDIA → ai_chips — click for source2025-11-05 · ACM Research → ai_chips — click for source2026-07-12 · ASML → ai_chips — click for source2026-01-28 · → Microsoft hbm — click for source2026-07-13 · → Advanced Micro Devices hbm — click for source2026-07-10 · FormFactor → ai_compute — click for source2026-07-13 · → Tesla hbm — click for source2025-07-28 · Cadence Design → ai_chips — click for source2026-01-21 · Advantest → ai_chips — click for source2025-03-18 · → NVIDIA hbm — click for source2025-11-06 · Tokyo Ohka Kogyo → ai_chips — click for source2025-07-11 · → Applied Materials hbm — click for source events 2026-07-29 · disclosure — SK hynix Inc. will hold an investor relations conference call on July 29, 2026 at 09:00 to present Q2 2026 financial results, with simultaneous webcast in Korean and English.2026-07-17 · financial — US-listed shares of SK Hynix plummeted by over 13% during Thursday's market selloff in AI chip-related stocks.2026-07-17 · financial — SK hynix shares have nearly tripled since the beginning of 2026 and the company overtook Samsung Electronics to become Korea's most valuable listed company by market capitalization for the first time in 25 years.2026-07-16 · financial — SK hynix tumbled 11.19 percent on the KOSPI on July 16, 2026, leading chipmaker declines amid broader tech stock losses.2026-07-16 · financial — SK Hynix ADRs plummeted 9% on Thursday, dragging the KOSPI index down more than 6%.2026-07-16 · financial — SK hynix tumbled 11.53 percent to 1,842,000 won in Seoul trading as semiconductor industry concerns pressured the index.2026-07-16 · financial — SK Hynix shares dropped 10.95% in Seoul on July 16, 2026, reversing the previous session's rally.2026-07-16 · financial — SK Hynix shares fell over 5% in South Korea following its strong Nasdaq debut, with a South Korean brokerage lowering its second-quarter earnings forecast.2026-07-16 · financial — SK Hynix tumbled more than 11 percent in regional chipmaker selloff.2026-07-16 · financial — KIS projected SK Hynix's second-quarter operating profit at 60.4 trillion won, roughly 8% below the 65 trillion won market consensus, due to heavy reliance on long-term fixed-price contracts for premium HBM chips.2026-07-16 · financial — SK hynix stock tumbled as much as 11.7% on renewed selling in chipmaker shares.2026-07-16 · financial — SK hynix tumbled 11.53 percent to 1,842,000 won in Seoul trading on July 16, 2026.2026-07-15 · regulatory — South Korean regulators warned about leveraged ETFs tracking SK Hynix, with 2x leveraged products approved in late May growing to over $9 billion.2026-07-14 · capital raised — SK hynix Inc. is issuing 17,790,000 ordinary shares at KRW 2,249,751 per share (totaling KRW 40,023,070,290,000) via third-party allocation to Citibank, N.A. as depositary for underlying American Depositary Receipts (ADRs) to be offered publicly in the United States at USD 149.002026-07-14 · capital raised — SK hynix issued 17,790,000 ordinary shares (via ADR) to overseas institutional investors for USD 26,507,100,000 (KRW 39,890,534,790,000) on July 14, 2026, with 10 ADRs issued per ordinary share at USD 1,490 per 10 ADRs. Proceeds designated for facility investments.2026-07-14 · capital raised — SK hynix decided to issue 17,790,000 new common shares at 2,249,751 KRW per share (2.72% premium to reference price of 2,190,229 KRW) via third-party allotment to raise 40,023,070,290,000 KRW for facility investments, with all shares deposited as American Depositary Receipts (ADR2026-07-14 · capital raised — SK hynix issued 17,790,000 new ordinary shares via third-party placement to Citibank, N.A. (as overseas depositary) for KRW 39,890,534,790,000 (approximately USD 26,507,100,000 in ADRs) on July 14, 2026, with the shares to be converted into American Depositary Receipts for overse2026-07-13 · financial — SK hynix Inc. (SKHY) was trading at $151.61 with 3,804,023 shares traded in pre-market activity on July 13, 2026.2026-07-13 · financial — SK hynix ADR dropped nearly 10% on concerns about rising oil prices and interest rates affecting semiconductor sector.2026-07-10 · financial — SK Hynix raised $26.5 billion in the second-largest U.S. share sale in history, debuting on Nasdaq with shares rising 12.8% on first day of trading.2026-07-10 · executive change — CEO Kwak Noh-Jung presented SK hynix's AI memory vision at the Nasdaq Opening Bell event.2026-07-10 · financial — SK hynix listed American Depositary Receipts (ADRs) on NASDAQ, elevating its global status at the heart of capital markets.2026-07-10 · financial — SK hynix listed American Depositary Receipts (ADRs) on NASDAQ stock market on July 10, 2026.2026-07-10 · product launch — SK hynix showcased its HBM (High Bandwidth Memory) as a flagship high-performance AI memory product through an anamorphic 3D display campaign in Times Square.2026-07-10 · financial — SK hynix marked the trading debut of its American depositary receipt (ADR) on Nasdaq.2026-07-10 · capital raised — SK hynix Inc. listed 177,900,000 American Depositary Shares (ADRs), representing 17,790,000 ordinary shares, on the Nasdaq Global Select Market on July 10, 2026, with payment settlement on July 14, 2026 and ADR issuance on July 15, 2026.2026-07-10 · financial — SK hynix edged down 0.23 percent after opening higher in Seoul trading.2026-07-10 · financial — SK hynix listed American Depositary Receipts (ADRs) on NASDAQ, marking a historic milestone in its global market expansion.2026-07-10 · financial — SK Hynix raised $26.5 billion in the largest U.S. listing ever by a foreign company and the second-largest share sale in U.S. history, debuting on Nasdaq with shares rising 12.8% on first day of trading.2026-07-08 · partnership — SK hynix hosted the 2026 Chungbuk SR Forum with the Chungbuk Institute for Lifelong Education and Human Resources Development to explore AI solutions for digital adoption among seniors.2026-07-08 · financial — SK hynix shares fell 5.68 per cent on July 8, 2026, due to investor concerns about potential memory competition from Chinese suppliers.2026-07-07 · financial — SK hynix experienced declines alongside Samsung Electronics following the announcement of Samsung's quarterly results.2026-07-07 · financial — SK hynix stock is down more than 20% from recent closing highs as of July 7, 2026.2026-07-06 · financial — SK hynix launched plans for a $28 billion US listing.2026-07-05 · financial — SK hynix was the biggest net purchase by the National Pension Service at 108.1 billion won during portfolio rebalancing in July 2026.2026-07-02 · capacity expansion — SK hynix announced a total investment of KRW 100 trillion in Cheongju to build M17 NAND production fab and P&T7 advanced packaging facility.2026-06-30 · financial — SK hynix gained 0.84 percent to 1.65 million won amid semiconductor share recovery.2026-06-30 · capacity expansion — SK hynix announced plans to establish a semiconductor cluster in the Southwestern Region with an investment of approximately KRW 400 trillion to meet surging AI memory demand.2026-06-30 · disclosure — SK Hynix Inc. filed an amended securities registration statement for equity securities.2026-06-30 · capacity expansion — SK Group unveiled plans to build 15GW of AI Data Center infrastructure nationwide, including a 1GW AI data center in the Southwestern Region.2026-06-29 · capacity expansion — SK hynix plans to invest KRW 100 trillion in Cheongju for new NAND fabs, manufacturing equipment, and advanced packaging capabilities for HBM.2026-06-29 · capacity expansion — The Yongin Semiconductor Cluster's fourth fab construction completion is accelerated to 2033 from the original 2045 target, with total Yongin investment reaching KRW 600 trillion.2026-06-29 · capacity expansion — SK hynix established a mid-to-long-term investment strategy totaling KRW 1,100 trillion for semiconductor manufacturing across Yongin, Cheongju, and the Southwestern Region.2026-06-29 · disclosure — SK Hynix Inc. disclosed future business and management plans for fair disclosure purposes.2026-06-29 · capacity expansion — SK hynix will invest KRW 400 trillion in the Southwestern Region to develop a new semiconductor cluster serving as its next major manufacturing hub.2026-06-26 · related party deal — SK hynix Inc. disclosed asset acquisition from a related party.2026-06-26 · financial — SK hynix fell more than 9 percent during Friday's trading session amid semiconductor sell-off.2026-06-26 · related party deal — SK hynix Inc. disclosed changes in product and service transactions with affiliated companies.2026-06-26 · other — SK hynix Inc. reported a major industrial accident occurrence.2026-06-26 · related party deal — SK hynix Inc. disclosed changes in product and service transactions with affiliated companies.2026-06-26 · related party deal — SK hynix Inc. disclosed an internal transaction with a related party.2026-06-26 · related party deal — SK hynix Inc. disclosed asset acquisition from a related party.2026-06-25 · financial — SK hynix soared 9.88 percent in Seoul trading, benefiting from semiconductor sector gains.2026-06-25 · disclosure — SK hynix Inc. voluntarily disclosed matters related to sustainability management report.2026-06-25 · financial — SK Hynix announced plans to raise up to 45.45 trillion won (slightly more than $29 billion) through American depositary receipts.2026-06-24 · capital raised — SK hynix Inc. filed a securities registration statement for equity securities.2026-06-24 · capital raised — SK hynix decided to issue depositary receipts (DR).2026-06-24 · capital raised — SK hynix decided to conduct a paid-in capital increase.2026-06-24 · capital raised — SK hynix decided to list equity securities on overseas securities markets.2026-06-23 · financial — SK hynix stock declined 5.34 percent on Tuesday morning amid a broader tech sector sell-off.2026-06-23 · financial — SK hynix stock dropped approximately 12 percent to 2.555 million won during the Kospi market decline on June 23, 2026.2026-06-22 · financial — SK hynix declined 0.07 percent in Seoul stock trading amid US-Iran peace negotiations uncertainty.2026-06-22 · financial — SK hynix jumped 5.61 percent to 2.92 million won, surpassing Samsung Electronics in terms of market capitalization for the first time.2026-06-18 · financial — SK hynix is among major holdings in the Kospi 200 Index and opened a record $26.5 billion Nasdaq listing.2026-06-18 · financial — SK hynix shares rose 6.51 percent to a record high of 2,685,000 won and surged as much as 8 percent to 2,738,000 won on June 18, 2026.2026-06-17 · capacity expansion — SK hynix achieved 48GB capacity in a 12-layer HBM4E stack using Advanced MR-MUF technology with 17% improved heat resistance compared to HBM4.2026-06-17 · product launch — SK hynix shipped samples of 12-layer HBM4E next-generation DRAM for AI to major customers with 16Gbps per pin speed and 20% improved power efficiency.2026-06-17 · product launch — SK hynix shipped samples of 12-layer HBM4E next-generation DRAM for AI to major customers, featuring 16Gbps per pin speed and 20% improved power efficiency.2026-06-17 · capacity expansion — SK hynix achieved 48GB capacity in 12-layer HBM4E stack using Advanced MR-MUF technology with 17% improved heat resistance.2026-06-16 · disclosure — SK hynix issued a clarification regarding rumors or press reports.2026-06-15 · product launch — SK hynix showcased its full-stack AI memory portfolio including HBM4, HBM3E, CMM-DDR5, eSSD, and server DRAM products at HPED 2026.2026-06-15 · partnership — SK hynix strengthened its strategic partnership with HPE by demonstrating certified products already deployed in HPE servers and co-showcasing CMM-DDR5 installed inside Liqid's CXL Pooled Memory Server.2026-06-11 · financial — SK hynix fell 2.54 percent on Seoul stock exchange on June 11, 2026.2026-06-10 · financial — SK hynix dropped 5.46 percent on Seoul stock exchange tracking US tech losses.2026-06-10 · financial — SK hynix dropped 2.08 percent in Seoul trading on June 10, 2026.2026-06-09 · financial — SK hynix shot up 15.91 percent to 2.2 million won amid AI investment sentiment.2026-06-08 · partnership — SK hynix partnered with NVIDIA to co-develop memory technologies for next-generation AI systems including Vera Rubin AI supercomputers.2026-06-08 · supply deal — SK hynix ordered new high-bandwidth memory production equipment worth 44.2 billion won from Hanmi Semiconductor for HBM4 production.2026-06-08 · partnership — SK hynix will co-develop next-generation memory for Nvidia's AI computing platforms including Vera Rubin supercomputer and Jetson Thor humanoid robotics platform.2026-06-08 · partnership — SK Group Chairman stated the company is elevating its partnership with Nvidia beyond memory cooperation.2026-06-07 · partnership — SK hynix will codevelop next-generation memory for NVIDIA Vera Rubin AI supercomputers, Vera CPUs, RTX Spark-powered PCs and Jetson Thor robotic computing platforms.2026-06-05 · financial — SK hynix fell 8.83 percent in trading on the Korea Composite Stock Price Index.2026-06-04 · financial — SK hynix stock fell 2.63 percent to 2,298,000 won on June 4, 2026.2026-06-02 · financial — SK hynix fell 0.13 percent to close at 2.36 million won.2026-06-02 · financial — SK hynix edged down 0.13 percent to 1,360,000 won amid market volatility.2026-05-29 · disclosure — SK hynix disclosed its corporate governance report.2026-05-29 · related party deal — SK hynix filed a correction to related-party internal transaction disclosure.2026-05-29 · disclosure — SK hynix disclosed large enterprise group status for Q1 quarterly reporting.2026-05-28 · financial — SK hynix slipped 2.45 percent on Thursday amid AI rally pause.2026-05-28 · financial — SK hynix added 0.62 percent in trading amid mixed market sentiment.2026-05-27 · financial — SK hynix soared 9.31 percent to 2.24 million won to become the second South Korean company to top 1,500 trillion won in market value.2026-05-21 · financial — SK hynix advanced 4.53 percent as major chipmakers opened sharply higher tracking overnight gains on Wall Street.2026-05-15 · financial report — SK hynix filed its quarterly report for Q1 2026.2026-05-14 · financial — SK hynix stock rose 0.2 percent on the Korea Composite Stock Price Index.2026-05-13 · financial — SK hynix slipped 2.18 percent in trading amid broader tech sector losses and concerns over AI investment sustainability.2026-05-13 · buyback — SK hynix decided to dispose of treasury shares.2026-05-12 · financial — SK hynix lost 2.39 percent to 1.84 million won amid semiconductor stock pullback.2026-05-11 · litigation — MonolithIC 3D Inc. alleges SK hynix infringed patent 830.2026-05-07 · buyback — SK hynix reported the results of treasury share disposal.2026-05-06 · disclosure — SK hynix disclosed changes in major shareholder equity ownership.2026-05-04 · financial — SK hynix surged 12.52 percent to a fresh record high of 1.4 million won, surpassing 10 trillion won in market capitalization for the first time.2026-04-30 · financial — SK hynix advanced 1.62 percent on stronger market performance driven by AI sector growth.2026-04-30 · financial — SK hynix advanced 1.39 percent on the Seoul stock market following strong earnings reports.2026-04-28 · other — SK hynix decided to acquire exchangeable bonds before maturity.2026-04-23 · related party deal — SK hynix disclosed related-party internal transactions.2026-04-23 · related party deal — SK hynix reported changes to product and service transactions with affiliated companies.2026-04-23 · related party deal — SK hynix filed a correction to related-party internal transaction disclosure.2026-04-23 · financial report — SK hynix reports consolidated provisional operating results on a fair disclosure basis.2026-04-22 · buyback — SK hynix reports decision to dispose of treasury stock.2026-04-22 · dividend — SK hynix sets shareholder registry closure date for cash and in-kind dividend payment.2026-04-22 · disclosure — SK hynix discloses future business and management plans on a fair disclosure basis.2026-04-22 · dividend — SK hynix decides on cash and in-kind dividend payment.2026-04-22 · financial — SK hynix is set to release its first quarter earnings this week.2026-04-09 · disclosure — SK hynix announces holding of investor relations briefing.2026-04-07 · disclosure — SK hynix reports major shareholder stock ownership change.2026-04-07 · disclosure — SK hynix files corrected report on major shareholder stock ownership change.2026-02-20 · litigation — MonolithIC 3D Inc. alleges SK Hynix infringed patent 830.2026-02-03 · litigation — Vervain, LLC alleges SK hynix infringed patent 830.2025-12-31 · financial — SK Hynix reported 97.1 trillion won ($64.1 billion) in revenue in 2025 and net income of 42.9 trillion won ($28.3 billion), implying a net profit margin of 44%.2025-12-31 · financial — SK hynix added more than 2,000 positions in 2025, bringing total employees to 34,549 as of end of 2025, up 2,159 from a year earlier.2025-12-31 · financial — SK Hynix reported 97.1 trillion won ($64.1 billion) in revenue in 2025 and net income of 42.9 trillion won ($28.3 billion), with a net profit margin of 44%.2025-10-14 · litigation — Network System Technologies, LLC alleges SK hynix infringed patent 830.2025-09-01 · product launch — SK hynix began mass production of HBM4 products in September 2025 for Nvidia's Vera Rubin artificial intelligence platform.2024-12-30 · litigation — Advanced Memory Technologies, LLC alleges SK Hynix infringed patent 830.
  • 2026-07-29 disclosure SK hynix Inc. will hold an investor relations conference call on July 29, 2026 at 09:00 to present Q2 2026 financial results, with simultaneous webcast in Korean and English.
  • 2026-07-17 financial US-listed shares of SK Hynix plummeted by over 13% during Thursday's market selloff in AI chip-related stocks.
  • 2026-07-17 financial SK hynix shares have nearly tripled since the beginning of 2026 and the company overtook Samsung Electronics to become Korea's most valuable listed company by market capitalization for the first time in 25 years.
  • 2026-07-16 financial SK hynix tumbled 11.19 percent on the KOSPI on July 16, 2026, leading chipmaker declines amid broader tech stock losses.
  • 2026-07-16 financial SK Hynix ADRs plummeted 9% on Thursday, dragging the KOSPI index down more than 6%.
  • 2026-07-16 financial SK hynix tumbled 11.53 percent to 1,842,000 won in Seoul trading as semiconductor industry concerns pressured the index.
  • 2026-07-16 financial SK Hynix shares dropped 10.95% in Seoul on July 16, 2026, reversing the previous session's rally.
  • 2026-07-16 financial SK Hynix shares fell over 5% in South Korea following its strong Nasdaq debut, with a South Korean brokerage lowering its second-quarter earnings forecast.
  • 2026-07-16 financial SK Hynix tumbled more than 11 percent in regional chipmaker selloff.
  • 2026-07-16 financial KIS projected SK Hynix's second-quarter operating profit at 60.4 trillion won, roughly 8% below the 65 trillion won market consensus, due to heavy reliance on long-term fixed-price contracts for premium HBM chips.
  • 2026-07-16 financial SK hynix stock tumbled as much as 11.7% on renewed selling in chipmaker shares.
  • 2026-07-16 financial SK hynix tumbled 11.53 percent to 1,842,000 won in Seoul trading on July 16, 2026.
  • 2026-07-15 regulatory South Korean regulators warned about leveraged ETFs tracking SK Hynix, with 2x leveraged products approved in late May growing to over $9 billion.
  • 2026-07-14 capital raised SK hynix Inc. is issuing 17,790,000 ordinary shares at KRW 2,249,751 per share (totaling KRW 40,023,070,290,000) via third-party allocation to Citibank, N.A. as depositary for underlying American Depositary Receipts (ADRs) to be offered publicly in the United States at USD 149.00
  • 2026-07-14 capital raised SK hynix issued 17,790,000 ordinary shares (via ADR) to overseas institutional investors for USD 26,507,100,000 (KRW 39,890,534,790,000) on July 14, 2026, with 10 ADRs issued per ordinary share at USD 1,490 per 10 ADRs. Proceeds designated for facility investments.
  • 2026-07-14 capital raised SK hynix decided to issue 17,790,000 new common shares at 2,249,751 KRW per share (2.72% premium to reference price of 2,190,229 KRW) via third-party allotment to raise 40,023,070,290,000 KRW for facility investments, with all shares deposited as American Depositary Receipts (ADR
  • 2026-07-14 capital raised SK hynix issued 17,790,000 new ordinary shares via third-party placement to Citibank, N.A. (as overseas depositary) for KRW 39,890,534,790,000 (approximately USD 26,507,100,000 in ADRs) on July 14, 2026, with the shares to be converted into American Depositary Receipts for overse
  • 2026-07-13 financial SK hynix Inc. (SKHY) was trading at $151.61 with 3,804,023 shares traded in pre-market activity on July 13, 2026.
  • 2026-07-13 financial SK hynix ADR dropped nearly 10% on concerns about rising oil prices and interest rates affecting semiconductor sector.
  • 2026-07-13 reported edge → Advanced Micro Devices hbm source ↗
  • 2026-07-13 reported edge → Tesla hbm source ↗
  • 2026-07-12 design-win ASML → ai_chips source ↗
  • 2026-07-10 financial SK Hynix raised $26.5 billion in the second-largest U.S. share sale in history, debuting on Nasdaq with shares rising 12.8% on first day of trading.
  • 2026-07-10 design-win FormFactor → ai_compute source ↗
  • 2026-06-01 design-win NVIDIA → ai_chips source ↗
  • 2026-01-28 design-win → Microsoft hbm source ↗
  • 2026-01-21 design-win Advantest → ai_chips source ↗
  • 2025-11-06 design-win Tokyo Ohka Kogyo → ai_chips source ↗
  • 2025-11-05 design-win ACM Research → ai_chips source ↗
  • 2025-07-28 design-win Cadence Design → ai_chips source ↗
  • 2025-07-11 design-win → Applied Materials hbm source ↗
  • 2025-03-18 sole-source → NVIDIA hbm source ↗

Patents — 2098 CPC-scoped to ai compute (physical-AI-relevant classes)

Memory 914
Computing 840
Semiconductors 276
Other 58
Power electronics 5
Imaging / cameras 5

IP chokepoint in: Memory

Newest 40 of 2098, most recent first — all on Google Patents →

  • 2026-07-09US20260195045CONTROLLER, A MEMORY DEVICE AND A DATA STORAGE SYSTEM
  • 2026-07-09US20260196251SEMICONDUCTOR DEVICE HAVING A LOCAL LINE BETWEEN CELL MATS
  • 2026-07-02US20260186654DATA LAYOUT FOR LARGE I/O OPERATIONS
  • 2026-07-02US20260186655SYSTEMS, METHODS, AND MEDIA FOR REDUCING PERFORMANCE PENALTIES CAUSED BY READ RE-TRIES
  • 2026-07-02US20260186661METHODS AND DEVICES FOR CACHE MANAGEMENT
  • 2026-07-02US20260186665BALANCED CODES FOR MOVING READ REFERENCES IN MEMORY DEVICES
  • 2026-07-02US20260186668Bit Flipping Decoder Threshold Controlling for Error Correction in Memory Devices
  • 2026-07-02US20260186673METHODS AND SYSTEMS FOR MEMORY BELT ARCHITECTURE MANAGEMENT
  • 2026-07-02US20260186835SYSTEMS, METHODS, AND MEDIA FOR CONTROLLING BANDWIDTH ALLOCATED TO PROCESSING HOSTS REQUESTS AND RELOCATING DATA
  • 2026-07-02US20260186893Latch-Based Low-Density Parity Check (LDPC) Implementations
  • 2026-07-02US20260186894Methods and Systems for Addressing Trapping Bits in Bit Flipping Decoders
  • 2026-07-02US20260186956METHODS AND SYSTEMS FOR STORING DATA IN A MEMORY DEVICE HAVING DYNAMIC NAMESPACE WITH DIFFERENT INDIRECTION UNIT SIZES
  • 2026-07-02US20260186958FLEXIBLE BACKGROUND DATA REFRESH ARCHITECTURE
  • 2026-07-02US20260188358INTERNAL VOLTAGE GENERATION CIRCUITS CONTROLLING DRIVING FORCE FOR DRIVING INTERNAL VOLTAGE
  • 2026-07-02US20260188388MEMORY DEVICE INCLUDING A FILTERING CIRCUIT AND MEMORY SYSTEM INCLUDING THE MEMORY DEVICE
  • 2026-06-25US20260178227DEVICES AND METHODS FOR MANAGING COMMAND RETRIEVAL AND EXECUTION
  • 2026-06-25US20260178229DYNAMIC VOLATILE MEMORY USAGE FOR INPUT AND OUTPUT BUFFERING IN A MEMORY DEVICE
  • 2026-06-25US20260178343DYNAMIC AI MODEL SELECTION AND PRE-LOADING BASED ON DATA TEMPERATURE SCORING AND NEXT PROMPT PREDICTION
  • 2026-06-25US20260178386DYNAMIC VOLATILE MEMORY USAGE FOR IN-MEMORY DATA PROCESSING
  • 2026-06-25US20260178414CONTEXT-AWARE AI MODEL SELECTION
  • 2026-06-25US20260178441DATA STORAGE DEVICE CAPABLE OF RECOVERING ERROR DATA AND METHOD OF OPERATING THE SAME
  • 2026-06-25US20260178477DATA SET STREAMING AND PROCESSING IN COMPUTATIONAL STORAGE DEVICES
  • 2026-06-25US20260178478VOLATILE MEMORY RESOURCE SHARING IN A MEMORY SYSTEM
  • 2026-06-25US20260178479DATA ACCESS MANAGEMENT IN COMPUTATIONAL STORAGE DEVICES
  • 2026-06-25US20260178493HOST MEMORY BUFFER USAGE IN IN-MEMORY DATA PROCESSING IN A MEMORY SYSTEM
  • 2026-06-25US20260178503MULTI-TENANT VOLATILE MEMORY SHARING IN A MEMORY SYSTEM
  • 2026-06-25US20260178532DATA COMMUNICATION FOR COMPUTATIONAL STORAGE FUNCTIONS OF MEMORY DEVICES
  • 2026-06-25US20260178576SYSTEMS AND METHODS FOR GENERATING AND DEPLOYING SPECIALIZED EXPERT SMALL MODELS
  • 2026-06-25US20260178729METHODS AND SYSTEMS FOR MALICIOUS ACTIVITY DETECTION AND PREVENTION
  • 2026-06-25US20260179704MEMORY DEVICE AND MEMORY SYSTEM
  • 2026-06-18US20260169625CONTROLLER, MEMORY DEVICE AND STORAGE DEVICE
  • 2026-06-18US20260169636PROTECTING DATA STORED IN MEMORY
  • 2026-06-18US20260169637STORAGE DEVICE AND METHOD OF OPERATING THE STORAGE DEVICE
  • 2026-06-18US20260169642HARDWARE SECURITY MODULES INTEGRATED IN MEMORY DEVICES AND SYSTEMS
  • 2026-06-18US20260169893DEVICE PERFORMANE ANALYSIS APPARATUS AND METHOD
  • 2026-06-18US20260169925DATA STORAGE DEVICE AND COMPUTING SYSTEM
  • 2026-06-18US20260171159MEMORY DEVICE AND METHOD FOR OPERATING THEREOF
  • 2026-06-18US20260171163MEMORY DEVICE INCLUDING PAGE BUFFER CIRCUIT
  • 2026-06-18US20260173345SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
  • 2026-06-18US20260173460SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

Buys from ← 9

🇺🇸 NVIDIA ai_chips L2 50
🇺🇸 ACM Research ai_chips → HBM (High Bandwidth Memory) L3 50
🇹🇼 Powertech osat → HBM (High Bandwidth Memory) L3 50
🇳🇱 ASML ai_chips L2 50
🇺🇸 FormFactor ai_compute → HBM (High Bandwidth Memory) L3 50
🇺🇸 Cadence Design ai_chips L2 50
🇯🇵 Advantest ai_chips → HBM (High Bandwidth Memory) L3 50
🇯🇵 Tokyo Ohka Kogyo ai_chips → HBM (High Bandwidth Memory) L3 50
🇨🇳 Empyrean ai_chips L2 50

Supplies → 6

🇺🇸 Microsoft hbm → Microsoft Azure L3 60
🇺🇸 Advanced Micro Devices hbm → Instinct MI300X L3
🇺🇸 NVIDIA hbm → Blackwell Ultra platform L3 50
🇺🇸 Tesla hbm L2
🇺🇸 NVIDIA hbm → Blackwell Ultra platform L3 90
🇺🇸 Applied Materials hbm L2 53

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

HBM (High Bandwidth Memory)DRAM

SK InnovationpublicFinancials only

physical ai · 🇰🇷 South Korea · 32 sources · 0 products · 1999 patents

$53.9Brevenue · FY2025 · USD$16.47T mkt cap

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Lithium-ion battery cells (inside pack)' for EVE. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $22.9BFY2021: $31.4BFY2022: $52.4BFY2023: $51.9BFY2024: $50.2BFY2025: $53.9B wins events 2024-01-01 · product launch — SK Innovation will showcase advanced battery materials at CES 2024.
  • 2024-01-01 product launch SK Innovation will showcase advanced battery materials at CES 2024.

Patents — 1999 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 1992
Computing 5
Power electronics 1
Semiconductors 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$22.9B '20
$31.4B '21
$52.4B '22
$51.9B '23
$50.2B '24
$53.9B '25

operating income

$-1625M '20
$1.2B '21
$2.6B '22
$1.1B '23
$15M '24
$-181M '25

net income

$-1458M '20
$196M '21
$1.1B '22
$172M '23
$-1517M '24
$-2247M '25

SKFpublicProduct-grade

physical ai · 🇸🇪 Sweden · STO: SKF-B · 48 sources · 10 products · 32 patents

$9.5Brevenue · FY2025 · USD$12.0B mkt cap

SKF is a Swedish manufacturer of bearings and related components, founded in 1907. Its products include ball, roller, and needle bearings used across industrial and automotive machinery.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $7.7BFY2021: $8.5BFY2022: $10.0BFY2023: $10.8BFY2024: $10.2BFY2025: $9.5B wins 2026-07-17 · Sandvik AB → steel — click for source2026-07-17 · Ovako → physical_ai — click for source events
  • 2026-07-17 reported edge Sandvik AB → steel source ↗
  • 2026-07-17 reported edge Ovako → physical_ai source ↗

Patents — 32 CPC-scoped to physical ai (physical-AI-relevant classes)

Electric motors 12
Bearings 10
Other 10

IP chokepoint in: Bearings

Newest 20 of 32, most recent first — all on Google Patents →

  • 2026-06-18US20260171880MACHINE ASSEMBLY WITH VERTICALLY-SPACED LEVITATION AND AXIAL ADJUSTMENT ACTUATORS
  • 2026-06-11WO2026119606PINION BEARING UNIT
  • 2026-06-11WO2026119607PINION BEARING UNIT
  • 2026-05-07US20260128636GROUNDING BRUSH ASSEMBLY
  • 2026-05-07US20260128637GROUNDING BRUSH ASSEMBLY
  • 2026-05-07US20260128638GROUNDING BRUSH ASSEMBLY
  • 2026-04-23US20260110335BEARING DEVICE WITH INTEGRATED ELECTRICAL INSULATION, IN PARTICULAR FOR AN ELECTRIC MOTOR OR MACHINE
  • 2026-03-26US20260088686GROUNDING BRUSH ASSEMBLY
  • 2026-03-19US20260081548SYSTEM FOR PROCESSING A PRODUCT DURING ROTATION
  • 2026-03-05US20260066725LOW PROFILE ROTOR FOR ROTATABLE MACHINING PLATFORMS
  • 2026-02-26US20260058518BEARING DEVICE WITH ELECTRICAL INSULATION INCORPORATED, IN PARTICULAR FOR AN ELECTRIC MOTOR OR ELECTRICAL MACHINE
  • 2026-01-15US20260018975INTERNALLY SHUNTING GROUNDING BRUSH ASSEMBLY WITH AXIAL BRUSHES
  • 2026-01-15US20260018976INTERNALLY SHUNTING GROUNDING BRUSH ASSEMBLY WITH A SPIRAL BRUSH
  • 2026-01-15US20260018977INTERNALLY SHUNTING GROUNDING BRUSH ASSEMBLY WITH AXIAL BRUSHES AND CENTERING BEARINGS
  • 2026-01-15US20260018978INTERNALLY SHUNTING GROUNDING BRUSH ASSEMBLY WITH AXIALLY-EXTENDING CONDUCTIVE FIBERS
  • 2025-12-11US2025377017POSITION SENSOR ROUTING SUPPORT, MAGNETIC BEARING MODULE AND PRODUCTION METHOD
  • 2025-12-11US2025379487RADIAL ACTUATOR ROUTING SUPPORT AND ASSOCIATED MAGNETIC BEARING MODULE
  • 2025-11-06US2025341232BEARING DEVICE WITH INTEGRATED ELECTRICAL INSULATION, NOTABLY FOR AN ELECTRIC MOTOR OR MACHINE, AND ASSOCIATED MANUFACTURING METHODS
  • 2025-10-16US2025320896BEARING DEVICE WITH INTEGRATED ELECTRICAL INSULATION, NOTABLY FOR ELECTRICAL MACHINE OR ELECTRIC MOTOR, AND ASSOCIATED METHODS OF MANUFACTURE
  • 2025-10-16US2025321126METHOD AND DEVICE FOR CONDITIONING A MEASUREMENT SIGNAL

Financials — multi-year, confidence 1.0 (filings)

revenue

$9.9B '18
$9.1B '19
$7.7B '20
$8.5B '21
$10.0B '22
$10.8B '23
$10.2B '24
$9.5B '25

operating income

$1.3B '18
$994M '19
$731M '20
$1.1B '21
$883M '22
$1.2B '23
$979M '24
$777M '25

net income

$839M '18
$588M '19
$446M '20
$855M '21
$463M '22
$663M '23
$670M '24
$409M '25

Buys from ← 3

🇸🇪 Sandvik AB steel L2
🇸🇪 Ovako physical_ai L2
🇸🇪 Ovako physical_ai L2 50

Supplies → 1

🇺🇸 Tesla robotics → Tesla Optimus L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Mounted BearingsThrust BearingsCARB BearingsAngular Contact Ball BearingsCylindrical Roller BearingsNeedle Roller BearingsDeep Groove Ball BearingsMagnetic BearingsTapered Roller BearingsSpherical Roller Bearings

SMICpublicRelationships + financials

ai compute · 🇨🇳 China · HKEX: 0981 · 26 sources · 0 products · 75 patents

$9.3Brevenue · FY2025 · USD

Leading CN foundry

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $4.1BFY2021: $5.3BFY2022: $7.3BFY2023: $6.3BFY2024: $8.5BFY2025: $9.3B wins 2025-02-04 · → NXP Semiconductors foundry — click for source2025-02-26 · ACM Research → ai_chips — click for source2026-07-16 · → Allegro MicroSystems foundry — click for source events
  • 2026-07-16 reported edge → Allegro MicroSystems foundry source ↗
  • 2025-02-26 design-win ACM Research → ai_chips source ↗
  • 2025-02-04 design-win → NXP Semiconductors foundry source ↗

Patents — 75 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 75

Financials — multi-year, confidence 1.0 (filings)

revenue

$3.4B '18
$3.1B '19
$4.1B '20
$5.3B '21
$7.3B '22
$6.3B '23
$8.5B '24
$9.3B '25

operating income

$15M '18
$49M '19
$312M '20
$1.7B '21
$2.2B '22
$1.0B '23
$932M '24
$1.2B '25

net income

$134M '18
$235M '19
$640M '20
$1.6B '21
$1.8B '22
$712M '23
$547M '24
$746M '25

Buys from ← 3

🇨🇳 Empyrean ai_chips L2 50
🇺🇸 ACM Research ai_chips L2 50
🇨🇳 AMEC ai_chips L2 50

Supplies → 3

🇳🇱 NXP Semiconductors foundry L2 50
🇨🇳 JCET foundry L2 50
🇺🇸 Allegro MicroSystems foundry L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Sony SemiconductorpublicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6758 · 29 sources · 7 products · 34 patents

$76.9Brevenue · FY2026 · USD$125.6B mkt cap

CMOS image sensors

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $55.5BFY2022: $61.2BFY2023: $67.6BFY2024: $80.3BFY2025: $79.0BFY2026: $82.9B wins 2026-06-06 · Taiwan Manufacturing → foundry — click for source events 2025-04-01 · financial report — Sony Group reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2026-06-06 design-win Taiwan Manufacturing → foundry source ↗
  • 2025-04-01 financial report Sony Group reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Patents — 34 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 21
Robotics / manipulators 7
Electric motors 5
Imaging / cameras 1

IP chokepoint in: Imaging / cameras

Newest 12 of 34, most recent first — all on Google Patents →

  • 2026-06-11WO2026119753CIRCUITRY, METHOD AND SYSTEM
  • 2026-03-26WO2026063217ACTUATOR MECHANISM AND ROBOT DEVICE
  • 2024-03-07WO2024048278INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM
  • 2024-01-04WO2024004746SYSTEM AND PROGRAM
  • 2023-12-14WO2023238735INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM
  • 2023-10-05WO2023186486HIGH SPEED ACTUATOR-BASED ITEM REGISTRATION SYSTEM
  • 2022-09-29WO2022201976IMAGE SENSOR AND IMAGING DEVICE
  • 2021-02-11WO2021024767IMAGING DEVICE AND IMAGING DEVICE CONTROL METHOD
  • 2019-10-03WO2019188387IMAGING DEVICE, ELECTRONIC DEVICE
  • 2019-07-18WO2019138640INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM
  • 2019-02-14WO2019031068BASE UNIT AND OPTICAL DISC DEVICE
  • 2018-11-01WO2018198815IMAGING DEVICE AND ELECTRONIC EQUIPMENT

Buys from ← 1

🇹🇼 Taiwan Manufacturing foundry L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Pregius SIMX500IMX seriesPregiusRX1IMX501Alpha series

STMicroelectronicspublicProduct-grade

physical ai · 🇨🇭 Switzerland · NYSE: STM · 47 sources · 9 products · 376 patents

$11.8Brevenue · FY2025 · USD$56.0B mkt cap

STMicroelectronics is a semiconductor company headquartered in Switzerland, formed in 1987 from the merger of Italian and French chipmakers, producing MEMS sensors (LSM6, LIS3DH), VL53L time-of-flight sensors, and STM32 microcontrollers.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $10.2BFY2021: $12.8BFY2022: $16.1BFY2023: $17.3BFY2024: $13.3BFY2025: $11.8B wins 2026-04-23 · Hua Hong → foundry — click for source2024-10-31 · Qualcomm → compute — click for source2026-04-23 · → NVIDIA imu — click for source2026-04-23 · → Amazon imu — click for source events 2026-07-13 · financial — STMicroelectronics N.V. (STM) was trading at $69.42 with 1,229,666 shares traded in pre-market activity on July 13, 2026.2026-07-10 · buyback — STMicroelectronics repurchased 96,195 ordinary shares on Euronext Paris between July 6-10, 2026 at a weighted average price of EUR 60.2676 per share for a total of EUR 5,797,437.03, bringing total treasury shares held to 18,978,298 shares (approximately 2.1% of issued capital).2026-07-03 · buyback — STMicroelectronics repurchased 145,390 ordinary shares on Euronext Paris from June 29 to July 3, 2026, at a weighted average price of EUR 63.5445 per share for a total of EUR 9,238,728.20, bringing total treasury shares held to 18,882,103 (approximately 2.1% of issued share capit2026-03-01 · capacity expansion — STMicroelectronics announced that the first batch of STM32 wafers fully produced in China for ST by partner Huahong has been delivered to customers in China.2026-02-01 · M&A — STMicroelectronics completed the acquisition of NXP's MEMS sensor business in February 2026.2025-07-01 · M&A — STMicroelectronics entered a definitive transaction agreement for the acquisition of NXP's MEMS sensor business for a purchase price of up to $950 million in cash.2025-03-31 · partnership — At the end of March, ST signed a development and manufacturing agreement for Gallium Nitride technology with Innoscience including a joint development initiative on GaN-powered technology, as well as a reciprocal agreement allowing each company to use the other front-end manufact2024-12-01 · product launch — In December, we made our most powerful MCU series, the STM32N6 available for broad market adoption.2024-10-01 · other — In October, we also announced the launch of a new company-wide program to reshape our manufacturing footprint, accelerating our wafer fab capacity to 300-mm silicon in Agrate and Crolles and 200mm silicon carbide in Catania and resizing our global cost base.2024-10-01 · partnership — In October, we announced a new strategic collaboration with Qualcomm Technologies for the new generation of industrial and consumer IoT solutions.2024-10-01 · executive change — Jerome Ramel appointed as Executive Vice President, Corporate Development and Integrated External Communication.2024-09-28 · financial — Q3 2024 net revenues of $3.25 billion, down 26.6% year-over-year with gross margin of 37.8%.2024-06-21 · financial — ST launched a new share buyback plan totaling up to $1.1 billion to be executed within a 3-year period on June 21, 2024.2024-06-01 · product launch — In June, the ST Edge AI Suite came online bringing together tools, software and knowledge to simplify and accelerate edge AI application development.2024-06-01 · supply deal — In June, we signed a long-term silicon carbide supply agreement with Geely Auto.2024-05-01 · capacity expansion — In May, we announced the construction of a new high volume 200-millimeter silicon carbide manufacturing facility in Catania, Italy to manufacture power devices and modules, including testing and packaging, along with the silicon carbide substrate manufacturing facility on the sam2024-05-01 · capacity expansion — In May, ST announced a strategic update with the construction of a new high-volume 200-millimeter silicon carbide manufacturing facility in Catania, Italy, with a EUR 5 billion multiyear investment including EUR 2 billion support provided by the State of Italy.2024-05-01 · executive change — In May, I was pleased to be reappointed as member and Chairman of the Managing Board for a three-year term to expire at the end of 2027 Annual General Meeting of Shareholders.2022-03-09 · other — STMicroelectronics is listed as a key market player in the global eSIM market.
  • 2026-07-13 financial STMicroelectronics N.V. (STM) was trading at $69.42 with 1,229,666 shares traded in pre-market activity on July 13, 2026.
  • 2026-07-10 buyback STMicroelectronics repurchased 96,195 ordinary shares on Euronext Paris between July 6-10, 2026 at a weighted average price of EUR 60.2676 per share for a total of EUR 5,797,437.03, bringing total treasury shares held to 18,978,298 shares (approximately 2.1% of issued capital).
  • 2026-07-03 buyback STMicroelectronics repurchased 145,390 ordinary shares on Euronext Paris from June 29 to July 3, 2026, at a weighted average price of EUR 63.5445 per share for a total of EUR 9,238,728.20, bringing total treasury shares held to 18,882,103 (approximately 2.1% of issued share capit
  • 2026-04-23 design-win Hua Hong → foundry source ↗
  • 2026-04-23 design-win → NVIDIA imu source ↗
  • 2026-04-23 design-win → Amazon imu source ↗
  • 2026-03-01 capacity expansion STMicroelectronics announced that the first batch of STM32 wafers fully produced in China for ST by partner Huahong has been delivered to customers in China.
  • 2026-02-01 M&A STMicroelectronics completed the acquisition of NXP's MEMS sensor business in February 2026.
  • 2025-07-01 M&A STMicroelectronics entered a definitive transaction agreement for the acquisition of NXP's MEMS sensor business for a purchase price of up to $950 million in cash.
  • 2025-03-31 partnership At the end of March, ST signed a development and manufacturing agreement for Gallium Nitride technology with Innoscience including a joint development initiative on GaN-powered technology, as well as a reciprocal agreement allowing each company to use the other front-end manufact
  • 2024-12-01 product launch In December, we made our most powerful MCU series, the STM32N6 available for broad market adoption.
  • 2024-10-31 design-win Qualcomm → compute source ↗
  • 2024-10-01 other In October, we also announced the launch of a new company-wide program to reshape our manufacturing footprint, accelerating our wafer fab capacity to 300-mm silicon in Agrate and Crolles and 200mm silicon carbide in Catania and resizing our global cost base.
  • 2024-10-01 partnership In October, we announced a new strategic collaboration with Qualcomm Technologies for the new generation of industrial and consumer IoT solutions.
  • 2024-10-01 executive change Jerome Ramel appointed as Executive Vice President, Corporate Development and Integrated External Communication.
  • 2024-09-28 financial Q3 2024 net revenues of $3.25 billion, down 26.6% year-over-year with gross margin of 37.8%.
  • 2024-06-21 financial ST launched a new share buyback plan totaling up to $1.1 billion to be executed within a 3-year period on June 21, 2024.
  • 2024-06-01 product launch In June, the ST Edge AI Suite came online bringing together tools, software and knowledge to simplify and accelerate edge AI application development.
  • 2024-06-01 supply deal In June, we signed a long-term silicon carbide supply agreement with Geely Auto.
  • 2024-05-01 capacity expansion In May, we announced the construction of a new high volume 200-millimeter silicon carbide manufacturing facility in Catania, Italy to manufacture power devices and modules, including testing and packaging, along with the silicon carbide substrate manufacturing facility on the sam
  • 2024-05-01 capacity expansion In May, ST announced a strategic update with the construction of a new high-volume 200-millimeter silicon carbide manufacturing facility in Catania, Italy, with a EUR 5 billion multiyear investment including EUR 2 billion support provided by the State of Italy.
  • 2024-05-01 executive change In May, I was pleased to be reappointed as member and Chairman of the Managing Board for a three-year term to expire at the end of 2027 Annual General Meeting of Shareholders.
  • 2022-03-09 other STMicroelectronics is listed as a key market player in the global eSIM market.

Patents — 376 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 95
Imaging / cameras 73
IMU / navigation 59
Power electronics 58
Lidar / ranging 53
Computing 17
Bearings 5
Electric motors 5
Robotics / manipulators 5
Batteries 4
Force / torque sensors 1
Semiconductors 1

Newest 1 of 376, most recent first — all on Google Patents →

  • 2025-02-20US2025058449Anti-kickback feature for power tools

Financials — multi-year, confidence 1.0 (filings)

revenue

$9.7B '18
$9.6B '19
$10.2B '20
$12.8B '21
$16.1B '22
$17.3B '23
$13.3B '24
$11.8B '25

operating income

$1.4B '18
$1.2B '19
$1.3B '20
$2.4B '21
$4.4B '22
$4.6B '23
$1.7B '24
$175M '25

net income

$1.6B '18
$1.0B '19
$1.1B '20
$2.0B '21
$4.0B '22
$4.2B '23
$1.6B '24
$166M '25

Sources: STM 20-F 2025-02-27 (acc 0000932787-25-000006) · STM 20-F 2024-02-22 (acc 0001628280-24-006353) · STM 20-F 2026-02-26 (acc 0000932787-26-000009) · STM 20-F 2023-02-23 (acc 0001564590-23-002312)

Buys from ← 2

🇨🇳 Hua Hong foundry → STM32 Series L3 50
🇺🇸 Qualcomm compute → STM32 Series L3 50

Supplies → 5

🇺🇸 Qualcomm imu → Snapdragon Robot RB3 Gen 2 L3 50
🇺🇸 NVIDIA imu → Data center GPUs / AI accelerators L3 50
🇰🇷 Samsung Electronics imu L2 50
🇺🇸 Amazon imu L2 50
🇺🇸 Tesla imu → Tesla Optimus L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

LIS3DHLSM6 SeriesSTM32 SeriesVL53L0XVL6180XIIS2DLPCLSM9DS1ASM330LHHVL53L1X

SUMCOpublicProduct-grade

ai compute · 🇯🇵 Japan · TSE: 3436 · 13 sources · 6 products · 369 patents

$2.7Brevenue · FY2025 · USD$8.4B mkt cap

Silicon wafers

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.8BFY2021: $2.1BFY2022: $2.7BFY2023: $2.6BFY2024: $2.4BFY2025: $2.7B wins 2024-01-09 · → Samsung Electronics ai_chips — click for source2023-07-07 · Hemlock → ai_compute — click for source events 2025-01-01 · financial report — SUMCO reported financial results for the first half of fiscal year 27 (2025).
  • 2025-01-01 financial report SUMCO reported financial results for the first half of fiscal year 27 (2025).
  • 2024-01-09 design-win → Samsung Electronics ai_chips source ↗
  • 2023-07-07 design-win Hemlock → ai_compute source ↗

Patents — 369 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 338
Computing 24
Robotics / manipulators 4
Other 2
Imaging / cameras 1

Newest 3 of 369, most recent first — all on Google Patents →

  • 2024-03-28WO2024062741METHOD FOR MODELING WAFER SHAPE, AND METHOD FOR MANUFACTURING WAFER
  • 2021-05-06WO2021084843POINT DEFECT SIMULATOR, POINT DEFECT SIMULATION PROGRAM, POINT DEFECT SIMULATION METHOD, METHOD FOR MANUFACTURING SILICON SINGLE CRYSTAL, AND SINGLE CRYSTAL PULLING DEVICE
  • 2020-06-04WO2020110796THERMAL CONDUCTIVITY ESTIMATION METHOD, THERMAL CONDUCTIVITY ESTIMATION DEVICE, PRODUCTION METHOD FOR SEMICONDUCTOR CRYSTAL PRODUCT, THERMAL CONDUCTIVITY COMPUTATION DEVICE, THERMAL CONDUCTIVITY COMPUTATION PROGRAM, AND, THERMAL CONDUCTIVITY COMPUTATION METHOD

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.9B '18
$2.7B '19
$1.8B '20
$2.1B '21
$2.7B '22
$2.6B '23
$2.4B '24
$2.7B '25

operating income

$771M '18
$465M '19
$233M '20
$318M '21
$676M '22
$450M '23
$244M '24
$9M '25

net income

$531M '18
$304M '19
$157M '20
$253M '21
$432M '22
$456M '23
$131M '24
$-79M '25

Sources: 株式会社SUMCO — 半期報告書-第27期(2025/01/01-2025/12/31) · 株式会社SUMCO — 臨時報告書 · 株式会社SUMCO — 有価証券報告書-第27期(2025/01/01-2025/12/31)

Buys from ← 1

🇺🇸 Hemlock ai_compute L2 50

Supplies → 2

🇰🇷 Samsung Electronics ai_chips → HBM (High Bandwidth Memory) L3 50
🇹🇼 Taiwan Manufacturing ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

300mm Silicon Wafers150mm Silicon Wafers200mm Silicon WafersFZ (Float Zone) WafersCZ (Czochralski) WafersEpitaxial Wafers

Sumitomo ElectricpublicRelationships + financials

ai compute · 🇯🇵 Japan · 8 sources · 0 products

$31.5Brevenue · FY2026 · USD$7.48T mkt cap

Discovered via news_counterparty (2026-07-12). News (Direxion Daily Semiconductor Bull 3X ETF Explodes) — supplier: Meta is buying fiber optic cables from Sumitomo Electric.. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $18.0BFY2022: $20.7BFY2023: $24.7BFY2024: $27.1BFY2025: $28.8BFY2026: $31.5B wins 2025-07-16 · → Sumitomo Heavy Industries ai_compute — click for source events
  • 2025-07-16 design-win → Sumitomo Heavy Industries ai_compute source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$18.0B '21
$20.7B '22
$24.7B '23
$27.1B '24
$28.8B '25
$31.5B '26

operating income

$701M '21
$752M '22
$1.1B '23
$1.4B '24
$2.0B '25
$2.6B '26

net income

$347M '21
$593M '22
$694M '23
$922M '24
$1.2B '25
$2.3B '26

Supplies → 1

🇯🇵 Sumitomo Heavy Industries ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Sumitomo Heavy IndustriespublicProduct-grade

physical ai · 🇯🇵 Japan · TSE: 6302 · 8 sources · 3 products · 1225 patents

$7.1Brevenue · FY2026 · USD$3.7B mkt cap

Sumitomo Heavy Industries is a Japanese industrial machinery conglomerate producing precision reduction gears, including Cyclo and planetary reducers, used in robotics and industrial equipment.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $8.0BFY2021: $5.2BFY2022: $5.8BFY2023: $8.4BFY2024: $7.5BFY2025: $6.6BFY2026: $7.1B wins 2025-07-16 · Sumitomo Electric → ai_compute — click for source events 2025-01-01 · financial report — Sumitomo Heavy Industries filed a half-year financial report for fiscal period 130 (January 1 - December 31, 2025).
  • 2025-07-16 design-win Sumitomo Electric → ai_compute source ↗
  • 2025-01-01 financial report Sumitomo Heavy Industries filed a half-year financial report for fiscal period 130 (January 1 - December 31, 2025).

Patents — 1225 CPC-scoped to physical ai (physical-AI-relevant classes)

Gears / reducers 542
Electric motors 231
Imaging / cameras 122
Robotics / manipulators 98
Bearings 92
Power electronics 57
Lidar / ranging 30
Force / torque sensors 19
Other 17
Computing 11
Semiconductors 3
IMU / navigation 2
Batteries 1

Newest 15 of 1225, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$8.1B '19
$8.0B '20
$5.2B '21
$5.8B '22
$8.4B '23
$7.5B '24
$6.6B '25
$7.1B '26

operating income

$679M '19
$523M '20
$484M '21
$405M '22
$368M '23
$364M '24
$344M '25
$317M '26

net income

$412M '19
$302M '20
$165M '21
$272M '22
$57M '23
$51M '24
$207M '25
$191M '26

Sources: 住友重機械工業株式会社 — 臨時報告書 · 住友重機械工業株式会社 — 臨時報告書 · 住友重機械工業株式会社 — 臨時報告書 · 住友重機械工業株式会社 — 臨時報告書 · 住友重機械工業株式会社 — 有価証券報告書-第130期(2025/01/01-2025/12/31) · 住友重機械工業株式会社 — 半期報告書-第130期(2025/01/01-2025/12/31)

Buys from ← 1

🇯🇵 Sumitomo Electric ai_compute L2 50

Supplies → 1

🇯🇵 Kawasaki Heavy Industries planetary_reducers → MOTOMAN L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Cyclo ReducerPrecision GearsPlanetary Reducer

Suzhou Green Harmonic Drive Equipment Co., Ltd.publicProduct-grade

physical ai · 🇨🇳 China · STAR: 688017 · 3 sources · 0 products · 1 patents

$84Mrevenue · FY2025 · USD$8.8B mkt cap

Suzhou Green Harmonic Drive Equipment Co., Ltd. is a China-based manufacturer of harmonic drive reducers and precision transmission components used in industrial robots and automation equipment.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $32MFY2021: $65MFY2022: $66MFY2023: $53MFY2024: $57MFY2025: $84M wins 2025-06-30 · → Tesla harmonic_reducer — click for source events
  • 2025-06-30 design-win → Tesla harmonic_reducer source ↗

Patents — 1 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$32M '20
$65M '21
$66M '22
$53M '23
$57M '24
$84M '25

operating income

$14M '20
$32M '21
$25M '22
$14M '23
$9M '24
$21M '25

net income

$12M '20
$28M '21
$23M '22
$12M '23
$8M '24
$18M '25

Supplies → 1

🇺🇸 Tesla harmonic_reducer → Tesla Optimus L3 80

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

SynopsyspublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: SNPS · 78 sources · 9 products · 1627 patents

$7.1Brevenue · FY2025 · USD$79.9B mkt cap

EDA suite; Ansys sim

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $3.7BFY2021: $4.2BFY2022: $4.6BFY2023: $5.3BFY2024: $6.1BFY2025: $7.1B wins 2024-11-05 · → Arteris ai_chips — click for source2025-02-26 · → Samsung Electronics ai_chips — click for source2024-08-21 · → Taiwan Manufacturing ai_chips — click for source2026-02-25 · → GlobalFoundries ai_chips — click for source2025-12-10 · → Amazon ai_chips — click for source events 2026-06-19 · other — Synopsys CIO Sriram Sitaraman discussed the company's shift from deploying multiple narrow-task agents to adding skills into existing agents for better cost-efficiency and governance.2026-06-15 · capacity expansion — Synopsys celebrated its 35th anniversary of Taiwan operations and officially opened a new office at Hsinchu Science Park X Software Park.2026-05-31 · partnership — Synopsys is working with NVIDIA to build always-on autonomous AI engineers for chip design with a focus on achieving full workflow autonomy.2026-05-28 · product launch — Synopsys announced production-ready AI-powered digital and analog flows for Samsung's second- and third-generation 2nm processes with expanded certified interface IP portfolio.2026-05-27 · financial — Q2 2026 total revenue reached $2.276 billion, exceeding guidance, with full-year revenue guidance raised to $9.625-$9.705 billion.2025-11-01 · other — Synopsys plans to cut roughly 10% of its workforce affecting about 2,000 employees and close several sites as part of restructuring tied to its Ansys acquisition.2025-06-01 · executive change — Synopsys reached an agreement with activist Elliott Investment Management, appointing Jesse Cohn to its board of directors, effective June 1.2025-01-31 · financial — Synopsys exited FY '25 with more than $11 billion in backlog, coming in at $11.4 billion.2025-01-31 · financial — Synopsys achieved record annual revenue of $7.05 billion in fiscal year 2025.2025-01-01 · product launch — Synopsys expanded hardware-assisted verification portfolio with new HAPS 200 prototyping systems and ZeBu 200 emulation systems with up to 2x better performance.2025-01-01 · M&A — European Commission approved Synopsys' pending acquisition of ANSYS in January 2025.2024-10-31 · M&A — Synopsys completed the ANSYS acquisition and divested the Optical Solutions and PowerArtist businesses.2024-07-17 · M&A — Synopsys closed the ANSYS acquisition on July 17, 2024, expanding revenue, customer base, and long-term opportunity.2022-09-14 · other — Synopsys is listed as a select competitor in the global Interface IP market.
  • 2026-06-19 other Synopsys CIO Sriram Sitaraman discussed the company's shift from deploying multiple narrow-task agents to adding skills into existing agents for better cost-efficiency and governance.
  • 2026-06-15 capacity expansion Synopsys celebrated its 35th anniversary of Taiwan operations and officially opened a new office at Hsinchu Science Park X Software Park.
  • 2026-05-31 partnership Synopsys is working with NVIDIA to build always-on autonomous AI engineers for chip design with a focus on achieving full workflow autonomy.
  • 2026-05-28 product launch Synopsys announced production-ready AI-powered digital and analog flows for Samsung's second- and third-generation 2nm processes with expanded certified interface IP portfolio.
  • 2026-05-27 financial Q2 2026 total revenue reached $2.276 billion, exceeding guidance, with full-year revenue guidance raised to $9.625-$9.705 billion.
  • 2026-02-25 design-win → GlobalFoundries ai_chips source ↗
  • 2025-12-10 design-win → Amazon ai_chips source ↗
  • 2025-11-01 other Synopsys plans to cut roughly 10% of its workforce affecting about 2,000 employees and close several sites as part of restructuring tied to its Ansys acquisition.
  • 2025-06-01 executive change Synopsys reached an agreement with activist Elliott Investment Management, appointing Jesse Cohn to its board of directors, effective June 1.
  • 2025-02-26 design-win → Samsung Electronics ai_chips source ↗
  • 2025-01-31 financial Synopsys exited FY '25 with more than $11 billion in backlog, coming in at $11.4 billion.
  • 2025-01-31 financial Synopsys achieved record annual revenue of $7.05 billion in fiscal year 2025.
  • 2025-01-01 product launch Synopsys expanded hardware-assisted verification portfolio with new HAPS 200 prototyping systems and ZeBu 200 emulation systems with up to 2x better performance.
  • 2025-01-01 M&A European Commission approved Synopsys' pending acquisition of ANSYS in January 2025.
  • 2024-11-05 design-win → Arteris ai_chips source ↗
  • 2024-10-31 M&A Synopsys completed the ANSYS acquisition and divested the Optical Solutions and PowerArtist businesses.
  • 2024-08-21 design-win → Taiwan Manufacturing ai_chips source ↗
  • 2024-07-17 M&A Synopsys closed the ANSYS acquisition on July 17, 2024, expanding revenue, customer base, and long-term opportunity.
  • 2022-09-14 other Synopsys is listed as a select competitor in the global Interface IP market.

Patents — 1627 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 1377
Memory 168
Semiconductors 56
Other 23
Robotics / manipulators 2
Power electronics 1

Newest 8 of 1627, most recent first — all on Google Patents →

  • 2026-05-21US20260141147BOOLEAN REASONING GUIDED UNGROUPING ACROSS CIRCUIT DESIGN HIERARCHY
  • 2026-05-21WO2026106925MACHINE-LEARNING-AIDED LOGIC SYNTHESIS USING DO-NOT-CARE-BASED BACKPROPAGATION
  • 2026-05-07US20260127092GENERATING VIOLATION WAIVERS FOR STATIC LINT CHECK
  • 2026-04-30US20260119764THERMAL AWARE TIMING ANALYSIS
  • 2026-04-23US20260111636GRAPH-BASED VISUALIZATION OF WAYPOINT FOR DETECTING DESIGN ERROR IN INTEGRATED CIRCUIT DESIGN
  • 2026-02-19US20260050721SCALABLE DISTRIBUTED ENVIRONMENT FOR RESET DOMAIN CROSSING ANALYSIS AND INTERACTIVE DEBUG
  • 2026-02-12US20260044421COMBINED SERIAL AND CONCURRENT FAULT SIMULATION
  • 2026-02-05US20260037705GENERATING HARDWARE DESCRIPTION LANGUAGE SLICES TO PROVIDE CONTEXT FOR VIOLATIONS

Financials — multi-year, confidence 1.0 (filings)

revenue

$3.7B '20
$4.2B '21
$4.6B '22
$5.3B '23
$6.1B '24
$7.1B '25

operating income

$620M '20
$735M '21
$1.1B '22
$1.3B '23
$1.4B '24
$915M '25

net income

$664M '20
$758M '21
$985M '22
$1.2B '23
$2.3B '24
$1.3B '25

Sources: SNPS 10-Q 2025-05-28 (acc 0000883241-25-000017) · SNPS 10-Q 2024-05-24 (acc 0000883241-24-000016) · SNPS 10-K 2024-12-19 (acc 0000883241-24-000024) · SNPS 10-Q 2023-08-18 (acc 0000883241-23-000016) · SNPS 10-Q 2025-09-09 (acc 0000883241-25-000024) · SNPS 10-Q 2026-02-25 (acc 0000883241-26-000014) · SNPS 10-Q 2026-05-27 (acc 0000883241-26-000018) · SNPS 10-Q 2023-05-19 (acc 0000883241-23-000012) · SNPS 10-Q 2023-02-17 (acc 0000883241-23-000005) · SNPS 10-Q 2025-02-26 (acc 0000883241-25-000014)

Supplies → 6

🇺🇸 Arteris ai_chips L2 50
🇰🇷 Samsung Electronics ai_chips → NPU (Neural Processing Unit) L3 50
🇹🇼 Taiwan Manufacturing ai_chips L2 50
🇺🇸 GlobalFoundries ai_chips L2 50
🇺🇸 Microsoft ai_chips → Microsoft Azure L3 50
🇺🇸 Amazon ai_chips → AWS Trainium L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Synopsys IC CompilerSynopsys PrimeTimeSynopsys ProteusSynopsys SentaurusSynopsys Design CompilerSynopsys Custom CompilerSynopsys FormalitySynopsys VCSSynopsys Seismic

Taiwan Semiconductor Manufacturing Company LimitedpublicProduct-grade

ai compute · 🇹🇼 Taiwan · TWSE: 2330 · 142 sources · 8 products · 120 patents

$118.7Brevenue · FY2025 · USD$1.84T mkt cap

TSMC, headquartered in Taiwan, is a semiconductor foundry founded in 1987 that manufactures chips for external customers using process nodes such as N3, N5 and N7.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $41.6BFY2021: $49.5BFY2022: $70.4BFY2023: $67.4BFY2024: $89.9BFY2025: $118.7B wins 2026-06-20 · Amkor → osat — click for source2026-07-16 · → Arm foundry — click for source2024-08-02 · Linde → ai_chips — click for source2026-06-06 · → Sony foundry — click for source2025-08-23 · → Lam Research foundry — click for source2026-07-16 · → Allegro MicroSystems foundry — click for source2025-02-26 · → NVIDIA foundry — click for source2026-06-30 · Lam Research → ai_chips — click for source2026-01-29 · → Texas Instruments foundry — click for source2025-03-19 · → Applied Materials foundry — click for source2025-12-24 · Advantest → ai_chips — click for source2025-10-27 · → Cadence Design foundry — click for source2025-07-22 · → NXP Semiconductors foundry — click for source2025-05-22 · → Analog Devices foundry — click for source2026-06-30 · ASML → ai_chips — click for source2025-01-30 · → Intel foundry — click for source2025-10-23 · → Tesla foundry — click for source2025-07-10 · → Micron foundry — click for source2024-08-21 · Synopsys → ai_chips — click for source2026-07-11 · → Amazon foundry — click for source2024-02-24 · AMEC → ai_chips — click for source2026-07-11 · → Microsoft foundry — click for source2026-07-06 · Winbond → ai_compute — click for source2024-12-30 · Ibiden → advanced_packaging — click for source2026-05-14 · → Entegris foundry — click for source2026-03-04 · Resonac → ai_chips — click for source2026-05-05 · → Navitas foundry — click for source events 2026-07-17 · financial — Taiwan Semiconductor Manufacturing announced a 77% annual earnings gain but shares fell more than 4%, triggering a pullback in the semiconductor sector.2026-07-16 · financial — TSMC reported solid earnings that failed to lift the stock, with US-listed ADRs down 2% shortly after market open.2026-07-16 · financial — TSMC raised full-year 2026 revenue growth outlook to slightly above 40% and increased capital expenditure guidance to $60–$64 billion, up from a prior ceiling of $56 billion.2026-07-16 · financial — TSMC Q2 2026 revenue expected around $40 billion, up 33% year-over-year from $30.07 billion in Q2 2025.2026-07-16 · financial — TSMC guided third-quarter operating margins roughly 70 basis points below consensus and warned that overseas expansion and 2-nanometer ramp costs would dilute gross margins in the second half of the year.2026-07-16 · financial — TSMC posted Q2 2026 revenue of $40.2 billion, a 36% year-over-year jump, with net profit surging 77.4% to NT$706.56 billion and gross margin reaching 67.7%.2026-07-16 · capacity expansion — TSMC increased capital expenditure guidance to $60–$64 billion from prior ceiling of $56 billion, citing overseas expansion and 2-nanometer ramp costs.2026-07-16 · financial — TSMC raised full-year 2026 growth target to above 40%, marking the second upward revision this year.2026-07-16 · financial — TSMC Q2 2026 earnings per ADR unit expected at approximately $3.80-$3.83, up from $2.47 a year ago.2026-07-16 · financial — TSMC achieved record profit beat with roughly 4% share decline despite raising full-year 2026 revenue growth outlook to slightly above 40%.2026-07-15 · financial — Taiwan Semiconductor Manufacturing Company Limited raised its 5-year revenue growth CAGR by 5 points to 25% per annum in response to strong AI chip demand.2026-07-15 · financial — Taiwan Semiconductor Manufacturing Company Limited raised its long-term gross margin guidance, signalling confidence in its ability to drive productivity, cost efficiencies and pricing power.2026-07-15 · financial — Taiwan Semiconductor Manufacturing Company Limited closed at $419.48 per share on July 15, 2026, with a market capitalization of $2.18 trillion.2026-07-14 · financial — TSMC reported June 2026 revenue of NT$442.68 billion (approximately $13.2 billion), a 67.9% year-over-year surge to a record high.2026-07-14 · financial — TSMC's second-quarter 2026 revenue reached approximately NT$1.27 trillion (roughly $39.6 billion), exceeding its guidance range and beating consensus estimates.2026-07-09 · product launch — TSMC's A16 process remains on track for production in the second half of 2026.2026-07-09 · capacity expansion — Capacity for CoWoS and SoIC advanced packaging projected to expand by more than 80% annually through 2027.2026-07-09 · product launch — TSMC introduced A13, A12, and N2U process technologies and announced mass production of 5.5-reticle-size CoWoS packaging solution with yields exceeding 98%.2026-07-09 · capacity expansion — TSMC plans to launch five new fabs in 2026 with 2nm production capacity growing at 70% compound annual rate between 2026 and 2028.2026-07-06 · financial — Citi reiterated a Buy rating and raised the price target to NT$3,800 from NT$2,875, expecting the company to raise its 2026 revenue growth outlook and long-term growth targets.2026-07-06 · financial — Citi raised its target price for TSMC to NT$3,800 from NT$2,875, maintaining a Buy rating based on strengthened AI chip demand outlook.2026-07-01 · regulatory — Goldman Sachs removed Taiwan Semiconductor Manufacturing Company Limited from its APAC Conviction List in July 2026.2026-06-30 · financial — For the first six months of 2026, Taiwan Semiconductor generated consolidated revenue of 2.40 trillion New Taiwan dollars, up 35.6% from the corresponding period in 2025.2026-06-30 · financial — TSMC reported consolidated net sales of NT$442.68 billion (approximately $13.8 billion) in June 2026, the largest monthly revenue in the company's nearly four-decade history.2026-06-30 · financial — June 2026 revenue reached T$442.68 billion ($13.78 billion), representing 67.9% year-on-year growth, the fastest monthly growth of 2026.2026-06-30 · financial — June consolidated revenue rose 6.2% from May to 442.68 billion New Taiwan dollars (about $15.1 billion), up 67.9% year-over-year.2026-06-30 · financial — First-half 2026 revenue reached T$2.4 trillion ($74.99 billion), up 35.6% year-on-year, representing approximately 63% of full-year 2025 revenue.2026-06-30 · financial — TSMC's stock reached a 52-week high of $479 on June 30.2026-06-24 · financial — BofA lifted the price target on Taiwan Semiconductor Manufacturing Company Limited to $590 from $490 on June 24 and maintained a Buy rating.2026-06-24 · financial — Taiwan Semiconductor Manufacturing Company Limited closed at $440.83 per share on June 24, 2026, with a market capitalization of $2.29 trillion.2026-06-24 · financial — Bank of America raised its price target on Taiwan Semiconductor Manufacturing Company Limited from $490 to $590 and raised 2026 and 2027 revenue growth forecasts to 40% and 39% year-over-year respectively.2026-06-24 · financial — Taiwan Semiconductor Manufacturing Company Limited's Q1 2026 revenue increased 6.4% sequentially in U.S. dollar terms to $35.9 billion, exceeding guidance.2026-06-23 · financial — S&P Global revised its outlook on the 'AA-' long-term issuer credit rating, reflecting healthy EBITDA and free operating cash flow growth driven by AI chip dominance in semiconductor foundry services.2026-06-22 · financial — Susquehanna lifted the price target on Taiwan Semiconductor Manufacturing Company Limited to $575 from $500 on June 22 and maintained a Positive rating.2026-06-22 · financial — Susquehanna lifted the price target on Taiwan Semiconductor Manufacturing Company Limited to $575 from $500 and maintained a Positive rating on the shares.2026-06-17 · financial — Taiwan Semiconductor Manufacturing Company Limited closed at $432.15 per share on June 17, 2026, with a market capitalization of $2.24 trillion.2026-06-16 · financial — Aletheia Capital boosted its price objective for Taiwan Semiconductor Manufacturing Company Limited to NT$3,500, keeping a Buy rating on the company's shares.2026-06-16 · financial — Aletheia Capital set Taiwan Semiconductor Manufacturing Company Limited's share price target at NT$3,500 with a Buy rating.2026-06-16 · partnership — TSMC entered into a 10-year partnership with Amkor Technology to expand advanced semiconductor packaging and testing capabilities in Arizona.2026-06-16 · capacity expansion — Aletheia Capital raised forecasts for TSMC's high-end node capacity growth to 70,000, 150,000, and 170,000 wafers per month in 2026, 2027, and 2028, respectively.2026-06-10 · financial — Taiwan Semiconductor Manufacturing Company Limited signaled potential pricing pressure and does not rule out price hikes as inflation has increased costs.2026-06-10 · financial — Taiwan Semiconductor Manufacturing Company Limited reported May 2026 revenue of approximately NT$416.98 billion, reflecting an increase of 1.5% from April 2026 and an increase of 30.1% from May 2025.2026-06-10 · financial — TSMC reported May 2026 revenue of NT$416.98 billion, up 30.1% year over year, with January-through-May revenue rising 30.0% to NT$1.96 trillion.2026-06-09 · regulatory — Taiwan authorities are considering imposing tight export controls on AI chip sales to China as part of broader trade negotiations with the US.2026-06-04 · capacity expansion — TSMC plans to invest $165 billion in US production projects and build new factories in the US.2026-06-04 · other — TSMC CEO C.C. Wei identified robots and autonomous vehicles as long-term growth drivers for the company.2026-06-04 · financial — TSMC may raise prices for customers as component costs continue to rise.2026-05-31 · financial — Taiwan Semiconductor Manufacturing Company Limited posted a 30% jump in May sales with revenue of NT$416.98 billion ($13.2 billion) due to sustained demand from global artificial intelligence infrastructure buildouts.2026-05-31 · partnership — TSMC is using NVIDIA CUDA-X libraries, Metropolis platform, TAO Toolkit, and Omniverse to accelerate fab operations, defect inspection, and build FabTwin virtual fab environment.2026-04-15 · financial — TSMC reported Q2 2026 earnings of $3.49 EPS, exceeding consensus estimate of $3.31, with revenue of $35.49 billion, up 40.6% year-over-year.2026-04-01 · capacity expansion — TSMC announced planned capital expenditures between $52 billion and $56 billion to expand manufacturing capacity for AI-driven demand.2026-04-01 · financial — Taiwan Semiconductor Manufacturing Company Limited raised its whole-year outlook in April and expects capital spending toward the upper end of its forecast of up to $56 billion in 2026.2026-03-31 · financial — Taiwan Semiconductor Manufacturing Company Limited's revenue increased 6.4% sequentially to $35.9 billion in Q1 2026, exceeding guidance.2026-03-31 · financial — Taiwan Semiconductor Manufacturing Company Limited represents 14.40% of Glen Kacher's Light Street Portfolio as of Q1 2026.2026-03-31 · financial — Taiwan Semiconductor Manufacturing Company Limited increased revenue 6.4% sequentially to $35.9 billion in Q1 2026, exceeding guidance.2026-03-31 · financial — Q1 2026 revenue totaled approximately $35.6 billion, up 35% year-over-year with January revenue up 37% YoY, February up 22% YoY, and March up 45% YoY.2026-01-01 · regulatory — January U.S.–Taiwan trade agreement secured favorable tariff treatment for Taiwanese semiconductor exports.2026-01-01 · capacity expansion — Company announced $56 billion capital expenditure plan for 2026 and stated capacity is effectively sold out through year-end.2025-12-31 · product launch — N2 successfully entered high-volume manufacturing in 4Q 2025, at both our Hsinchu and Kaohsiung site with good yield.2025-05-28 · capacity expansion — TSMC is building six fabs and two advanced packaging plants in Arizona to make chips for NVIDIA Corporation with volume production expected by year-end.2025-04-24 · litigation — TSMC Arizona Corporation sues Morrison Express Corporation U.S.A. for breach of contract.2025-04-01 · litigation — Advanced Integrated Circuit Process LLC sues Taiwan Semiconductor Manufacturing Company Limited for patent infringement.2025-03-05 · product launch — GraniteShares announced a 2x Short TSM Daily ETF tracking Taiwan Semiconductor stock performance.2025-01-21 · regulatory — January 21 Taiwan earthquake with 6.4 magnitude Richter scale and several significant aftershocks impacted operations but much of lost production was recovered.2025-01-01 · regulatory — The US strong-armed Taiwan into promising large-scale investments in the US in return for lowering tariffs to 15%, requiring TSMC to spend US$250 billion on building semiconductor plants in the US.2024-12-31 · capacity expansion — Our first specialty technology fab in Kumamoto has started volume production at the end of 2024 with record yield.2024-10-01 · capacity expansion — TSMC's first specialty fab in Kumamoto, Japan has already started volume production in late 2024 with very good yield, and the construction of a second fab has begun.2024-10-01 · capacity expansion — In Japan, thanks to the strong support from the Japan Central prefecture and the local government, our first specialty fab in Kumamoto has already started volume production in late 2024 with very good yield.2024-08-01 · partnership — Together with our JV partners, we held a groundbreaking ceremony in August for our specialty technology fab in Dresden, Germany.2024-04-01 · capacity expansion — Our first fab entered engineered wafer production in April with 4-nanometer process technology, and the result is highly satisfactory with a very good yield.2023-12-31 · financial — TSMC raised $1.5 billion in subsidies in 2023, mainly received in Japan.
  • 2026-07-17 financial Taiwan Semiconductor Manufacturing announced a 77% annual earnings gain but shares fell more than 4%, triggering a pullback in the semiconductor sector.
  • 2026-07-16 financial TSMC reported solid earnings that failed to lift the stock, with US-listed ADRs down 2% shortly after market open.
  • 2026-07-16 financial TSMC raised full-year 2026 revenue growth outlook to slightly above 40% and increased capital expenditure guidance to $60–$64 billion, up from a prior ceiling of $56 billion.
  • 2026-07-16 financial TSMC Q2 2026 revenue expected around $40 billion, up 33% year-over-year from $30.07 billion in Q2 2025.
  • 2026-07-16 financial TSMC guided third-quarter operating margins roughly 70 basis points below consensus and warned that overseas expansion and 2-nanometer ramp costs would dilute gross margins in the second half of the year.
  • 2026-07-16 financial TSMC posted Q2 2026 revenue of $40.2 billion, a 36% year-over-year jump, with net profit surging 77.4% to NT$706.56 billion and gross margin reaching 67.7%.
  • 2026-07-16 capacity expansion TSMC increased capital expenditure guidance to $60–$64 billion from prior ceiling of $56 billion, citing overseas expansion and 2-nanometer ramp costs.
  • 2026-07-16 financial TSMC raised full-year 2026 growth target to above 40%, marking the second upward revision this year.
  • 2026-07-16 financial TSMC Q2 2026 earnings per ADR unit expected at approximately $3.80-$3.83, up from $2.47 a year ago.
  • 2026-07-16 financial TSMC achieved record profit beat with roughly 4% share decline despite raising full-year 2026 revenue growth outlook to slightly above 40%.
  • 2026-07-16 reported edge → Arm foundry source ↗
  • 2026-07-16 reported edge → Allegro MicroSystems foundry source ↗
  • 2026-07-15 financial Taiwan Semiconductor Manufacturing Company Limited raised its 5-year revenue growth CAGR by 5 points to 25% per annum in response to strong AI chip demand.
  • 2026-07-15 financial Taiwan Semiconductor Manufacturing Company Limited raised its long-term gross margin guidance, signalling confidence in its ability to drive productivity, cost efficiencies and pricing power.
  • 2026-07-15 financial Taiwan Semiconductor Manufacturing Company Limited closed at $419.48 per share on July 15, 2026, with a market capitalization of $2.18 trillion.
  • 2026-07-14 financial TSMC reported June 2026 revenue of NT$442.68 billion (approximately $13.2 billion), a 67.9% year-over-year surge to a record high.
  • 2026-07-14 financial TSMC's second-quarter 2026 revenue reached approximately NT$1.27 trillion (roughly $39.6 billion), exceeding its guidance range and beating consensus estimates.
  • 2026-07-11 design-win → Amazon foundry source ↗
  • 2026-07-11 design-win → Microsoft foundry source ↗
  • 2026-07-09 product launch TSMC's A16 process remains on track for production in the second half of 2026.
  • 2026-07-09 capacity expansion Capacity for CoWoS and SoIC advanced packaging projected to expand by more than 80% annually through 2027.
  • 2026-07-09 product launch TSMC introduced A13, A12, and N2U process technologies and announced mass production of 5.5-reticle-size CoWoS packaging solution with yields exceeding 98%.
  • 2026-07-09 capacity expansion TSMC plans to launch five new fabs in 2026 with 2nm production capacity growing at 70% compound annual rate between 2026 and 2028.
  • 2026-07-06 financial Citi reiterated a Buy rating and raised the price target to NT$3,800 from NT$2,875, expecting the company to raise its 2026 revenue growth outlook and long-term growth targets.
  • 2026-07-06 design-win Winbond → ai_compute source ↗
  • 2026-06-30 design-win Lam Research → ai_chips source ↗
  • 2026-06-30 design-win ASML → ai_chips source ↗
  • 2026-06-20 design-win Amkor → osat source ↗
  • 2026-06-06 design-win → Sony foundry source ↗
  • 2026-05-14 design-win → Entegris foundry source ↗
  • 2026-05-05 design-win → Navitas foundry source ↗
  • 2026-03-04 design-win Resonac → ai_chips source ↗
  • 2026-01-29 design-win → Texas Instruments foundry source ↗
  • 2025-12-24 design-win Advantest → ai_chips source ↗
  • 2025-10-27 design-win → Cadence Design foundry source ↗
  • 2025-10-23 design-win → Tesla foundry source ↗
  • 2025-08-23 design-win → Lam Research foundry source ↗
  • 2025-07-22 design-win → NXP Semiconductors foundry source ↗
  • 2025-07-10 design-win → Micron foundry source ↗
  • 2025-05-22 design-win → Analog Devices foundry source ↗

Patents — 120 CPC-scoped to ai compute (physical-AI-relevant classes)

Memory 47
Other 36
Computing 36
Semiconductors 1

IP chokepoint in: Computing

Newest 45 of 120, most recent first — all on Google Patents →

  • 2026-07-09US20260198230SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
  • 2026-07-02US20260190864HAPTIC RESPONSE INTEGRATED CIRCUIT DEVICE WITH PIEZOELECTRIC STRUCTURES
  • 2026-06-25US20260178447METHOD OF MANUFACTURING IN A COMPUTE-IN-MEMORY SYSTEM HAVING BIT ERROR DETECTION, AND METHOD OF OPERATING SAME
  • 2026-06-25US20260179664INTEGRATED CIRCUIT AND METHOD OF OPERATING THE SAME
  • 2026-06-25US20260179665System with Memory Device Replica for Stable Read Operations
  • 2026-06-25US20260179679STACKED MEMORY CELL STRUCTURE AND METHOD OF FORMING THE SAME
  • 2026-06-25US20260179701READ-ONLY MEMORY (ROM) DEVICE AND METHOD
  • 2026-06-25US20260179703MEMORY DEVICE
  • 2026-06-25US20260181883SEMICONDUCTOR MEMORY DEVICES WITH BACKSIDE TRANSISTORS
  • 2026-06-18US20260170220MEMORY WITH BUNDLE-WIDE ACCESS LINES, METHOD OF READING FROM THE SAME AND METHOD OF MANUFACTURING SAME
  • 2026-06-18US20260170223METHOD OF AND SYSTEM FOR GENERATING LAYOUT DIAGRAM OF INTEGRATED CIRCUIT DEVICE HAVING TRANSISTOR ARCHITECTURE
  • 2026-06-11US20260161354SYSTEM, CIRCUIT AND METHOD FOR DATA PROCESSING
  • 2026-06-11US20260161539SYSTEM FOR ARTIFICIAL INTELLIGENCE ACCELERATION, MEMORY DEVICE AND METHOD FOR OPERATING THE SAME
  • 2026-06-11US20260162690MEMORY DEVICES HAVING STRAP REGIONS WITH FEEDTHROUGH VIAS
  • 2026-06-11US20260162691SEMICONDUCTOR DEVICE INCLUDING MEMORY CELL ARRAY
  • 2026-06-04US20260155165MEMORY DEVICE, CIRCUIT, AND METHOD
  • 2026-05-28US20260148765MEMORY CIRCUITS AND METHODS FOR LATCHING READOUT IN MULTI-BANK SRAM MEMORY
  • 2026-05-28US20260150647MEMORY DEVICE WITH BACKSIDE CONTACTS FOR SIGNAL ROUTING
  • 2026-05-21US20260141937MEMORY DEVICE AND FABRICATING METHOD THEREOF
  • 2026-05-14US20260133799SYSTEM AND METHOD FOR ARTIFICIAL INTELLIGENCE ACCELERATOR
  • 2026-05-14US20260134900MEMORY CIRCUIT AND METHOD OF OPERATING SAME
  • 2026-05-14US20260134938METHOD TO TEST LDO DRIVING/SINKING IN SOC
  • 2026-04-30US20260119435MULTIPLE TIERS NETWORK-ON-CHIP ARCHITECTURE
  • 2026-04-30US20260119767SYSTEM AND METHOD FOR SEMICONDUCTOR FABRICATION
  • 2026-04-30US20260120784Memory Device with Low Wire Resistance and Method of Manufacturing the Same
  • 2026-04-09US20260101490SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
  • 2026-04-02US20260093968MEMORY CIRCUITS AND METHODS FOR ENCODER/DECODER DUAL MODE FOR COMPUTE-IN-MEMORY
  • 2026-04-02US20260094624SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
  • 2026-04-02US20260094625MEMORY DEVICE AND METHOD OF FORMING THE SAME
  • 2026-03-26US20260088987IMAGE ENCRYPTION CIRCUIT AND METHOD FOR OPERATING THE SAME
  • 2026-03-26US20260089938MEMORY DEVICES WITH DIFFERENT CONDUCTIVE TYPES AND METHODS FOR MANUFACTURING THE SAME
  • 2025-10-30US2025338627OSCILLATOR CIRCUIT, LAYOUT, AND METHOD
  • 2025-10-23US2025331145INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
  • 2025-09-25US2025299725Memory circuit with level shifter circuit and method of operating same
  • 2025-07-10US2025226012CIRCUIT AND METHOD FOR POWER MANAGEMENT
  • 2025-06-12US2025190663METHOD AND SYSTEM FOR REDUCING MIGRATION ERRORS
  • 2025-05-22US2025166698Memory device, write assist circuit, and method
  • 2025-03-20US2025095704Memory device having tracking word line with adjust circuit, method of operating same and method of manufacturing same
  • 2025-02-27US2025072117ECO base cell structure, layout method, and system
  • 2025-02-20US2025060777Memory structure with optimized latch clock design
  • 2025-01-09US2025014631Memory device and operating method thereof
  • 2025-01-02US2025006255Memory circuit and method of operating same
  • 2024-12-12US2024412777Memory device
  • 2024-11-14US2024378367STATIC VOLTAGE DROP PREDICTION SYSTEM AND METHOD
  • 2024-10-17US2024346225SYSTEM FOR PHYSICAL VERIFICATION RUNTIME REDUCTION AND METHOD OF USING SAME

Financials — multi-year, confidence 1.0 (filings)

revenue

$41.6B '20
$49.5B '21
$70.4B '22
$67.4B '23
$89.9B '24
$118.7B '25

operating income

$17.6B '20
$20.3B '21
$34.8B '22
$28.7B '23
$41.1B '24
$60.1B '25

net income

$15.9B '20
$18.4B '21
$30.8B '22
$26.1B '23
$36.0B '24
$53.4B '25

Sources: TSMC Arizona Corporation v. Morrison Express Corporation U… · Advanced Integrated Circuit Process LLC v. TAIWAN SEMICOND…

Buys from ← 13

🇺🇸 Amkor osat L2 50
🇺🇸 Linde ai_chips L2 50
🇺🇸 Lam Research ai_chips L2 50
🇯🇵 Advantest ai_chips L2 50
🇯🇵 SUMCO ai_chips L2 50
🇳🇱 ASML ai_chips → N3 L3 50
🇩🇪 Merck KGaA ai_chips L2 50
🇩🇪 Siltronic ai_chips L2 50
🇺🇸 Synopsys ai_chips L2 50
🇨🇳 AMEC ai_chips → N6 L3 50
🇹🇼 Winbond ai_compute L2 50
🇯🇵 Ibiden advanced_packaging L2 50
🇯🇵 Resonac ai_chips L2 50

Supplies → 23

🇯🇵 TDK InvenSense foundry L2 50
🇺🇸 NVIDIA foundry → Grace L3 50
🇬🇧 Arm foundry L2
🇯🇵 Sony foundry L2 50
🇺🇸 Lam Research foundry L2 53
🇺🇸 Allegro MicroSystems foundry L2
🇺🇸 NVIDIA foundry → Grace L3 95
🇺🇸 MaxLinear foundry L2 50
🇺🇸 Texas Instruments foundry L2 53
🇺🇸 Applied Materials foundry L2 53
🇺🇸 Cadence Design foundry L2 50
🇳🇱 NXP Semiconductors foundry L2 50
🇺🇸 Analog Devices foundry L2 50
🇺🇸 Intel foundry L2 50
🇺🇸 Tesla foundry L2 60
🇺🇸 Micron foundry L2 65
🇺🇸 Amazon foundry → AWS Inferentia L3 50
🇺🇸 NVIDIA foundry → Grace L3 50
🇺🇸 Microsoft foundry → Microsoft Azure L3 50
🇺🇸 Entegris foundry L2 53
🇺🇸 Navitas foundry → GaN power integrated circuits (ICs) L3 50
🇨🇳 OmniVision foundry L2 50
🇨🇳 Orbbec foundry L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

N6N328HPCN516FF+N4N722ULL

TDK InvenSensepublicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6762 · 10 sources · 6 products

$15.4Brevenue · FY2026 · USD$34.7B mkt cap

MEMS IMUs; also NdFeB magnets

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $9.1BFY2022: $11.7BFY2023: $13.5BFY2024: $13.0BFY2025: $14.5BFY2026: $16.6B wins events 2025-04-01 · financial report — TDK Corporation reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2025-04-01 financial report TDK Corporation reports half-year financial results for fiscal period 2025/04/01-2026/03/31.

Financials — multi-year, confidence 1.0 (filings)

revenue

$9.1B '21
$11.7B '22
$13.5B '23
$13.0B '24
$14.5B '25
$16.6B '26

operating income

$690M '21
$944M '22
$924M '23
$1.1B '24
$1.5B '25
$1.8B '26

net income

$461M '21
$809M '22
$704M '23
$768M '24
$1.1B '25
$1.3B '26

Sources: TDK株式会社 — 臨時報告書 · TDK株式会社 — 有価証券報告書-第130期(2025/04/01-2026/03/31) · TDK株式会社 — 臨時報告書 · TDK株式会社 — 半期報告書-第130期(2025/04/01-2026/03/31) · TDK株式会社 — 臨時報告書 · TDK株式会社 — 臨時報告書 · TDK株式会社 — 臨時報告書

Buys from ← 2

🇹🇼 Taiwan Manufacturing foundry L2 50
🇺🇸 GlobalFoundries foundry L2 50

Supplies → 1

🇰🇷 Samsung Electronics imu L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

MPU-9xxx SeriesICM-40xxx SeriesICM-42xxx SeriesICM-20xxx SeriesICP-201xx SeriesICP-101xx Series

TE ConnectivitypublicFinancials only

ai compute · 🇺🇸 United States · 23 sources · 0 products · 36 patents

$17.1Brevenue · FY2025 · USD$59.1B mkt cap

Discovered via news_counterparty (2026-07-12). News (Goldman Sachs says buy these 16 tech stocks positioned to wi) — supplier: Listed as an electronic components supplier positioned to benefit from AI capex . Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $12.2BFY2021: $14.9BFY2022: $16.3BFY2023: $16.0BFY2024: $15.8BFY2025: $17.1B wins events

Patents — 36 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 23
Semiconductors 7
Robotics / manipulators 5
Power electronics 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$12.2B '20
$14.9B '21
$16.3B '22
$16.0B '23
$15.8B '24
$17.1B '25

operating income

$1.8B '20
$2.6B '21
$2.9B '22
$2.7B '23
$2.8B '24
$3.2B '25

net income

$-241M '20
$2.3B '21
$2.4B '22
$1.9B '23
$3.2B '24
$1.8B '25

Tesla, Inc.publicProduct-grade

physical ai · 🇺🇸 United States · NASDAQ: TSLA · 356 sources · 13 products · 708 patents

$94.8Brevenue · FY2025 · USD$1.47T mkt cap

US EV, energy and AI company. In the Tettares model the relevant activity is the Optimus humanoid program (a physical-AI OEM); Tesla is otherwise predominantly automotive/energy. Founded 2003; HQ Austin, TX.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026202720282029 rev FY2020: $31.5BFY2021: $53.8BFY2022: $81.5BFY2023: $96.8BFY2024: $97.7BFY2025: $94.8B wins 2024-10-31 · → Aptiv humanoid — click for source2025-06-30 · Suzhou Green Harmonic Drive Equipment → harmonic_reducer — click for source2024-12-26 · EVE Energy → batteries — click for source2026-04-23 · Leaderdrive → harmonic_reducers — click for source2025-06-30 · Zhejiang Sanhua Intelligent Controls → actuator_assembly — click for source2025-07-28 · Samsung Electronics → foundry — click for source2025-06-30 · Ningbo Tuopu → rotary_actuator — click for source2026-07-13 · Samsung Electronics → ai_chips — click for source2025-10-23 · Taiwan Manufacturing → foundry — click for source2026-07-14 · Samsung Electronics → ai_chips — click for source2026-07-13 · SK hynix → hbm — click for source2026-06-30 · NVIDIA → ai_chips — click for source2026-07-12 · Panasonic → physical_ai — click for source2025-06-30 · Nidec → actuator_motor — click for source2025-06-30 · Harmonic Drive → harmonic_reducer — click for source2026-07-16 · Allegro MicroSystems → physical_ai — click for source2026-07-12 · MP Materials → physical_ai — click for source events 2028-12-31 · capacity expansion — Tesla plans to add another 70,000 units of Optimus capacity at its Austin facility by 2028.2028-12-31 · capacity expansion — Tesla plans to add another 70,000 units of capacity for Optimus at its Austin facility by 2028.2026-07-14 · litigation — Tesla Inc. sues Bedeschi America, Inc. in federal district court over a contract dispute.2026-07-11 · product launch — Tesla's AI5 chip reached tape-out and is scheduled for manufacturing at Samsung's Taylor fab using 2nm Gate-All-Around process technology.2026-07-02 · disclosure — Tesla, Inc. published a press release on July 2, 2026, disclosing results of operations and financial condition.2026-06-30 · regulatory — Ford recalled over 740,000 vehicles from 2018 to 2021 due to a transmission defect posing rollaway risk.2026-06-26 · financial — Tesla shares were mentioned among major stocks tracked in cautious Canadian trading on June 26, 2026.2026-06-18 · capacity expansion — Tesla increased its registered autonomous vehicles in Texas from 42 to 69, a 64% increase in less than a month.2026-06-04 · litigation — Waller v. Tesla, Inc. involves a contract dispute.2026-06-01 · financial — Ford reported a 13.6% drop in total vehicle sales for May, with Mustang Mach-E sales down 44% and F-150 Lightning sales down 45%.2026-05-28 · litigation — MiiR Holdings LLC alleges Tesla Inc. infringed patent 830.2026-05-14 · other — Tesla leadership joined US President Donald Trump's business delegation to Beijing.2026-05-01 · litigation — Elon Musk's high-profile lawsuit against OpenAI over its shift away from a nonprofit mission was unanimously dismissed by a California jury in May 2026.2026-04-01 · product launch — Tesla's AI5 chip successfully completed tape-out in April 2026 and is scheduled for production at Samsung's 2nm process.2026-01-01 · capacity expansion — Tesla resumed plans for the Dojo3 supercomputer project in January 2026 with TeraFab operational for developing DRAM, packaging, and chips.2025-07-01 · supply deal — Tesla signed a $16.5 billion foundry supply agreement with Samsung covering AI5 and AI6 chip production through 2033.2025-06-11 · litigation — Tesla sued former Optimus engineer Zhongjie Li and his company Proception Inc. for allegedly stealing confidential information about the humanoid robot's advanced hand sensors.2025-06-11 · litigation — Tesla, Inc. sues Proception, Inc. for trade secret misappropriation under the Defend Trade Secrets Act.2025-06-11 · litigation — Tesla sued former engineer Zhongjie 'Jay' Li for allegedly stealing trade secrets regarding advanced robotic hand sensors from its Optimus humanoid robotics program to launch rival startup Proception.2025-06-05 · executive change — Milan Kovac, head of engineering for Optimus, left Tesla, with Ashok Elluswamy taking over responsibility for the Optimus program.2025-06-01 · product launch — Tesla plans to launch unsupervised Full Self Driving as a paid service in Austin in June 2025.2025-06-01 · litigation — Tesla sued ex-Optimus engineer Jay Li and his startup Proception in June 2025 for allegedly downloading confidential files related to robotic hand actuation, with the case being settled and dismissed earlier in 2025.2025-03-05 · product launch — GraniteShares announced changes to TSLA Daily ETFs, modifying leverage factors and renaming funds effective May 4, 2025.2023-01-01 · product launch — Optimus Generation 2 was announced in 2023 and has successfully carried out tasks in Tesla factories with projected cost of $20,000 to $30,000 at scale.
  • 2028-12-31 capacity expansion Tesla plans to add another 70,000 units of Optimus capacity at its Austin facility by 2028.
  • 2028-12-31 capacity expansion Tesla plans to add another 70,000 units of capacity for Optimus at its Austin facility by 2028.
  • 2026-07-16 reported edge Allegro MicroSystems → physical_ai source ↗
  • 2026-07-14 litigation Tesla Inc. sues Bedeschi America, Inc. in federal district court over a contract dispute.
  • 2026-07-14 design-win Samsung Electronics → ai_chips source ↗
  • 2026-07-13 design-win Samsung Electronics → ai_chips source ↗
  • 2026-07-13 reported edge SK hynix → hbm source ↗
  • 2026-07-12 design-win Panasonic → physical_ai source ↗
  • 2026-07-12 reported edge MP Materials → physical_ai source ↗
  • 2026-07-11 product launch Tesla's AI5 chip reached tape-out and is scheduled for manufacturing at Samsung's Taylor fab using 2nm Gate-All-Around process technology.
  • 2026-07-02 disclosure Tesla, Inc. published a press release on July 2, 2026, disclosing results of operations and financial condition.
  • 2026-06-30 regulatory Ford recalled over 740,000 vehicles from 2018 to 2021 due to a transmission defect posing rollaway risk.
  • 2026-06-30 design-win NVIDIA → ai_chips source ↗
  • 2026-06-26 financial Tesla shares were mentioned among major stocks tracked in cautious Canadian trading on June 26, 2026.
  • 2026-06-18 capacity expansion Tesla increased its registered autonomous vehicles in Texas from 42 to 69, a 64% increase in less than a month.
  • 2026-06-04 litigation Waller v. Tesla, Inc. involves a contract dispute.
  • 2026-06-01 financial Ford reported a 13.6% drop in total vehicle sales for May, with Mustang Mach-E sales down 44% and F-150 Lightning sales down 45%.
  • 2026-05-28 litigation MiiR Holdings LLC alleges Tesla Inc. infringed patent 830.
  • 2026-05-14 other Tesla leadership joined US President Donald Trump's business delegation to Beijing.
  • 2026-05-01 litigation Elon Musk's high-profile lawsuit against OpenAI over its shift away from a nonprofit mission was unanimously dismissed by a California jury in May 2026.
  • 2026-04-23 design-win Leaderdrive → harmonic_reducers source ↗
  • 2026-04-01 product launch Tesla's AI5 chip successfully completed tape-out in April 2026 and is scheduled for production at Samsung's 2nm process.
  • 2026-01-01 capacity expansion Tesla resumed plans for the Dojo3 supercomputer project in January 2026 with TeraFab operational for developing DRAM, packaging, and chips.
  • 2025-10-23 design-win Taiwan Manufacturing → foundry source ↗
  • 2025-07-28 design-win Samsung Electronics → foundry source ↗
  • 2025-07-01 supply deal Tesla signed a $16.5 billion foundry supply agreement with Samsung covering AI5 and AI6 chip production through 2033.
  • 2025-06-30 design-win Suzhou Green Harmonic Drive Equipment → harmonic_reducer source ↗
  • 2025-06-30 design-win Zhejiang Sanhua Intelligent Controls → actuator_assembly source ↗
  • 2025-06-30 design-win Ningbo Tuopu → rotary_actuator source ↗
  • 2025-06-30 design-win Nidec → actuator_motor source ↗
  • 2025-06-30 design-win Harmonic Drive → harmonic_reducer source ↗
  • 2025-06-11 litigation Tesla sued former Optimus engineer Zhongjie Li and his company Proception Inc. for allegedly stealing confidential information about the humanoid robot's advanced hand sensors.
  • 2025-06-11 litigation Tesla, Inc. sues Proception, Inc. for trade secret misappropriation under the Defend Trade Secrets Act.
  • 2025-06-11 litigation Tesla sued former engineer Zhongjie 'Jay' Li for allegedly stealing trade secrets regarding advanced robotic hand sensors from its Optimus humanoid robotics program to launch rival startup Proception.
  • 2025-06-05 executive change Milan Kovac, head of engineering for Optimus, left Tesla, with Ashok Elluswamy taking over responsibility for the Optimus program.
  • 2024-12-26 design-win EVE Energy → batteries source ↗
  • 2024-10-31 design-win → Aptiv humanoid source ↗

Patents — 708 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 393
Electric motors 88
Lidar / ranging 39
IMU / navigation 36
Computing 32
Robotics / manipulators 29
Power electronics 25
Gears / reducers 19
Other 18
Imaging / cameras 14
Bearings 8
Force / torque sensors 5
Semiconductors 2

Newest 15 of 708, most recent first — all on Google Patents →

  • 2026-06-11US20260160330DYNAMIC TORQUE VISUALIZATION SYSTEM
  • 2026-06-04US20260155691ROTOR STRUCTURE WITH NON-MAGNETIC FILLER
  • 2026-04-16WO2026080690WRIST JOINT FOR ROBOTIC HAND
  • 2026-04-16WO2026080691ROBOTIC FOREARM ASSEMBLY
  • 2026-04-16WO2026080693JOINT ASSEMBLY FOR ROBOTIC APPENDAGE
  • 2026-04-16WO2026080701ROBOTIC APPENDAGE
  • 2025-07-10US2025224025SYSTEMS AND METHODS FOR DYNAMIC AND CONTINUOUS PHASE ADJUSTMENT USING STRAIN-WAVE GEARING FOR POWER TRANSMISSION SHAFTS
  • 2024-05-10WO2024097176SLITTED MAGNET FOR SELECTIVE COERCIVITY, AND METHODS THEREOF
  • 2024-05-10WO2024097226ELECTRIC MOTOR WITH MITIGATION OF ELECTRICALLY INDUCED BEARING DAMAGE (EIBD)
  • 2024-04-25WO2024086115LOCKING DIFFERENTIAL
  • 2024-04-04WO2024072966VERTICAL ENERGY STORAGE DEVICE ENCLOSURE AND SYSTEMS THEREOF FOR A ROBOT
  • 2024-04-04WO2024072984ACTUATOR AND ACTUATOR DESIGN METHODOLOGY
  • 2024-04-04WO2024073135SYSTEMS AND METHODS FOR A ROBOT KNEE JOINT ASSEMBLY
  • 2023-04-20WO2023064379INTEGRATED COMPONENTS FOR VEHICLES
  • 2020-02-06WO2020028730ALUMINUM ALLOYS FOR DIE CASTING

Financials — multi-year, confidence 1.0 (filings)

revenue

$24.6B '19
$31.5B '20
$53.8B '21
$81.5B '22
$96.8B '23
$97.7B '24
$94.8B '25

operating income

$-69M '19
$2.0B '20
$6.5B '21
$13.7B '22
$8.9B '23
$7.1B '24
$4.4B '25

net income

$-862M '19
$721M '20
$5.5B '21
$12.6B '22
$15.0B '23
$7.1B '24
$3.8B '25

Sources: Tesla, Inc. Form 10-K (accession 0001628280-24-002390) · MiiR Holdings LLC v. Tesla Inc — District Court, W.D. Wash… · TSLA 10-Q 2023-10-23 (acc 0001628280-23-034847) · Tesla, Inc. Form 10-K (accession 0001628280-26-003952) · Tesla, Inc. Form 10-K (accession 0000950170-22-000796) · TSLA 10-Q 2025-04-23 (acc 0001628280-25-018911) · TSLA 10-K 2023-01-31 (acc 0000950170-23-001409) · TSLA 10-K 2026-01-29 (acc 0001628280-26-003952) · TSLA 10-Q 2025-10-23 (acc 0001628280-25-045968) · Waller v. Tesla, Inc. — District Court, N.D. California — …

Buys from ← 21

🇨🇳 CATL batteries → Powerwall L3 50
🇨🇳 Suzhou Green Harmonic Drive Equipment harmonic_reducer → Tesla Optimus L3 80
🇨🇳 EVE Energy batteries → Powerwall L3 50
🇨🇳 Leaderdrive harmonic_reducers → Tesla Optimus L3 50
🇨🇳 Zhejiang Sanhua Intelligent Controls actuator_assembly → Tesla Optimus L3 70
🇰🇷 Samsung Electronics foundry → Tesla Optimus L3 80
🇨🇳 Ningbo Tuopu rotary_actuator → Tesla Optimus L3 50
🇰🇷 Samsung Electronics ai_chips → Full Self-Driving (FSD) (Supervised) L3 50
🇹🇼 Taiwan Manufacturing foundry L2 60
🇰🇷 Samsung Electronics ai_chips → Tesla Optimus L3 50
🇨🇳 JL MAG Rare-Earth rare_earth_magnets → Tesla Optimus L3 50
🇨🇭 STMicroelectronics imu → Tesla Optimus L3 50
🇰🇷 SK hynix hbm L2
🇨🇳 Zhongke Sanhuan rare_earth_magnets L2 50
🇺🇸 NVIDIA ai_chips → Tesla Optimus L3 50
🇯🇵 Panasonic physical_ai L2 50
🇯🇵 Nidec actuator_motor → Tesla Optimus L3 50
🇸🇪 SKF robotics → Tesla Optimus L3 50
🇯🇵 Harmonic Drive harmonic_reducer → Tesla Optimus L3 50
🇺🇸 Allegro MicroSystems physical_ai L2
🇺🇸 MP Materials physical_ai L2

Supplies → 1

🇮🇪 Aptiv humanoid L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Model YModel STesla OptimusSolar RoofRobotaxiTesla SemiCybertruckModel XPowerwallFull Self-Driving (FSD) (Supervised)CybercabMegapackModel 3

Texas InstrumentspublicProduct-grade

physical ai · 🇺🇸 United States · NASDAQ: TXN · 66 sources · 9 products · 2066 patents

$17.7Brevenue · FY2025 · USD$265.0B mkt cap

Texas Instruments is a US semiconductor manufacturer founded in 1930, producing analog and embedded processing chips including the C2000 and MSP430 microcontroller families, DRV motor drivers, and TPS power management ICs.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $14.5BFY2021: $18.3BFY2022: $20.0BFY2023: $17.5BFY2024: $15.6BFY2025: $17.7B wins 2023-04-20 · Merck KGaA → ai_chips — click for source2026-04-29 · Murata Manufacturing → imu — click for source2026-01-29 · Taiwan Manufacturing → foundry — click for source2026-06-22 · → NVIDIA compute — click for source2025-12-15 · UBTech Robotics → humanoid — click for source2021-04-08 · JCET → osat — click for source2026-07-12 · Arteris → ai_compute — click for source2025-12-15 · → UBTech Robotics compute — click for source events 2026-07-15 · financial — Texas Instruments stock fell approximately 4.14% in early afternoon trading as semiconductor sector volatility spread following memory chip market turmoil.2026-01-01 · financial — Investment tax credit increased to 35% as of January 1, 2026 for any CapEx put in place including equipment, building, and clean room.2025-12-31 · financial — Received $670 million cash benefit related to CHIPS Act incentives in 2025.2025-12-31 · financial — Data center revenue reached approximately $450 million per quarter at end of 2025 and grew 70% year-over-year in 2025.2025-10-21 · executive change — The board of directors has elected Haviv Ilan as chairman of the board beginning January 2026, succeeding Rich Templeton who will retire as chairman after a 45-year career with Texas Instruments.2025-09-01 · financial — In September, we announced we would increase our dividend by 4%, marking our twenty-second consecutive year of dividend increases.2022-09-13 · other — Texas Instruments is mentioned among companies in the Mixed Signal System-on-Chip market competitive landscape.
  • 2026-07-15 financial Texas Instruments stock fell approximately 4.14% in early afternoon trading as semiconductor sector volatility spread following memory chip market turmoil.
  • 2026-07-12 design-win Arteris → ai_compute source ↗
  • 2026-06-22 design-win → NVIDIA compute source ↗
  • 2026-04-29 design-win Murata Manufacturing → imu source ↗
  • 2026-01-29 design-win Taiwan Manufacturing → foundry source ↗
  • 2026-01-01 financial Investment tax credit increased to 35% as of January 1, 2026 for any CapEx put in place including equipment, building, and clean room.
  • 2025-12-31 financial Received $670 million cash benefit related to CHIPS Act incentives in 2025.
  • 2025-12-31 financial Data center revenue reached approximately $450 million per quarter at end of 2025 and grew 70% year-over-year in 2025.
  • 2025-12-15 design-win UBTech Robotics → humanoid source ↗
  • 2025-12-15 design-win → UBTech Robotics compute source ↗
  • 2025-10-21 executive change The board of directors has elected Haviv Ilan as chairman of the board beginning January 2026, succeeding Rich Templeton who will retire as chairman after a 45-year career with Texas Instruments.
  • 2025-09-01 financial In September, we announced we would increase our dividend by 4%, marking our twenty-second consecutive year of dividend increases.
  • 2023-04-20 design-win Merck KGaA → ai_chips source ↗
  • 2022-09-13 other Texas Instruments is mentioned among companies in the Mixed Signal System-on-Chip market competitive landscape.
  • 2021-04-08 design-win JCET → osat source ↗

Patents — 2066 CPC-scoped to physical ai (physical-AI-relevant classes)

Power electronics 1081
Imaging / cameras 475
Lidar / ranging 283
Batteries 59
Computing 49
Electric motors 39
Other 26
Force / torque sensors 21
Semiconductors 18
IMU / navigation 10
Robotics / manipulators 4
Gears / reducers 1

IP chokepoint in: Power electronics

Newest 4 of 2066, most recent first — all on Google Patents →

  • 2018-02-27US9902068Impedance signature analyzer to control automated actions
  • 2006-08-03WO2006080695CONNECTING PACKAGE FOR REFRIGERATOR COMPRESSOR
  • 2006-08-03WO2006080698CLAMP DEVICE FOR MOUNTING CONNECTING PACKAGE FOR REFRIGERATOR COMPRESSOR
  • 2005-12-27US6979788Electrical switch system responsive to gear selection of vehicular transmission

Financials — multi-year, confidence 1.0 (filings)

revenue

$14.5B '20
$18.3B '21
$20.0B '22
$17.5B '23
$15.6B '24
$17.7B '25

operating income

$5.9B '20
$9.0B '21
$10.1B '22
$7.3B '23
$5.5B '24
$6.0B '25

net income

$5.6B '20
$7.8B '21
$8.7B '22
$6.5B '23
$4.8B '24
$5.0B '25

Sources: TXN 10-Q 2023-10-25 (acc 0000097476-23-000041) · TXN 10-Q 2025-04-24 (acc 0000097476-25-000027) · TXN 10-Q 2025-07-29 (acc 0000097476-25-000036) · TXN 10-Q 2026-04-24 (acc 0000097476-26-000101) · TXN 10-Q 2024-04-24 (acc 0000097476-24-000021) · TXN 10-Q 2025-10-23 (acc 0000097476-25-000060) · TXN 10-Q 2024-07-24 (acc 0000097476-24-000030) · TXN 10-K 2026-02-06 (acc 0000097476-26-000059) · TXN 10-K 2024-02-02 (acc 0000097476-24-000007) · TXN 10-Q 2023-04-26 (acc 0000097476-23-000025)

Buys from ← 7

🇩🇪 Merck KGaA ai_chips L2 50
🇯🇵 Murata Manufacturing imu L2 65
🇹🇼 Taiwan Manufacturing foundry L2 53
🇨🇳 UBTech Robotics humanoid L2 50
🇹🇼 UMC foundry L2 50
🇨🇳 JCET osat L2 50
🇺🇸 Arteris ai_compute L2 50

Supplies → 3

🇺🇸 NVIDIA compute → NVIDIA DRIVE L3 50
🇺🇸 Apptronik compute → Apollo L3 50
🇨🇳 UBTech Robotics compute → Walker S L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

DRV seriesTPS seriesArm Cortex-M4 MCUDAC seriesC2000INA seriesOPA seriesADS seriesMSP430

THK Co., Ltd.publicRelationships + financials

physical ai · 🇯🇵 Japan · TSE: 6481 · 14 sources · 2 products · 923 patents

$1.5Brevenue · FY2025 · USD$4.6B mkt cap

Japanese maker of linear-motion components — LM guides, ball screws, ball splines, linear actuators — used in robots, machine tools and semiconductor equipment. Founded 1971; HQ Tokyo.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $2.1BFY2021: $2.9BFY2022: $3.0BFY2023: $2.5BFY2024: $2.3BFY2025: $1.5B wins 2026-07-17 · Daido Steel → steel — click for source2026-07-17 · Sanyo Special Steel → steel — click for source events 2025-01-01 · financial report — THK filed a half-year financial report for fiscal period 56 (January 1 - December 31, 2025).
  • 2026-07-17 reported edge Daido Steel → steel source ↗
  • 2026-07-17 reported edge Sanyo Special Steel → steel source ↗
  • 2025-01-01 financial report THK filed a half-year financial report for fiscal period 56 (January 1 - December 31, 2025).

Patents — 923 CPC-scoped to physical ai (physical-AI-relevant classes)

Bearings 430
Gears / reducers 200
Robotics / manipulators 171
Electric motors 88
Force / torque sensors 14
Imaging / cameras 9
IMU / navigation 5
Other 4
Power electronics 1
Lidar / ranging 1

IP chokepoint in: Bearings

Newest 26 of 923, most recent first — all on Google Patents →

Buys from ← 2

🇯🇵 Daido Steel steel L2
🇯🇵 Sanyo Special Steel steel L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Ball screwLM Guide (linear motion guide)

Tokyo ElectronpublicProduct-grade

ai compute · 🇯🇵 Japan · TSE: 8035 · 32 sources · 5 products · 2080 patents

$16.2Brevenue · FY2026 · USD$182.4B mkt cap

Coat/develop, etch, deposition

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $10.4BFY2021: $8.6BFY2022: $17.8BFY2023: $16.3BFY2024: $11.3BFY2025: $15.0BFY2026: $16.2B wins 2026-06-22 · → Intel ai_chips — click for source2025-10-29 · → Micron ai_chips — click for source events 2026-01-27 · financial — Tokyo Electron stock was purchased by market participants following strong U.S. semiconductor sector performance.2025-04-01 · financial report — Tokyo Electron reports half-year financial results for fiscal period 2025/04/01-2026/03/31.2025-01-27 · financial — Tokyo Electron stock rose as part of semiconductor-related buying following Philadelphia Semiconductor Index's 18-consecutive day rally.
  • 2026-06-22 design-win → Intel ai_chips source ↗
  • 2026-01-27 financial Tokyo Electron stock was purchased by market participants following strong U.S. semiconductor sector performance.
  • 2025-10-29 design-win → Micron ai_chips source ↗
  • 2025-04-01 financial report Tokyo Electron reports half-year financial results for fiscal period 2025/04/01-2026/03/31.
  • 2025-01-27 financial Tokyo Electron stock rose as part of semiconductor-related buying following Philadelphia Semiconductor Index's 18-consecutive day rally.

Patents — 2080 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 1751
Computing 181
Robotics / manipulators 60
Other 53
Imaging / cameras 15
Electric motors 6
Memory 5
Force / torque sensors 4
Power electronics 2
Lidar / ranging 2
Bearings 1

Newest 27 of 2080, most recent first — all on Google Patents →

  • 2026-06-04US20260157123RESISTIVE RANDOM-ACCESS MEMORY DEVICE AND METHODS OF FORMING THEREOF
  • 2026-05-07WO2026094644COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE
  • 2026-04-02US20260093865INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, AND INFORMATION PROCESSING APPARATUS
  • 2026-04-02WO2026070598INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND COMPUTER PROGRAM
  • 2026-04-02WO2026070604INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND COMPUTER PROGRAM
  • 2026-03-26US20260087228INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, AND INFORMATION PROCESSING APPARATUS
  • 2026-03-19WO2026058728EXAMINATION METHOD, EXAMINATION SYSTEM, AND TESTER SYSTEM
  • 2025-12-04WO2025249225COMPUTER PROGRAM, METHOD FOR GENERATING TRAINED MODEL, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE
  • 2025-11-20WO2025239382PROCESSOR FOR EXECUTING PREFETCH TO ABSENT AREA OF PROGRAM MEMORY, PROGRAM RECORDING MEDIUM, AND METHOD
  • 2025-10-23US2025329562INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND STORAGE MEDIUM
  • 2025-10-16WO2025216108INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND COMPUTER PROGRAM
  • 2025-10-02US2025306572INFORMATION PROCESSING APPARATUS, RECIPE EDITING METHOD, AND SEMICONDUCTOR MANUFACTURING APPARATUS
  • 2025-10-02US2025307521METHOD FOR PROCESS FINE TUNING BASED ON COMPUTER SIMULATIONS
  • 2025-10-02WO2025205051INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND COMPUTER PROGRAM
  • 2025-10-02WO2025205125CONCEALMENT METHOD, INDUSTRIAL EQUIPMENT SYSTEM, AND COMPUTER PROGRAM
  • 2025-09-18WO2025192673INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND COMPUTER PROGRAM
  • 2025-09-12WO2025187669COMPUTER PROGRAM, METHOD FOR GENERATING LEARNING MODEL, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE
  • 2025-07-24WO2025154573COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND INFORMATION PROCESSING SYSTEM
  • 2025-06-26US2025209654INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND STORAGE MEDIUM
  • 2025-06-19US2025200058INFORMATION PROCESSING APPARATUS AND SELECTION SUPPORTING METHOD
  • 2025-06-19US2025200247INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND STORAGE MEDIUM
  • 2025-06-05WO2025115335COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE
  • 2025-06-05WO2025115751INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, AND INFORMATION PROCESSING DEVICE
  • 2025-05-15US2025155879SYSTEM FOR PROCESS DEVELOPMENT ASSISTANCE
  • 2025-04-17WO2025079460INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, AND INFORMATION PROCESSING DEVICE
  • 2025-02-27US2025068823CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS
  • 2025-01-09WO2025009470INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, AND INFORMATION PROCESSING DEVICE

Financials — multi-year, confidence 1.0 (filings)

revenue

$11.5B '19
$10.4B '20
$8.6B '21
$17.8B '22
$16.3B '23
$11.3B '24
$15.0B '25
$16.2B '26

operating income

$2.8B '19
$2.2B '20
$2.0B '21
$3.7B '22
$3.8B '23
$3.2B '24
$4.6B '25
$4.2B '26

net income

$2.2B '19
$1.7B '20
$2.3B '21
$2.7B '22
$2.9B '23
$2.2B '24
$3.6B '25
$3.8B '26

Sources: 東京エレクトロン株式会社 — 臨時報告書 · 東京エレクトロン株式会社 — 半期報告書-第63期(2025/04/01-2026/03/31) · 東京エレクトロン株式会社 — 臨時報告書 · 東京エレクトロン株式会社 — 有価証券報告書-第63期(2025/04/01-2026/03/31) · 東京エレクトロン株式会社 — 臨時報告書

Supplies → 3

🇺🇸 Intel ai_chips → Gaudi Accelerators L3 53
🇺🇸 Micron ai_chips L2 53
🇮🇳 Tata Electronics ai_chips L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Stratos platformProtura platformNexx platformLithius platformVector platform

Tokyo Ohka KogyopublicProduct-grade

ai compute · 🇯🇵 Japan · TSE: 4186 · 10 sources · 5 products · 237 patents

$1.6Brevenue · FY2025 · USD$7.3B mkt cap

Photoresists

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.1BFY2021: $863MFY2022: $1.1BFY2023: $1000MFY2024: $1.2BFY2025: $1.6B wins 2025-10-01 · → Intel ai_chips — click for source2025-11-06 · → Samsung Electronics ai_chips — click for source2025-11-06 · → SK hynix ai_chips — click for source events 2025-01-01 · financial report — Tokyo Ohka Kogyo reported financial results for the first half of fiscal year 96 (2025).
  • 2025-11-06 design-win → Samsung Electronics ai_chips source ↗
  • 2025-11-06 design-win → SK hynix ai_chips source ↗
  • 2025-10-01 design-win → Intel ai_chips source ↗
  • 2025-01-01 financial report Tokyo Ohka Kogyo reported financial results for the first half of fiscal year 96 (2025).

Patents — 237 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 227
Computing 6
Other 3
Robotics / manipulators 1

Newest 2 of 237, most recent first — all on Google Patents →

  • 2020-08-13WO2020162177AUTHENTICATION OBJECT, AUTHENTICATION SYSTEM, AND AUTHENTICATION-USE MEDIUM PRODUCTION METHOD
  • 2015-01-22WO2015008776SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND PRODUCTION METHOD

Financials — multi-year, confidence 1.0 (filings)

revenue

$953M '18
$944M '19
$1.1B '20
$863M '21
$1.1B '22
$1000M '23
$1.2B '24
$1.6B '25

operating income

$94M '18
$86M '19
$144M '20
$128M '21
$186M '22
$162M '23
$219M '24
$317M '25

net income

$62M '18
$50M '19
$93M '20
$162M '21
$121M '22
$91M '23
$150M '24
$223M '25

Sources: 東京応化工業株式会社 — 臨時報告書 · 東京応化工業株式会社 — 臨時報告書 · 東京応化工業株式会社 — 臨時報告書 · 東京応化工業株式会社 — 半期報告書-第96期(2025/01/01-2025/12/31) · 東京応化工業株式会社 — 臨時報告書 · 東京応化工業株式会社 — 有価証券報告書-第96期(2025/01/01-2025/12/31) · 東京応化工業株式会社 — 臨時報告書 · 東京応化工業株式会社 — 臨時報告書 · 東京応化工業株式会社 — 臨時報告書

Supplies → 3

🇺🇸 Intel ai_chips → Intel 7/Intel 4/Intel 20A/Intel 18A L3 50
🇰🇷 Samsung Electronics ai_chips → HBM (High Bandwidth Memory) L3 50
🇰🇷 SK hynix ai_chips → HBM (High Bandwidth Memory) L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Electron Beam Resisti-line PhotoresistArF PhotoresistKrF PhotoresistEUV Photoresist

Tower SemiconductorpublicRelationships + financials

ai compute · 🇮🇱 Israel · 42 sources · 0 products · 48 patents

$1.6Brevenue · FY2025 · USD$76.4B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.3BFY2021: $1.5BFY2022: $1.7BFY2023: $1.4BFY2024: $1.4BFY2025: $1.6B wins events 2024-03-26 · litigation — GlobalFoundries sued Tower Semiconductor for patent infringement involving 11 patents across a range of products on March 26.
  • 2024-03-26 litigation GlobalFoundries sued Tower Semiconductor for patent infringement involving 11 patents across a range of products on March 26.

Patents — 48 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 36
Memory 5
Power electronics 4
Imaging / cameras 2
Lidar / ranging 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.3B '20
$1.5B '21
$1.7B '22
$1.4B '23
$1.4B '24
$1.6B '25

operating income

$91M '20
$167M '21
$312M '22
$547M '23
$191M '24
$194M '25

net income

$82M '20
$150M '21
$265M '22
$519M '23
$208M '24
$221M '25

Supplies → 1

🇺🇸 Vishay Intertechnology ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

UBTech RoboticspublicProduct-grade

physical ai · 🇨🇳 China · HKEX: 9880 · 26 sources · 5 products · 1314 patents

$295Mrevenue · FY2025 · USD$4.5B mkt cap

Walker S humanoid

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $109MFY2021: $121MFY2022: $149MFY2023: $156MFY2024: $193MFY2025: $295M wins 2025-12-15 · → Texas Instruments humanoid — click for source2026-04-23 · Leaderdrive → harmonic_reducers — click for source2025-12-15 · Texas Instruments → compute — click for source2026-07-01 · Rockchip → ai_compute — click for source events 2026-07-02 · other — J.P. Morgan analyst maintained a Buy rating on UBTECH ROBOTICS CORP LTD Class H with a price target of HK$161.00.2026-07-01 · product launch — UBTech Robotics unveiled the U1, a consumer humanoid robot designed for personal companionship with lifelike silicone skin and emotional AI, available in Lite, Pro and Ultra variants priced from 119,800 yuan to 990,000 yuan.2026-06-30 · product launch — UBTech unveiled the U1 humanoid robot, priced at 119,800 yuan ($17,600) for basic version and 990,000 yuan for Ultra version, with over 13,300 pre-orders and deliveries starting in September.
  • 2026-07-02 other J.P. Morgan analyst maintained a Buy rating on UBTECH ROBOTICS CORP LTD Class H with a price target of HK$161.00.
  • 2026-07-01 product launch UBTech Robotics unveiled the U1, a consumer humanoid robot designed for personal companionship with lifelike silicone skin and emotional AI, available in Lite, Pro and Ultra variants priced from 119,800 yuan to 990,000 yuan.
  • 2026-07-01 design-win Rockchip → ai_compute source ↗
  • 2026-06-30 product launch UBTech unveiled the U1 humanoid robot, priced at 119,800 yuan ($17,600) for basic version and 990,000 yuan for Ultra version, with over 13,300 pre-orders and deliveries starting in September.
  • 2026-04-23 design-win Leaderdrive → harmonic_reducers source ↗
  • 2025-12-15 design-win → Texas Instruments humanoid source ↗
  • 2025-12-15 design-win Texas Instruments → compute source ↗

Patents — 1314 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 896
IMU / navigation 159
Lidar / ranging 95
Computing 43
Imaging / cameras 41
Other 30
Gears / reducers 17
Electric motors 14
Force / torque sensors 7
Batteries 6
Power electronics 5
Bearings 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$109M '20
$121M '21
$149M '22
$156M '23
$193M '24
$295M '25

operating income

$-86M '20
$-137M '21
$-143M '22
$-181M '23
$-169M '24
$-108M '25

net income

$-104M '20
$-136M '21
$-144M '22
$-182M '23
$-166M '24
$-104M '25

Buys from ← 3

🇨🇳 Leaderdrive harmonic_reducers → Walker S L3 50
🇺🇸 Texas Instruments compute → Walker S L3 50
🇨🇳 Rockchip ai_compute → Walker Pro L3 50

Supplies → 1

🇺🇸 Texas Instruments humanoid L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Walker SWalker ProWalker XAlpha seriesYanshee

UMCpublicRelationships + financials

ai compute · 🇹🇼 Taiwan · TWSE: 2303 · 49 sources · 8 products · 2056 patents

$7.7Brevenue · FY2025 · USD

Foundry

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $6.0BFY2021: $7.6BFY2022: $9.4BFY2023: $7.2BFY2024: $7.3BFY2025: $7.7B wins 2026-07-16 · → Allegro MicroSystems foundry — click for source2025-07-30 · Intel → merchant_gpu — click for source events 2026-07-15 · disclosure — UMC filed a Form 6-K on July 15, 2026, with no substantive material event disclosed in the body; the filing contains only standard SEC cover page, signature block, and exhibit index.2026-07-14 · disclosure — UMC filed a Form 6-K on July 14, 2026, signed by CFO Chitung Liu. The filing body contains only administrative SEC cover pages and signature blocks with no material business event disclosed.2026-07-06 · disclosure — UMC filed a Form 6-K on July 6, 2026, as a routine foreign issuer report with no substantive material event disclosed in the body.2026-06-01 · partnership — Cooperation with Intel on 12-nanometer is progressing well and remain on track according to project milestone, with early PDK ready for first wave of customer in June 2026.2026-01-01 · capacity expansion — 12i P3 production range will actually start in January 2026 now, and the P3 will ramp up with high volume starting from the second half of 2026.2026-01-01 · capacity expansion — Phase 3 facility at Singapore Fab 12i set to start production in 2026 with ramp-up beginning in January 2026 and higher volume starting in second half of 2026.2026-01-01 · partnership — 12-nanometer collaboration with U.S. partner Intel to offer customers a migration path beyond 22 nanometers with early PDK ready for first wave of customers by 2026.2025-12-31 · capacity expansion — UMC completed the new Phase III facility at its Singapore Fab 12i in 2025, which is playing a central role in supporting customers to diversify supply chain.2025-12-31 · financial — 2025 cash-based CapEx budget remains unchanged at USD 1.8 billion.2025-01-26 · capacity expansion — Singapore Phase 3 fab will enhance customer supply chain resilience and is progressing as planned with production starting January 26.2025-01-21 · other — January 21 earthquake impact affected Q1 2025 gross margin by about low single digit percentage with losses to be compensated through insurance.2024-05-01 · product launch — Launched industry first 22-nanometer high-V solution in May 2024 for next-generation handsets and OLED display applications.
  • 2026-07-16 reported edge → Allegro MicroSystems foundry source ↗
  • 2026-07-15 disclosure UMC filed a Form 6-K on July 15, 2026, with no substantive material event disclosed in the body; the filing contains only standard SEC cover page, signature block, and exhibit index.
  • 2026-07-14 disclosure UMC filed a Form 6-K on July 14, 2026, signed by CFO Chitung Liu. The filing body contains only administrative SEC cover pages and signature blocks with no material business event disclosed.
  • 2026-07-06 disclosure UMC filed a Form 6-K on July 6, 2026, as a routine foreign issuer report with no substantive material event disclosed in the body.
  • 2026-06-01 partnership Cooperation with Intel on 12-nanometer is progressing well and remain on track according to project milestone, with early PDK ready for first wave of customer in June 2026.
  • 2026-01-01 capacity expansion 12i P3 production range will actually start in January 2026 now, and the P3 will ramp up with high volume starting from the second half of 2026.
  • 2026-01-01 capacity expansion Phase 3 facility at Singapore Fab 12i set to start production in 2026 with ramp-up beginning in January 2026 and higher volume starting in second half of 2026.
  • 2026-01-01 partnership 12-nanometer collaboration with U.S. partner Intel to offer customers a migration path beyond 22 nanometers with early PDK ready for first wave of customers by 2026.
  • 2025-12-31 capacity expansion UMC completed the new Phase III facility at its Singapore Fab 12i in 2025, which is playing a central role in supporting customers to diversify supply chain.
  • 2025-12-31 financial 2025 cash-based CapEx budget remains unchanged at USD 1.8 billion.
  • 2025-07-30 design-win Intel → merchant_gpu source ↗
  • 2025-01-26 capacity expansion Singapore Phase 3 fab will enhance customer supply chain resilience and is progressing as planned with production starting January 26.
  • 2025-01-21 other January 21 earthquake impact affected Q1 2025 gross margin by about low single digit percentage with losses to be compensated through insurance.
  • 2024-05-01 product launch Launched industry first 22-nanometer high-V solution in May 2024 for next-generation handsets and OLED display applications.

Patents — 2056 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 1436
Memory 476
Computing 81
Other 55
Power electronics 7
Force / torque sensors 1

Newest 1 of 2056, most recent first — all on Google Patents →

  • 2006-10-05WO2006105473AUTOMATIC DETECTION OF RED LESIONS IN DIGITAL COLOR FUNDUS PHOTOGRAPHS

Financials — multi-year, confidence 1.0 (filings)

revenue

$5.0B '18
$4.8B '19
$6.0B '20
$7.6B '21
$9.4B '22
$7.2B '23
$7.3B '24
$7.7B '25

operating income

$189M '18
$158M '19
$749M '20
$1.9B '21
$3.5B '22
$1.9B '23
$1.6B '24
$1.4B '25

net income

$256M '18
$265M '19
$780M '20
$1.8B '21
$3.0B '22
$1.9B '23
$1.5B '24
$1.3B '25

Sources: UMC 20-F 2026-04-30 (acc 0001193125-26-193757) · UMC 20-F 2023-04-27 (acc 0001193125-23-119772) · UMC 20-F 2025-04-24 (acc 0001193125-25-092142) · UMC 20-F 2024-04-25 (acc 0001193125-24-111429)

Buys from ← 1

🇺🇸 Intel merchant_gpu L2 50

Supplies → 5

🇺🇸 Allegro MicroSystems foundry L2
🇺🇸 Intel foundry L2 50
🇺🇸 Texas Instruments foundry L2 50
🇹🇼 MediaTek foundry L2 50
🇺🇸 MaxLinear foundry L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

14nm Process TechnologyRF/Analog Services7nm Process Technology3nm Process TechnologyMemory Manufacturing Services5nm Process Technology12nm Process Technology28nm Process Technology

UnimicronpublicProduct-grade

ai compute · 🇹🇼 Taiwan · TWSE: 3037 · 9 sources · 3 products · 246 patents

$4.2Brevenue · FY2025 · USD$38.7B mkt cap

ABF substrates, PCB

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $2.7BFY2021: $3.3BFY2022: $4.7BFY2023: $3.3BFY2024: $3.6BFY2025: $4.2B wins events 2026-07-06 · financial — Unimicron targets $1.4 billion in global share sale through 50 million global depositary shares at $26.96 to $27.76 per share, representing a 3-5.8% discount to closing price.
  • 2026-07-06 financial Unimicron targets $1.4 billion in global share sale through 50 million global depositary shares at $26.96 to $27.76 per share, representing a 3-5.8% discount to closing price.

Patents — 246 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 204
Computing 27
Other 15

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.5B '18
$2.7B '19
$2.7B '20
$3.3B '21
$4.7B '22
$3.3B '23
$3.6B '24
$4.2B '25

operating income

$46M '18
$154M '19
$209M '20
$527M '21
$1.4B '22
$504M '23
$159M '24
$207M '25

net income

$57M '18
$106M '19
$170M '20
$412M '21
$923M '22
$372M '23
$158M '24
$207M '25

Supplies → 1

🇺🇸 NVIDIA advanced_packaging → Blackwell Ultra platform L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

PCB (Printed Circuit Boards)ABF (Ajinomoto Build-up Film) SubstratesHigh-Density Interconnect (HDI) Substrates

Velodyne LidarpublicFinancials only

physical ai · 🇺🇸 United States · 3 sources · 0 products · 116 patents

$62Mrevenue · FY2021 · USD$300M mkt cap

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'VLP-16 LiDAR (EAP payload option, not base config)' for Spot. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202020212022 rev FY2020: $95MFY2021: $62M wins events

Patents — 116 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 114
IMU / navigation 2

Financials — multi-year, confidence 1.0 (filings)

revenue

$95M '20
$62M '21

operating income

$-154M '20
$-211M '21

net income

$-150M '20
$-212M '21

VicorpublicProduct-grade

ai compute · 🇺🇸 United States · NASDAQ: VICR · 52 sources · 4 products · 66 patents

$408Mrevenue · FY2025 · USD$10.4B mkt cap

Power modules

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $297MFY2021: $359MFY2022: $399MFY2023: $405MFY2024: $359MFY2025: $408M wins 2023-08-01 · → Intel ai_chips — click for source2023-08-01 · → NVIDIA ai_chips — click for source events 2026-12-31 · financial — Total returns from Vicor's first ITC action (LEO 1) are expected to reach approximately $400 million through the end of 2026.2026-02-19 · regulatory — United States International Trade Commission has instituted a second investigation into illegal importation of power modules and computing systems, infringing Vicor's IP to nonisolated bus converters.2025-12-31 · financial — Royalty revenue for the year ended December 31, 2025, totaled $57.4 million, a 23.2% increase from $46.6 million for the prior year.2025-12-31 · financial — Product revenue for the fourth quarter totaled $92.7 million, up 4.5% sequentially and up 15.3% year-over-year.2025-12-31 · financial — Total product revenue and royalty revenue, including a $45 million patent litigation settlement received for the year ended December 31, 2025, increased 26.1% to $452.7 million.2025-12-31 · financial — Q4 book-to-bill improving sequentially, came in well above 1 and with 1-year backlog increasing 15.8% from the prior quarter, closing at $176.9 million.2025-09-30 · financial — Q3 product revenues and licensing income totaled $110.4 million, up 18.5% year-over-year.2025-09-30 · product launch — A new 800-volt power module, which will deliver 10 kilowatts at 48 volts in a package smaller than an iPhone will begin sampling in Q4.2025-09-30 · financial — Licensing revenue reached a run rate of nearly $90 million per year in Q3 2025.2025-07-02 · regulatory — Vicor has instituted a 10% tariff surcharge applicable to all new orders and customer backlog shipping after July 2.2025-06-30 · financial — Vicor recorded product revenues, licensing income and a patent litigation settlement for the second quarter of $141 million, up 50.1% sequentially from the first quarter of 2025 total of $94 million and up 64.3% in the second quarter of 2024 total of $85.9 million.2025-06-30 · capacity expansion — We ended the quarter with a construction in progress balance primarily for manufacturing and equipment of approximately $11.8 million and with approximately $3.1 million remaining to be spent.2025-06-30 · partnership — I am pleased to announce that our Gen 5 vertical power delivery solution to a lead customer is coming to fruition with a current density exceeding its original target specification.2025-06-30 · litigation — Earlier this year, we bought to fruition our first ITC action, which has resulted in cease and desist orders against the name respondents and an exclusion order against their customers, both OEM and hyperscalers.2025-02-28 · product launch — Vicor's second generation VPD ASIC is coming out of fab before the end of February 2025, with expectations to provide complete high performance solutions to lead customer in March.2025-02-13 · regulatory — The ITC issued final determination in Vicor's first NBM patent infringement case, resulting in exclusion and cease and desist orders banning the importation of infringing power modules and unlicensed computer systems infringing two Vicor patents.2025-01-31 · partnership — A hyperscaler has recently taken a license to Vicor's NBM IP and booked its future NBM requirements in January.2025-01-01 · other — Vicor transitioned off of a legacy ERP system and onto SAP, which went live on January 1.2024-12-31 · capacity expansion — Vicor successfully ramped its new vertically integrated ChiP factory, which is now achieving short cycle times and high-yield goals, enabling more efficient operations.2024-12-31 · financial — Advanced Products revenue increased 18% sequentially in Q4 2024, while Brick Products revenue declined 13% from Q3.2024-12-31 · financial — 1-year backlog increased 3.3% from prior quarter, closing at $155.5 million with Q4 book-to-bill ratio improving sequentially above 1.0.2024-12-31 · financial — Q4 2024 total revenue was $96.2 million, up 3.2% sequentially and up 3.8% year-over-year; full year 2024 revenue decreased 11.4% to $359.1 million from $405.1 million in prior year.2024-12-31 · financial — Q4 2024 gross profit margin was 52.4%, approximately 3.3% more than prior quarter; full year 2024 gross margin rose 0.7% to 51.2% from 50.6% in prior year.2024-09-30 · litigation — As evidenced by a recent ITC initial determination, certain actors have been playing a game of catch me if you can with copycat suppliers of infringing modules or discrete solutions.2024-09-30 · product launch — In Q3, we introduced five new DC to DC converter power module families that utilized advanced packaging technologies from our new ChiP fab featuring advances in control systems and components enabling two to three times higher power density.2024-09-30 · capacity expansion — We ended the quarter with a construction in progress balance, primarily for manufacturing equipment, of approximately $13.9 million and with approximately $8 million remaining to be spent.2024-09-30 · regulatory — With regards to automotive-grade capabilities, we were notified by the TUV that Vicor has met the requirements of the IATF 16949 standard.
  • 2026-12-31 financial Total returns from Vicor's first ITC action (LEO 1) are expected to reach approximately $400 million through the end of 2026.
  • 2026-02-19 regulatory United States International Trade Commission has instituted a second investigation into illegal importation of power modules and computing systems, infringing Vicor's IP to nonisolated bus converters.
  • 2025-12-31 financial Royalty revenue for the year ended December 31, 2025, totaled $57.4 million, a 23.2% increase from $46.6 million for the prior year.
  • 2025-12-31 financial Product revenue for the fourth quarter totaled $92.7 million, up 4.5% sequentially and up 15.3% year-over-year.
  • 2025-12-31 financial Total product revenue and royalty revenue, including a $45 million patent litigation settlement received for the year ended December 31, 2025, increased 26.1% to $452.7 million.
  • 2025-12-31 financial Q4 book-to-bill improving sequentially, came in well above 1 and with 1-year backlog increasing 15.8% from the prior quarter, closing at $176.9 million.
  • 2025-09-30 financial Q3 product revenues and licensing income totaled $110.4 million, up 18.5% year-over-year.
  • 2025-09-30 product launch A new 800-volt power module, which will deliver 10 kilowatts at 48 volts in a package smaller than an iPhone will begin sampling in Q4.
  • 2025-09-30 financial Licensing revenue reached a run rate of nearly $90 million per year in Q3 2025.
  • 2025-07-02 regulatory Vicor has instituted a 10% tariff surcharge applicable to all new orders and customer backlog shipping after July 2.
  • 2025-06-30 financial Vicor recorded product revenues, licensing income and a patent litigation settlement for the second quarter of $141 million, up 50.1% sequentially from the first quarter of 2025 total of $94 million and up 64.3% in the second quarter of 2024 total of $85.9 million.
  • 2025-06-30 capacity expansion We ended the quarter with a construction in progress balance primarily for manufacturing and equipment of approximately $11.8 million and with approximately $3.1 million remaining to be spent.
  • 2025-06-30 partnership I am pleased to announce that our Gen 5 vertical power delivery solution to a lead customer is coming to fruition with a current density exceeding its original target specification.
  • 2025-06-30 litigation Earlier this year, we bought to fruition our first ITC action, which has resulted in cease and desist orders against the name respondents and an exclusion order against their customers, both OEM and hyperscalers.
  • 2025-02-28 product launch Vicor's second generation VPD ASIC is coming out of fab before the end of February 2025, with expectations to provide complete high performance solutions to lead customer in March.
  • 2025-02-13 regulatory The ITC issued final determination in Vicor's first NBM patent infringement case, resulting in exclusion and cease and desist orders banning the importation of infringing power modules and unlicensed computer systems infringing two Vicor patents.
  • 2025-01-31 partnership A hyperscaler has recently taken a license to Vicor's NBM IP and booked its future NBM requirements in January.
  • 2025-01-01 other Vicor transitioned off of a legacy ERP system and onto SAP, which went live on January 1.
  • 2024-12-31 capacity expansion Vicor successfully ramped its new vertically integrated ChiP factory, which is now achieving short cycle times and high-yield goals, enabling more efficient operations.
  • 2024-12-31 financial Advanced Products revenue increased 18% sequentially in Q4 2024, while Brick Products revenue declined 13% from Q3.
  • 2023-08-01 design-win → Intel ai_chips source ↗
  • 2023-08-01 design-win → NVIDIA ai_chips source ↗

Patents — 66 CPC-scoped to ai compute (physical-AI-relevant classes)

Power electronics 46
Other 18
Semiconductors 2

Supplies → 2

🇺🇸 Intel ai_chips → Gaudi Accelerators L3 50
🇺🇸 NVIDIA ai_chips → Data center GPUs / AI accelerators L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Factorized Power Architecture (FPA)Brick ProductsAdvanced ProductsVicor Custom Power

Vishay IntertechnologypublicRelationships + financials

ai compute · 🇺🇸 United States · NYSE: VSH · 25 sources · 0 products · 4 patents

$3.1Brevenue · FY2025 · USD$5.1B mkt cap

Discovered via news_ner (2026-07-08). Monolithic Power Systems, Vishay Intertechnology, and Microchip Technology Stocks Trade Up, What You Need To Know. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $2.5BFY2021: $3.2BFY2022: $3.5BFY2023: $3.4BFY2024: $2.9BFY2025: $3.1B wins 2025-07-29 · → Denso / Denso Wave ai_compute — click for source2023-10-07 · Key Foundry → ai_compute — click for source events
  • 2025-07-29 design-win → Denso / Denso Wave ai_compute source ↗
  • 2023-10-07 design-win Key Foundry → ai_compute source ↗

Patents — 4 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 4

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.5B '20
$3.2B '21
$3.5B '22
$3.4B '23
$2.9B '24
$3.1B '25

operating income

$210M '20
$468M '21
$616M '22
$486M '23
$6M '24
$57M '25

net income

$123M '20
$298M '21
$429M '22
$324M '23
$-31M '24
$-9M '25

Buys from ← 2

🇮🇱 Tower ai_compute L2 50
🇰🇷 Key Foundry ai_compute L2 50

Supplies → 1

🇯🇵 Denso / Denso Wave ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

WinbondpublicRelationships + financials

ai compute · 🇹🇼 Taiwan · TWSE: 2344 · 6 sources · 0 products · 25 patents

$2.8Brevenue · FY2025 · USD$21.6B mkt cap

Discovered via news_ner (2026-07-08). TSMC's Winbond DRAM Deal Isn't Domination, It's Insurance. Here's What It Actually Means for Chip ETFs. Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $1.9BFY2021: $3.1BFY2022: $2.9BFY2023: $2.3BFY2024: $2.5BFY2025: $2.8B wins 2026-07-06 · → Taiwan Manufacturing ai_compute — click for source events
  • 2026-07-06 design-win → Taiwan Manufacturing ai_compute source ↗

Patents — 25 CPC-scoped to ai compute (physical-AI-relevant classes)

Other 18
Memory 7

Newest 7 of 25, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.9B '20
$3.1B '21
$2.9B '22
$2.3B '23
$2.5B '24
$2.8B '25

operating income

$61M '20
$590M '21
$580M '22
$-51M '23
$10M '24
$176M '25

net income

$41M '20
$423M '21
$403M '22
$-36M '23
$19M '24
$124M '25

Supplies → 1

🇹🇼 Taiwan Manufacturing ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Wolong ElectricpublicRelationships + financials

physical ai · 🇨🇳 China · SSE: 600580 · 2 sources · 7 products · 80 patents

$2.3Brevenue · FY2025 · USD$6.8B mkt cap

Motors

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.9BFY2021: $2.0BFY2022: $2.1BFY2023: $2.3BFY2024: $2.4BFY2025: $2.3B wins events

Patents — 80 CPC-scoped to physical ai (physical-AI-relevant classes)

Electric motors 41
Other 31
Power electronics 5
Batteries 2
Bearings 1

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.7B '18
$1.8B '19
$1.9B '20
$2.0B '21
$2.1B '22
$2.3B '23
$2.4B '24
$2.3B '25

operating income

$120M '18
$174M '19
$161M '20
$208M '21
$147M '22
$114M '23
$149M '24
$168M '25

net income

$96M '18
$139M '19
$128M '20
$153M '21
$118M '22
$78M '23
$117M '24
$157M '25

Buys from ← 1

🇨🇳 C&U physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

YVF SeriesYE3 SeriesYVFE SeriesYE2 SeriesYEJ SeriesYX3 SeriesYC Series

Wuzhou XinchunpublicFinancials only

physical ai · 🇨🇳 China · SSE: 603667 · 2 sources · 0 products

$465Mrevenue · FY2025 · USD

Bearings, screws

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $254MFY2021: $357MFY2022: $476MFY2023: $439MFY2024: $481MFY2025: $465M wins events

Financials — multi-year, confidence 1.0 (filings)

revenue

$208M '18
$263M '19
$254M '20
$357M '21
$476M '22
$439M '23
$481M '24
$465M '25

operating income

$18M '18
$16M '19
$11M '20
$22M '21
$26M '22
$23M '23
$16M '24
$17M '25

net income

$16M '18
$15M '19
$9M '20
$18M '21
$22M '22
$20M '23
$14M '24
$14M '25

Yaskawa ElectricpublicProduct-grade

physical ai · 🇯🇵 Japan · TSE: 6506 · 31 sources · 8 products · 1142 patents

$3.6Brevenue · FY2026 · USD$8.2B mkt cap

Motoman robots, servo/motion

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev FY2021: $2.4BFY2022: $3.0BFY2023: $3.4BFY2024: $3.6BFY2025: $3.5BFY2026: $3.6B wins 2026-07-17 · Proterial → rare_earth_magnets — click for source2026-07-17 · Shin-Etsu Chemical → rare_earth_magnets — click for source2026-07-16 · NVIDIA → ai_chips — click for source2026-07-16 · → NVIDIA industrial_arm — click for source events 2025-03-01 · financial report — Yaskawa Electric reported financial results for the first half of fiscal year 110 (March 2025-February 2026).
  • 2026-07-17 reported edge Proterial → rare_earth_magnets source ↗
  • 2026-07-17 reported edge Shin-Etsu Chemical → rare_earth_magnets source ↗
  • 2026-07-16 reported edge NVIDIA → ai_chips source ↗
  • 2026-07-16 reported edge → NVIDIA industrial_arm source ↗
  • 2025-03-01 financial report Yaskawa Electric reported financial results for the first half of fiscal year 110 (March 2025-February 2026).

Patents — 1142 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 826
Power electronics 154
Electric motors 83
Computing 24
Force / torque sensors 10
Gears / reducers 10
Other 10
Bearings 8
Batteries 8
Semiconductors 7
Imaging / cameras 2

IP chokepoint in: Computing, Electric motors, Force / torque sensors, Power electronics, Robotics / manipulators

Newest 20 of 1142, most recent first — all on Google Patents →

  • 2026-06-11WO2026120837ROBOT SYSTEM, SETTING DEVICE, AND ROBOT CONTROL METHOD
  • 2026-06-11WO2026120934ROBOT SYSTEM AND ROBOT CONTROL METHOD
  • 2026-06-11WO2026120957ROBOT CONTROL SYSTEM, ROBOT CONTROL METHOD, AND ROBOT CONTROL PROGRAM
  • 2026-05-21WO2026105552ROBOT SYSTEM, TORQUE SENSOR, AND COMMUNICATION METHOD FOR ROBOT SYSTEM
  • 2026-05-07WO2026094365SUBSTRATE TRANSFER ROBOT SYSTEM, SUBSTRATE TRANSFER APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, MAINTENANCE METHOD, AND SUBSTRATE TRANSFER METHOD
  • 2026-04-23US20260109032TRANSFER ROBOT
  • 2026-03-05US20260061597ROBOT AND ROBOT SYSTEM
  • 2026-02-05US20260034681SUBSTRATE TRANSFER ROBOT SYSTEM, SEMICONDUCTOR TRANSFER APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, AND CONTROL METHOD THEREOF
  • 2026-01-22US20260026293SUBSTRATE TRANSFER ROBOT SYSTEM, SEMICONDUCTOR MANUFACTURING APPARATUS, AND CONTROL METHOD
  • 2025-11-13WO2025234440ROBOT SYSTEM, CONTROL METHOD, AND PROGRAM
  • 2025-10-02US2025303580END EFFECTOR VISION WITH LASER ASSIST
  • 2025-08-21WO2025173188ROBOT MONITORING SYSTEM, ROBOT MONITORING METHOD, AND ROBOT MONITORING PROGRAM
  • 2025-07-31US2025242493DETERMINATION OF CONSTRAINT FOR ROBOT CONTROL
  • 2025-06-26US2025205889DETERMINATION OF POSITIONAL RELATIONSHIP BETWEEN WORKPIECE AND ROBOT
  • 2025-06-26US2025205890DETERMINATION OF HOLDING POSITION ON WORKPIECE
  • 2025-06-26US2025205891ROBOT CONTROL WITH LIMITATION OF CONTROL QUANTITY
  • 2025-05-29US2025170705ROBOT CONTROL WITH ERROR REDUCTION
  • 2025-05-22US2025162136ROBOT AND METHOD FOR MANUFACTURING ROBOT
  • 2025-05-22US2025162137ROBOT AND METHOD FOR MANUFACTURING ROBOT
  • 2025-05-08US2025144813ROBOT SYSTEM, ROBOT, AND ROBOT CONTROL METHOD

Financials — multi-year, confidence 1.0 (filings)

revenue

$2.4B '21
$3.0B '22
$3.4B '23
$3.6B '24
$3.5B '25
$3.6B '26

operating income

$159M '21
$321M '22
$366M '23
$401M '24
$329M '25
$316M '26

net income

$117M '21
$236M '22
$319M '23
$312M '24
$374M '25
$235M '26

Sources: 株式会社安川電機 — 有価証券報告書-第110期(2025/03/01-2026/02/28) · 株式会社安川電機 — 半期報告書-第110期(2025/03/01-2026/02/28) · 株式会社安川電機 — 臨時報告書 · 株式会社安川電機 — 臨時報告書

Buys from ← 5

🇺🇸 ATI Industrial Automation force_torque → Motoman L3 50
🇯🇵 Proterial rare_earth_magnets L2
🇯🇵 Shin-Etsu Chemical rare_earth_magnets L2
🇨🇳 Sunrise Instruments force_torque → Motoman L3 50
🇺🇸 NVIDIA ai_chips L2

Supplies → 1

🇺🇸 NVIDIA industrial_arm L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

MotomanMH seriesYaskawa AC drives (Inverters)Servo drives and motion controlHC seriesGP seriesSigma seriesMPL series

Zhejiang Sanhua Intelligent Controls Co., Ltd.publicProduct-grade

physical ai · 🇨🇳 China · SZSE: 002050 · 3 sources · 6 products · 199 patents

$4.6Brevenue · FY2025 · USD$21.9B mkt cap

Zhejiang Sanhua Intelligent Controls Co., Ltd. is a China-based manufacturer of electronic expansion valves, solenoid valves and thermal management components for HVAC, refrigeration and automotive/EV applications.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.8BFY2021: $2.4BFY2022: $3.1BFY2023: $3.6BFY2024: $4.1BFY2025: $4.6B wins 2025-06-30 · → Tesla actuator_assembly — click for source events
  • 2025-06-30 design-win → Tesla actuator_assembly source ↗

Patents — 199 CPC-scoped to physical ai (physical-AI-relevant classes)

Electric motors 97
Gears / reducers 31
Other 28
Batteries 26
Robotics / manipulators 9
Bearings 3
Force / torque sensors 3
Power electronics 1
Computing 1

Newest 4 of 199, most recent first — all on Google Patents →

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.8B '20
$2.4B '21
$3.1B '22
$3.6B '23
$4.1B '24
$4.6B '25

operating income

$251M '20
$293M '21
$452M '22
$525M '23
$547M '24
$712M '25

net income

$216M '20
$249M '21
$380M '22
$431M '23
$457M '24
$599M '25

Supplies → 1

🇺🇸 Tesla actuator_assembly → Tesla Optimus L3 70

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Reversing ValvesPilot-Operated ValvesElectronic Expansion ValvesIntelligent Control ModulesSolenoid ValvesCheck Valves

Zhejiang WanmapublicFinancials only

physical ai · 🇨🇳 China · 1 sources · 0 products

$2.8Brevenue · FY2025 · USD$9.7B mkt cap

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026 rev FY2020: $1.4BFY2022: $1.9BFY2023: $2.2BFY2024: $2.6BFY2025: $2.8B wins events

Financials — multi-year, confidence 1.0 (filings)

revenue

$1.4B '20
$1.9B '22
$2.2B '23
$2.6B '24
$2.8B '25

operating income

$36M '20
$43M '22
$90M '23
$56M '24
$63M '25

net income

$33M '20
$40M '22
$61M '23
$50M '24
$51M '25

Zhongji InnoLightpublicProduct-grade

ai compute · 🇨🇳 China · SZSE: 300308 · 14 sources · 0 products

$5.3Brevenue · FY2025 · USD$161.2B mkt cap

800G/1.6T optical modules

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $1.0BFY2021: $1.1BFY2022: $1.2BFY2023: $1.6BFY2024: $3.5BFY2025: $5.3B wins 2026-07-01 · → NVIDIA optical_modules — click for source2026-07-01 · → Amazon optical_modules — click for source2026-04-18 · Broadcom → custom_asic — click for source events 2026-07-14 · financial — Zhongji InnoLight ranked No. 2 on Forbes China's 2026 Best CEOs List with shares rising more than six-fold in the past year and CEO Liu Sheng's fortune at $6.1 billion.
  • 2026-07-14 financial Zhongji InnoLight ranked No. 2 on Forbes China's 2026 Best CEOs List with shares rising more than six-fold in the past year and CEO Liu Sheng's fortune at $6.1 billion.
  • 2026-07-01 design-win → NVIDIA optical_modules source ↗
  • 2026-07-01 design-win → Amazon optical_modules source ↗
  • 2026-04-18 design-win Broadcom → custom_asic source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$780M '18
$689M '19
$1.0B '20
$1.1B '21
$1.2B '22
$1.6B '23
$3.5B '24
$5.3B '25

operating income

$103M '18
$83M '19
$146M '20
$142M '21
$142M '22
$369M '23
$841M '24
$1.9B '25

net income

$94M '18
$74M '19
$128M '20
$129M '21
$136M '22
$321M '23
$763M '24
$1.6B '25

Buys from ← 1

🇺🇸 Broadcom custom_asic L2 50

Supplies → 2

🇺🇸 NVIDIA optical_modules → Data center GPUs / AI accelerators L3 50
🇺🇸 Amazon optical_modules L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Zhongke SanhuanpublicRelationships + financials

physical ai · 🇨🇳 China · SZSE: 000970 · 2 sources · 0 products

$979Mrevenue · FY2025 · USD

Zhongke Sanhuan, also known as Beijing Zhong Ke San Huan High-Tech, is a publicly listed Chinese company producing rare-earth permanent magnet materials used in motors and industrial applications.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev FY2020: $686MFY2021: $1.1BFY2022: $1.4BFY2023: $1.2BFY2024: $938MFY2025: $979M wins 2026-07-17 · China Northern Rare Earth High-Tech → physical_ai — click for source2022-12-13 · → BYD rare_earth_magnets — click for source events
  • 2026-07-17 reported edge China Northern Rare Earth High-Tech → physical_ai source ↗
  • 2022-12-13 design-win → BYD rare_earth_magnets source ↗

Financials — multi-year, confidence 1.0 (filings)

revenue

$630M '18
$584M '19
$686M '20
$1.1B '21
$1.4B '22
$1.2B '23
$938M '24
$979M '25

operating income

$61M '18
$48M '19
$32M '20
$94M '21
$190M '22
$66M '23
$5M '24
$26M '25

net income

$38M '18
$29M '19
$19M '20
$62M '21
$126M '22
$41M '23
$2M '24
$14M '25

Buys from ← 3

🇨🇳 Jiangxi South Rare Earth Hi-Tech physical_ai L2 50
🇨🇳 Ganzhou Keli Rare Earth New Materials physical_ai L2 50
🇨🇳 China Northern Rare Earth High-Tech physical_ai L2

Supplies → 2

🇨🇳 BYD rare_earth_magnets L2 50
🇺🇸 Tesla rare_earth_magnets L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

1X TechnologiesprivateProduct-grade

physical ai · 🇳🇴 Norway · 52 sources · 2 products · 7 patents

revenue · USD

NEO / EVE humanoids

Last round Series B · 2024-01-01 · $100M raised Valuation $820M ↗

Investors SoftBank

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202520262027 rev wins 2025-12-13 · → EQT Partners humanoid — click for source events 2026-07-09 · product launch — 1X unveiled its Neo humanoid robot hands featuring 25 actuated degrees of freedom with tendon-driven motion, low gear ratios for force transparency, high-resolution tactile sensors, and IP68-sealed washable design.2026-04-30 · capacity expansion — 1X's Hayward NEO Factory spans 58,000 sq ft and employs 200+ team members with plans to scale to 100,000 humanoid robots per year by end of 2027.2026-04-30 · product launch — 1X commenced full-scale production of Neo humanoid robot at its Hayward, California facility.2026-01-01 · product launch — 1X Technologies' NEO bipedal home robot is available for $20,000 to own or $499 per month subscription with US deliveries beginning in 2026.
  • 2026-07-09 product launch 1X unveiled its Neo humanoid robot hands featuring 25 actuated degrees of freedom with tendon-driven motion, low gear ratios for force transparency, high-resolution tactile sensors, and IP68-sealed washable design.
  • 2026-04-30 capacity expansion 1X's Hayward NEO Factory spans 58,000 sq ft and employs 200+ team members with plans to scale to 100,000 humanoid robots per year by end of 2027.
  • 2026-04-30 product launch 1X commenced full-scale production of Neo humanoid robot at its Hayward, California facility.
  • 2026-01-01 product launch 1X Technologies' NEO bipedal home robot is available for $20,000 to own or $499 per month subscription with US deliveries beginning in 2026.
  • 2025-12-13 design-win → EQT Partners humanoid source ↗

Patents — 7 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 5
Other 2

No filing-grade financials loaded yet.

Buys from ← 1

🇺🇸 NVIDIA ai_chips → NEO L3 50

Supplies → 1

EQT Partners humanoid L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

EVENEO

ABB MotorssubsidiaryProfile

physical ai · 🇸🇪 Sweden · 9 sources · 0 products

Subsidiary of ABB Ltd · financials roll up to parent

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'AC servo motor (per-joint drive)' for IRB 14000. Skeleton pending enrichment (identifiers/financials).

Financials roll up to parent ABB Ltd — ABB Motors is a subsidiary and does not file standalone.

AgiBotprivateProduct-grade

physical ai · 🇨🇳 China · 78 sources · 2 products · 4 patents

revenue · USD

AgiBot, also known as Zhiyuan Robotics, is a China-based humanoid robotics developer founded in 2023, producing robots such as Yuanzheng and Genie for industrial and service applications. It is privately held.

Last round Series B · 2025-08-01 Valuation $2.1B ↗

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202520262027 rev wins 2025-02-19 · Ningbo Yunsheng → rare_earth_magnets — click for source2026-04-23 · Leaderdrive → harmonic_reducers — click for source2026-01-26 · Eyou Robot → physical_ai — click for source events
  • 2026-04-23 design-win Leaderdrive → harmonic_reducers source ↗
  • 2026-01-26 design-win Eyou Robot → physical_ai source ↗
  • 2025-02-19 design-win Ningbo Yunsheng → rare_earth_magnets source ↗

Patents — 4 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 3
Gears / reducers 1

Newest 4, most recent first — all on Google Patents →

  • 2025-10-02WO2025201073INSTRUMENT ASSEMBLY METHOD, SURGICAL ROBOT, AND COMPUTER-READABLE STORAGE MEDIUM
  • 2025-03-20WO2025055555POWER BOX OUTPUT ASSEMBLY, POWER BOX, SLIDE TABLE ASSEMBLY, AND SURGICAL ROBOT
  • 2024-05-10WO2024093422POWER BOX AND CONTROL ARM
  • 2022-12-01WO2022247481MECHANICAL ARM AND CONTROL METHOD THEREFOR

No filing-grade financials loaded yet.

Buys from ← 4

🇨🇳 Ningbo Yunsheng rare_earth_magnets → Yuanzheng L3 50
🇬🇧 Arm ai_chips L2 50
🇨🇳 Leaderdrive harmonic_reducers → Yuanzheng L3 50
🇨🇳 Eyou Robot physical_ai → Yuanzheng L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

YuanzhengGenie

Agility RoboticsprivateProduct-grade

physical ai · 🇺🇸 United States · 140 sources · 1 products · 58 patents

revenue · USD

Agility Robotics is a US-based robotics company, founded in 2015 as a spin-out from Oregon State University, known for developing the Digit bipedal humanoid robot for logistics applications.

Last round 2026-07-14 · $622M raised Valuation not disclosed

Investors Amazon · Samsung Electronics · Intrinsic

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20232024202520262027 rev wins 2026-05-15 · → Toyota Motor humanoid — click for source2024-11-14 · → Schaeffler humanoid — click for source2026-06-22 · NVIDIA → ai_chips — click for source2026-03-09 · Delta Electronics → ai_chips — click for source2026-05-15 · → Schaeffler humanoid — click for source2026-05-15 · → Amazon humanoid — click for source2024-11-14 · → Schaeffler humanoid — click for source events 2026-12-31 · product launch — A safety certified Digit Version 5 is targeted for release later this year to operate outside of the work cage and do multiple jobs at the same cost as an entry-level factory worker.2026-06-30 · M&A — Agility Robotics signed $2.5 billion SPAC deal in June 2026 to become first publicly listed pure-play humanoid robotics company, backed by Amazon and NVIDIA.2026-06-22 · partnership — Agility is the first company to incorporate elements of NVIDIA Halos for Robotics into its proprietary safety system for its humanoid robot Digit.2024-12-17 · partnership — Agility Robotics announced a minority investment, partnership, and new customer relationship with Schaeffler AG.2023-09-18 · other — Melonee Wise, CTO of Agility Robotics, is speaking at TechCrunch Disrupt 2023.2023-09-18 · other — Agility Robotics executives Damion Shelton and Melonee Wise are speaking at TechCrunch Disrupt 2023.
  • 2026-12-31 product launch A safety certified Digit Version 5 is targeted for release later this year to operate outside of the work cage and do multiple jobs at the same cost as an entry-level factory worker.
  • 2026-06-30 M&A Agility Robotics signed $2.5 billion SPAC deal in June 2026 to become first publicly listed pure-play humanoid robotics company, backed by Amazon and NVIDIA.
  • 2026-06-22 partnership Agility is the first company to incorporate elements of NVIDIA Halos for Robotics into its proprietary safety system for its humanoid robot Digit.
  • 2026-06-22 design-win NVIDIA → ai_chips source ↗
  • 2026-05-15 design-win → Toyota Motor humanoid source ↗
  • 2026-05-15 design-win → Schaeffler humanoid source ↗
  • 2026-05-15 design-win → Amazon humanoid source ↗
  • 2026-03-09 reported edge Delta Electronics → ai_chips source ↗
  • 2024-12-17 partnership Agility Robotics announced a minority investment, partnership, and new customer relationship with Schaeffler AG.
  • 2024-11-14 reported edge → Schaeffler humanoid source ↗
  • 2024-11-14 reported edge → Schaeffler humanoid source ↗
  • 2023-09-18 other Melonee Wise, CTO of Agility Robotics, is speaking at TechCrunch Disrupt 2023.
  • 2023-09-18 other Agility Robotics executives Damion Shelton and Melonee Wise are speaking at TechCrunch Disrupt 2023.

Patents — 58 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 35
Other 14
Gears / reducers 8
Computing 1

Newest 9 of 58, most recent first — all on Google Patents →

  • 2026-06-25US20260175408ACTUATOR ASSEMBLY WITH LOAD-DISTRIBUTION FEATURES AND RELATED TECHNOLOGY
  • 2025-09-04US2025278092Escalating hazard-response of dynamically stable mobile robot in a collaborative environment and related technology
  • 2025-08-21US2025264148Cycloid gear assembly with partial contact and related technology
  • 2025-08-21US2025264149CYCLOID GEAR ASSEMBLY WITH PARTIAL CONTACT AND RELATED TECHNOLOGY
  • 2025-08-21WO2025174861CYCLOID GEAR ASSEMBLY WITH PARTIAL CONTACT AND RELATED TECHNOLOGY
  • 2025-06-12US2025189962Differential Communication With Robots in a Fleet and Related Technology
  • 2025-04-17US2025122927THREADABLE CYCLOID ACTUATOR
  • 2021-02-18WO2021030263A TRANSMISSION, AND RELATED SYSTEMS AND METHODS
  • 1999-04-29WO9921070ROBOTIC MANIPULATOR

No filing-grade financials loaded yet.

Buys from ← 2

🇺🇸 NVIDIA ai_chips → Digit L3 50
🇹🇼 Delta Electronics ai_chips → Digit L3

Supplies → 5

Toyota Motor humanoid L2 50
🇩🇪 Schaeffler humanoid L2
🇩🇪 Schaeffler humanoid L2 50
🇺🇸 Amazon humanoid L2 50
🇩🇪 Schaeffler humanoid L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Digit

Allied VisionsubsidiaryProfile

physical ai · 🇩🇪 Germany · 5 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Head camera (vision)' for HUBO (+1 more). Skeleton pending enrichment (identifiers/financials).

No filing-grade financials loaded yet.

Alphatec Semiconductor Packaging Co.privateRelationships

ai compute · 🇹🇭 TH · 0 sources · 0 products

revenue · USD

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet · no sources yet (coverage gap).

Supplies → 1

🇨🇳 OmniVision ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Amazon Annapurna LabssubsidiaryProfile

ai compute · 🇺🇸 United States · 2 sources · 3 products

Subsidiary of Amazon.com, Inc. · financials roll up to parent

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'AWS Nitro DPU card (VPC/security/networking offload)' for AWS Trainium (+1 more). Skeleton pending enrichment (identifiers/financials).

Financials roll up to parent Amazon.com, Inc. — Amazon Annapurna Labs is a subsidiary and does not file standalone.

Products

AWS TrainiumAWS Nitro DPUAWS Inferentia

ApptronikprivateProduct-grade

physical ai · 🇺🇸 United States · 65 sources · 1 products · 64 patents

revenue · USD

Apptronik is a US-based private robotics company, founded in 2016, developing the Apollo humanoid robot for industrial and logistics applications.

Last round 2026-02-12 · $935M raised Valuation not disclosed

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2024202520262027 rev wins 2024-03-18 · NVIDIA → ai_chips — click for source events 2026-02-11 · financial — Apptronik closed a $520 million extension round, adding to its initial $415 million Series A funding for a total of $935 million.2026-02-01 · financial — Apptronik achieved a $5 billion valuation in February.
  • 2026-02-11 financial Apptronik closed a $520 million extension round, adding to its initial $415 million Series A funding for a total of $935 million.
  • 2026-02-01 financial Apptronik achieved a $5 billion valuation in February.
  • 2024-03-18 design-win NVIDIA → ai_chips source ↗

Patents — 64 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 44
Electric motors 7
Gears / reducers 7
Other 6

Newest 8 of 64, most recent first — all on Google Patents →

  • 2026-06-25WO2026136697HUMANOID ROBOT WITH VACUUM END EFFECTOR
  • 2026-02-19WO2026039621MANAGING ROBOTIC MANIPULATORS IN WORKFLOWS
  • 2025-10-30WO2025227025MANAGING ROBOTS IN WORKFLOWS WITH HUMAN INTERVENTION
  • 2024-10-03WO2024206984MANAGING ROBOTS IN WORKFLOWS
  • 2024-09-19WO2024191850LINEAR ACTUATOR AND HUMANOID ROBOT COMPRISING THE SAME
  • 2024-09-19WO2024191925HUMANOID ROBOT INTERFACE AND WORKFLOW
  • 2024-06-20WO2024129735HUMANOID ROBOT
  • 2019-09-12WO2019173751EXOSKELETON DEVICE WITH IMPROVED ACTUATION SYSTEM

No filing-grade financials loaded yet.

Buys from ← 2

🇺🇸 Texas Instruments compute → Apollo L3 50
🇺🇸 NVIDIA ai_chips → Apollo L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Apollo

ATI Industrial AutomationsubsidiaryProduct-grade

physical ai · 🇺🇸 United States · 24 sources · 5 products · 32 patents

revenue · USD

6-axis F/T sensors, tool changers

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20232024 rev wins 2023-08-09 · → FANUC force_torque — click for source events
  • 2023-08-09 design-win → FANUC force_torque source ↗

Patents — 32 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 28
Robotics / manipulators 3
Force / torque sensors 1

IP chokepoint in: Force / torque sensors

Newest 4 of 32, most recent first — all on Google Patents →

  • 2026-07-09US20260192470Robotic Tool Changer Having An Integrated Force/Torque Sensor
  • 2026-05-15WO2026102447REDUCING SENSITIVITY OF A FORCE/TORQUE SENSOR TO VARIATIONS IN BOUNDARY CONDITIONS
  • 2026-05-14US20260133085Force and/or Torque Sensor Employing Multiple Sensing Technologies
  • 2024-10-17US2024342927Manual Robotic Tool Changer with Generally Opposed Decoupling Actuation Force and Safety Latch Actuation Force

No filing-grade financials loaded yet.

Supplies → 2

🇯🇵 Yaskawa Electric force_torque → Motoman L3 50
🇯🇵 FANUC force_torque → Industrial robots L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Quick Change Tool ChangersESTsoftAxia80GammaMini45

Bosch RexrothsubsidiaryProduct-grade

physical ai · 🇩🇪 Germany · 4 sources · 7 products · 36 patents

Subsidiary of Robert Bosch GmbH · financials roll up to parent

revenue · USD

Linear motion, drives

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2023202420252026 rev wins 2025-11-18 · Signaloid → ai_compute — click for source events 2023-12-31 · partnership — Bosch Rexroth Assembly Technology and Bosch Rexroth Linear Motion Technology were added as new Industry 4.0 suppliers by RS in 2023.
  • 2025-11-18 design-win Signaloid → ai_compute source ↗
  • 2023-12-31 partnership Bosch Rexroth Assembly Technology and Bosch Rexroth Linear Motion Technology were added as new Industry 4.0 suppliers by RS in 2023.

Patents — 36 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 27
Electric motors 5
Gears / reducers 4

Newest 3 of 36, most recent first — all on Google Patents →

  • 2007-11-08WO2007124882HYDRAULIC FLUID RESERVOIR WITH INTEGRATED HIGH- AND LOW-PRESSURE CHAMBER
  • 2007-09-20WO2007104539MECHANICO-HYDRAULIC DRIVE COMPRISING A POWER SPLIT TRANSMISSION
  • 2007-06-28WO2007071380ENERGY RECOVERY DRIVE

Financials roll up to parent Robert Bosch GmbH — Bosch Rexroth is a subsidiary and does not file standalone.

Buys from ← 2

🇺🇸 NVIDIA ai_chips L2 50
🇬🇧 Signaloid ai_compute → IndraDrive L3 50

Supplies → 1

🇹🇼 Advantech roller_screws L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Rexroth Linear Motion SystemsMSK Servo MotorsRoller Screw SystemsBosch Rexroth GearboxesIndraDriveMKE Stepper MotorsIndraMotion

Bosch SensortecsubsidiaryProduct-grade

physical ai · 🇩🇪 Germany · 0 sources · 10 products · 3 patents

Subsidiary of Robert Bosch GmbH · financials roll up to parent

revenue · USD

MEMS IMUs, sensors

Patents — 3 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 2
Other 1

Financials roll up to parent Robert Bosch GmbH — Bosch Sensortec is a subsidiary and does not file standalone.

Supplies → 1

🇺🇸 Microsoft imu → Microsoft Azure L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

BNO055BME680BMI270BMI160BNO085BMG160BMA423BMP180BMI088BME688

Boston DynamicssubsidiaryProduct-grade

physical ai · 🇺🇸 United States · 203 sources · 3 products · 765 patents

Subsidiary of Hyundai Motor · financials roll up to parent

revenue · USD

Atlas (electric) humanoid, Spot, Stretch

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2020202120222023202420252026202720282029 rev wins 2024-11-29 · Hiwin → roller_screws — click for source2020-09-28 · → SoftBank humanoid — click for source2024-11-05 · Harmonic Drive L → actuators_reducers — click for source2021-12-16 · → Hyundai Motor humanoid — click for source2026-06-22 · LG Energy Solution → batteries — click for source2023-12-09 · → Hyundai Motor humanoid — click for source events 2028-12-31 · capacity expansion — Boston Dynamics aims to scale up manufacturing with South Korean supply chain to produce 30,000 Atlas humanoid robots annually by 2028.2028-01-01 · partnership — Boston Dynamics' humanoid robot Atlas will be deployed at HMG Metaplant America starting in 2028 for parts sequencing and potentially component assembly by 2030.2026-07-17 · acquired by — Boston Dynamics is now fully owned by Hyundai Motor Group, which plans to deploy the company's humanoid robots in its own factories.2026-07-05 · product launch — Boston Dynamics' Atlas robot performed at FIFA World Cup 2026 halftime show on July 5, 2026, delivering match ball and executing goal celebrations.2026-06-30 · other — Boston Dynamics CEO states that America's next 250 years will be built by robots and discusses the need for a national robotics strategy.2026-06-27 · capacity expansion — Boston Dynamics announced $100 million investment in new 323,000-square-foot robotics and AI center at 1601 Trapelo Road in Waltham, Massachusetts, expected to create 1,250 new jobs by 2033.2026-06-25 · acquired by — Boston Dynamics is planned to be acquired in full by Hyundai Motor, with current shareholders absorbing SoftBank's stake according to their ownership percentages.2026-01-05 · product launch — Fifth-generation fully electric Atlas humanoid robot was introduced publicly at CES 2026 on January 5, 2026, and entered commercial production in January 2026 at Waltham, Massachusetts headquarters.2025-07-18 · other — Boston Dynamics is profiled as a sample player in the global mobile robots market forecast report covering 2025-2035.2024-12-24 · product launch — Boston Dynamics' electric Atlas humanoid robot performed a backflip while wearing a Santa suit in a new video demonstration.2024-12-24 · product launch — Boston Dynamics' electric Atlas humanoid robot performed a backflip while wearing a Santa hat in a new video demonstration.2024-11-17 · product launch — Boston Dynamics' Spot robotic dog is being deployed by the US Secret Service for perimeter patrol at Mar-a-Lago.2024-11-17 · product launch — Boston Dynamics' Spot robotic dog is being deployed by the US Secret Service at Mar-a-Lago for security patrol operations.2023-12-22 · partnership — Aaron Saunders from Boston Dynamics discusses foundation models' impact on natural language interfaces and computer vision for robots.2023-12-14 · partnership — Boston Dynamics partnered with NEON Group and its subsidiary ANIMAX to develop fully untethered entertainment robots for immersive storytelling experiences.2023-12-03 · product launch — Boston Dynamics robot dogs (Basia Spot, Omuzana Spot, and Bunny Spot) were trained to paint autonomously as part of Agnieszka Pilat's art installation at the NGV Triennial.2023-09-18 · other — Marc Raibert of Boston Dynamics AI Institute is speaking on the Hardware Stage at TechCrunch Disrupt 2023.2023-09-18 · other — Boston Dynamics AI Institute head Marc Raibert is speaking at TechCrunch Disrupt 2023.2023-06-27 · other — Boston Dynamics is profiled as a company in the service robotics market.2023-01-01 · product launch — Boston Dynamics expanded the applications of its Spot robot in 2023, including remote monitoring and logistics support.2022-09-27 · partnership — Boston Dynamics' Spot robot will be the first to leverage FARO's new Robotics API for integrating reality captured data into virtual jobsites.2022-09-27 · partnership — Boston Dynamics' Spot robot is the first to leverage FARO's new Robotics API for the 4D Construction Progress Management Solution.2022-03-28 · product launch — Boston Dynamics will launch the Stretch Robot at MODEX 2022.2022-01-01 · product launch — Boston Dynamics showcased a quadrupedal robot dog at CES 2022 under Hyundai ownership.2021-12-28 · product launch — Boston Dynamics launched Stretch, a warehouse robot capable of moving 800 heavy boxes per hour with a single arm, gripper with sensors and suction cups, and omnidirectional mobile base.2021-12-21 · product launch — Boston Dynamics released a holiday video featuring its dog-like Spot robot disguised as a present.2021-12-05 · product launch — Hyundai-owned Boston Dynamics presented a four-footed robot called Spot and two-bipedal robots at Seoul Mobility Show 2021.2021-12-05 · product launch — Boston Dynamics presented a four-footed robot called Spot and two-bipedal robots at the Seoul Mobility Show 2021.2021-06-29 · acquired by — Hyundai officially completed its acquisition of Boston Dynamics.2021-06-22 · acquired by — Hyundai acquired an 80 percent stake in Boston Dynamics, valuing the company at $1.1 billion.2021-06-01 · acquired by — Hyundai Motor acquired an 80% stake in Boston Dynamics from SoftBank Group for approximately $880 million in June 2021.2021-06-01 · acquired by — Boston Dynamics acquired by Hyundai Motor Company2020-09-28 · product launch — Boston Dynamics' Spot robot is now on sale to the public.2020-09-25 · other — Boston Dynamics conducted routine mobility tests of its Spot robot in Northern Ontario, Canada.2020-09-17 · product launch — Boston Dynamics plans to announce logistics robot products in 2021 with commercial availability in 2022.2020-03-03 · partnership — Boston Dynamics unveiled a collaboration with OTTO Motors to automate warehouse logistics using heterogeneous robot fleets.2020-01-01 · executive change — Boston Dynamics appointed Rob Playter as its first-ever new CEO in January 2020.
  • 2028-12-31 capacity expansion Boston Dynamics aims to scale up manufacturing with South Korean supply chain to produce 30,000 Atlas humanoid robots annually by 2028.
  • 2028-01-01 partnership Boston Dynamics' humanoid robot Atlas will be deployed at HMG Metaplant America starting in 2028 for parts sequencing and potentially component assembly by 2030.
  • 2026-07-17 acquired by Boston Dynamics is now fully owned by Hyundai Motor Group, which plans to deploy the company's humanoid robots in its own factories.
  • 2026-07-05 product launch Boston Dynamics' Atlas robot performed at FIFA World Cup 2026 halftime show on July 5, 2026, delivering match ball and executing goal celebrations.
  • 2026-06-30 other Boston Dynamics CEO states that America's next 250 years will be built by robots and discusses the need for a national robotics strategy.
  • 2026-06-27 capacity expansion Boston Dynamics announced $100 million investment in new 323,000-square-foot robotics and AI center at 1601 Trapelo Road in Waltham, Massachusetts, expected to create 1,250 new jobs by 2033.
  • 2026-06-25 acquired by Boston Dynamics is planned to be acquired in full by Hyundai Motor, with current shareholders absorbing SoftBank's stake according to their ownership percentages.
  • 2026-06-22 design-win LG Energy Solution → batteries source ↗
  • 2026-01-05 product launch Fifth-generation fully electric Atlas humanoid robot was introduced publicly at CES 2026 on January 5, 2026, and entered commercial production in January 2026 at Waltham, Massachusetts headquarters.
  • 2025-07-18 other Boston Dynamics is profiled as a sample player in the global mobile robots market forecast report covering 2025-2035.
  • 2024-12-24 product launch Boston Dynamics' electric Atlas humanoid robot performed a backflip while wearing a Santa suit in a new video demonstration.
  • 2024-12-24 product launch Boston Dynamics' electric Atlas humanoid robot performed a backflip while wearing a Santa hat in a new video demonstration.
  • 2024-11-29 design-win Hiwin → roller_screws source ↗
  • 2024-11-17 product launch Boston Dynamics' Spot robotic dog is being deployed by the US Secret Service for perimeter patrol at Mar-a-Lago.
  • 2024-11-17 product launch Boston Dynamics' Spot robotic dog is being deployed by the US Secret Service at Mar-a-Lago for security patrol operations.
  • 2024-11-05 design-win Harmonic Drive L → actuators_reducers source ↗
  • 2023-12-22 partnership Aaron Saunders from Boston Dynamics discusses foundation models' impact on natural language interfaces and computer vision for robots.
  • 2023-12-14 partnership Boston Dynamics partnered with NEON Group and its subsidiary ANIMAX to develop fully untethered entertainment robots for immersive storytelling experiences.
  • 2023-12-09 design-win → Hyundai Motor humanoid source ↗
  • 2023-12-03 product launch Boston Dynamics robot dogs (Basia Spot, Omuzana Spot, and Bunny Spot) were trained to paint autonomously as part of Agnieszka Pilat's art installation at the NGV Triennial.
  • 2023-09-18 other Marc Raibert of Boston Dynamics AI Institute is speaking on the Hardware Stage at TechCrunch Disrupt 2023.
  • 2023-09-18 other Boston Dynamics AI Institute head Marc Raibert is speaking at TechCrunch Disrupt 2023.
  • 2023-06-27 other Boston Dynamics is profiled as a company in the service robotics market.
  • 2023-01-01 product launch Boston Dynamics expanded the applications of its Spot robot in 2023, including remote monitoring and logistics support.
  • 2021-12-16 design-win → Hyundai Motor humanoid source ↗
  • 2020-09-28 reported edge → SoftBank humanoid source ↗

Patents — 765 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 667
IMU / navigation 31
Computing 28
Gears / reducers 13
Lidar / ranging 11
Force / torque sensors 8
Electric motors 5
Batteries 1
Other 1

Newest 34 of 765, most recent first — all on Google Patents →

  • 2026-07-02US20260183963METHODS AND APPARATUS FOR CONTROLLING A ROBOT BASED ON VIDEO
  • 2026-07-02US20260184510METHODS AND APPARATUS FOR PALLET HANDLING
  • 2026-07-02US20260189090MOTOR FOR A MOBILE ROBOT
  • 2026-07-02US20260189097STATOR FOR AN ELECTRIC MOTOR OF A MOBILE ROBOT
  • 2026-06-25WO2026136238CONTROL ARCHITECTURE FOR A MOBILE ROBOT
  • 2026-06-11US20260158660SYSTEMS AND METHODS FOR CALIBRATING ROBOT ACTUATORS USING IMAGE DATA
  • 2026-04-30US20260119982MACHINE LEARNING MODEL PROMPT GENERATION BASED ON MOBILE ROBOT DATA
  • 2026-04-23US20260109055FLEXIBLE FINGER COMPONENTS
  • 2026-03-05US20260062075PERFORMANCE OF DOCKING MANEUVERS BY LEGGED ROBOTS USING DOCK ASSOCIATIONS
  • 2026-02-26US20260054392SEMANTIC ROBOT HAZARD AVOIDANCE WITH MULTI-MODAL PROMPTING
  • 2026-01-01US20260001217METHODS AND APPARATUS FOR DETERMINING POSE AND SIZE OF OBJECTS USING THREE-DIMENSIONAL MACHINE LEARNING
  • 2025-12-25US2025387915SYSTEMS AND METHOD FOR SAFE ACTUATION OF A MOBILE ROBOT
  • 2025-12-04US2025368453METHODS AND APPARATUS FOR PLACEMENT OF AN OBJECT ON A CONVEYOR USING A ROBOTIC DEVICE
  • 2025-12-04US2025370476METHODS AND APPARATUS FOR OBJECT QUALITY DETECTION
  • 2025-10-02US2025303589ROBOT WITH EXTRA-HUMAN BEHAVIOR
  • 2025-09-25US2025296235ROBOTIC END EFFECTOR WITH TACTILE SENSING
  • 2025-06-19US2025196326Screw actuator
  • 2025-06-19US2025196327BODY STRUCTURE FOR A ROBOT
  • 2025-06-19US2025196332ROBOTIC MANIPULATION OF OBJECTS
  • 2025-06-19US2025196333ROBOTIC MANIPULATION OF OBJECTS
  • 2025-06-19US2025196339AUTOMATED CONSTRAINED MANIPULATION
  • 2025-06-19US2025196345DYNAMIC AND VARIABLE DEFINITION OF ROBOT MISSIONS
  • 2025-06-19US2025199490SYSTEMS AND METHODS FOR ALTERING OPERATION OF MACHINERY
  • 2025-06-19US2025199543POWER MANAGEMENT FOR A ROBOTIC DEVICE
  • 2025-05-08US2025147517ROBOTIC STEP TIMING AND SEQUENCING USING REINFORCEMENT LEARNING
  • 2025-05-01US2025135636SYSTEMS AND METHODS FOR GRASPING OBJECTS WITH UNKNOWN OR UNCERTAIN EXTENTS USING A ROBOTIC MANIPULATOR
  • 2025-03-27US2025103052DYNAMIC PERFORMANCE OF ACTIONS BY A MOBILE ROBOT BASED ON SENSOR DATA AND A SITE MODEL
  • 2025-01-30US2025033225SYSTEMS AND METHODS FOR PROVIDING MODULAR ARCHITECTURES FOR ROBOTIC END EFFECTORS
  • 2024-10-24WO2024220811LIGHT AND/OR AUDIO OUTPUT USING LIGHT AND/OR AUDIO SOURCES OF A ROBOT
  • 2024-09-26US2024315910PERCEPTION SYSTEM FOR A LOWER BODY POWERED EXOSKELETON
  • 2024-09-26US2024316762ENVIRONMENTAL FEATURE-SPECIFIC ACTIONS FOR ROBOT NAVIGATION
  • 2024-09-12US2024300109Systems and methods for grasping and placing multiple objects with a robotic gripper
  • 2024-09-12US2024300110Methods and apparatus for modeling loading dock environments
  • 2024-06-27US2024208058METHODS AND APPARATUS FOR AUTOMATED CEILING DETECTION

Financials roll up to parent Hyundai Motor — Boston Dynamics is a subsidiary and does not file standalone.

Buys from ← 3

🇹🇼 Hiwin roller_screws → Spot L3 50
🇺🇸 Harmonic Drive L actuators_reducers → Atlas L3 50
🇰🇷 LG Energy Solution batteries L2 58

Supplies → 3

SoftBank humanoid L2
🇰🇷 Hyundai Motor humanoid L2 50
🇰🇷 Hyundai Motor humanoid L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

StretchSpotAtlas

C&U GroupprivateRelationships

physical ai · 🇨🇳 China · 62 sources · 0 products · 203 patents

revenue · USD

Last round not disclosed Valuation not disclosed

Patents — 203 CPC-scoped to physical ai (physical-AI-relevant classes)

Bearings 163
Force / torque sensors 33
Gears / reducers 6
Computing 1

No filing-grade financials loaded yet.

Supplies → 1

🇨🇳 Wolong Electric physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Carnegie RoboticsprivateProfile

physical ai · 🇺🇸 United States · 2 sources · 1 products · 20 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Spot CAM+IR thermal inspection camera (payload option)' for Spot. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 20 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 8
IMU / navigation 5
Imaging / cameras 5
Lidar / ranging 2

No filing-grade financials loaded yet.

Products

Spot CAM+IR

Cascade MicrotechsubsidiaryProfile

ai compute · 🇺🇸 United States · 2 sources · 3 products

Subsidiary of FormFactor, Inc. · financials roll up to parent

revenue · USD

Discovered via transcript_counterparty (2026-07-12). Earnings call (FormFactor, Inc.) — supplier: Part of that was the acquisition of Cascade Microtech in 2016 to get us some RF know-how.. Skeleton pending enrichment (identifiers/financials).

Financials roll up to parent FormFactor, Inc. — Cascade Microtech is a subsidiary and does not file standalone.

Products

Probe SystemsHigh-Frequency Test SolutionsRF Probe Cards

China Northern Rare Earth High-Tech Co., Ltd.publicRelationships

physical ai · 🇨🇳 China · 0 sources · 0 products

revenue · USD

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202520262027 rev wins 2026-07-17 · → JL MAG Rare-Earth physical_ai — click for source2026-07-17 · → Zhongke Sanhuan physical_ai — click for source2026-07-17 · → Ningbo Yunsheng physical_ai — click for source2025-08-10 · → JL MAG Rare-Earth physical_ai — click for source events
  • 2026-07-17 reported edge → JL MAG Rare-Earth physical_ai source ↗
  • 2026-07-17 reported edge → Zhongke Sanhuan physical_ai source ↗
  • 2026-07-17 reported edge → Ningbo Yunsheng physical_ai source ↗
  • 2025-08-10 design-win → JL MAG Rare-Earth physical_ai source ↗

No filing-grade financials loaded yet · no sources yet (coverage gap).

Supplies → 4

🇨🇳 JL MAG Rare-Earth physical_ai L2
🇨🇳 Zhongke Sanhuan physical_ai L2
🇨🇳 Ningbo Yunsheng physical_ai L2
🇨🇳 JL MAG Rare-Earth physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

CovariantsubsidiaryProduct-grade

physical ai · 🇺🇸 United States · 7 sources · 0 products · 43 patents

revenue · USD

Covariant, formerly Embodied Intelligence, is a US company developing AI software for robotic manipulation used in warehouse and logistics automation; its founding team and technology were licensed to Amazon in 2024.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202020212022202320242025 rev wins 2020-01-31 · NVIDIA → ai_chips — click for source2024-08-31 · → Amazon physical_ai — click for source2020-02-25 · → ABB Robotics physical_ai — click for source events
  • 2024-08-31 design-win → Amazon physical_ai source ↗
  • 2020-02-25 design-win → ABB Robotics physical_ai source ↗
  • 2020-01-31 design-win NVIDIA → ai_chips source ↗

Patents — 43 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 43

No filing-grade financials loaded yet.

Buys from ← 1

🇺🇸 NVIDIA ai_chips L2 50

Supplies → 2

🇺🇸 Amazon physical_ai L2 50
🇨🇭 ABB Robotics physical_ai → IRB 6700 L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

D-RoboticsprivateRelationships

ai compute · 🇨🇳 China · 197 sources · 0 products

revenue · USD

Last round Series B2 · 2026-04-08 · $150M raised Valuation not disclosed

Investors SZ DJI Osmo Technology Co., Ltd.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20242025 rev wins 2024-07-27 · → Rainbow Robotics ai_compute — click for source events
  • 2024-07-27 reported edge → Rainbow Robotics ai_compute source ↗

No filing-grade financials loaded yet.

Supplies → 1

🇰🇷 Rainbow Robotics ai_compute L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Double Ring TransmissionprivateProfile

physical ai · 🇨🇳 China · 1 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'RV reducer (high-load waist joint)' for Genie. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

ebm-papstprivateProfile

physical ai · 🇩🇪 Germany · 1 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Head cooling fan (single active fan, cools the compute stack; rest of robot passively cooled)' for Atlas. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

EinrideprivateProduct-grade

physical ai · 🇸🇪 Sweden · 21 sources · 1 products

revenue · USD

Autonomous electric freight pods

Last round PIPE (pre-SPAC / public debut) · 2026-02-26 · $113M raised Valuation not disclosed

Investors Ijijim Capital · Norrsken VC · Scania CV AB

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202220232024202520262027 rev wins 2026-04-22 · → Amazon physical_ai — click for source2022-03-24 · BYD → batteries — click for source events
  • 2026-04-22 design-win → Amazon physical_ai source ↗
  • 2022-03-24 design-win BYD → batteries source ↗

No filing-grade financials loaded yet.

Buys from ← 1

🇨🇳 BYD batteries → T-pod L3 50

Supplies → 1

🇺🇸 Amazon physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

T-pod

EwellixsubsidiaryProfile

physical ai · 🇩🇪 Germany · 2 sources · 5 products · 21 patents

Subsidiary of Schaeffler · financials roll up to parent

revenue · USD

Ball/roller screws, actuators

Patents — 21 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 19
Gears / reducers 2

Newest 2 of 21, most recent first — all on Google Patents →

  • 2024-12-19US2024417225LIFTING COLUMN
  • 2024-08-29US2024288231ELECTROMECHANICAL CYLINDER, COOLING ASSEMBLY, SYSTEM, AND METHOD

Financials roll up to parent Schaeffler — Ewellix is a subsidiary and does not file standalone.

Products

Linear ActuatorsBall ScrewsRoller ScrewsShaft Mounted GearboxesElectromechanical Actuators

Eyou Robot TechnologyprivateProduct-grade

physical ai · 🇨🇳 China · 2 sources · 0 products

revenue · USD

Humanoid joint modules (world's 1st automated line)

Last round Series B · 2026-04-01 Valuation not disclosed

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-01-26 · → AgiBot physical_ai — click for source events
  • 2026-01-26 design-win → AgiBot physical_ai source ↗

No filing-grade financials loaded yet.

Supplies → 1

🇨🇳 AgiBot physical_ai → Yuanzheng L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Figure AI Inc.privateProduct-grade

physical ai · 🇺🇸 United States · 35 sources · 2 products · 86 patents

revenue · USD

US humanoid-robot OEM building general-purpose humanoids (Figure 02, Figure 03) with the Helix VLA model. Private; Series C Sep 2025 at $39B post-money. Founded 2022; HQ San Jose, CA.

Last round Series C · 2025-09-01 · $1.0B raised Valuation $39.0B ↗

Investors NVIDIA · Microsoft · Amazon · SoftBank · Toyota Motor · Intel

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202220232024202520262027 rev wins 2024-04-14 · → Amazon humanoid — click for source2026-04-29 · Qualcomm → compute — click for source2024-08-06 · NVIDIA → ai_gpu — click for source2025-10-09 · NVIDIA → ai_chips — click for source2026-04-23 · Leaderdrive → harmonic_reducers — click for source events 2025-09-16 · capital raised — Series C (Sep 2025): exceeded $1B raised at a $39B post-money valuation; ~$1.9B total funding to date. Investors incl. Parkway, Brookfield, NVIDIA, Intel Capital, Qualcomm, LG, Salesforce.2022-09-22 · financial — Figure AI is bootstrapping with $100 million in funding from co-founder Brett Adcock to develop an all-purpose humanoid robot.2022-09-22 · executive change — Figure AI hired Jerry Pratt as CTO, Michael Rose as engineer, and Gabe Nelson as chief scientist, with additional hires from Apple, Tesla, Google X and the Toyota Research Institute.
  • 2026-04-29 design-win Qualcomm → compute source ↗
  • 2026-04-23 design-win Leaderdrive → harmonic_reducers source ↗
  • 2025-10-09 design-win NVIDIA → ai_chips source ↗
  • 2025-09-16 capital raised Series C (Sep 2025): exceeded $1B raised at a $39B post-money valuation; ~$1.9B total funding to date. Investors incl. Parkway, Brookfield, NVIDIA, Intel Capital, Qualcomm, LG, Salesforce.
  • 2024-08-06 design-win NVIDIA → ai_gpu source ↗
  • 2024-04-14 design-win → Amazon humanoid source ↗
  • 2022-09-22 financial Figure AI is bootstrapping with $100 million in funding from co-founder Brett Adcock to develop an all-purpose humanoid robot.
  • 2022-09-22 executive change Figure AI hired Jerry Pratt as CTO, Michael Rose as engineer, and Gabe Nelson as chief scientist, with additional hires from Apple, Tesla, Google X and the Toyota Research Institute.

Patents — 86 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 80
Electric motors 2
Other 2
Imaging / cameras 1
Force / torque sensors 1

Newest 29 of 86, most recent first — all on Google Patents →

  • 2026-06-18US20260166719HUMANOID ROBOT WITH ADVANCED ACTUATOR
  • 2026-06-18US20260168872REACTION-TYPE TORQUE CELLS
  • 2026-05-14US20260131464METHOD FOR CONTROLLING ONE OR MORE ACTUATORS OF A HUMANOID ROBOT
  • 2026-05-07US20260124746TRAINING AND USE OF A BIPEDAL ACTION MODEL FOR HUMANOID ROBOT
  • 2026-05-07US20260124750BIPEDAL ACTION MODEL FOR HUMANOID ROBOT
  • 2026-05-07US20260126804BIPEDAL ACTION MODEL FOR HUMANOID ROBOT
  • 2026-04-16US20260102903SENSORS OF A HUMANOID ROBOT
  • 2026-04-16US20260102909DYNAMIC TASK ASSIGNMENT AMONGST COMMUNICATING HUMANOID ROBOTS
  • 2026-04-16US20260102926END EFFECTOR OF A HUMANOID ROBOT
  • 2026-04-16US20260103253LEG OF A HUMANOID ROBOT
  • 2026-04-16US20260106490DOCKING STATION FOR A HUMANOID ROBOT
  • 2026-04-09US20260097492ANNOTATION MODEL FOR HUMANOID ROBOT DATA
  • 2026-04-02US20260091507HUMANOID ROBOT DATA COLLECTION SYSTEM
  • 2026-04-02US20260091509END EFFECTOR OF A HUMANOID ROBOT
  • 2026-03-26US20260084309SYSTEM AND METHOD FOR CALIBRATION OF HUMANOID ROBOTS
  • 2026-03-26US20260084314SYSTEM AND METHOD FOR TRAINING AND USING A BIPEDAL SPATIAL PERCEPTION MODEL
  • 2026-03-19US20260077481HUMANOID ROBOT HAVING COMMON ACTUATOR COMPONENTS
  • 2026-03-19US20260077482Humanoid robot with advanced kinematics
  • 2026-03-12US20260070211HUMANOID ROBOT DATA COLLECTION SYSTEMS
  • 2026-03-12US20260070212System and method for efficient control of a humanoid robot
  • 2026-03-12US20260070216CLUTCH FOR AN ACTUATOR FOR A HUMANOID ROBOT
  • 2026-03-12US20260070221BIPEDAL ACTION MODEL FOR HUMANOID ROBOT
  • 2026-03-05US20260061611MANAGEMENT OF MULTIPLE MODES FOR HUMANOID ROBOT
  • 2026-01-29US20260027736HEAD AND NECK ASSEMBLY OF A HUMANOID ROBOT
  • 2026-01-08US20260008178HUMANOID ROBOT HAVING ADVANCED JOINT ASSEMBLIES
  • 2025-10-23WO2025221821HUMANOID ROBOT WITH ADVANCED WIRING ASSEMBLY
  • 2025-10-23WO2025221916ADVANCED ARRAY OF SENSOR ASSEMBLIES OF A HUMANOID ROBOT
  • 2025-10-16US2025319614LOWER ARM ASSEMBLY OF A ROBOT
  • 2025-10-16US2025322372COMPENSATION FOR A SERVICE ASSOCIATED WITH A HUMANOID ROBOT WITH ADVANCED KINEMATICS

No filing-grade financials loaded yet.

Buys from ← 4

🇺🇸 Qualcomm compute → Figure 03 L3 50
🇺🇸 NVIDIA ai_gpu → Figure 02 L3 70
🇺🇸 NVIDIA ai_chips → Figure 02 L3 50
🇨🇳 Leaderdrive harmonic_reducers → Figure 03 L3 50

Supplies → 1

🇺🇸 Amazon humanoid L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Figure 03Figure 02

Fourier IntelligenceprivateProduct-grade

physical ai · 🇨🇳 China · 6 sources · 3 products · 11 patents

revenue · USD

Fourier Intelligence is a Chinese robotics company developing humanoid robots, including the GR-1 and GR-2, alongside rehabilitation robotics equipment.

Last round 2025-05-29 · $42M raised Valuation not disclosed

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20212022 rev wins 2021-01-11 · maxon → servomotors — click for source events
  • 2021-01-11 design-win maxon → servomotors source ↗

Patents — 11 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 10
Gears / reducers 1

Newest 9 of 11, most recent first — all on Google Patents →

  • 2026-06-18WO2026123743ACTUATOR HAVING PLANETARY REDUCTION MECHANISM, AND ROBOT JOINT
  • 2026-06-11US20260158643Actuator with planetary reducer, and robot joint
  • 2026-05-15WO2026098724SHOULDER JOINT STRUCTURE AND HUMANOID ROBOT
  • 2026-05-15WO2026098725HEAD-NECK ASSEMBLY AND HUMANOID ROBOT
  • 2026-03-12US20260072054ROTATIONAL SPEED DETECTION STRUCTURE OF ACTUATOR AND ACTUATOR
  • 2026-02-05WO2026026989CONNECTING STRUCTURE, HIP ASSEMBLY, AND HUMANOID ROBOT
  • 2023-04-06WO2023051108ROBOT CONTROL METHOD AND DEVICE BASED ON PHYSICAL ENGINE AND REHABILITATION ROBOT
  • 2023-03-16WO2023035946REHABILITATION EXERCISE APPARATUS AND ROPE TRANSMISSION DEVICE
  • 2022-04-07WO2022068154EXOSKELETON JOINT SELF-LOCKING MECHANISM, KNEE JOINT, AND BIONIC REHABILITATION ROBOT

No filing-grade financials loaded yet.

Buys from ← 1

🇨🇭 maxon servomotors → Fourier Rehabilitation Robotics L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Fourier Rehabilitation RoboticsGR-2GR-1

FreudenbergprivateProfile

physical ai · 🇩🇪 Germany · 4 sources · 0 products · 3 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Shaft Seal / Rubber Gaskets' for EMG Servo Motors. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 3 CPC-scoped to physical ai (physical-AI-relevant classes)

Batteries 3

No filing-grade financials loaded yet.

Fulin PrecisionprivateProfile

physical ai · 🇨🇳 China · 1 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Joint module assembly' for Genie. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

GalbotprivateProduct-grade

physical ai · 🇨🇳 China · 6 sources · 0 products · 4 patents

revenue · USD

Galbot G1 wheeled humanoid

Last round 2026-03-01 · $362M raised Valuation not disclosed

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202520262027 rev wins 2026-06-23 · Leaderdrive → harmonic_reducers — click for source2025-07-28 · → Robert Bosch GmbH humanoid — click for source2025-08-26 · NVIDIA → ai_chips — click for source2026-06-24 · → CATL humanoid — click for source2026-06-24 · CATL → batteries — click for source2025-12-19 · → Toyota Motor humanoid — click for source events
  • 2026-06-24 design-win → CATL humanoid source ↗
  • 2026-06-24 design-win CATL → batteries source ↗
  • 2026-06-23 design-win Leaderdrive → harmonic_reducers source ↗
  • 2025-12-19 design-win → Toyota Motor humanoid source ↗
  • 2025-08-26 design-win NVIDIA → ai_chips source ↗
  • 2025-07-28 design-win → Robert Bosch GmbH humanoid source ↗

Patents — 4 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 4

Newest 4, most recent first — all on Google Patents →

  • 2026-05-07WO2026092309ROBOT, AND BEHAVIOR PLANNING METHOD AND CONTROL METHOD THEREFOR
  • 2026-05-07WO2026092366CONTROL METHOD AND TRAINING METHOD, CONTROL ASSEMBLY, AND ROBOT
  • 2026-03-05WO2026045995FINGER MECHANISM AND ROBOT
  • 2026-03-05WO2026046162GRIPPING METHOD, ROBOTIC ARM, AND ROBOT

No filing-grade financials loaded yet.

Buys from ← 3

🇨🇳 Leaderdrive harmonic_reducers L2 50
🇺🇸 NVIDIA ai_chips L2 50
🇨🇳 CATL batteries L2 50

Supplies → 3

Robert Bosch GmbH humanoid → Bosch Packaging Technology L3 50
🇨🇳 CATL humanoid L2 50
Toyota Motor humanoid L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Ganzhou Keli Rare Earth New Materials Co., Ltd.subsidiaryRelationships

physical ai · 🇨🇳 China · 0 sources · 0 products

revenue · USD

No filing-grade financials loaded yet · no sources yet (coverage gap).

Supplies → 1

🇨🇳 Zhongke Sanhuan physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

GraphcoreprivateProfile

ai compute · 🇬🇧 United Kingdom · 3 sources · 0 products · 758 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Dual embedded low-power onboard GPUs (Helix S1/S2 inference compute)' for Figure 03. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 758 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 735
Memory 14
Semiconductors 9

No filing-grade financials loaded yet.

Harmonic Drive SEsubsidiaryProfile

physical ai · 🇩🇪 Germany · 7 sources · 4 products

Subsidiary of Harmonic Drive Systems Inc. · financials roll up to parent

revenue · USD

Financials roll up to parent Harmonic Drive Systems Inc. — Harmonic Drive SE is a subsidiary and does not file standalone.

Products

Harmonic Drive®CSFFHACSD

Harmonic Drive Systems (Shanghai) Co., Ltd.subsidiaryProduct-grade

physical ai · 🇨🇳 China · 0 sources · 3 products

Subsidiary of Harmonic Drive Systems Inc. · financials roll up to parent

revenue · USD

Financials roll up to parent Harmonic Drive Systems Inc. — Harmonic Drive Systems (Shanghai) Co., Ltd. is a subsidiary and does not file standalone.

Buys from ← 1

🇯🇵 Harmonic Drive harmonic_reducers → Harmonic Gear L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

CSF SeriesCSD SeriesHarmonic Gear

Harmonic Drive L.L.C.subsidiaryProduct-grade

physical ai · 🇺🇸 United States · 0 sources · 4 products

Subsidiary of Harmonic Drive Systems Inc. · financials roll up to parent

revenue · USD

Harmonic Drive L.L.C. is the US subsidiary of Japan's Harmonic Drive Systems Inc, manufacturing precision strain-wave gearboxes and actuators (CSF/CSD, FHA, SHD, HFUS series) used in robotics and motion-control equipment.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20242025 rev wins 2024-11-05 · → Boston Dynamics actuators_reducers — click for source events
  • 2024-11-05 design-win → Boston Dynamics actuators_reducers source ↗

Financials roll up to parent Harmonic Drive Systems Inc. — Harmonic Drive L.L.C. is a subsidiary and does not file standalone.

Supplies → 1

🇺🇸 Boston Dynamics actuators_reducers → Atlas L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Harmonic Drive Gearbox (SHD series)Harmonic Drive Gearbox (HFUS series)Harmonic Drive Gearbox (FHA series)Harmonic Drive Gearbox (CSF/CSD series)

Harmonic Winbell Inc.subsidiaryProduct-grade

physical ai · 🇯🇵 Japan · 0 sources · 0 products

Subsidiary of Harmonic Drive Systems Inc. · financials roll up to parent

revenue · USD

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20242025 rev wins 2024-08-07 · → Harmonic Drive actuators_reducers — click for source events
  • 2024-08-07 design-win → Harmonic Drive actuators_reducers source ↗

Financials roll up to parent Harmonic Drive Systems Inc. — Harmonic Winbell Inc. is a subsidiary and does not file standalone.

Supplies → 1

🇯🇵 Harmonic Drive actuators_reducers → HarmonicDrive precision speed reducer L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

HCFAprivateProfile

physical ai · 🇨🇳 China · 2 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Servo actuator / servo motor (full-line supply)' for Genie. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

HD Hyundai RoboticssubsidiaryRelationships

physical ai · 🇰🇷 South Korea · 29 sources · 6 products · 88 patents

Subsidiary of Hyundai Heavy Industries Group · financials roll up to parent

revenue · USD

HD Hyundai Robotics, a subsidiary of South Korea's HD Hyundai group, manufactures industrial robots including the HH series for welding, handling and assembly applications.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20202021202220232024202520262027 rev wins 2025-07-07 · NEURA Robotics → humanoid — click for source2025-01-22 · → Hyundai Motor industrial_arm — click for source2025-05-07 · Persona AI → physical_ai — click for source events 2026-06-10 · financial — HD Hyundai Heavy jumped 5.56 percent, among few winners in market decline.2026-05-13 · financial — HD Hyundai Electric shed 4.89 percent in Seoul trading.2024-01-01 · product launch — HD Hyundai will present its vision for sustainable land transformation and infrastructure construction at CES 2024.2023-03-31 · capacity expansion — A Chinese subsidiary of HD Hyundai Robotics started producing conventional industrial robots in Jiangsu Province after finishing factory construction.2020-12-31 · product launch — HD Hyundai Robotics launched the YL series in 2020 and has continued studies on collaborative robots.
  • 2026-06-10 financial HD Hyundai Heavy jumped 5.56 percent, among few winners in market decline.
  • 2026-05-13 financial HD Hyundai Electric shed 4.89 percent in Seoul trading.
  • 2025-07-07 design-win NEURA Robotics → humanoid source ↗
  • 2025-05-07 design-win Persona AI → physical_ai source ↗
  • 2025-01-22 design-win → Hyundai Motor industrial_arm source ↗
  • 2024-01-01 product launch HD Hyundai will present its vision for sustainable land transformation and infrastructure construction at CES 2024.
  • 2023-03-31 capacity expansion A Chinese subsidiary of HD Hyundai Robotics started producing conventional industrial robots in Jiangsu Province after finishing factory construction.
  • 2020-12-31 product launch HD Hyundai Robotics launched the YL series in 2020 and has continued studies on collaborative robots.

Patents — 88 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 57
Other 23
Semiconductors 3
Bearings 3
Lidar / ranging 1
Gears / reducers 1

Newest 4 of 88, most recent first — all on Google Patents →

  • 2023-05-11WO2023080723MOBILE ROBOT AND METHOD FOR CONTROLLING MOBILE ROBOT
  • 2023-05-11WO2023080727DRIVING SYSTEM FOR MOBILE ROBOT
  • 2023-01-05WO2023277277PIPING SPOOL AUTO MANUFACTURING SYSTEM
  • 2023-01-05WO2023277463SYSTEM FOR AUTOMATICALLY MANUFACTURING STEEL FRAME

Financials roll up to parent Hyundai Heavy Industries Group — HD Hyundai Robotics is a subsidiary and does not file standalone.

Buys from ← 2

🇩🇪 NEURA Robotics humanoid L2 50
🇺🇸 Persona AI physical_ai L2 50

Supplies → 1

🇰🇷 Hyundai Motor industrial_arm L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

HH50HH30HH seriesHH100HH7HH180

HEIDENHAINprivateSkeleton

physical ai · 🇩🇪 Germany · 0 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Multi-turn Absolute Encoder' for EC Series Servo Drives. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet · no sources yet (coverage gap).

Hemlock SemiconductorsubsidiaryRelationships

ai compute · 🇺🇸 United States · 3 sources · 0 products

Subsidiary of Corning · financials roll up to parent

revenue · USD

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20232024 rev wins 2023-07-07 · → SUMCO ai_compute — click for source events
  • 2023-07-07 design-win → SUMCO ai_compute source ↗

Financials roll up to parent Corning — Hemlock Semiconductor is a subsidiary and does not file standalone.

Supplies → 1

🇯🇵 SUMCO ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Hokuyo Automatic Co.privateProfile

physical ai · 🇯🇵 Japan · 1 sources · 4 products · 67 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies '2D scanning LIDAR (perception)' for HUBO. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 67 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 51
Electric motors 7
IMU / navigation 4
Imaging / cameras 3
Gears / reducers 1
Robotics / manipulators 1

No filing-grade financials loaded yet.

Products

YVT SeriesURG SeriesUTM SeriesUST Series

Huayi TechnologyprivateProfile

physical ai · 🇨🇳 China · 1 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'IMU (inertial measurement unit)' for Genie. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

ID QuantiquesubsidiaryProfile

quantum · 🇨🇭 Switzerland · 1 sources · 4 products

Subsidiary of IonQ · financials roll up to parent

revenue · USD

Discovered via transcript_counterparty (2026-07-12). Earnings call (IonQ) — partner: Meanwhile, our Quantum Networking vision has expanded considerably this past quarter with the acquisitions of ID Quantique, Cape. Skeleton pending enrichment (identifiers/financials).

Financials roll up to parent IonQ — ID Quantique is a subsidiary and does not file standalone.

Products

CerberisQuantisClavisID Quantique Software Suite

IgusprivateProfile

physical ai · 🇩🇪 Germany · 1 sources · 0 products · 340 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Cable Carrier/Chain Management System' for ER Series Industrial Robots. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 340 CPC-scoped to physical ai (physical-AI-relevant classes)

Bearings 210
Robotics / manipulators 41
Force / torque sensors 35
Gears / reducers 34
Lidar / ranging 11
Electric motors 9

No filing-grade financials loaded yet.

INAsubsidiaryRelationships

physical ai · 🇩🇪 Germany · 48 sources · 0 products · 10 patents

Subsidiary of Schaeffler · financials roll up to parent

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Cross-roller / joint output bearing' for H2515 (+1 more). Skeleton pending enrichment (identifiers/financials).

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-07-17 · Ovako → physical_ai — click for source events
  • 2026-07-17 reported edge Ovako → physical_ai source ↗

Patents — 10 CPC-scoped to physical ai (physical-AI-relevant classes)

Imaging / cameras 10

Financials roll up to parent Schaeffler — INA is a subsidiary and does not file standalone.

Buys from ← 1

🇸🇪 Ovako physical_ai L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Intel FoundrysubsidiaryProfile

ai compute · 🇺🇸 United States · 9 sources · 0 products

Subsidiary of Intel Corporation · financials roll up to parent

revenue · USD

Discovered via news_counterparty (2026-07-12). News (Why Analysts Are Growing More Bullish on Cadence Design Syst) — partner: Intel Foundry entered into a multiyear Design Technology Co-Optimization collabor. Skeleton pending enrichment (identifiers/financials).

Financials roll up to parent Intel Corporation — Intel Foundry is a subsidiary and does not file standalone.

JAKA RoboticsprivateRelationships

physical ai · 🇨🇳 China · 3 sources · 5 products · 31 patents

revenue · USD

Collaborative robots

Last round Series D · 2022-07-20 · $150M raised Valuation not disclosed

Investors Midea

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-04-02 · → Toyota Motor industrial_arm — click for source events
  • 2026-04-02 design-win → Toyota Motor industrial_arm source ↗

Patents — 31 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 27
Electric motors 2
Other 1
Imaging / cameras 1

Newest 11 of 31, most recent first — all on Google Patents →

  • 2026-01-22WO2026017173JOINT STRUCTURE AND ROBOT
  • 2025-07-24WO2025152407PARAMETER DEVIATION DETERMINATION METHOD, APPARATUS AND TOOL, STORAGE MEDIUM, AND COMPUTER DEVICE
  • 2025-01-02WO2025001659TEACH PENDANT AND ROBOT
  • 2025-01-02WO2025001931ROBOT COLLISION DETECTION OPTIMIZATION METHOD AND APPARATUS, ELECTRONIC DEVICE, AND STORAGE MEDIUM
  • 2024-10-03WO2024199475ROTOR SINGLE-CHIP, ROTOR, ELECTRIC MOTOR AND ROBOT
  • 2024-05-16WO2024098787SHAFT HOLE ASSEMBLY METHOD AND SYSTEM, AND STORAGE MEDIUM
  • 2024-01-25WO2024016965COORDINATE SYSTEM CALIBRATION METHOD AND APPARATUS, ROBOT AND STORAGE MEDIUM
  • 2024-01-25WO2024016980ROBOT CALIBRATION METHOD AND APPARATUS, ELECTRONIC DEVICE AND STORAGE MEDIUM
  • 2023-04-27WO2023065781CONTROL METHOD, DEVICE, AND SYSTEM FOR HYBRID ROBOT
  • 2023-03-09WO2023029901ROBOT COLLISION PREDICTION METHOD, COMPUTER STORAGE MEDIUM, AND ELECTRONIC DEVICE
  • 2020-01-09WO2020007305DRAGGING DEMONSTRATION SYSTEM AND METHOD

No filing-grade financials loaded yet.

Supplies → 1

Toyota Motor industrial_arm L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

Zu 12Zu 7Zu 5Zu SeriesZu 3

Jiangxi South Rare Earth Hi-Tech Co., Ltd.state_ownedRelationships

physical ai · 🇨🇳 China · 0 sources · 0 products

revenue · USD

No filing-grade financials loaded yet · no sources yet (coverage gap).

Supplies → 1

🇨🇳 Zhongke Sanhuan physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Kassow RobotssubsidiarySkeleton

physical ai · 🇩🇰 Denmark · 0 sources · 3 products

Subsidiary of Robert Bosch GmbH · financials roll up to parent

revenue · USD

7-axis cobots

Financials roll up to parent Robert Bosch GmbH — Kassow Robots is a subsidiary and does not file standalone.

Products

KR5 R900KR12 R1800KR10 R1100 HE

Key FoundrysubsidiaryRelationships

ai compute · 🇰🇷 South Korea · 1 sources · 0 products · 183 patents

revenue · USD

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20232024 rev wins 2023-10-07 · → Vishay Intertechnology ai_compute — click for source events
  • 2023-10-07 design-win → Vishay Intertechnology ai_compute source ↗

Patents — 183 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 130
Memory 51
Power electronics 2

No filing-grade financials loaded yet.

Supplies → 1

🇺🇸 Vishay Intertechnology ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

KollmorgensubsidiaryRelationships

physical ai · 🇺🇸 United States · 2 sources · 4 products · 64 patents

Subsidiary of Regal Rexnord Corporation · financials roll up to parent

revenue · USD

Frameless servo motors

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-07-17 · Vacuumschmelze → rare_earth_magnets — click for source2026-07-17 · JL MAG Rare-Earth → rare_earth_magnets — click for source events
  • 2026-07-17 reported edge Vacuumschmelze → rare_earth_magnets source ↗
  • 2026-07-17 reported edge JL MAG Rare-Earth → rare_earth_magnets source ↗

Patents — 64 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 23
Electric motors 22
Power electronics 13
Robotics / manipulators 5
Gears / reducers 1

IP chokepoint in: Electric motors

Newest 7 of 64, most recent first — all on Google Patents →

  • 2026-05-07US20260128624SEGMENTED ARMATURE STATOR ASSEMBLY FOR ELECTROMAGNETIC MOTOR
  • 2013-10-03WO2013148245FLUX DIRECTING, POLE SPAN SETTING, FEATURE ON ROTOR LAMINATION OF AIR-COOLED ELECTRIC MOTOR/GENERATOR
  • 2013-03-26US8405262Cooling of electric motor with coolant pipe and conduction plates or cups
  • 2011-12-22WO2011159916SEPARABLE TOOTH TIP ARMATURE CONSTRUCTION
  • 2007-03-01WO2007024220FAILURE-TOLERANT REDUNDANT ACTUATOR SYSTEM
  • 2006-11-02WO2006116482MOTOR-ENCODER SYSTEM HAVING A FLEXIBLE COUPLING
  • 2006-05-04WO2006047519DESIGN OF THE MAGNET AND WEBS IN INTERIOR PERMANENT MAGENT ROTORS

Financials roll up to parent Regal Rexnord Corporation — Kollmorgen is a subsidiary and does not file standalone.

Buys from ← 2

🇩🇪 Vacuumschmelze rare_earth_magnets L2
🇨🇳 JL MAG Rare-Earth rare_earth_magnets L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

AKM Frameless Servo MotorsFortive Motion ControlIronless Core MotorsAKM2G Frameless Motors

LeaderdriveprivateProduct-grade

physical ai · 🇨🇳 China · 6 sources · 0 products · 2 patents

revenue · USD

Harmonic reducers

Last round IPO (SSE STAR Market, 688017) · 2020-08-28 · $153M raised Valuation not disclosed

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-06-23 · → Galbot harmonic_reducers — click for source2026-04-23 · → Tesla harmonic_reducers — click for source2026-04-23 · → AgiBot harmonic_reducers — click for source2026-04-23 · → UBTech Robotics harmonic_reducers — click for source2026-04-23 · → Figure AI harmonic_reducers — click for source events
  • 2026-06-23 design-win → Galbot harmonic_reducers source ↗
  • 2026-04-23 design-win → Tesla harmonic_reducers source ↗
  • 2026-04-23 design-win → AgiBot harmonic_reducers source ↗
  • 2026-04-23 design-win → UBTech Robotics harmonic_reducers source ↗
  • 2026-04-23 design-win → Figure AI harmonic_reducers source ↗

Patents — 2 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 2

No filing-grade financials loaded yet.

Supplies → 5

🇨🇳 Galbot harmonic_reducers L2 50
🇺🇸 Tesla harmonic_reducers → Tesla Optimus L3 50
🇨🇳 AgiBot harmonic_reducers → Yuanzheng L3 50
🇨🇳 UBTech Robotics harmonic_reducers → Walker S L3 50
🇺🇸 Figure AI harmonic_reducers → Figure 03 L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Lingyi iTech 领益智造publicProfile

physical ai · 🇨🇳 China · 1 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Thermal management + high-power charging solution' for Yuanzheng. Skeleton pending enrichment (identifiers/financials).

No filing-grade financials loaded yet.

LivoxprivateProfile

physical ai · 🇨🇳 China · 1 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'LiDAR (perception)' for Genie (+4 more). Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

maxonprivateProduct-grade

physical ai · 🇨🇭 Switzerland · 20 sources · 8 products · 30 patents

revenue · USD

Maxon is a Swiss manufacturer of precision drive systems, producing DC and EC motors, planetary and spur gearheads for robotics, medical and industrial automation applications. Headquartered in Sachseln, Switzerland, it is privately held.

Last round not disclosed Valuation not disclosed

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

2021202220232024202520262027 rev wins 2026-07-17 · Vacuumschmelze → rare_earth_magnets — click for source2026-07-17 · JL MAG Rare-Earth → rare_earth_magnets — click for source2021-01-11 · → Fourier Intelligence servomotors — click for source events
  • 2026-07-17 reported edge Vacuumschmelze → rare_earth_magnets source ↗
  • 2026-07-17 reported edge JL MAG Rare-Earth → rare_earth_magnets source ↗
  • 2021-01-11 design-win → Fourier Intelligence servomotors source ↗

Patents — 30 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 30

No filing-grade financials loaded yet.

Buys from ← 2

🇩🇪 Vacuumschmelze rare_earth_magnets L2
🇨🇳 JL MAG Rare-Earth rare_earth_magnets L2

Supplies → 1

🇨🇳 Fourier Intelligence servomotors → Fourier Rehabilitation Robotics L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

EC-4poleEC MotorPlanetary GearheadRE MotorSpur GearheadDCX MotorFAULHABERGPX Motor

MAYRprivateProfile

physical ai · 🇩🇪 Germany · 13 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Electromagnetic holding brakes (per axis)' for HH100. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

MEANWELLpublicProfile

physical ai · 🇹🇼 Taiwan · 9 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Power Supply Unit (24V DC, internal)' for ER Series Industrial Robots. Skeleton pending enrichment (identifiers/financials).

No filing-grade financials loaded yet.

Mentee RoboticsprivateRelationships

physical ai · 🇮🇱 Israel · 7 sources · 0 products · 3 patents

revenue · USD

MenteeBot humanoid

Last round Series A · 2025-03-01 · $21M raised Valuation $162M ↗

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-07-12 · → Intel physical_ai — click for source events
  • 2026-07-12 design-win → Intel physical_ai source ↗

Patents — 3 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 3

No filing-grade financials loaded yet.

Buys from ← 1

🇺🇸 NVIDIA ai_chips L2 50

Supplies → 1

🇺🇸 Intel physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

MolicelprivateProfile

physical ai · 🇨🇳 China · 2 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Battery cells (Molicel, 14s, ~564 Wh) - 2024 Enterprise pack' for Spot. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

MovellaprivateSkeleton

physical ai · 🇺🇸 United States · 0 sources · 0 products · 9 patents

revenue · USD

Parent (created for subsidiary mapping).

Last round not disclosed Valuation not disclosed

Patents — 9 CPC-scoped to physical ai (physical-AI-relevant classes)

Imaging / cameras 6
Other 3

No filing-grade financials loaded yet · no sources yet (coverage gap).

NeugartprivateProfile

physical ai · 🇩🇪 Germany · 1 sources · 0 products · 20 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Planetary reducer (smaller-ratio FSA joints)' for GR-1. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 20 CPC-scoped to physical ai (physical-AI-relevant classes)

Gears / reducers 17
Bearings 3

No filing-grade financials loaded yet.

NEURA RoboticsprivateProduct-grade

physical ai · 🇩🇪 Germany · 21 sources · 2 products · 113 patents

revenue · USD

NEURA Robotics is a German developer of cognitive and humanoid robots, including the MAiRA collaborative robot arm, aimed at industrial and service applications. Founded in 2019 and headquartered in Metzingen, it is privately held.

Last round Series C · 2026-06-10 · $1.4B raised Valuation $7.0B ↗

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202520262027 rev wins 2026-07-16 · Schaeffler → roller_screws — click for source2025-07-07 · → HD Hyundai Robotics humanoid — click for source events
  • 2026-07-16 reported edge Schaeffler → roller_screws source ↗
  • 2025-07-07 design-win → HD Hyundai Robotics humanoid source ↗

Patents — 113 CPC-scoped to physical ai (physical-AI-relevant classes)

Force / torque sensors 41
Robotics / manipulators 30
Lidar / ranging 23
Gears / reducers 10
Other 9

No filing-grade financials loaded yet.

Buys from ← 1

🇩🇪 Schaeffler roller_screws → 4NE-1 L3

Supplies → 1

🇰🇷 HD Hyundai Robotics humanoid L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

MAiRA4NE-1

OvakosubsidiaryRelationships

physical ai · 🇸🇪 Sweden · 1 sources · 0 products

Subsidiary of Nippon Steel · financials roll up to parent

revenue · USD

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-07-17 · → INA physical_ai — click for source2026-07-17 · → SKF physical_ai — click for source events
  • 2026-07-17 reported edge → INA physical_ai source ↗
  • 2026-07-17 reported edge → SKF physical_ai source ↗

Financials roll up to parent Nippon Steel — Ovako is a subsidiary and does not file standalone.

Supplies → 3

🇩🇪 INA physical_ai L2
🇸🇪 SKF physical_ai L2
🇸🇪 SKF physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

PaXini TechprivateRelationships

physical ai · 🇨🇳 China · 5 sources · 0 products

revenue · USD

Tactile sensors; dexterous hands

Last round Series B · 2026-03-06 · $145M raised Valuation $1.4B ↗

No filing-grade financials loaded yet.

Supplies → 1

🇨🇳 BYD physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Persona AIprivateRelationships

physical ai · 🇺🇸 United States · 8 sources · 0 products · 1 patents

revenue · USD

Industrial humanoids (shipyards/welding)

Last round Pre-Seed (final oversubscribed close) · 2025-05-14 · $27M raised Valuation not disclosed

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20252026 rev wins 2025-05-07 · → HD Hyundai Robotics physical_ai — click for source events
  • 2025-05-07 design-win → HD Hyundai Robotics physical_ai source ↗

Patents — 1 CPC-scoped to physical ai (physical-AI-relevant classes)

Imaging / cameras 1

No filing-grade financials loaded yet.

Supplies → 1

🇰🇷 HD Hyundai Robotics physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Phoenix ContactprivateProfile

physical ai · 🇩🇪 Germany · 2 sources · 0 products · 122 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Motor Power Connectors (M23 or DT style)' for EC Series Servo Drives (+1 more). Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 122 CPC-scoped to physical ai (physical-AI-relevant classes)

Power electronics 71
Batteries 15
Force / torque sensors 10
Robotics / manipulators 6
Computing 6
Imaging / cameras 6
Bearings 6
Electric motors 1
IMU / navigation 1

No filing-grade financials loaded yet.

PilzprivateProfile

physical ai · 🇩🇪 Germany · 19 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Emergency Stop Module & Safety Relay' for ER Series Industrial Robots. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

PSYONICprivateProfile

- · 🇺🇸 United States · 1 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-13). GoFa BOM: Ability Hand. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

Q5DprivateProfile

- · 🇬🇧 United Kingdom · 7 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-13). NEO BOM: wiring harnesses. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

RoboteraprivateRelationships

physical ai · 🇨🇳 China · 0 sources · 2 products

revenue · USD

STAR1 / L7 humanoid

Last round Strategic · 2026-03-01 · $140M raised Valuation $1.4B ↗

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-04-28 · → Samsung Electronics humanoid — click for source events
  • 2026-04-28 reported edge → Samsung Electronics humanoid source ↗

No filing-grade financials loaded yet · no sources yet (coverage gap).

Supplies → 1

🇰🇷 Samsung Electronics humanoid L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

STAR1L7

SambaNova SystemsprivateProduct-grade

ai compute · 🇺🇸 United States · 13 sources · 3 products · 576 patents

revenue · USD

RDU dataflow accelerators

Last round 2026-02-24 · $350M raised Valuation not disclosed

Investors SoftBank · Intel

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-07-08 · Intel → merchant_gpu — click for source2026-04-23 · → Intel accelerators — click for source events 2026-07-08 · partnership — JPMorgan Chase selected SambaNova as an inference infrastructure partner and will deploy its SN40 and SN50 systems.2026-07-08 · financial — SambaNova raised $1 billion at an $11 billion valuation in Series F funding led by General Atlantic.2026-07-08 · financial — SambaNova Systems raised $1 billion at an $11 billion valuation in Series F funding led by General Atlantic.2026-07-08 · financial — SambaNova Systems raised $1 billion at an $11 billion valuation in its Series F round led by General Atlantic.2026-07-08 · financial — SambaNova raised $1 billion at an $11 billion valuation in Series F funding led by General Atlantic.2026-07-07 · financial — SambaNova Systems raised $1 billion at an $11 billion valuation in Series F funding led by General Atlantic.2026-07-07 · partnership — JPMorgan Chase & Co. will deploy SambaNova's chips to power AI workloads in-house.2026-06-28 · financial — SambaNova Systems is in talks to raise between $800 million and $1 billion at an implied valuation of around $10 billion, excluding new capital.2026-02-01 · product launch — SambaNova unveiled its next-generation SN50 chip in February 2026, due to begin shipping in the second half of 2026.2026-02-01 · product launch — SambaNova unveiled its SN50 chip in February 2026, with shipping to customers expected in the second half of 2026.2026-02-01 · product launch — SambaNova unveiled its next-generation SN50 chip in February 2026, scheduled to begin shipping to customers in the second half of 2026.
  • 2026-07-08 partnership JPMorgan Chase selected SambaNova as an inference infrastructure partner and will deploy its SN40 and SN50 systems.
  • 2026-07-08 financial SambaNova raised $1 billion at an $11 billion valuation in Series F funding led by General Atlantic.
  • 2026-07-08 financial SambaNova Systems raised $1 billion at an $11 billion valuation in Series F funding led by General Atlantic.
  • 2026-07-08 financial SambaNova Systems raised $1 billion at an $11 billion valuation in its Series F round led by General Atlantic.
  • 2026-07-08 financial SambaNova raised $1 billion at an $11 billion valuation in Series F funding led by General Atlantic.
  • 2026-07-08 design-win Intel → merchant_gpu source ↗
  • 2026-07-07 financial SambaNova Systems raised $1 billion at an $11 billion valuation in Series F funding led by General Atlantic.
  • 2026-07-07 partnership JPMorgan Chase & Co. will deploy SambaNova's chips to power AI workloads in-house.
  • 2026-06-28 financial SambaNova Systems is in talks to raise between $800 million and $1 billion at an implied valuation of around $10 billion, excluding new capital.
  • 2026-04-23 design-win → Intel accelerators source ↗
  • 2026-02-01 product launch SambaNova unveiled its next-generation SN50 chip in February 2026, due to begin shipping in the second half of 2026.
  • 2026-02-01 product launch SambaNova unveiled its SN50 chip in February 2026, with shipping to customers expected in the second half of 2026.
  • 2026-02-01 product launch SambaNova unveiled its next-generation SN50 chip in February 2026, scheduled to begin shipping to customers in the second half of 2026.

Patents — 576 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 534
Memory 26
Other 16

Newest 41 of 576, most recent first — all on Google Patents →

  • 2026-06-25US20260178509Systems And Methods For Looping Dynamic Memory Access Operations
  • 2026-06-11US20260161357Systems And Methods For Area Efficient Multi-Precision Dot Product Determination
  • 2026-05-28US20260147570Kernel Looping to Eliminate Synchronization Boundaries for Peak Inference Performance in Dataflow Accelerators for Artificial Intelligence AI
  • 2026-05-28US20260147728System and method for batched speculative decoding on a data flow architecture
  • 2026-05-14US20260134908Scannable SRAM
  • 2026-03-05US20260067239COURSE-GRAINED RECONFIGURABLE ARCHITECTURE SYSTEM WITH IMPROVED TRAFFFIC MANAGEMENT
  • 2026-01-22US20260023954Read-modify-write for lossless tiling in convolution networks
  • 2025-09-11US2025284660Runtime Profiler
  • 2025-08-21US2025265053Section-Based Iterative Feedback to Different Levels of Compiler
  • 2025-08-21US2025265223Solver Based Buffer Depth Balancing for Dataflow AI Accelerator Architecture
  • 2025-08-14US2025258678Flexible Runtime Execution and Communication Scheduler for Reconfigurable Processors
  • 2025-07-03US2025217240INTELLIGENT REDUNDANCY MANAGEMENT FRAMEWORK FOR A RECONFIGURABLE DATA PROCESSOR
  • 2025-06-26US2025208839Compiler for Mixed Precision in a Computational Graph
  • 2025-06-05US2025181550Unified Management Framework for Mediating Access to a Reconfigurable Processor System
  • 2025-05-08US2025148205COMBINING IN-CONTEXT LEARNING AND INSTRUCTION TUNING TO ENHANCE LARGE LANGUAGE MODELS
  • 2025-05-08US2025148276ALL-SHOT TRAINING OF LARGE LANGUAGE MODELS
  • 2025-03-06US2025077239HARDWARE LAYER-BY-LAYER PROGRAM CONTROL IN A RECONFIGURABLE DATAFLOW PROCESSOR
  • 2025-02-13US2025053518Duplication of tensors for memory allocation in a reconfigurable data processor
  • 2025-01-23US2025028785Reconfigurable Processing Element for a Systolic Array
  • 2024-12-26US2024427727Handling dynamic tensor lengths in a reconfigurable processor that includes multiple memory units
  • 2024-12-12US2024412797Fully Scannable Memory Arrays
  • 2024-12-05US2024403012Defining and executing a section of code for an interpreted software language
  • 2024-11-21US2024385920Hang Detection In A Coarse Grained Reconfigurable Architecture Processor
  • 2024-11-14US2024378147Convolution Calculation Engine Using Look-Up Tables for Address Calculation
  • 2024-11-14US2024378259Convolution Calculation Engine
  • 2024-10-17US2024345936Dataflow Graph Performance Debugger And Design Rule Checker For CGRA
  • 2024-10-10US2024338297Debugging framework for a reconfigurable data processor
  • 2024-10-10US2024338340Intelligent graph execution and orchestration engine for a reconfigurable data processor
  • 2024-08-08US2024264896Fault management in a reconfigurable dataflow architecture
  • 2024-07-25US2024248853Method and apparatus for data access in a heterogeneous processing system with multiple processors using memory extension operation
  • 2024-07-25US2024248855Method and apparatus for selecting data access method in a heterogeneous processing system with multiple processors
  • 2024-07-25US2024248860Method and apparatus for data transfer between accessible memories of multiple processors in a heterogeneous processing system using two memory to memory transfer operations
  • 2024-07-25US2024248863Data transfer between accessible memories of multiple processors incorporated in coarse-grained reconfigurable (CGR) architecture within heterogeneous processing system using one memory to memory transfer operation
  • 2024-07-11US2024232127DATAFLOW ARCHITECTURE PROCESSOR STATICALLY RECONFIGURABLE TO PERFORM N-DIMENSIONAL AFFINE TRANSFORMATION IN A TILED MANNER
  • 2024-07-11US2024232128DATAFLOW ARCHITECTURE PROCESSOR STATICALLY RECONFIGURABLE TO PERFORM N-DIMENSIONAL AFFINE TRANSFORMATION IN PARALLEL MANNER BY REPLICATING COPIES OF INPUT IMAGE ACROSS SCRATCHPAD MEMORY BANKS
  • 2024-07-11US2024233068Dataflow architecture processor statically reconfigurable to perform n-dimensional affine transformation
  • 2024-07-04US2024220698Database driven place and route for coarse-grain reconfigurable architectures
  • 2024-07-04US2024220766ITERATIVE DATABASE DRIVEN PLACE AND ROUTE FOR COARSE-GRAIN RECONFIGURABLE ARCHITECTURES
  • 2024-07-04US2024220803TRAINING A GRAPH NEURAL NETWORK FOR DATABASE DRIVEN PLACE AND ROUTE
  • 2024-06-20US2024202046Hot-plug events in a pool of reconfigurable data flow resources
  • 2024-03-14WO2024054687INTEGRATED CIRCUIT THAT MITIGATES INDUCTIVE-INDUCED VOLTAGE DROOP

No filing-grade financials loaded yet.

Buys from ← 1

🇺🇸 Intel merchant_gpu L2 50

Supplies → 1

🇺🇸 Intel accelerators → Xeon Processors L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

SambaNova SN10 RDUSambaNova RDUSambaNova DataScale

Shanghai HuaHong NEC Electronics Co. Ltd.subsidiarySkeleton

ai compute · 🇨🇳 China · 0 sources · 0 products

Subsidiary of Hua Hong Semiconductor · financials roll up to parent

revenue · USD

Financials roll up to parent Hua Hong Semiconductor — Shanghai HuaHong NEC Electronics Co. Ltd. is a subsidiary and does not file standalone.

SICK AGprivateSkeleton

physical ai · 🇩🇪 Germany · 0 sources · 0 products · 1519 patents

revenue · USD

Last round not disclosed Valuation not disclosed

Patents — 1519 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 969
Imaging / cameras 266
Robotics / manipulators 153
IMU / navigation 53
Electric motors 29
Force / torque sensors 25
Computing 20
Gears / reducers 2
Bearings 2

No filing-grade financials loaded yet · no sources yet (coverage gap).

Siemens EDAsubsidiaryRelationships

ai compute · 🇩🇪 Germany · 7 sources · 8 products

Subsidiary of Siemens · financials roll up to parent

revenue · USD

EDA suite

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

202520262027 rev wins 2025-08-27 · NVIDIA → ai_chips — click for source2025-05-06 · Advanced Micro Devices → merchant_gpu — click for source events 2026-05-31 · product launch — Siemens is integrating NVIDIA NemoClaw and OpenShell into Fuse EDA AI Agent for chip design and circuit board system design.
  • 2026-05-31 product launch Siemens is integrating NVIDIA NemoClaw and OpenShell into Fuse EDA AI Agent for chip design and circuit board system design.
  • 2025-08-27 design-win NVIDIA → ai_chips source ↗
  • 2025-05-06 design-win Advanced Micro Devices → merchant_gpu source ↗

Financials roll up to parent Siemens — Siemens EDA is a subsidiary and does not file standalone.

Buys from ← 2

🇺🇸 NVIDIA ai_chips L2 50
🇺🇸 Advanced Micro Devices merchant_gpu L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

QuestaQuestaSimHyperLynxModelSimTessentXpeditionXpedition EnterpriseCalibre

SignaloidprivateProduct-grade

ai compute · 🇬🇧 United Kingdom · 2 sources · 0 products · 10 patents

revenue · USD

Last round Seed · 2023-05-25 · $4M raised Valuation not disclosed

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20252026 rev wins 2025-11-18 · → Bosch Rexroth ai_compute — click for source events
  • 2025-11-18 design-win → Bosch Rexroth ai_compute source ↗

Patents — 10 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 10

No filing-grade financials loaded yet.

Supplies → 1

🇩🇪 Bosch Rexroth ai_compute → IndraDrive L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Skild AIprivateRelationships

physical ai · 🇺🇸 United States · 5 sources · 0 products

revenue · USD

Skild AI is a US-based private startup developing general-purpose AI foundation models intended to control robots across multiple hardware platforms and tasks.

Last round Series C · 2026-01-14 · $1.4B raised Valuation $14.0B ↗

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-03-18 · → Hon Hai Precision Industry physical_ai — click for source2026-03-17 · → ABB Robotics physical_ai — click for source events
  • 2026-03-18 design-win → Hon Hai Precision Industry physical_ai source ↗
  • 2026-03-17 design-win → ABB Robotics physical_ai source ↗

No filing-grade financials loaded yet.

Buys from ← 2

🇺🇸 NVIDIA ai_chips L2 50
🇺🇸 Hewlett Packard Enterprise ai_compute L2 50

Supplies → 2

Hon Hai Precision Industry physical_ai L2 50
🇨🇭 ABB Robotics physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Standard BotsprivateRelationships

physical ai · 🇺🇸 United States · 10 sources · 0 products · 2 patents

revenue · USD

RO1 six-axis cobot

Last round 2026-06-11 Valuation not disclosed

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20252026 rev wins 2025-05-10 · NVIDIA → ai_chips — click for source events
  • 2025-05-10 design-win NVIDIA → ai_chips source ↗

Patents — 2 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 2

No filing-grade financials loaded yet.

Buys from ← 1

🇺🇸 NVIDIA ai_chips L2 50

Supplies → 1

🇺🇸 Amazon physical_ai L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Sunrise InstrumentsprivateProduct-grade

physical ai · 🇨🇳 China · 0 sources · 0 products · 3 patents

revenue · USD

Multi-axis F/T sensors

Last round not disclosed Valuation not disclosed

Patents — 3 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 3

No filing-grade financials loaded yet · no sources yet (coverage gap).

Supplies → 4

🇩🇪 KUKA force_torque → KUKA KMR IIWA L3 50
🇨🇭 ABB Robotics force_torque L2 50
Hon Hai Precision Industry force_torque L2 50
🇯🇵 Yaskawa Electric force_torque → Motoman L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Tamagawa SeikiprivateSkeleton

physical ai · 🇯🇵 Japan · 0 sources · 0 products · 12 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Absolute rotary servo encoders (joint feedback)' for HH180. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 12 CPC-scoped to physical ai (physical-AI-relevant classes)

Force / torque sensors 6
Electric motors 6

No filing-grade financials loaded yet · no sources yet (coverage gap).

Tata ElectronicssubsidiaryRelationships

ai compute · 🇮🇳 India · 58 sources · 0 products

Subsidiary of Tata Sons · financials roll up to parent

revenue · USD

India's first mega semiconductor fab (Dholera SIR, Gujarat); subsidiary of Tata Group.

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20242025 rev wins 2024-09-26 · Powerchip → foundry — click for source events
  • 2024-09-26 design-win Powerchip → foundry source ↗

Financials roll up to parent Tata Sons — Tata Electronics is a subsidiary and does not file standalone.

Buys from ← 3

🇳🇱 ASML ai_chips L2 50
🇹🇼 Powerchip foundry L2 50
🇯🇵 Tokyo Electron ai_chips L2 50

Supplies → 2

🇺🇸 Qualcomm ai_compute L2 50
Robert Bosch GmbH ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Toppan Printing Co., Ltd.publicRelationships

ai compute · 🇯🇵 Japan · 1 sources · 0 products · 132 patents

revenue · USD

Patents — 132 CPC-scoped to ai compute (physical-AI-relevant classes)

Semiconductors 75
Computing 44
Imaging / cameras 6
Memory 4
Power electronics 3

No filing-grade financials loaded yet.

Supplies → 1

🇨🇳 OmniVision ai_compute L2 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

VacuumschmelzeprivateRelationships

physical ai · 🇩🇪 Germany · 22 sources · 5 products · 30 patents

revenue · USD

Magnetic materials, NdFeB

Last round not disclosed Valuation not disclosed

Investors

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20262027 rev wins 2026-07-17 · → maxon rare_earth_magnets — click for source2026-07-17 · → Kollmorgen rare_earth_magnets — click for source2026-07-17 · MP Materials → physical_ai — click for source events
  • 2026-07-17 reported edge → maxon rare_earth_magnets source ↗
  • 2026-07-17 reported edge → Kollmorgen rare_earth_magnets source ↗
  • 2026-07-17 reported edge MP Materials → physical_ai source ↗

Patents — 30 CPC-scoped to physical ai (physical-AI-relevant classes)

Other 27
Electric motors 3

Newest 3 of 30, most recent first — all on Google Patents →

  • 2010-09-30WO2010109272LAMINATED CORE HAVING A SOFT MAGNETIC MATERIAL AND METHOD FOR JOINING CORE SHEETS IN A BONDED MANNER TO FORM A SOFT-MAGNETIC LAMINATED CORE
  • 2008-12-11WO2008148402METHOD FOR CONNECTING TWO JOINING PARTNERS
  • 2000-10-26WO0063454CORROSION-FREE IRON-NICKEL ALLOY FOR RESIDUAL-CURRENT CIRCUIT-BREAKERS AND CLOCKWORKS

No filing-grade financials loaded yet.

Buys from ← 1

🇺🇸 MP Materials physical_ai L2

Supplies → 2

🇨🇭 maxon rare_earth_magnets L2
🇺🇸 Kollmorgen rare_earth_magnets L2

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

Products

VACOMAXVACODYMVACOXIDVITROVACVACOFLUX

WiBOTICprivateProfile

physical ai · 🇺🇸 United States · 1 sources · 0 products · 5 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Wireless inductive foot-charging coils (2 kW)' for Figure 03. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 5 CPC-scoped to physical ai (physical-AI-relevant classes)

Lidar / ranging 5

No filing-grade financials loaded yet.

Wonik RoboticspublicProduct-grade

physical ai · 🇰🇷 South Korea · KOSDAQ: 322970 · 2 sources · 0 products · 17 patents

revenue · USD

Allegro Hand dexterous hands; AMRs

Timeline — revenue trend · supply / design-wins · events (click a marker for detail & source)

events acquired acquired by capital in partnership capacity product launch other

design-wins confirmed reported sole-source

20252026 rev wins 2025-05-20 · → NVIDIA physical_ai — click for source events
  • 2025-05-20 design-win → NVIDIA physical_ai source ↗

Patents — 17 CPC-scoped to physical ai (physical-AI-relevant classes)

Robotics / manipulators 14
Lidar / ranging 2
Batteries 1

No filing-grade financials loaded yet.

Supplies → 1

🇺🇸 NVIDIA physical_ai → Omniverse L3 50

Click a name to open its profile · click the row to walk the next tier · L3 product-grade · L2 component · L1 company-level · number = materiality

XMOSprivateProfile

ai compute · 🇬🇧 United Kingdom · 3 sources · 0 products · 45 patents

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Microphone array (spatial audio)' for S1 (+1 more). Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

Patents — 45 CPC-scoped to ai compute (physical-AI-relevant classes)

Computing 44
Lidar / ranging 1

No filing-grade financials loaded yet.

XsenssubsidiaryProfile

physical ai · 🇳🇱 Netherlands · 1 sources · 0 products

Subsidiary of Movella · financials roll up to parent

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Inertial measurement unit (IMU)' for Spot (+2 more). Skeleton pending enrichment (identifiers/financials).

Financials roll up to parent Movella — Xsens is a subsidiary and does not file standalone.

Zhongdali De 中大力德privateProfile

physical ai · 🇨🇳 China · 1 sources · 0 products

revenue · USD

Discovered via bom_teardown (2026-07-12). BOM teardown: supplies 'Planetary reducer (used inside PowerFlow joints, ~≤10:1 ratio) — reported exclusive supplier' for Yuanzheng. Skeleton pending enrichment (identifiers/financials).

Last round not disclosed Valuation not disclosed

No filing-grade financials loaded yet.

What each vertical makes, grouped by product category. Expand a company (+) for its products and where they ship. Categories generalise 500+ raw product types.

AI compute

86 companies · $2.03T · 267 supply edges

Other 13

Software & cloud 13

Semiconductor equipment 12

AI accelerators & GPUs 11

Packaging & substrates 11

Optical & networking 11

Foundry & wafers 8

CPUs & SoCs 8

Memory & storage 7

EDA & design tools 4

Power & thermal 4

Materials & chemicals 3

Test equipment 3

Physical AI

143 companies · $1.30T · 137 supply edges

Robots (industrial & cobot) 18

Sensors (IMU / force) 13

Humanoid & legged robots 13

Other 12

Reducers & gearboxes 11

Motors & drives 10

Motion components 10

Vision & LiDAR 8

Batteries & energy 6

Actuators 5

Chips (MCU / SoC) 5

Magnets & materials 4

Software 4

Drives & control 4

Appliances & HVAC 2

Each line traces a component from a robot program to the supplier that makes it. A supplier many lines converge on — hotter, wider — is a concentration chokepoint: if it stumbles, much of the field does.
Find
Component
Origin
Reach 1many programs
Concentration map
Tier-1 supplier ledger
Supplier Reach Origin T2

Source: approved supply edges (design-win two-step) Tier: T1 + T2 material · dashed = inferred material tier

COMPONENTS · TEARDOWN-GRADE BILL OF MATERIALS

Components

Component-level bill of materials for 70 flagship products. Every line is graded by confidence and shown; estimates firm up as sources corroborate. Concentration & sole-source risk analytics count only sourced (≥70%) lines. Click any component to drill in.

sourced ≥70% (counts in risk analytics) single source best estimate unverified — needs corroboration

EVE

made by 🇳🇴 1X Technologies · physical ai · 14 components

57%built in-house
14components
8in-house
6bought-in
6named suppliers
3sole-source
3IP-locked
8 in-house6 bought-in
ComponentCategorySupplierGeographyMake / buy
Revo1 quasi-direct-drive actuator (joint actuator) actuator 1X 🇳🇴 Norway Make
Gripper-style end-effector hands actuator 1X 🇳🇴 Norway Make
Wheeled self-balancing mobile base drive actuator 1X 🇳🇴 Norway Make
Onboard battery pack (~4 hr runtime) battery 1X 🇳🇴 Norway Make
Revo1 high-torque-density brushless DC motor (in-actuator) motor 1X 🇳🇴 Norway Make
Permanent magnets (BLDC motor rotor) other 1X 🇳🇴 Norway Make
Low-gear-ratio cable-driven transmission (near-zero-backlash, replaces conventional harmonic/strain-wave reducer) reducer 1X 🇳🇴 Norway Make
Chassis / structural frame and torso structure 1X 🇳🇴 Norway Make
Lithium-ion battery cells (inside pack) battery SK Innovation 🇰🇷 South Korea Buy
Precision bearings (actuator/joint)sole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
HDR vision cameras (2 front + 1 rear, panoramic)sole-sourceIP-locked camera Sony 🇯🇵 Japan Buy
Real-time control processor (Intel Core i7 CPU) compute Intel 🇺🇸 United States Buy
AI inference / perception compute (NVIDIA Jetson Xavier SoM) compute NVIDIA 🇺🇸 United States Buy
Inertial measurement unit (IMU)sole-sourceIP-locked sensor Bosch Sensortec 🇩🇪 Germany Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

NEO

made by 🇳🇴 1X Technologies · physical ai · 20 components

55%built in-house
20components
11in-house
9bought-in
8named suppliers
4sole-source
3IP-locked
11 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
1X Tendon Drive quasi-direct-drive actuator (Myofiber actuators) actuator 1X 🇳🇴 Norway Make
Tendon-driven hand (25 DoF, forearm-mounted motors) actuator 1X 🇳🇴 Norway Make
high-performance, silicon-enhanced lithium-ion batteries battery 1X 🇳🇴 Norway Make
Battery pack (842 Wh) with in-house BMS electronics battery 1X 🇳🇴 Norway Make
Revo2 motor (frameless BLDC, tendon-drive) motor 1X 🇳🇴 Norway Make
Three-stage speaker system (pelvis + chest) other 1X 🇳🇴 Norway Make
Low-ratio (approx 5:1-15:1) tendon transmission / reduction (in-house; NOT Harmonic Drive or external strain-wave reducer) reducer 1X 🇳🇴 Norway Make
Force-torque / tendon force sensing (force-transparent tendon feedback) sensor 1X 🇳🇴 Norway Make
Proprietary tendons (transmission cabling) structure 1X 🇳🇴 Norway Make
Structural frame / chassis (in-house fabricated) structure 1X 🇳🇴 Norway Make
Soft polymer covering / knit soft-goods exterior ('flesh') structure 1X 🇳🇴 Norway Make
Lithium-ion battery cells (pack assembled in-house; cell supplier not disclosed) battery unresolved Buy
Dual stereo fisheye cameras (8.85 MP, 90 Hz, ~180 deg FOV, RGB-D)sole-sourceIP-locked camera OmniVision 🇨🇳 China Buy
1X NEO Cortex compute module (NVIDIA Jetson Thor: Blackwell GPU + 14x Arm Neoverse V3AE, ~2070 FP4 TFLOPS)sole-sourceIP-locked compute NVIDIA 🇺🇸 United States Buy
128 GB LPDDR5X memory (integrated on Jetson Thor module)sole-sourceIP-locked memory SK hynix 🇰🇷 South Korea Buy
Wireless connectivity module (Wi-Fi / Bluetooth / 5G) other Qualcomm 🇺🇸 United States Buy
Beamforming microphone array (4 mics) sensor Knowles 🇺🇸 United States Buy
IMU (inertial measurement unit) sensor Bosch Sensortec 🇩🇪 Germany Buy
LiDAR sensor sensor Livox 🇨🇳 China Buy
wiring harnessessole-source wiring Q5D 🇬🇧 United Kingdom Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

GoFa

made by 🇨🇭 ABB Robotics · physical ai · 11 components

64%built in-house
11components
7in-house
4bought-in
3named suppliers
3sole-source
1IP-locked
7 in-house4 bought-in
ComponentCategorySupplierGeographyMake / buy
Integrated joint drive module (per-axis actuator assembly: motor + reducer + torque/position sensor + brake, integrated design) actuator ABB Robotics 🇨🇭 Switzerland Make
OmniCore controller (C30/C90) motion-control compute unit compute ABB Robotics 🇨🇭 Switzerland Make
Joint servomotor (brushless PMSM, ABB-wound robot motor) motor ABB Robotics 🇨🇭 Switzerland Make
FlexPendant teach-pendant HMI (touchscreen tablet) other ABB Robotics 🇨🇭 Switzerland Make
Servo drive / axis power electronics (integrated in OmniCore) power ABB Robotics 🇨🇭 Switzerland Make
Integrated joint torque sensor (power/force limiting, one per joint) sensor ABB Robotics 🇨🇭 Switzerland Make
Arm structure (aluminum links / joint housings / castings) structure ABB Robotics 🇨🇭 Switzerland Make
Ability Hand prostheticsole-source hand PSYONIC 🇺🇸 United States Buy
Ability Handsole-source hand PSYONIC 🇺🇸 United States Buy
Precision strain-wave (harmonic) reducer, per jointsole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Joint position sensor / encoder (one per joint) sensor HEIDENHAIN 🇩🇪 Germany Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

IRB 1200

made by 🇨🇭 ABB Robotics · physical ai · 14 components

43%built in-house
14components
6in-house
8bought-in
8named suppliers
5sole-source
2IP-locked
6 in-house8 bought-in
ComponentCategorySupplierGeographyMake / buy
Robot Control System (IRC5/S4C) controller ABB Robotics 🇨🇭 Switzerland Make
Tool Interface Plate (ISO 9409) other ABB Robotics 🇨🇭 Switzerland Make
Power Drive Module (6-axis) power ABB Robotics 🇨🇭 Switzerland Make
Base Pedestal/Column Casting structure ABB Robotics 🇨🇭 Switzerland Make
Robot Arm Casting (Ductile Iron) structure ABB Robotics 🇨🇭 Switzerland Make
Signal/Control Cable Harness wiring ABB Robotics 🇨🇭 Switzerland Make
Precision Angular Contact Bearingssole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Absolute Multi-turn Encodersole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (6-axis)sole-source motor ABB Buy
Pressure Relief/Hydraulic Valves other Bosch Rexroth 🇩🇪 Germany Buy
Brake Units (Spring-applied) other MAYR 🇩🇪 Germany Buy
Harmonic Drive Reducer (Circular Spline)sole-source reducer Harmonic Drive Systems Buy
Joint Torque/Force Sensorssole-sourceIP-locked sensor ATI Industrial Automation 🇺🇸 United States Buy
Motor Power Harness (Shielded Cable) wiring Lappkabel Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

IRB 14000

made by 🇨🇭 ABB Robotics · physical ai · 9 components

33%built in-house
9components
3in-house
6bought-in
5named suppliers
6sole-source
2IP-locked
3 in-house6 bought-in
ComponentCategorySupplierGeographyMake / buy
Integrated servo smart gripper / hand module actuator ABB Robotics 🇨🇭 Switzerland Make
IRC5 motion controller / compute (system, external cabinet) compute ABB Robotics 🇨🇭 Switzerland Make
Lightweight magnesium-alloy skeleton / arm structure structure ABB Robotics 🇨🇭 Switzerland Make
Joint cross-roller / precision bearing (inferred, per joint)sole-sourceIP-locked bearing JTEKT 🇯🇵 Japan Buy
Integrated vision camera (optional, hand/wrist mounted)sole-source camera unresolved Buy
AC servo motor (per-joint drive)sole-source motor ABB Motors 🇸🇪 Sweden Buy
24V DC holding brake (axes 1-4 of each arm)sole-source other MAYR 🇩🇪 Germany Buy
Harmonic-drive (strain-wave) joint reducersole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Resolver (motor position feedback)sole-source sensor HEIDENHAIN 🇩🇪 Germany Buy

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IRB 2400

made by 🇨🇭 ABB Robotics · physical ai · 14 components

43%built in-house
14components
6in-house
8bought-in
7named suppliers
5sole-source
2IP-locked
6 in-house8 bought-in
ComponentCategorySupplierGeographyMake / buy
Motion Control Board (S4C or IRB-specific) controller ABB Robotics 🇨🇭 Switzerland Make
Cooling System (thermal management) other ABB Robotics 🇨🇭 Switzerland Make
Electrical Cabinet (IP54 rated) other ABB Robotics 🇨🇭 Switzerland Make
End Effector Interface (ISO/TS 13732) other ABB Robotics 🇨🇭 Switzerland Make
Aluminum/Ductile Iron Arm Castings & Structural Frame structure ABB Robotics 🇨🇭 Switzerland Make
Harness & Cable Assemblies wiring ABB Robotics 🇨🇭 Switzerland Make
High-precision Robotic Joint Bearingssole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Absolute Multi-turn Encoder (6-axis)sole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (6-axis set)sole-source motor ABB Buy
Brake Module (holding brake per joint) other MAYR 🇩🇪 Germany Buy
Power Drive Module (servo drive)sole-source power ABB Buy
Harmonic Drive Reducer (6-axis set)sole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Inclinometer/Gravity Compensation Sensor sensor Xsens 🇳🇱 Netherlands Buy
Wrist Force/Torque Sensor (optional) sensor ATI Industrial Automation 🇺🇸 United States Buy

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IRB 6700

made by 🇨🇭 ABB Robotics · physical ai · 15 components

47%built in-house
15components
7in-house
8bought-in
7named suppliers
7sole-source
3IP-locked
7 in-house8 bought-in
ComponentCategorySupplierGeographyMake / buy
IRC5 Robot Controller controller ABB Robotics 🇨🇭 Switzerland Make
Cooling System (Liquid/Fan) other ABB Robotics 🇨🇭 Switzerland Make
Tool Flange (Tool Changer Interface) other ABB Robotics 🇨🇭 Switzerland Make
Power Supply Module (400-480V) power ABB Robotics 🇨🇭 Switzerland Make
Drive Module (Servo Amplifiers) power ABB Robotics 🇨🇭 Switzerland Make
Steel Base Casting & Joints structure ABB Robotics 🇨🇭 Switzerland Make
Aluminum Die-Cast Arm Structure structure ABB Robotics 🇨🇭 Switzerland Make
Precision Angular Contact Bearingssole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Incremental/Absolute Encodersole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (Main Axis)sole-source motor ABB Buy
Brake Units (Spring-Applied) other MAYR 🇩🇪 Germany Buy
Harmonic Drive RV Reducersole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Force/Torque Sensor (Optional)sole-sourceIP-locked sensor ATI Industrial Automation 🇺🇸 United States Buy
Control Signal Harnesssole-source wiring Lapp Buy
Motor Cable Harness (Shielded)sole-source wiring Lapp Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

IRB 910SC

made by 🇨🇭 ABB Robotics · physical ai · 14 components

64%built in-house
14components
9in-house
5bought-in
5named suppliers
2sole-source
2IP-locked
9 in-house5 bought-in
ComponentCategorySupplierGeographyMake / buy
Motion Controller (IRC5 Compact) controller ABB Robotics 🇨🇭 Switzerland Make
Absolute Encoder (Axis 1-4) encoder ABB Robotics 🇨🇭 Switzerland Make
AC Servo Motor (Axis 1-4) motor ABB Robotics 🇨🇭 Switzerland Make
Wrist Flange/Tool Interface Plate other ABB Robotics 🇨🇭 Switzerland Make
Brake Module (Spring-Applied) other ABB Robotics 🇨🇭 Switzerland Make
Servo Drive Module (ACS/DSQC) power ABB Robotics 🇨🇭 Switzerland Make
Thermal Sensor (Motor Temperature) sensor ABB Robotics 🇨🇭 Switzerland Make
Steel Base/Pedestal Casting structure ABB Robotics 🇨🇭 Switzerland Make
Aluminum Arm Casting (Upper/Lower Link) structure ABB Robotics 🇨🇭 Switzerland Make
Angular Contact Ball Bearing (Joint Assemblies)sole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Harmonic Drive RV Reducer (Axis 1-4)sole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
TCP Force/Torque Sensor Interface sensor ATI Industrial Automation 🇺🇸 United States Buy
Motor Power Harness (Shielded Cable) wiring Lapp Buy
Signal/Control Connector Assembly wiring Phoenix Contact 🇩🇪 Germany Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

YuMi

made by 🇨🇭 ABB Robotics · physical ai · 15 components

40%built in-house
15components
6in-house
9bought-in
9named suppliers
6sole-source
2IP-locked
6 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
Motion Control / Drive Unit (per arm) controller ABB Robotics 🇨🇭 Switzerland Make
Main Controller / Safety PLC controller ABB Robotics 🇨🇭 Switzerland Make
Gripper / End Effector Coupling other ABB Robotics 🇨🇭 Switzerland Make
Collaborative Safety Skin / Bumper other ABB Robotics 🇨🇭 Switzerland Make
Aluminum/Cast Arm Links & Joint Housings structure ABB Robotics 🇨🇭 Switzerland Make
Base Pedestal / Casting structure ABB Robotics 🇨🇭 Switzerland Make
Precision Ball / Roller Bearings (joints & base)sole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Absolute Rotary Encoder (per joint)sole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (per arm, ~7 per robot)sole-source motor ABB Buy
Vision System Integration / Camera other Cognex Buy
Power Supply / PSU (multi-output)sole-sourceIP-locked power Phoenix Contact 🇩🇪 Germany Buy
Precision RV Reducer / Harmonic Drive (per joint)sole-source reducer Harmonic Drive Systems Buy
Force/Torque Sensor (per wrist) sensor ATI Industrial Automation 🇺🇸 United States Buy
Proximity / Safety Sensors sensor Sick Buy
Motor Cable Harness (servo + encoder lines)sole-source wiring Lapp Buy

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Instinct MI300X

made by 🇺🇸 Advanced Micro Devices · ai compute · 17 components

6%built in-house
17components
1in-house
16bought-in
4named suppliers
13sole-source
9IP-locked
1 in-house16 bought-in
ComponentCategorySupplierGeographyMake / buy
OAM (OCP Accelerator Module) baseboard/PCB carrier structure Advanced Micro Devices 🇺🇸 United States Make
IOD I/O Die (Infinity Fabric + Infinity Cache + memory controllers, TSMC N6)sole-sourceIP-locked compute Taiwan Manufacturing 🇹🇼 Taiwan Buy
XCD Accelerator Complex Die (CDNA 3 GPU compute chiplet, TSMC N5)sole-sourceIP-locked compute Taiwan Manufacturing 🇹🇼 Taiwan Buy
I/O die / Active Interposer Die (IOD/AID, codename Elk Range, ~370mm2 TSMC N6, holds Infinity Cache + memory controllers)sole-sourceIP-locked compute Taiwan Manufacturing 🇹🇼 Taiwan Buy
GPU compute chiplet (XCD, codename Banff, CDNA3, ~115mm2 TSMC N5)sole-sourceIP-locked compute Taiwan Manufacturing 🇹🇼 Taiwan Buy
Zen4 CPU chiplet (CCD, codename Durango, ~70mm2 TSMC N5) - MI300A APU variant onlysole-sourceIP-locked compute Taiwan Manufacturing 🇹🇼 Taiwan Buy
HBM3 memory stack (24GB, 8x = 192GB total; 12-Hi/8-Hi)sole-sourceIP-locked memory SK hynix 🇰🇷 South Korea Buy
HBM3 memory stack (24GB, 8-Hi; 192GB total, ~5.3 TB/s aggregate)sole-sourceIP-locked memory SK hynix 🇰🇷 South Korea Buy
HBM memorysole-source other SK hynix 🇰🇷 South Korea Buy
Advanced packaging: TSMC SoIC gen-1 hybrid bonding (9um pitch) + CoWoS assembly/testsole-source packaging Taiwan Manufacturing 🇹🇼 Taiwan Buy
CoWoS-S 2.5D silicon interposer (record 3.5x reticle-size)sole-source packaging Taiwan Manufacturing 🇹🇼 Taiwan Buy
SoIC 3D hybrid-bond stacking / CoWoS assembly & test (XCD-on-IOD)sole-source packaging Taiwan Manufacturing 🇹🇼 Taiwan Buy
Power delivery / VRM stage on OAM modulesole-sourceIP-locked power Infineon 🇩🇪 Germany Buy
Power delivery / voltage regulation (multiphase VRM on OAM module)sole-sourceIP-locked power Infineon 🇩🇪 Germany Buy
Organic package substrate (ABF build-up, ~76.8x72.0mm body) substrate Ibiden 🇯🇵 Japan Buy
CoWoS-S silicon interposer (3.5x reticle, passive, TSVs + metal routing) substrate Taiwan Manufacturing 🇹🇼 Taiwan Buy
FC-BGA package substrate (BT core + Ajinomoto ABF build-up film, OAM form factor) substrate Ibiden 🇯🇵 Japan Buy

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Genie

made by 🇨🇳 AgiBot · physical ai · 22 components

14%built in-house
22components
3in-house
19bought-in
17named suppliers
3sole-source
1IP-locked
3 in-house19 bought-in
ComponentCategorySupplierGeographyMake / buy
Dexterous hand (12-DoF, tactile) actuator AgiBot 🇨🇳 China Make
PowerFlow joint actuator (integrated torque-sensing joint) actuator AgiBot 🇨🇳 China Make
Fingertip visuo-tactile sensor sensor AgiBot 🇨🇳 China Make
Joint module assembly actuator Fulin Precision 🇨🇳 China Buy
Battery packsole-source battery CATL 🇨🇳 China Buy
RGB-D / 3D vision camerasole-sourceIP-locked camera Orbbec 🇨🇳 China Buy
Databricks Genie compute Databricks Buy
Onboard AI compute SoC (~200 TOPS, NVIDIA Jetson Orin class) compute NVIDIA 🇺🇸 United States Buy
Servo actuator / servo motor (full-line supply) motor HCFA 🇨🇳 China Buy
Coreless (hollow-cup) motor for lightweight joints motor Moons' Electric 🇨🇳 China Buy
multi-agent orchestration system other Aimpoint Digital Buy
multi-agent orchestration interface other CI&T Buy
Unity Catalog other Databricks Buy
Composite motion cable (robot harness) other Zhejiang Wanma 🇨🇳 China Buy
Lakebase other Databricks Buy
RV reducer (high-load waist joint) reducer Double Ring Transmission 🇨🇳 China Buy
Planetary reducer (joint modules) reducer Ningbo Zhongda Leader Intelligent Transmission Co., Ltd. 🇨🇳 China Buy
Harmonic reducer (arm joints) reducer Leaderdrive 🇨🇳 China Buy
Planetary roller screw (linear actuators)sole-source screw Wuzhou Xinchun 🇨🇳 China Buy
8-microphone array sensor Knowles 🇺🇸 United States Buy
LiDAR (perception) sensor Livox 🇨🇳 China Buy
IMU (inertial measurement unit) sensor Huayi Technology 🇨🇳 China Buy

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Yuanzheng

made by 🇨🇳 AgiBot · physical ai · 15 components

13%built in-house
15components
2in-house
13bought-in
12named suppliers
4sole-source
1IP-locked
2 in-house13 bought-in
ComponentCategorySupplierGeographyMake / buy
PowerFlow integrated joint actuator (準直驱/quasi-direct-drive, peak torque >350–430 N·m, ~1.6 kg, ~50 Nm/kg density, dual coaxial encoders + liquid cooling + self-developed vector-control driver) actuator AgiBot 🇨🇳 China Make
SkillHand dexterous hand (12 active + 5 passive DOF, all drives internal, vision-based fingertip sensors, MEMS tactile/visuo-tactile sensing) other AgiBot 🇨🇳 China Make
Heavy-load actuator / core drive components for 远征 A2 — reported supplier actuator HCFA 🇨🇳 China Buy
Hot-swappable battery pack (minute-level swap on A2-W; supplier not disclosed — CATL only in testing scenarios for sibling G2)sole-source battery unresolved Buy
Main compute / AI controller — NVIDIA Jetson AGX Orin 64GBsole-sourceIP-locked compute NVIDIA 🇺🇸 United States Buy
Servo motor (positional joints) — long-term supply via subsidiary motor Wolong Electric 🇨🇳 China Buy
Hollow-cup (coreless) motor for dexterous hand — sampled/passed whole-machine test (2025) motor Moons' Electric 🇨🇳 China Buy
Rare-earth permanent magnet material (for joint/hand motors) motor Ningbo Yunsheng 🇨🇳 China Buy
Thermal management + high-power charging solutionsole-source power Lingyi iTech 领益智造 🇨🇳 China Buy
RV reducer (waist / high-load) — reported exclusive supplier reducer Shuanghuan Driveline 🇨🇳 China Buy
Planetary reducer (used inside PowerFlow joints, ~≤10:1 ratio) — reported exclusive supplier reducer Zhongdali De 中大力德 🇨🇳 China Buy
Harmonic reducer (forearm / distal joints) — reported exclusive/primary supplier reducer Leaderdrive 🇨🇳 China Buy
Planetary roller screw / electric joint module (0.3μm-grade screw grinding; covers 远征A2 & 灵犀X1) screw Fulin Precision 🇨🇳 China Buy
Ball screw (linear transmission) — reported core supplier screw Wuzhou Xinchun 🇨🇳 China Buy
Six-axis force / torque sensor (tactile feedback, ~0.1ms response) — samples delivered, in test/validationsole-source sensor Keli Sensing Technology 🇨🇳 China Buy

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Digit

made by 🇺🇸 Agility Robotics · physical ai · 15 components

47%built in-house
15components
7in-house
8bought-in
8named suppliers
4sole-source
4IP-locked
7 in-house8 bought-in
ComponentCategorySupplierGeographyMake / buy
Custom arm / manipulation actuators actuator Agility Robotics 🇺🇸 United States Make
Custom series-elastic leg/hip/torso actuators (springs + cable/belt drive) actuator Agility Robotics 🇺🇸 United States Make
Lithium-ion battery pack (UN 38.3 certified, ~8 hr runtime) battery Agility Robotics 🇺🇸 United States Make
End effectors / hands (grippers) other Agility Robotics 🇺🇸 United States Make
Motor drive / power electronics (actuator controllers) power Agility Robotics 🇺🇸 United States Make
Cable/belt-drive transmission (in lieu of harmonic/RV reducer) reducer Agility Robotics 🇺🇸 United States Make
Structural frame / chassis (legs, arms, torso housings) structure Agility Robotics 🇺🇸 United States Make
Actuator joint bearingssole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Intel RealSense depth camerassole-sourceIP-locked camera Intel 🇺🇸 United States Buy
Onboard AI compute (NVIDIA Jetson AGX / RTX-class accelerator)sole-sourceIP-locked compute NVIDIA 🇺🇸 United States Buy
BLDC / frameless electric motors inside actuatorssole-sourceIP-locked motor Kollmorgen 🇺🇸 United States Buy
Joint encoders (absolute + incremental) sensor HEIDENHAIN 🇩🇪 Germany Buy
LiDAR unit (head sensor array, 3D mapping) sensor Livox 🇨🇳 China Buy
Force/torque sensors in arms (compliant manipulation) sensor ATI Industrial Automation 🇺🇸 United States Buy
MEMS IMU / gyroscope (balance & proprioception) sensor Bosch Sensortec 🇩🇪 Germany Buy

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AWS Inferentia

made by 🇺🇸 Amazon.com, Inc. · ai compute · 6 components

17%built in-house
6components
1in-house
5bought-in
4named suppliers
5sole-source
2IP-locked
1 in-house5 bought-in
ComponentCategorySupplierGeographyMake / buy
Power delivery / voltage regulator module (VRM) on accelerator card power Amazon 🇺🇸 United States Make
Inferentia2 compute ASIC die (2x NeuronCore-v2, ~190 TFLOPS FP16)sole-sourceIP-locked compute Taiwan Manufacturing 🇹🇼 Taiwan Buy
HBM stacks (32 GB total, ~HBM2e; ~9.8 TB/s aggregate across 12 chips)sole-sourceIP-locked memory SK hynix 🇰🇷 South Korea Buy
Backend physical / ASIC design service (place-and-route, IP integration)sole-source other Alchip Technologies Buy
CoWoS 2.5D advanced package / silicon interposer (die + HBM co-integration)sole-source packaging Taiwan Manufacturing 🇹🇼 Taiwan Buy
ABF organic IC substrate (package substrate)sole-source substrate Unimicron 🇹🇼 Taiwan Buy

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AWS Trainium

made by 🇺🇸 Amazon.com, Inc. · ai compute · 12 components

25%built in-house
12components
3in-house
9bought-in
8named suppliers
5sole-source
1IP-locked
3 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
AWS Nitro DPU card (VPC/security/networking offload) compute Amazon 🇺🇸 United States Make
Trainium2 compute die / ASIC (2x 5nm compute chiplets) compute Amazon 🇺🇸 United States Make
Passive structural silicon dies (mechanical/stiffener) structure Amazon 🇺🇸 United States Make
Trainium chips for initial processing stage compute Amazon Web Services (AWS) Buy
HBM3e memory stack (24GB each, 96GB total per chip)sole-sourceIP-locked memory SK hynix 🇰🇷 South Korea Buy
PCIe Gen5 SerDes IP (NeuronLink scale-up interconnect) other Synopsys 🇺🇸 United States Buy
Backplane connectors (scale-up interconnect, 48 connectors/server) other TE Connectivity 🇺🇸 United States Buy
Active electrical cables / AECs (Trn2-Ultra scale-up, ~$1-1.2k per chip incl. connectors) other Astera Labs 🇺🇸 United States Buy
Organic thin-film RDL interposer (6-layer copper RDL on polymer, CoWoS-R)sole-source packaging Taiwan Manufacturing 🇹🇼 Taiwan Buy
CoWoS-S/R advanced 2.5D packaging (chiplet-to-HBM integration)sole-source packaging Taiwan Manufacturing 🇹🇼 Taiwan Buy
Power delivery / VRM (~500W per chip)sole-source power Kinetic Technologies Buy
ABF package substrate (joins the two compute-chiplet halves)sole-source substrate Ibiden 🇯🇵 Japan Buy

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Apollo

made by 🇺🇸 Apptronik · physical ai · 14 components

21%built in-house
14components
3in-house
11bought-in
9named suppliers
9sole-source
7IP-locked
3 in-house11 bought-in
ComponentCategorySupplierGeographyMake / buy
Custom rotary actuators actuator Apptronik 🇺🇸 United States Make
Linear electric actuators (custom, bespoke linear actuator design) actuator Apptronik 🇺🇸 United States Make
Electric drive motors (6th-generation in-house motors) motor Apptronik 🇺🇸 United States Make
Hot-swappable battery pack (~4 hour runtime)sole-sourceIP-locked battery Samsung SDI 🇰🇷 South Korea Buy
Actuator bearingssole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Depth cameras (perception / vision)sole-sourceIP-locked camera Intel 🇺🇸 United States Buy
NVIDIA Jetson AGX Orin AI compute modulesole-sourceIP-locked compute NVIDIA 🇺🇸 United States Buy
NVIDIA Jetson Orin NX compute modulesole-sourceIP-locked compute NVIDIA 🇺🇸 United States Buy
Power-management ICs (functional-safety compliant power path)sole-sourceIP-locked power Texas Instruments 🇺🇸 United States Buy
Motor-control MCUs, gate drivers and analog motor-control ICssole-sourceIP-locked power Texas Instruments 🇺🇸 United States Buy
Precision reducers / gearing for rotary jointssole-source reducer Harmonic Drive L 🇺🇸 United States Buy
Ball-screw / planetary-roller-screw linear drive elements (inside actuators)sole-source screw THK 🇯🇵 Japan Buy
LiDAR sensor sensor Livox 🇨🇳 China Buy
Force-torque sensors (joint / wrist) sensor ATI Industrial Automation 🇺🇸 United States Buy

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EUV lithography systems (NXE series)

made by 🇳🇱 ASML · ai compute · 3 components

0%built in-house
3components
0in-house
3bought-in
2named suppliers
3sole-source
0 in-house3 bought-in
ComponentCategorySupplierGeographyMake / buy
Optical systemssole-source compute ZEISS Buy
EUV opticssole-source other ZEISS Buy
laser sourcesole-source power Trumpf Buy

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High-NA EUV systems (NXE:3400B)

made by 🇳🇱 ASML · ai compute · 1 components

0%built in-house
1components
0in-house
1bought-in
1named suppliers
1sole-source
0 in-house1 bought-in
ComponentCategorySupplierGeographyMake / buy
MeRiT AE photomask repair toolsole-source other ZEISS Buy

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Atlas

made by 🇺🇸 Boston Dynamics · physical ai · 20 components

40%built in-house
20components
8in-house
12bought-in
9named suppliers
6sole-source
3IP-locked
8 in-house12 bought-in
ComponentCategorySupplierGeographyMake / buy
custom rotary actuators using planetary roller screws and high-density neodymium magnets actuator Boston Dynamics 🇺🇸 United States Make
Three-finger dexterous gripper hand module (self-contained, 7 actuators / 7 DOF each, articulated thumb) actuator Boston Dynamics 🇺🇸 United States Make
Proprietary rotary electric actuators (hip / knee / ankle / shoulder / elbow), modular reusable design actuator Boston Dynamics 🇺🇸 United States Make
Swappable industrial battery pack (~4 hr runtime, ~2 hr heavy lifting, 3-min autonomous swap) — cell supplier undisclosed battery Boston Dynamics 🇺🇸 United States Make
wet multiplate slipper clutch reducer Boston Dynamics 🇺🇸 United States Make
IMU / joint encoders (IMU ~1 kHz, joint encoders ~4 kHz) — supplier undisclosed sensor Boston Dynamics 🇺🇸 United States Make
Tactile fingertip / palm sensors (pressure sensing in high-friction elastomer) sensor Boston Dynamics 🇺🇸 United States Make
Structural frame — titanium + aluminum 3D-printed (additive) parts with integrated cooling-fin cladding structure Boston Dynamics 🇺🇸 United States Make
KYB fork and monoshocksole-source bearing KYB 🇯🇵 Japan Buy
Stereo / RGB / depth (RGB-D + ToF) camera suite, 360-degree head view — supplier undisclosedsole-source camera unresolved Buy
NVIDIA Jetson Thor (T5000) compute module with Blackwell GPU (~2070 FP4 TFLOPS)sole-sourceIP-locked compute NVIDIA 🇺🇸 United States Buy
LPDDR5X memory (on-module, part of Jetson Thor T5000, ~128 GB) — DRAM maker undisclosedsole-sourceIP-locked memory Samsung Electronics 🇰🇷 South Korea Buy
Frameless torque motors (rotor/stator inside each actuator)sole-sourceIP-locked motor Kollmorgen 🇺🇸 United States Buy
brake calipers and discs other ByBre Buy
suspension fork and rear shock absorber other KYB 🇯🇵 Japan Buy
Head cooling fan (single active fan, cools the compute stack; rest of robot passively cooled)sole-source power ebm-papst 🇩🇪 Germany Buy
Gear reducers (harmonic / planetary gearing integrated in actuators) — supplier undisclosed reducer Harmonic Drive L 🇺🇸 United States Buy
six-axis IMU sensor Bosch Buy
six-axis Inertial Measurement Unit sensor Bosch Buy
360-degree LiDAR (environmental mapping) — supplier undisclosed sensor Velodyne Lidar 🇺🇸 United States Buy

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Spot

made by 🇺🇸 Boston Dynamics · physical ai · 15 components

27%built in-house
15components
4in-house
11bought-in
10named suppliers
5sole-source
2IP-locked
4 in-house11 bought-in
ComponentCategorySupplierGeographyMake / buy
Leg-drive actuator (hip/knee joint actuator) actuator Boston Dynamics 🇺🇸 United States Make
Projected-stereo B/W camera pairs (5 pairs, 360 deg) camera Boston Dynamics 🇺🇸 United States Make
Motor-controller / power-distribution board power Boston Dynamics 🇺🇸 United States Make
Chassis / structural leg module housing structure Boston Dynamics 🇺🇸 United States Make
Battery cells (Molicel, 14s, ~564 Wh) - 2024 Enterprise pack battery Molicel 🇨🇳 China Buy
Battery cells (Samsung INR18650-30Q, 14s4p, ~605 Wh) - Explorer battery Samsung SDI 🇰🇷 South Korea Buy
Joint / output bearingssole-sourceIP-locked bearing JTEKT 🇯🇵 Japan Buy
Spot CAM+IR thermal inspection camera (payload option) camera Carnegie Robotics 🇺🇸 United States Buy
Onboard compute (x86 desktop-class CPU)sole-sourceIP-locked compute Intel 🇺🇸 United States Buy
Brushless DC joint motor (3 per leg)sole-source motor maxon 🇨🇭 Switzerland Buy
50:1 harmonic (strain-wave) reducer, rotary hip jointssole-source reducer Harmonic Drive L 🇺🇸 United States Buy
Linear ball-screw actuator, knee jointsole-source screw THK 🇯🇵 Japan Buy
Depth camera (Intel RealSense D430-class module) sensor Intel 🇺🇸 United States Buy
Inertial measurement unit (IMU) sensor Xsens 🇳🇱 Netherlands Buy
VLP-16 LiDAR (EAP payload option, not base config) sensor Velodyne Lidar 🇺🇸 United States Buy

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Stretch

made by 🇺🇸 Boston Dynamics · physical ai · 16 components

38%built in-house
16components
6in-house
10bought-in
9named suppliers
4sole-source
1IP-locked
6 in-house10 bought-in
ComponentCategorySupplierGeographyMake / buy
Central compute unit (onboard PC/SBC) controller Boston Dynamics 🇺🇸 United States Make
Motor drive controllers/servo amplifiers controller Boston Dynamics 🇺🇸 United States Make
Compliant gripper/end-effector actuator other Boston Dynamics 🇺🇸 United States Make
Battery management system (BMS) power Boston Dynamics 🇺🇸 United States Make
Lithium battery pack (modular cells) power Boston Dynamics 🇺🇸 United States Make
Aluminum frame/chassis (CNC machined/welded) structure Boston Dynamics 🇺🇸 United States Make
Mobile base drive motors (brushless DC)sole-source actuator maxon 🇨🇭 Switzerland Buy
Precision ball bearings (arm)sole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
Absolute rotary encoders (joints) encoder HEIDENHAIN 🇩🇪 Germany Buy
Wheel odometry encoders encoder US Digital Buy
Arm joint servo motors (brushless)sole-source motor maxon 🇨🇭 Switzerland Buy
Planetary gearbox (base drive) reducer Neugart 🇩🇪 Germany Buy
Harmonic Drive reducers (arm joints) reducer Harmonic Drive 🇯🇵 Japan Buy
3D perception camera (RGB-D or LiDAR) sensor Intel 🇺🇸 United States Buy
IMU/gyroscope sensor Xsens 🇳🇱 Netherlands Buy
Custom harness & connectorssole-source wiring Molex Buy

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H2017

made by 🇰🇷 Doosan Robotics · physical ai · 8 components

62%built in-house
8components
5in-house
3bought-in
3named suppliers
3sole-source
2IP-locked
5 in-house3 bought-in
ComponentCategorySupplierGeographyMake / buy
Robot controller / motion-control compute (control cabinet) compute Doosan Robotics 🇰🇷 South Korea Make
Joint servo drive / power electronics (IP54 control device) power Doosan Robotics 🇰🇷 South Korea Make
6-axis joint torque sensors (one per joint) sensor Doosan Robotics 🇰🇷 South Korea Make
Absolute joint encoders (position feedback) sensor Doosan Robotics 🇰🇷 South Korea Make
Structural arm links and joint housings (lightweight, gravity-compensated) structure Doosan Robotics 🇰🇷 South Korea Make
Frameless servo motors (joint drive motors)sole-sourceIP-locked motor Nidec 🇯🇵 Japan Buy
Joint holding brakes (safety brakes)sole-source other MAYR 🇩🇪 Germany Buy
Harmonic / strain-wave reducers (joint gearboxes)sole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy

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H2515

made by 🇰🇷 Doosan Robotics · physical ai · 9 components

44%built in-house
9components
4in-house
5bought-in
5named suppliers
4sole-source
2IP-locked
4 in-house5 bought-in
ComponentCategorySupplierGeographyMake / buy
Controller / control box compute (x86 control PC) compute Doosan Robotics 🇰🇷 South Korea Make
Servo drive / joint motor-driver electronics power Doosan Robotics 🇰🇷 South Korea Make
Joint torque sensor (one per axis, Doosan-developed) sensor Doosan Robotics 🇰🇷 South Korea Make
Aluminum arm housing / structural castings structure Doosan Robotics 🇰🇷 South Korea Make
Cross-roller / joint output bearingsole-source bearing INA 🇩🇪 Germany Buy
Frameless BLDC servo motor, per jointsole-sourceIP-locked motor Kollmorgen 🇺🇸 United States Buy
Electromagnetic holding brake, per jointsole-source other MAYR 🇩🇪 Germany Buy
Strain-wave (harmonic) reducer, per jointsole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Absolute joint encoder sensor HEIDENHAIN 🇩🇪 Germany Buy

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M0609

made by 🇰🇷 Doosan Robotics · physical ai · 14 components

29%built in-house
14components
4in-house
10bought-in
10named suppliers
6sole-source
2IP-locked
4 in-house10 bought-in
ComponentCategorySupplierGeographyMake / buy
Joint Motion Controller (Servo Drive) controller Doosan Robotics 🇰🇷 South Korea Make
Main Robot Controller (Industrial PC/PLC) controller Doosan Robotics 🇰🇷 South Korea Make
Tool Interface Flange (Quick-change) other Doosan Robotics 🇰🇷 South Korea Make
Aluminum/Ductile Iron Arm Castings & Forgings structure Doosan Robotics 🇰🇷 South Korea Make
Precision Ball/Roller Bearingssole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Absolute Multi-turn Encodersole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
Servo Motor (Joint Actuator)sole-source motor maxon 🇨🇭 Switzerland Buy
Brake (Spring-applied, solenoid-released) other MAYR 🇩🇪 Germany Buy
Cables & Connectors (Signal/Power) other Lemo Buy
Power Supply Unit (24V/48V DC)sole-source power MEAN WELL Buy
RV Harmonic Reducersole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Inertial Measurement Unit (IMU) sensor Xsens 🇳🇱 Netherlands Buy
Force/Torque Sensor (Wrist) sensor ATI Industrial Automation 🇺🇸 United States Buy
Harness Assembly & Connectorssole-source wiring Phoenix Contact 🇩🇪 Germany Buy

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M0610

made by 🇰🇷 Doosan Robotics · physical ai · 14 components

50%built in-house
14components
7in-house
7bought-in
7named suppliers
5sole-source
1IP-locked
7 in-house7 bought-in
ComponentCategorySupplierGeographyMake / buy
Main Robot Controller (real-time OS, safety controller) controller Doosan Robotics 🇰🇷 South Korea Make
Arm Control Servo Drive (joint servo amplifier module) controller Doosan Robotics 🇰🇷 South Korea Make
End-Effector Interface/Tool Flange other Doosan Robotics 🇰🇷 South Korea Make
Proximity/Safety Monitoring (bumpers, force limits) sensor Doosan Robotics 🇰🇷 South Korea Make
Aluminum/Steel Link Castings & Extrusions (arm body) structure Doosan Robotics 🇰🇷 South Korea Make
Base Casting & Mounting Bracket structure Doosan Robotics 🇰🇷 South Korea Make
Integrated Harness/Cable Assembly wiring Doosan Robotics 🇰🇷 South Korea Make
Precision Crossed-Roller Bearings (joint interfaces)sole-sourceIP-locked bearing JTEKT 🇯🇵 Japan Buy
Absolute Multi-turn Encoder (integrated with motor/gearbox)sole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
Servo Motor (AC brushless, ~200W-400W per joint)sole-source motor Maxon Motor Buy
Protective Covers & Cable Guides (polymer, protective sleeves) other Igus 🇩🇪 Germany Buy
Power Supply Unit (industrial AC-DC, ~2kW)sole-source power MEANWELL 🇹🇼 Taiwan Buy
Harmonic Drive Reducer (CSF-11-50, CSF-14-50 series)sole-source reducer Harmonic Drive Systems Buy
Collaborative Force/Torque Sensor (wrist, cobot-specific) sensor ATI Industrial Automation 🇺🇸 United States Buy

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M1013

made by 🇰🇷 Doosan Robotics · physical ai · 14 components

43%built in-house
14components
6in-house
8bought-in
8named suppliers
6sole-source
1IP-locked
6 in-house8 bought-in
ComponentCategorySupplierGeographyMake / buy
Joint Control Module (Drive + DSP) controller Doosan Robotics 🇰🇷 South Korea Make
Main Robot Controller (Real-time OS) controller Doosan Robotics 🇰🇷 South Korea Make
Vision System Interface Module (optional) controller Doosan Robotics 🇰🇷 South Korea Make
Mechanical End-Effector Coupler other Doosan Robotics 🇰🇷 South Korea Make
Safety-Rated Joint Torque Sensor sensor Doosan Robotics 🇰🇷 South Korea Make
Aluminum/Steel Link Casting & CNC Machining structure Doosan Robotics 🇰🇷 South Korea Make
Precision Crossed Roller Bearingsole-sourceIP-locked bearing THK 🇯🇵 Japan Buy
Multi-turn Absolute Encodersole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
Servo Motor (Joint Actuator)sole-source motor Maxon Motor Buy
Cable Management Drag Chain other Igus 🇩🇪 Germany Buy
Power Supply Module (24VDC/48VDC)sole-source power MEANWELL 🇹🇼 Taiwan Buy
RV Harmonic Reducersole-source reducer HDSI (Harmonic Drive Systems) Buy
6-Axis Force/Torque Sensor sensor ATI Industrial Automation 🇺🇸 United States Buy
Cable Harness & Connectorssole-source wiring LAPP Buy

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EC Series Servo Drives

made by 🇨🇳 Estun Automation · physical ai · 15 components

40%built in-house
15components
6in-house
9bought-in
9named suppliers
1sole-source
1IP-locked
6 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
Servo Drive Control Board (DSP/FPGA) controller Estun Automation 🇨🇳 China Make
Firmware/Control Software Stack other Estun Automation 🇨🇳 China Make
Aluminum Die-cast Heatsink Housing structure Estun Automation 🇨🇳 China Make
PCB (multilayer, copper-clad laminate) structure Estun Automation 🇨🇳 China Make
Shielded Encoder Cable Assembly wiring Estun Automation 🇨🇳 China Make
Internal Harness (wiring looms) wiring Estun Automation 🇨🇳 China Make
Thermal Management Cooling Fan Bearingsole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
Input EMI Filter Module power TDK InvenSense 🇯🇵 Japan Buy
IGBT Power Module (inverter stage) power Infineon 🇩🇪 Germany Buy
Electrolytic Capacitors (bulk storage) power Nippon Chemi-Con 🇯🇵 Japan Buy
Gate Driver IC (IGBT/MOSFET) power Texas Instruments 🇺🇸 United States Buy
Multi-turn Absolute Encoder sensor HEIDENHAIN 🇩🇪 Germany Buy
Temperature Sensor (NTC Thermistor) sensor Murata Manufacturing 🇯🇵 Japan Buy
Current Sensing Hall Effect IC sensor Allegro MicroSystems 🇺🇸 United States Buy
Motor Power Connectors (M23 or DT style) wiring Phoenix Contact 🇩🇪 Germany Buy

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EMG Servo Motors

made by 🇨🇳 Estun Automation · physical ai · 14 components

29%built in-house
14components
4in-house
10bought-in
9named suppliers
6sole-source
3IP-locked
4 in-house10 bought-in
ComponentCategorySupplierGeographyMake / buy
Servo Drive / Motion Controller PCB controller Estun Automation 🇨🇳 China Make
BLDC Motor Stator & Rotor motor Estun Automation 🇨🇳 China Make
Aluminum/Iron Motor Housing Casting structure Estun Automation 🇨🇳 China Make
Output Shaft & Coupling structure Estun Automation 🇨🇳 China Make
Motor Bearings (radial/axial)sole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Deep Groove Ball Bearings (output shaft)sole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Incremental/Absolute Rotary Encodersole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
Sealed Bearing Grease other Shell Buy
Shaft Seal / Rubber Gaskets other Freudenberg 🇩🇪 Germany Buy
Electrolytic Capacitors (bus) power Nichicon 🇯🇵 Japan Buy
Power MOSFETs / IGBTs power Infineon 🇩🇪 Germany Buy
Planetary Gearbox / RV Reducersole-sourceIP-locked reducer Nabtesco 🇯🇵 Japan Buy
Temperature Sensor (NTC Thermistor)sole-source sensor Vishay Intertechnology 🇺🇸 United States Buy
Power/Signal Harness & Connectorssole-source wiring Phoenix Contact 🇩🇪 Germany Buy

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ER Series Industrial Robots

made by 🇨🇳 Estun Automation · physical ai · 14 components

36%built in-house
14components
5in-house
9bought-in
8named suppliers
6sole-source
4IP-locked
5 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
Motion Control Cabinet/Drive Unit controller Estun Automation 🇨🇳 China Make
Tool Flange/End-Effector Interface Plate other Estun Automation 🇨🇳 China Make
Base Frame/Pedestal Structure structure Estun Automation 🇨🇳 China Make
Aluminum/Ductile Iron Arm Castings & Linkages structure Estun Automation 🇨🇳 China Make
Power & Signal Harness Assembly wiring Estun Automation 🇨🇳 China Make
Precision Ball/Roller Bearings (arm joints & base)sole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
Servo Drive/Amplifier (per axis) controller Panasonic 🇯🇵 Japan Buy
Absolute Multi-turn Encoder (per motor)sole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (per joint)sole-sourceIP-locked motor Panasonic 🇯🇵 Japan Buy
Emergency Stop Module & Safety Relay other Pilz 🇩🇪 Germany Buy
Cable Carrier/Chain Management System other Igus 🇩🇪 Germany Buy
Power Supply Unit (24V DC, internal)sole-source power MEANWELL 🇹🇼 Taiwan Buy
RV Harmonic Reducer/Speed Reducer (per joint)sole-sourceIP-locked reducer Nabtesco 🇯🇵 Japan Buy
Force/Torque Sensor (wrist mounted)sole-sourceIP-locked sensor ATI Industrial Automation 🇺🇸 United States Buy

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CNC systems

made by 🇯🇵 FANUC Corporation · physical ai · 15 components

53%built in-house
15components
8in-house
7bought-in
5named suppliers
5sole-source
5IP-locked
8 in-house7 bought-in
ComponentCategorySupplierGeographyMake / buy
Servo Drive / Amplifier Module controller FANUC 🇯🇵 Japan Make
CNC Control Unit / Drive Cabinet controller FANUC 🇯🇵 Japan Make
Rotary Encoder (Absolute/Incremental) encoder FANUC 🇯🇵 Japan Make
Servo Motor (AC) motor FANUC 🇯🇵 Japan Make
Spindle Motor Assembly other FANUC 🇯🇵 Japan Make
Power Supply Unit (AC-DC Converter) power FANUC 🇯🇵 Japan Make
Cast Iron Bed / Base Casting structure FANUC 🇯🇵 Japan Make
Harness / Cable Assembly wiring FANUC 🇯🇵 Japan Make
Ballscrew Assemblysole-sourceIP-locked actuator NSK 🇯🇵 Japan Buy
Angular Contact / Spindle Bearingssole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
Hydraulic/Coolant Pump System other Bosch Rexroth 🇩🇪 Germany Buy
RV Reducer / Precision Gearheadsole-sourceIP-locked reducer Nabtesco 🇯🇵 Japan Buy
Temperature / Pressure Sensorssole-sourceIP-locked sensor Omron (Adept) 🇯🇵 Japan Buy
Limit/Proximity Sensorssole-sourceIP-locked sensor Omron (Adept) 🇯🇵 Japan Buy
Linear Guide Rails (X/Y/Z Axis) structure THK 🇯🇵 Japan Buy

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Industrial robots

made by 🇯🇵 FANUC Corporation · physical ai · 27 components

56%built in-house
27components
15in-house
12bought-in
10named suppliers
3sole-source
1IP-locked
15 in-house12 bought-in
ComponentCategorySupplierGeographyMake / buy
batteries battery FANUC 🇯🇵 Japan Make
Omniverse and Jetson modules controller FANUC 🇯🇵 Japan Make
control systems controller FANUC 🇯🇵 Japan Make
Robot Control Cabinet (CNC/PLC) controller FANUC 🇯🇵 Japan Make
Multi-turn Absolute Rotary Encoder encoder FANUC 🇯🇵 Japan Make
AC Servo Motor motor FANUC 🇯🇵 Japan Make
motors motor FANUC 🇯🇵 Japan Make
Teach Pendant (Handheld Controller) other FANUC 🇯🇵 Japan Make
Collision Detection / Torque Monitoring Board sensor FANUC 🇯🇵 Japan Make
sensors sensor FANUC 🇯🇵 Japan Make
End-of-Arm Force/Torque Sensor sensor FANUC 🇯🇵 Japan Make
Steel Base / Pedestal Casting structure FANUC 🇯🇵 Japan Make
Aluminum Die-cast & Ductile Iron Arm Segments structure FANUC 🇯🇵 Japan Make
Optical/Ethernet Interface Board wiring FANUC 🇯🇵 Japan Make
Power & Signal Harness Assembly wiring FANUC 🇯🇵 Japan Make
Brake (Spring-applied, Electrically Released)sole-source actuator MAYR 🇩🇪 Germany Buy
Deep Groove Ball Bearings & Cylindrical Roller Bearingssole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
robot controllers controller Lavichip Buy
servo motors motor Welling Motor Buy
Atlas humanoid robot other Boston Dynamics 🇺🇸 United States Buy
Protective Bellows & Cable Covers other MAYR 🇩🇪 Germany Buy
RF microwave products other Kinghelm Buy
Power Supply Unit (AC-DC conversion)sole-source power MEANWELL 🇹🇼 Taiwan Buy
precision gears for reducers reducer mold makers Buy
RV Harmonic Reducer / Cycloidal Gearbox reducer Nabtesco 🇯🇵 Japan Buy
Spot robot with sensor-embedded nose sensor Boston Dynamics 🇺🇸 United States Buy
stereo cameras sensor NVIDIA Buy

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Figure 02

made by 🇺🇸 Figure AI Inc. · physical ai · 12 components

42%built in-house
12components
5in-house
7bought-in
7named suppliers
5sole-source
3IP-locked
5 in-house7 bought-in
ComponentCategorySupplierGeographyMake / buy
Dexterous hands (16-DoF, integrated in-finger motor+sensor actuators) actuator Figure AI 🇺🇸 United States Make
Integrated joint actuators (A2 50Nm / L1-L4 150Nm rotary actuator units) actuator Figure AI 🇺🇸 United States Make
Custom frameless BLDC joint motors (one optimized per DoF) motor Figure AI 🇺🇸 United States Make
Joint force / torque sensors sensor Figure AI 🇺🇸 United States Make
Structural exoskeleton / chassis (integrated cabling, matte-black frame) structure Figure AI 🇺🇸 United States Make
Battery pack (2.25 kWh lithium-ion, torso-integrated)sole-source battery CATL 🇨🇳 China Buy
Joint / actuator bearingssole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
RGB cameras (6x, 360-degree perception envelope)sole-sourceIP-locked camera OmniVision 🇨🇳 China Buy
Onboard AI compute (dual NVIDIA RTX / Jetson-class GPU modules, torso-mounted)sole-sourceIP-locked compute NVIDIA 🇺🇸 United States Buy
Precision reducers / gearboxes (harmonic + planetary joint reducers)sole-source reducer Ningbo Zhongda Leader Intelligent Transmission Co., Ltd. 🇨🇳 China Buy
Microphones and speakers (onboard conversational audio) sensor Knowles 🇺🇸 United States Buy
IMU / gyroscope (inertial measurement unit) sensor Bosch Sensortec 🇩🇪 Germany Buy

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Figure 03

made by 🇺🇸 Figure AI Inc. · physical ai · 26 components

77%built in-house
26components
20in-house
6bought-in
5named suppliers
0sole-source
20 in-house6 bought-in
ComponentCategorySupplierGeographyMake / buy
Custom joint actuators actuator Figure AI 🇺🇸 United States Make
actuators actuator Figure AI 🇺🇸 United States Make
Custom electromechanical actuators (joint actuators) actuator Figure AI 🇺🇸 United States Make
batteries battery Figure AI 🇺🇸 United States Make
2.3 kWh battery pack (die-cast housing, active cooling, custom BMS, UN38.3 certified) battery Figure AI 🇺🇸 United States Make
Custom battery pack with BMS battery Figure AI 🇺🇸 United States Make
Vision cameras including palm cameras camera Figure AI 🇺🇸 United States Make
hands hand Figure AI 🇺🇸 United States Make
Compliant hand system with soft fingertips hand Figure AI 🇺🇸 United States Make
Custom joint motors motor Figure AI 🇺🇸 United States Make
Actuator electric motors (in-house designed) motor Figure AI 🇺🇸 United States Make
Dexterous hands (embedded sensing + in-palm camera) other Figure AI 🇺🇸 United States Make
Custom Battery Management System (BMS) power Figure AI 🇺🇸 United States Make
Wireless charging coils power Figure AI 🇺🇸 United States Make
Joint reducer / gearbox (strain-wave or planetary, integrated into custom actuator) reducer Figure AI 🇺🇸 United States Make
Custom fingertip tactile sensors sensor Figure AI 🇺🇸 United States Make
Audio hardware (speaker and microphone) sensor Figure AI 🇺🇸 United States Make
First-generation in-house fingertip tactile sensors (detect ~3 g force) sensor Figure AI 🇺🇸 United States Make
Structural chassis and body structure Figure AI 🇺🇸 United States Make
Structural chassis / exoskeleton (die-cast, injection-molded, stamped) structure Figure AI 🇺🇸 United States Make
Lithium-ion battery cells (sourced externally, format/chemistry undisclosed) battery LG Energy Solution 🇰🇷 South Korea Buy
Next-gen camera / vision system (head + palm cameras, 2x frame rate, 60% wider FOV) camera OmniVision 🇨🇳 China Buy
Dual embedded low-power onboard GPUs (Helix S1/S2 inference compute) compute Graphcore 🇬🇧 United Kingdom Buy
NVIDIA Jetson Thor compute module compute NVIDIA 🇺🇸 United States Buy
mmWave high-bandwidth data offload module (10 Gbps / ~60 GHz) other unresolved Buy
Wireless inductive foot-charging coils (2 kW) power WiBOTIC 🇺🇸 United States Buy

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Fourier Rehabilitation Robotics

made by 🇨🇳 Fourier Intelligence · physical ai · 16 components

19%built in-house
16components
3in-house
13bought-in
13named suppliers
5sole-source
2IP-locked
3 in-house13 bought-in
ComponentCategorySupplierGeographyMake / buy
Main Robot Control Unit (Embedded Linux/Real-time OS) controller Fourier Intelligence 🇨🇳 China Make
Soft Silicone Exoskeleton Padding/Interface other Fourier Intelligence 🇨🇳 China Make
Cast Aluminum/Magnesium Joint Housings structure Fourier Intelligence 🇨🇳 China Make
Deep Groove Ball Bearing (6000-series, various sizes)sole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Servo Drive/Motor Controller (multi-axis, CAN/EtherCAT) controller Elmo Motion Control Buy
Incremental Rotary Encoder 2048 PPRsole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
Brushless DC Motor (BLDC) 48V 200-400Wsole-source motor Maxon Motor Buy
Safety Emergency Stop Module & Relay Logic other Siemens 🇩🇪 Germany Buy
DC-DC Converter (48V to 24V, 12V rails) power Vicor 🇺🇸 United States Buy
48V Li-ion Battery Pack (10-20 Ah) power A123 Systems Buy
Planetary Gearbox (50:1 to 100:1 ratio)sole-sourceIP-locked reducer Neugart 🇩🇪 Germany Buy
Joint Angle/Position Potentiometric Sensor sensor Vishay Intertechnology 🇺🇸 United States Buy
6-Axis Force/Torque Sensor sensor ATI Industrial Automation 🇺🇸 United States Buy
Inertial Measurement Unit (IMU) 9-DoF sensor Bosch Sensortec 🇩🇪 Germany Buy
Aluminum Extrusion Frame & Joints structure Bosch Rexroth 🇩🇪 Germany Buy
Shielded Cable Harness & Connectorssole-source wiring Lappkabel Buy

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GR-1

made by 🇨🇳 Fourier Intelligence · physical ai · 14 components

29%built in-house
14components
4in-house
10bought-in
10named suppliers
2sole-source
1IP-locked
4 in-house10 bought-in
ComponentCategorySupplierGeographyMake / buy
Dexterous hand (11 DoF, per hand) actuator Fourier Intelligence 🇨🇳 China Make
Fourier Smart Actuator (FSA) integrated rotary joint actuator actuator Fourier Intelligence 🇨🇳 China Make
Onboard AI compute module compute Fourier Intelligence 🇨🇳 China Make
Structural frame / lightweight body chassis structure Fourier Intelligence 🇨🇳 China Make
Battery pack (approx. 2-hour runtime)sole-source battery CATL 🇨🇳 China Buy
RGB camera array (6 cameras, 360-degree vision) camera OmniVision 🇨🇳 China Buy
Depth camera (head + torso; Intel RealSense referenced) camera Intel 🇺🇸 United States Buy
Frameless torque motor (inside FSA)sole-sourceIP-locked motor Kollmorgen 🇺🇸 United States Buy
Harmonic reducer (large hip/knee/shoulder FSA joints) reducer Harmonic Drive (Shanghai) 🇨🇳 China Buy
Planetary reducer (smaller-ratio FSA joints) reducer Neugart 🇩🇪 Germany Buy
Joint absolute/incremental encoder (4000 PPR, inside FSA) sensor HEIDENHAIN 🇩🇪 Germany Buy
Circular microphone array (voice recognition) sensor XMOS 🇬🇧 United Kingdom Buy
IMU / joint position sensing sensor Bosch Sensortec 🇩🇪 Germany Buy
Six-axis force/torque sensor (wrist/ankle) sensor ATI Industrial Automation 🇺🇸 United States Buy

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GR-2

made by 🇨🇳 Fourier Intelligence · physical ai · 13 components

54%built in-house
13components
7in-house
6bought-in
6named suppliers
3sole-source
2IP-locked
7 in-house6 bought-in
ComponentCategorySupplierGeographyMake / buy
FSA 2.0 smart actuator (integrated motor+driver+reducer+dual-encoder; 7 distinct types, peak torque >380 N·m) actuator Fourier Intelligence 🇨🇳 China Make
Motion controller (real-time control unit) compute Fourier Intelligence 🇨🇳 China Make
Array-type tactile sensor (fingertip/palm, in dexterous hand) sensor Fourier Intelligence 🇨🇳 China Make
Multi-dimensional (6-axis) force/torque sensor (0.1 N·m force-feedback platform) sensor Fourier Intelligence 🇨🇳 China Make
Dual-encoder system (absolute position + velocity feedback, per FSA) sensor Fourier Intelligence 🇨🇳 China Make
12-DoF dexterous hand (bionic hand assembly) structure Fourier Intelligence 🇨🇳 China Make
Structural frame / body chassis (integrated cabling, modular layout) structure Fourier Intelligence 🇨🇳 China Make
Detachable battery pack (~2 hr runtime, ~2x GR-1 capacity)sole-source battery CATL 🇨🇳 China Buy
Head/vision camera systemsole-sourceIP-locked camera OmniVision 🇨🇳 China Buy
Onboard AI compute module (NVIDIA; likely Jetson AGX Orin, not officially confirmed) compute NVIDIA 🇺🇸 United States Buy
Servo / frameless motor (inside FSA modules)sole-sourceIP-locked motor Nidec 🇯🇵 Japan Buy
Planetary reducer (lower-body / hip joints) reducer Harmonic Drive (Shanghai) 🇨🇳 China Buy
Harmonic reducer (upper-body joints, inside FSA modules) reducer Leaderdrive 🇨🇳 China Buy

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HH series

made by 🇰🇷 HD Hyundai Robotics · physical ai · 15 components

20%built in-house
15components
3in-house
12bought-in
10named suppliers
7sole-source
4IP-locked
3 in-house12 bought-in
ComponentCategorySupplierGeographyMake / buy
Robot Arm Controller/Drive Unit controller HD Hyundai Robotics 🇰🇷 South Korea Make
Aluminum/Ductile Iron Castings (Arm Links) structure HD Hyundai Robotics 🇰🇷 South Korea Make
Precision Machined Steel Flanges/Brackets structure HD Hyundai Robotics 🇰🇷 South Korea Make
Deep Groove Ball Bearing (Motor) bearing FAG Buy
Cross-roller Bearing (Joint) bearing NSK 🇯🇵 Japan Buy
Absolute Multi-turn Encodersole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motorsole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Connector Kits (Circular Connectors) other Phoenix Contact 🇩🇪 Germany Buy
Slip Ring Assembly (Wrist Cable Routing) other Moog Industrial Buy
Hydraulic Damper/Brake (Optional Joint Lock) other MOOG Buy
Servo Drive (Amplifier)sole-sourceIP-locked power Yaskawa Electric 🇯🇵 Japan Buy
RV Harmonic/Cycloidal Reducersole-sourceIP-locked reducer Nabtesco 🇯🇵 Japan Buy
Joint Torque/Load Cell Sensorsole-sourceIP-locked sensor ATI Industrial Automation 🇺🇸 United States Buy
Shielded Motor Power Harness (Per Joint)sole-source wiring Lapp Buy
Encoder Signal Cable Harnesssole-source wiring Lapp Buy

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HH100

made by 🇰🇷 HD Hyundai Robotics · physical ai · 10 components

40%built in-house
10components
4in-house
6bought-in
6named suppliers
3sole-source
2IP-locked
4 in-house6 bought-in
ComponentCategorySupplierGeographyMake / buy
Robot controller (Hi5a-S60 / Hi6 class, motion control + drives) compute HD Hyundai Robotics 🇰🇷 South Korea Make
Cable / dress-pack harness (internal power + signal routing) other HD Hyundai Robotics 🇰🇷 South Korea Make
Servo drive / power amplifier modules (in controller cabinet) power HD Hyundai Robotics 🇰🇷 South Korea Make
Arm structural castings / links (base, lower/upper arm, wrist housing) structure HD Hyundai Robotics 🇰🇷 South Korea Make
Cross-roller / slewing joint bearingssole-source bearing INA 🇩🇪 Germany Buy
AC servo motors (one per axis)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Electromagnetic holding brakes (per axis) other MAYR 🇩🇪 Germany Buy
Strain-wave / harmonic reducers (wrist axes 4-6) reducer Harmonic Drive 🇯🇵 Japan Buy
RV / cycloidal precision reducers (heavy axes: base, shoulder, elbow) reducer Nabtesco 🇯🇵 Japan Buy
Absolute encoders (joint position feedback, per axis)sole-sourceIP-locked sensor SICK AG 🇩🇪 Germany Buy

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HH180

made by 🇰🇷 HD Hyundai Robotics · physical ai · 8 components

38%built in-house
8components
3in-house
5bought-in
4named suppliers
3sole-source
3IP-locked
3 in-house5 bought-in
ComponentCategorySupplierGeographyMake / buy
Hi6 robot controller (motion controller / compute) compute HD Hyundai Robotics 🇰🇷 South Korea Make
Servo drives / power amplifiers (in Hi6 controller) power HD Hyundai Robotics 🇰🇷 South Korea Make
Cast structural arm links / base casting (structure) structure HD Hyundai Robotics 🇰🇷 South Korea Make
Main axis / cross-roller output bearings (largely integrated in RV reducer)sole-sourceIP-locked bearing Nabtesco 🇯🇵 Japan Buy
AC servo motors (6-axis joint motors)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
RV precision reducers (base/shoulder/elbow axes, J1-J3) reducer Nabtesco 🇯🇵 Japan Buy
Wrist-axis precision reducers (J4-J6; smaller RV or strain-wave) reducer Harmonic Drive 🇯🇵 Japan Buy
Absolute rotary servo encoders (joint feedback)sole-sourceIP-locked sensor Tamagawa Seiki 🇯🇵 Japan Buy

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HH30

made by 🇰🇷 HD Hyundai Robotics · physical ai · 14 components

43%built in-house
14components
6in-house
8bought-in
7named suppliers
6sole-source
3IP-locked
6 in-house8 bought-in
ComponentCategorySupplierGeographyMake / buy
Robot Motion Controller (main CPU/logic) controller HD Hyundai Robotics 🇰🇷 South Korea Make
Control Pendant/Teach Box other HD Hyundai Robotics 🇰🇷 South Korea Make
End-Effector Interface Plate other HD Hyundai Robotics 🇰🇷 South Korea Make
Aluminum/Steel Arm Castings & Extrusions structure HD Hyundai Robotics 🇰🇷 South Korea Make
Precision Machined Link Assemblies structure HD Hyundai Robotics 🇰🇷 South Korea Make
Motor Power & Signal Harness wiring HD Hyundai Robotics 🇰🇷 South Korea Make
Precision Ball/Roller Bearings (joints & axes)sole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
Servo Drive/Amplifier controller Yaskawa Electric 🇯🇵 Japan Buy
Absolute Multi-turn Encodersole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (6-axis)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Power Supply Unit (24V/48V DC)sole-source power Mean Well Buy
RV Harmonic Reducer (Joint gearbox)sole-source reducer HDSI Buy
Force/Torque Sensor (optional wrist)sole-sourceIP-locked sensor ATI Industrial Automation 🇺🇸 United States Buy
Connectors (M12/DIN industrial) wiring Phoenix Contact 🇩🇪 Germany Buy

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HH50

made by 🇰🇷 HD Hyundai Robotics · physical ai · 14 components

36%built in-house
14components
5in-house
9bought-in
8named suppliers
4sole-source
3IP-locked
5 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
Motion Control Board (PLC/CNC-grade) controller HD Hyundai Robotics 🇰🇷 South Korea Make
Tool Flange & Interface Plate other HD Hyundai Robotics 🇰🇷 South Korea Make
Aluminum/Ductile Iron Arm Castings & Links structure HD Hyundai Robotics 🇰🇷 South Korea Make
Joint Housing Assemblies structure HD Hyundai Robotics 🇰🇷 South Korea Make
Power & Signal Harness Assembly wiring HD Hyundai Robotics 🇰🇷 South Korea Make
Deep Groove Ball Bearings & Angular Contact Bearingssole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Absolute Multi-turn Encodersole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (50W-500W range)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Brake Unit (Electromagnetic) other MAYR 🇩🇪 Germany Buy
Servo Amplifier/Driver Unit power Yaskawa Electric 🇯🇵 Japan Buy
Main Power Supply Unit (24V/48V DC) power MEANWELL 🇹🇼 Taiwan Buy
Harmonic Drive RV Gear Reducersole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Joint Limit Switches sensor Eaton Buy
Force/Torque Sensor (6-axis optional) sensor ATI Industrial Automation 🇺🇸 United States Buy

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HH7

made by 🇰🇷 HD Hyundai Robotics · physical ai · 14 components

29%built in-house
14components
4in-house
10bought-in
9named suppliers
4sole-source
3IP-locked
4 in-house10 bought-in
ComponentCategorySupplierGeographyMake / buy
Main Motion Controller / Drive Board controller HD Hyundai Robotics 🇰🇷 South Korea Make
Industrial PLC / Real-time Controller Unit controller HD Hyundai Robotics 🇰🇷 South Korea Make
Aluminum / Iron Arm Castings & Extrusions structure HD Hyundai Robotics 🇰🇷 South Korea Make
Motor Power & Signal Harness Assembly wiring HD Hyundai Robotics 🇰🇷 South Korea Make
Precision Crossed Roller Bearing (joint interfaces, 6x) bearing SKF 🇸🇪 Sweden Buy
Base Rotary Bearing (pedestal joint) bearing Slewing Bearing Inc. Buy
Absolute Rotary Encoder (per joint, 6x)sole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (per joint, 6x)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Cable Carrier / Drag Chain other Igus 🇩🇪 Germany Buy
Brake Module (joint safety, 1-2x) other MAYR 🇩🇪 Germany Buy
Servo Drive / Power Amplifier (per joint, 6x)sole-sourceIP-locked power Yaskawa Electric 🇯🇵 Japan Buy
RV Harmonic Reducer (per joint, 6x)sole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
6-Axis Force/Torque Sensor (optional wrist) sensor ATI Industrial Automation 🇺🇸 United States Buy
Temperature Sensor (motor windings) sensor TDK InvenSense 🇯🇵 Japan Buy

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MOTOMAN

made by 🇯🇵 Kawasaki Heavy Industries · physical ai · 9 components

0%built in-house
9components
0in-house
9bought-in
3named suppliers
9sole-source
8IP-locked
0 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
Cross-roller joint bearingssole-sourceIP-locked bearing THK 🇯🇵 Japan Buy
Main controller compute board (motion CPU)sole-sourceIP-locked compute Yaskawa Electric 🇯🇵 Japan Buy
Robot controller (YRC1000 / YRC1000micro)sole-sourceIP-locked compute Yaskawa Electric 🇯🇵 Japan Buy
Sigma-7 AC servo motor (SGM7-series)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Servo amplifier / drive (SERVOPACK, integrated in controller)sole-sourceIP-locked power Yaskawa Electric 🇯🇵 Japan Buy
Precision strain-wave / harmonic reducer (joint gearbox)sole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Joint torque / moment sensor (per-axis force sensing)sole-sourceIP-locked sensor Yaskawa Electric 🇯🇵 Japan Buy
Absolute rotary encoder (in-motor, Sigma-series 20/24-bit)sole-sourceIP-locked sensor Yaskawa Electric 🇯🇵 Japan Buy
Arm structure / aluminum-alloy joint housingssole-source structure Yaskawa Electric 🇯🇵 Japan Buy

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MOTOMAN-HC

made by 🇯🇵 Kawasaki Heavy Industries · physical ai · 14 components

29%built in-house
14components
4in-house
10bought-in
9named suppliers
5sole-source
3IP-locked
4 in-house10 bought-in
ComponentCategorySupplierGeographyMake / buy
Robot Motion Controller / Drive Unit controller Kawasaki Heavy Industries 🇯🇵 Japan Make
Power Supply Unit (24VDC, 48VDC rails) power Kawasaki Heavy Industries 🇯🇵 Japan Make
Aluminum/Ductile Iron Castings (arm links) structure Kawasaki Heavy Industries 🇯🇵 Japan Make
Shielded Harness/Cable Assembly wiring Kawasaki Heavy Industries 🇯🇵 Japan Make
Precision Ball/Roller Bearingssole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
Safety PLC Module controller Siemens 🇩🇪 Germany Buy
Absolute Rotary Encodersole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (6-axis)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Pneumatic Gripper Interface/Couplersole-source other SMC Buy
Servo Drive Amplifier power Yaskawa Electric 🇯🇵 Japan Buy
RV Reducer / Harmonic Drivesole-sourceIP-locked reducer Nabtesco 🇯🇵 Japan Buy
Proximity/Collision Detection Sensor sensor SICK Buy
Force/Torque Sensor (wrist-mounted) sensor ATI Industrial Automation 🇺🇸 United States Buy
Fasteners (bolts, screws, pins) structure ESCO Technologies Buy

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MOTOMAN-HC10

made by 🇯🇵 Kawasaki Heavy Industries · physical ai · 15 components

33%built in-house
15components
5in-house
10bought-in
9named suppliers
5sole-source
3IP-locked
5 in-house10 bought-in
ComponentCategorySupplierGeographyMake / buy
Motion Controller (Real-time CPU) controller Kawasaki Heavy Industries 🇯🇵 Japan Make
Emergency Stop Module & Safety Logic other Kawasaki Heavy Industries 🇯🇵 Japan Make
Power Supply Unit (48V/24V DC) power Kawasaki Heavy Industries 🇯🇵 Japan Make
Aluminum/Magnesium Structural Castings structure Kawasaki Heavy Industries 🇯🇵 Japan Make
Precision Machined Joint Housings structure Kawasaki Heavy Industries 🇯🇵 Japan Make
Precision Ball Bearings (Cross Roller)sole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Absolute Rotary Encoderssole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motors (6-axis)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Hydraulic Pressure Relief Valve System other Bosch Rexroth 🇩🇪 Germany Buy
Lithium-Ion Battery Pack (if mobile variant) other Panasonic Buy
Servo Drives (6-axis) power Yaskawa Electric 🇯🇵 Japan Buy
RV Reducers (Joint Gearboxes)sole-sourceIP-locked reducer Nabtesco 🇯🇵 Japan Buy
6-axis Force/Torque Sensor (Wrist) sensor ATI Industrial Automation 🇺🇸 United States Buy
Inertial Measurement Unit (IMU) sensor Xsens 🇳🇱 Netherlands Buy
Motor Power Harness & Shielded Cablessole-source wiring Lapp Buy

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MOTOMAN-HCR

made by 🇯🇵 Kawasaki Heavy Industries · physical ai · 15 components

40%built in-house
15components
6in-house
9bought-in
8named suppliers
5sole-source
3IP-locked
6 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
Servo Drive Module controller Kawasaki Heavy Industries 🇯🇵 Japan Make
Motion Control Unit (MCU) controller Kawasaki Heavy Industries 🇯🇵 Japan Make
Collaborative Safety Padding/Bumper other Kawasaki Heavy Industries 🇯🇵 Japan Make
End-Effector Interface Plate (tool flange) other Kawasaki Heavy Industries 🇯🇵 Japan Make
Aluminum/Cast Iron Joint Housings & Link Arms structure Kawasaki Heavy Industries 🇯🇵 Japan Make
Twisted Pair/Shielded Cable Harness Assembly wiring Kawasaki Heavy Industries 🇯🇵 Japan Make
Angular Contact Ball Bearings (precision grade)sole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
Absolute Rotary Encodersole-sourceIP-locked encoder Yaskawa Electric 🇯🇵 Japan Buy
AC Servo Motor (6-axis)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Grease & Lubricants (sealed joints) other Shell Tellus Buy
Power Supply Unit (24V, 48V DC)sole-source power MEANWELL 🇹🇼 Taiwan Buy
Harmonic Drive Reducer (CSF/CSD series)sole-source reducer Harmonic Drive Systems Buy
Force/Torque Sensor (wrist-mounted) sensor ATI Industrial Automation 🇺🇸 United States Buy
Safety-rated Proximity Sensors sensor SICK Buy
Precision Ball Screws & Shafts structure THK 🇯🇵 Japan Buy

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MOTOMAN-MH

made by 🇯🇵 Kawasaki Heavy Industries · physical ai · 14 components

43%built in-house
14components
6in-house
8bought-in
8named suppliers
3sole-source
2IP-locked
6 in-house8 bought-in
ComponentCategorySupplierGeographyMake / buy
Motion Controller / Drive Unit controller Kawasaki Heavy Industries 🇯🇵 Japan Make
Flange/Tool Interface Plate other Kawasaki Heavy Industries 🇯🇵 Japan Make
Servo Amplifier / Power Supply power Kawasaki Heavy Industries 🇯🇵 Japan Make
Base/Pedestal Casting structure Kawasaki Heavy Industries 🇯🇵 Japan Make
Aluminum/Ductile Iron Arm Castings structure Kawasaki Heavy Industries 🇯🇵 Japan Make
Integrated Cable Harness Assembly wiring Kawasaki Heavy Industries 🇯🇵 Japan Make
Precision Crossed-Roller Bearing bearing NSK 🇯🇵 Japan Buy
Deep Groove Ball Bearing (Support) bearing SKF 🇸🇪 Sweden Buy
Absolute Encoder (Multi-turn)sole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (Main Axis)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Brake Unit (Safety) other MAYR 🇩🇪 Germany Buy
RV Reducer / Harmonic Drivesole-sourceIP-locked reducer Nabtesco 🇯🇵 Japan Buy
Incremental Encoder (Commutation) sensor Omron (Adept) 🇯🇵 Japan Buy
Collision/Force Torque Sensor sensor ATI Industrial Automation 🇺🇸 United States Buy

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MOTOMAN-SDA

made by 🇯🇵 Kawasaki Heavy Industries · physical ai · 14 components

21%built in-house
14components
3in-house
11bought-in
10named suppliers
5sole-source
3IP-locked
3 in-house11 bought-in
ComponentCategorySupplierGeographyMake / buy
Motion Controller / PLC (dual-arm synchronization) controller Kawasaki Heavy Industries 🇯🇵 Japan Make
Aluminum/Ductile Iron Arm Castings & Structural Frame structure Kawasaki Heavy Industries 🇯🇵 Japan Make
End-Effector Mounting Plate / Flange Interface structure Kawasaki Heavy Industries 🇯🇵 Japan Make
Precision Ball & Roller Bearings (joints/drive shafts)sole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
Absolute Encoder (per joint)sole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (per arm, 6 joints)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Safety Relay Module / E-Stop Logic other Pilz 🇩🇪 Germany Buy
Harmonic Drive Strain Wave Gearbox (secondary, selected joints) other Harmonic Drive Systems Buy
Servo Amplifier / Drive Module (per axis) power Yaskawa Electric 🇯🇵 Japan Buy
Power Supply Unit (24V/48V DC regulated) power MEANWELL 🇹🇼 Taiwan Buy
RV Reduction Gearbox (per joint)sole-sourceIP-locked reducer Nabtesco 🇯🇵 Japan Buy
Force/Torque Sensor (wrist-mounted, per arm) sensor ATI Industrial Automation 🇺🇸 United States Buy
Joint Limit / Proximity Sensors sensor Balluff Buy
Motor Power & Signal Harness (shielded, rated for flex)sole-source wiring Lappkabel Buy

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MOTOMAN-UP

made by 🇯🇵 Kawasaki Heavy Industries · physical ai · 14 components

36%built in-house
14components
5in-house
9bought-in
9named suppliers
5sole-source
2IP-locked
5 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
Motion Control Board (Servo Drive & PLC) controller Kawasaki Heavy Industries 🇯🇵 Japan Make
Tool Flange & Gripper Interface Plate other Kawasaki Heavy Industries 🇯🇵 Japan Make
Servo Amplifiers (6-axis) power Kawasaki Heavy Industries 🇯🇵 Japan Make
Base Pedestal Casting (Ductile Iron) structure Kawasaki Heavy Industries 🇯🇵 Japan Make
Aluminum Die-Cast Arm Links & Housing structure Kawasaki Heavy Industries 🇯🇵 Japan Make
Deep Groove Ball Bearings (Joint Supports)sole-sourceIP-locked bearing NSK 🇯🇵 Japan Buy
Absolute Rotary Encoder (Joint Feedback)sole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
AC Servo Motor (Main Joint Motors)sole-sourceIP-locked motor Yaskawa Electric 🇯🇵 Japan Buy
Brake System (Spring-Applied Electromagnetic) other MAYR 🇩🇪 Germany Buy
RV Harmonic Reducer (Joint Gearboxes)sole-source reducer Harmonic Drive Systems Buy
Force/Torque Sensor (Wrist) sensor ATI Industrial Automation 🇺🇸 United States Buy
Collision Detection Accelerometer sensor Bosch Sensortec 🇩🇪 Germany Buy
Safety Laser Scanner (Perimeter) sensor SICK Buy
Shielded Multi-Conductor Cable Harnesssole-source wiring Lappkabel Buy

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DDR5

made by 🇺🇸 Micron Technology · ai compute · 2 components

50%built in-house
2components
1in-house
1bought-in
1named suppliers
0sole-source
1 in-house1 bought-in
ComponentCategorySupplierGeographyMake / buy
128 gig DDR-5 memory other Micron 🇺🇸 United States Make
DDR5 DRAM chips other ChangXin Memory Technologies Buy

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LPDDR

made by 🇺🇸 Micron Technology · ai compute · 2 components

50%built in-house
2components
1in-house
1bought-in
1named suppliers
0sole-source
1 in-house1 bought-in
ComponentCategorySupplierGeographyMake / buy
memory for phones other Micron 🇺🇸 United States Make
LPDDR5 chips other ChangXin Memory Technologies Buy

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4NE-1

made by 🇩🇪 NEURA Robotics · physical ai · 15 components

20%built in-house
15components
3in-house
12bought-in
8named suppliers
7sole-source
6IP-locked
3 in-house12 bought-in
ComponentCategorySupplierGeographyMake / buy
12-DOF dexterous hand / end effector other NEURA Robotics 🇩🇪 Germany Make
Artificial Skin (patent-pending pre-contact tactile sensor) sensor NEURA Robotics 🇩🇪 Germany Make
Omnisensor (patented touchless human-detection sensor) sensor NEURA Robotics 🇩🇪 Germany Make
Planetary-gear joint actuator (hip/knee/shoulder heavy-lift joints)sole-sourceIP-locked actuator Schaeffler 🇩🇪 Germany Buy
Dual hot-swappable battery pack (6-8h runtime, 24/7 operation)sole-sourceIP-locked battery Samsung SDI 🇰🇷 South Korea Buy
Precision joint bearingssole-sourceIP-locked bearing Schaeffler 🇩🇪 Germany Buy
Depth / 3D vision camerassole-sourceIP-locked camera Intel 🇺🇸 United States Buy
Main AI compute module (NVIDIA Thor T5000 / Jetson Thor, running Isaac GR00T) compute NVIDIA 🇺🇸 United States Buy
Robotics co-processor (Qualcomm Dragonwing IQ10 reference design) compute Qualcomm 🇺🇸 United States Buy
Frameless electric servo motor (integrated in actuator)sole-sourceIP-locked motor Schaeffler 🇩🇪 Germany Buy
Two-stage planetary gearbox (integrated in actuator)sole-sourceIP-locked reducer Schaeffler 🇩🇪 Germany Buy
Joint position encoder (integrated in actuator) sensor Schaeffler 🇩🇪 Germany Buy
LiDAR (360-degree 3D vision) sensor SICK AG 🇩🇪 Germany Buy
Joint force/torque sensors sensor ATI Industrial Automation 🇺🇸 United States Buy
Exterior structural design / chassis (Gen 3 industrial design)sole-source structure Studio F.A. Porsche Buy

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MAiRA

made by 🇩🇪 NEURA Robotics · physical ai · 12 components

83%built in-house
12components
10in-house
2bought-in
2named suppliers
2sole-source
2IP-locked
10 in-house2 bought-in
ComponentCategorySupplierGeographyMake / buy
Integrated joint actuator (7 axes) actuator NEURA Robotics 🇩🇪 Germany Make
Integrated 3D vision camera (AI object recognition / point cloud) camera NEURA Robotics 🇩🇪 Germany Make
Servo motor (joint drive) motor NEURA Robotics 🇩🇪 Germany Make
Motor drive / power electronics (Neuraverse Electronics) power NEURA Robotics 🇩🇪 Germany Make
Joint gearbox / strain-wave reducer reducer NEURA Robotics 🇩🇪 Germany Make
6-DOF force-torque sensor (flange / joints) sensor NEURA Robotics 🇩🇪 Germany Make
360-degree microphone array (3D speech recognition) sensor NEURA Robotics 🇩🇪 Germany Make
Capacitive proximity/touch safety skin (NEURA Touch — Pro variants) sensor NEURA Robotics 🇩🇪 Germany Make
Absolute joint encoder sensor NEURA Robotics 🇩🇪 Germany Make
Arm structure / aluminium housing structure NEURA Robotics 🇩🇪 Germany Make
Joint bearings / crossed-roller bearingssole-sourceIP-locked bearing THK 🇯🇵 Japan Buy
On-board AI compute / edge processor (cognitive brain)sole-sourceIP-locked compute Qualcomm 🇺🇸 United States Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

Blackwell architecture

made by 🇺🇸 NVIDIA Corporation · ai compute · 3 components

33%built in-house
3components
1in-house
2bought-in
2named suppliers
1sole-source
1 in-house2 bought-in
ComponentCategorySupplierGeographyMake / buy
CoWoS packaging with HBM stacks compute NVIDIA 🇺🇸 United States Make
High-bandwidth memory compute Micron 🇺🇸 United States Buy
HBM memorysole-source other SK hynix 🇰🇷 South Korea Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

Blackwell Ultra platform

made by 🇺🇸 NVIDIA Corporation · ai compute · 13 components

31%built in-house
13components
4in-house
9bought-in
8named suppliers
3sole-source
2IP-locked
4 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
Blackwell Ultra B300 GPU (dual-reticle die, TSMC 4NP) compute NVIDIA 🇺🇸 United States Make
Grace CPU (Arm-based, NVIDIA) compute NVIDIA 🇺🇸 United States Make
NVLink Switch (NVSwitch) chip compute NVIDIA 🇺🇸 United States Make
ConnectX-8 SuperNIC ASIC (800G, InfiniBand/Ethernet) compute NVIDIA 🇺🇸 United States Make
LPDDR5X memory (Grace CPU main memory, ~17TB per rack)sole-sourceIP-locked memory SK hynix 🇰🇷 South Korea Buy
HBM3E 12-high 36GB stack (288GB per GPU, 20.7TB per rack)sole-sourceIP-locked memory SK hynix 🇰🇷 South Korea Buy
NVLink backplane spine connectors (UltraPass/Paladin, 224G) other Amphenol Buy
Liquid-cooling cold plates + manifolds (full-rack cooling system) other Cooler Master Buy
CoWoS-L advanced package (RDL interposer + LSI bridge dies)sole-source packaging Taiwan Manufacturing 🇹🇼 Taiwan Buy
Power shelf / PSU (rack power distribution) power Delta Electronics 🇹🇼 Taiwan Buy
VRM / power-stage array (48V-to-12V power delivery) power Monolithic Power 🇺🇸 United States Buy
ABF organic package substrate (CoWoS carrier) substrate Ibiden 🇯🇵 Japan Buy
Compute/switch tray PCB (high-layer-count, M8 material) substrate Unimicron 🇹🇼 Taiwan Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

Cosmos

made by 🇺🇸 NVIDIA Corporation · ai compute · 1 components

100%built in-house
1components
1in-house
0bought-in
0named suppliers
0sole-source
1 in-house0 bought-in
ComponentCategorySupplierGeographyMake / buy
foundation model compute NVIDIA 🇺🇸 United States Make

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

Data center GPUs / AI accelerators

made by 🇺🇸 NVIDIA Corporation · ai compute · 1 components

0%built in-house
1components
0in-house
1bought-in
1named suppliers
1sole-source
0 in-house1 bought-in
ComponentCategorySupplierGeographyMake / buy
ABF substratessole-source compute Ajinomoto Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

DPU

made by 🇺🇸 NVIDIA Corporation · ai compute · 1 components

100%built in-house
1components
1in-house
0bought-in
0named suppliers
0sole-source
1 in-house0 bought-in
ComponentCategorySupplierGeographyMake / buy
BlueField DPU compute NVIDIA 🇺🇸 United States Make

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

Grace

made by 🇺🇸 NVIDIA Corporation · ai compute · 9 components

0%built in-house
9components
0in-house
9bought-in
5named suppliers
7sole-source
5IP-locked
0 in-house9 bought-in
ComponentCategorySupplierGeographyMake / buy
NVSwitch 4.0 interconnect chip (NVLink fabric)sole-sourceIP-locked compute Taiwan Manufacturing 🇹🇼 Taiwan Buy
Blackwell GPU compute die (2x ~800mm2 chiplets, TSMC 4NP)sole-sourceIP-locked compute Taiwan Manufacturing 🇹🇼 Taiwan Buy
Grace CPU (Arm-based, TSMC 4N) — GB200 superchipsole-sourceIP-locked compute Taiwan Manufacturing 🇹🇼 Taiwan Buy
HBM3E stacked memory (192GB total, 8x 8-hi stacks)sole-sourceIP-locked memory SK hynix 🇰🇷 South Korea Buy
Amphenol Ultrapass Paladin backplane/NVLink connector (72 diff pairs, 224Gb/s) other Amphenol Buy
Bianca board / high-layer-count PCB other Unimicron 🇹🇼 Taiwan Buy
CoWoS-L advanced packaging (RDL interposer + embedded silicon bridge dies/LSI)sole-source packaging Taiwan Manufacturing 🇹🇼 Taiwan Buy
Voltage regulator module / power delivery (12V-to-1V VRM, PMIC)sole-sourceIP-locked power Infineon 🇩🇪 Germany Buy
Organic IC substrate (700+mm2)sole-source substrate Unimicron 🇹🇼 Taiwan Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

NVIDIA B200

made by 🇺🇸 NVIDIA Corporation · ai compute · 7 components

0%built in-house
7components
0in-house
7bought-in
6named suppliers
7sole-source
2IP-locked
0 in-house7 bought-in
ComponentCategorySupplierGeographyMake / buy
GPU logic die (Blackwell, dual-reticle)sole-source logic_die Taiwan Manufacturing 🇹🇼 Taiwan Buy
HBM3e memory stackssole-sourceIP-locked memory SK hynix 🇰🇷 South Korea Buy
Passive components (capacitors, inductors)sole-source other TDK InvenSense 🇯🇵 Japan Buy
CoWoS-L advanced packagingsole-source packaging Taiwan Manufacturing 🇹🇼 Taiwan Buy
Voltage-regulator / power-delivery modulessole-sourceIP-locked power Monolithic Power 🇺🇸 United States Buy
Substrate / Bianca HDI board (22-layer)sole-source substrate Unimicron 🇹🇼 Taiwan Buy
NVLink interconnect + signal retimerssole-source wiring Astera Labs 🇺🇸 United States Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

NVIDIA Nemotron

made by 🇺🇸 NVIDIA Corporation · ai compute · 1 components

100%built in-house
1components
1in-house
0bought-in
0named suppliers
0sole-source
1 in-house0 bought-in
ComponentCategorySupplierGeographyMake / buy
foundation model compute NVIDIA 🇺🇸 United States Make

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

DRC-HUBO

made by 🇰🇷 Rainbow Robotics · physical ai · 15 components

53%built in-house
15components
8in-house
7bought-in
7named suppliers
4sole-source
1IP-locked
8 in-house7 bought-in
ComponentCategorySupplierGeographyMake / buy
Integrated Joint Module (Motor + Reducer + Encoder) actuator Rainbow Robotics 🇰🇷 South Korea Make
Central Compute Unit (Real-time OS Controller) controller Rainbow Robotics 🇰🇷 South Korea Make
Joint Motor Drives/Servo Controllers controller Rainbow Robotics 🇰🇷 South Korea Make
Lithium-ion Battery Pack power Rainbow Robotics 🇰🇷 South Korea Make
Power Distribution & BMS (Battery Management System) power Rainbow Robotics 🇰🇷 South Korea Make
Aluminum/Magnesium Castings & Machined Frame structure Rainbow Robotics 🇰🇷 South Korea Make
Carbon Fiber Composite Panels structure Rainbow Robotics 🇰🇷 South Korea Make
Custom Wiring Harness & Connectors wiring Rainbow Robotics 🇰🇷 South Korea Make
Precision Ball & Roller Bearingssole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Absolute Multi-turn Encoderssole-source encoder HEIDENHAIN 🇩🇪 Germany Buy
Brushless DC Motors (Joint Actuators)sole-source motor maxon 🇨🇭 Switzerland Buy
Harmonic Drive Strain Wave Gearboxessole-source reducer Harmonic Drive Systems Buy
Force/Torque Sensors (Wrist/Foot) sensor ATI Industrial Automation 🇺🇸 United States Buy
Vision System (RGB-D Depth Camera) sensor Intel 🇺🇸 United States Buy
IMU (6-axis Accelerometer/Gyroscope) sensor Xsens 🇳🇱 Netherlands Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

HUBO

made by 🇰🇷 Rainbow Robotics · physical ai · 25 components

32%built in-house
25components
8in-house
17bought-in
10named suppliers
9sole-source
5IP-locked
8 in-house17 bought-in
ComponentCategorySupplierGeographyMake / buy
Joint actuator units (motor + harmonic gear + servo, per joint) actuator Rainbow Robotics 🇰🇷 South Korea Make
Distributed CAN motor servo controllers (1 per 2 actuators) compute Rainbow Robotics 🇰🇷 South Korea Make
Motor servo controllers / joint drive electronics other Rainbow Robotics 🇰🇷 South Korea Make
6-axis force/torque sensor with tilt sensor (ankle) sensor Rainbow Robotics 🇰🇷 South Korea Make
3-axis force/torque sensor (wrist) sensor Rainbow Robotics 🇰🇷 South Korea Make
6-axis force/torque sensors (limb ends / ankles / wrists) sensor Rainbow Robotics 🇰🇷 South Korea Make
Structural frame / body (machined aluminum, dual-mode walk/wheel chassis) structure Rainbow Robotics 🇰🇷 South Korea Make
Aluminum endoskeleton + polycarbonate structural covers structure Rainbow Robotics 🇰🇷 South Korea Make
Li-ion battery pack (48V / 11.4 Ah)sole-sourceIP-locked battery Samsung SDI 🇰🇷 South Korea Buy
Li-ion battery pack (chest)sole-sourceIP-locked battery Samsung SDI 🇰🇷 South Korea Buy
Head vision camerasole-source camera Allied Vision 🇩🇪 Germany Buy
Head camera (vision)sole-source camera Allied Vision 🇩🇪 Germany Buy
Main onboard computer CPU (Core i5-4250U, 1.30 GHz quad-core, Ubuntu 12.04 + Xenomai/PODO) compute Intel 🇺🇸 United States Buy
Onboard head/vision computer, PC/104 CPU module (PCM-3372, Pentium III) compute Advantech 🇹🇼 Taiwan Buy
Onboard body computer, PC/104-Plus CPU module (PCM-3370, Pentium III) compute Advantech 🇹🇼 Taiwan Buy
Joint actuator motors (BLDC / brushless DC)sole-source motor maxon 🇨🇭 Switzerland Buy
Joint actuator motors (BLDC/DC, ~200W/100W/11W/0.75W classes)sole-source motor maxon 🇨🇭 Switzerland Buy
Planetary reduction gears (small joints: fingers, wrist-pan, neck-pan, eye)sole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Harmonic (strain-wave) reduction gears at each jointsole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Harmonic reduction gears (major arm/leg joints)sole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
2D scanning LIDAR (perception) sensor Hokuyo Automatic Co. 🇯🇵 Japan Buy
Optical flow sensors (mounted on shins) sensor unresolved Buy
Inertial measurement unit (IMU), model ADIS-16480 sensor Analog Devices 🇺🇸 United States Buy
Inertial / tilt sensor (pelvis IMU) sensor Xsens 🇳🇱 Netherlands Buy
Fiber optic gyro (FOG) attitude sensor, model KVH-1750 sensor KVH Industries 🇺🇸 United States Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

HUBO 2

made by 🇰🇷 Rainbow Robotics · physical ai · 15 components

33%built in-house
15components
5in-house
10bought-in
10named suppliers
5sole-source
2IP-locked
5 in-house10 bought-in
ComponentCategorySupplierGeographyMake / buy
Motor driver IC (multi-axis servo controller) controller Rainbow Robotics 🇰🇷 South Korea Make
Main onboard compute (embedded Linux SBC/real-time CPU) controller Rainbow Robotics 🇰🇷 South Korea Make
End-effector gripper (electromechanical or underactuated) other Rainbow Robotics 🇰🇷 South Korea Make
DC-DC converter and power management board power Rainbow Robotics 🇰🇷 South Korea Make
Aluminum extrusion & machined frame castings structure Rainbow Robotics 🇰🇷 South Korea Make
Torque-controlled servo motor (BLDC, 200W+ per joint)sole-source actuator Maxon Motor Buy
Precision ball bearings (angular contact, sealed)sole-sourceIP-locked bearing SKF 🇸🇪 Sweden Buy
Absolute magnetic rotary encodersole-source encoder AMS (now ams OSRAM) Buy
Cabling, connectors & PCB integration other TE Connectivity 🇺🇸 United States Buy
Lithium-ion battery pack (48V, ~10Ah) power Samsung SDI 🇰🇷 South Korea Buy
Harmonic Drive RV reducer (50:1–100:1)sole-sourceIP-locked reducer Harmonic Drive 🇯🇵 Japan Buy
Stereo depth camera (RGB-D) sensor Intel 🇺🇸 United States Buy
Inertial Measurement Unit (IMU) sensor Xsens 🇳🇱 Netherlands Buy
6-axis force/torque sensor (wrist) sensor ATI Industrial Automation 🇺🇸 United States Buy
Motor power harness & signal cables (multi-conductor, shielded)sole-source wiring Lappkabel Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

STAR1

made by 🇨🇳 Robotera · physical ai · 14 components

50%built in-house
14components
7in-house
7bought-in
7named suppliers
3sole-source
7 in-house7 bought-in
ComponentCategorySupplierGeographyMake / buy
XHAND1 five-finger dexterous hand (12 active DOF, full-gear QDD) actuator Robotera 🇨🇳 China Make
Joint actuator modules (whole-body integrated joints) actuator Robotera 🇨🇳 China Make
Direct-drive / hollow-cup joint motors motor Robotera 🇨🇳 China Make
Joint controllers / motor drive electronics other Robotera 🇨🇳 China Make
Joint reducers (gear reduction for non-direct-drive joints) reducer Robotera 🇨🇳 China Make
Fingertip tactile array sensors (3D force + temperature, >100 points/finger) sensor Robotera 🇨🇳 China Make
Structural frame / limb structures structure Robotera 🇨🇳 China Make
Battery pack (Li-ion, ~4h runtime)sole-source battery CATL 🇨🇳 China Buy
Joint bearings (cross-roller / harmonic output bearings)sole-source bearing Harmonic Drive (Shanghai) 🇨🇳 China Buy
Binocular / stereo camera (head vision)sole-source camera OAK-D Buy
Secondary CPU (x86 real-time / motion control) compute Intel 🇺🇸 United States Buy
Primary AI compute module (Jetson AGX Orin, 275 TOPS) compute NVIDIA 🇺🇸 United States Buy
3D LiDAR (head/perception) sensor Livox 🇨🇳 China Buy
IMU (torso inertial measurement unit) sensor Xsens 🇳🇱 Netherlands Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

HBM (High Bandwidth Memory)

made by 🇰🇷 Samsung Electronics Co., Ltd. · ai compute · 2 components

0%built in-house
2components
0in-house
2bought-in
2named suppliers
0sole-source
0 in-house2 bought-in
ComponentCategorySupplierGeographyMake / buy
ABF substrate other Ajinomoto Buy
HBM memory other SK hynix 🇰🇷 South Korea Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

DRAM

made by 🇰🇷 SK hynix Inc. · ai compute · 2 components

100%built in-house
2components
2in-house
0bought-in
0named suppliers
0sole-source
2 in-house0 bought-in
ComponentCategorySupplierGeographyMake / buy
Server DRAM other SK hynix 🇰🇷 South Korea Make
DRAM other SK hynix 🇰🇷 South Korea Make

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

HBM (High Bandwidth Memory)

made by 🇰🇷 SK hynix Inc. · ai compute · 3 components

0%built in-house
3components
0in-house
3bought-in
2named suppliers
3sole-source
0 in-house3 bought-in
ComponentCategorySupplierGeographyMake / buy
High-bandwidth memory (HBM)sole-source compute ChangXin Memory Technologies Buy
NLX-100 X-ray metrology systemsole-source other ZEISS Buy
DUNE 100 wafer-flattening toolsole-source other ZEISS Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

Full Self-Driving (FSD) (Supervised)

made by 🇺🇸 Tesla, Inc. · physical ai · 2 components

50%built in-house
2components
1in-house
1bought-in
1named suppliers
1sole-source
1IP-locked
1 in-house1 bought-in
ComponentCategorySupplierGeographyMake / buy
Autonomous driving system architecture other Tesla 🇺🇸 United States Make
AI4 processorsole-sourceIP-locked compute Samsung Electronics 🇰🇷 South Korea Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

Tesla Optimus

made by 🇺🇸 Tesla, Inc. · physical ai · 20 components

45%built in-house
20components
9in-house
11bought-in
8named suppliers
2sole-source
1IP-locked
9 in-house11 bought-in
ComponentCategorySupplierGeographyMake / buy
Battery pack battery Tesla 🇺🇸 United States Make
Custom bearing assembly bearing Tesla 🇺🇸 United States Make
Autopilot-grade camera camera Tesla 🇺🇸 United States Make
advanced chips compute Tesla 🇺🇸 United States Make
Tesla FSD Computer (AI4) compute Tesla 🇺🇸 United States Make
Tesla AI5 inference chip compute Tesla 🇺🇸 United States Make
Dexterous hand with coreless motors and planetary gearboxes hand Tesla 🇺🇸 United States Make
Optimus Academy training facility other Tesla 🇺🇸 United States Make
Fingertip tactile sensor sensor Tesla 🇺🇸 United States Make
robot actuator actuator Robotis Buy
Linear actuator assembly actuator Ningbo Tuopu 🇨🇳 China Buy
Rotary actuator assembly actuator Ningbo Tuopu 🇨🇳 China Buy
RK3588 processor compute Rockchip 🇨🇳 China Buy
AI5 processor compute Samsung Electronics 🇰🇷 South Korea Buy
AI5 chip compute Samsung Electronics 🇰🇷 South Korea Buy
Frameless torque motorsole-sourceIP-locked motor Kollmorgen 🇺🇸 United States Buy
Planetary roller screw other Wuzhou Xinchun 🇨🇳 China Buy
Harmonic drive reducersole-source reducer Suzhou Green Harmonic Drive Equipment 🇨🇳 China Buy
Foot force/torque sensor sensor ATI Industrial Automation 🇺🇸 United States Buy
Joint torque sensor sensor ATI Industrial Automation 🇺🇸 United States Buy

Click any component to drill in — who else supplies it, which other products use it, sole-source risk, and the source behind every figure. Cost is an estimate shown on expand; every line stays below the 0.7 analytics floor until a second source corroborates it.

IP CHOKEPOINTS

Where one supplier owns the supply and the IP

The signature risk: a sole-source component whose supplier also owns the patents for that technology — a double lock-in of manufacturing and intellectual property. 93 in the current data.

memoryIP-locked

Boston Dynamics Samsung Electronics

sole-source · supplier owns 3917 Memory patents

computeIP-locked

Tesla Samsung Electronics

sole-source · supplier owns 3917 Computing patents

actuatorIP-locked

NEURA Robotics Schaeffler

sole-source · supplier owns 2735 Robotics / manipulators patents

bearingIP-locked

NEURA Robotics Schaeffler

sole-source · supplier owns 2735 Bearings patents

motorIP-locked

NEURA Robotics Schaeffler

sole-source · supplier owns 2735 Electric motors patents

reducerIP-locked

NEURA Robotics Schaeffler

sole-source · supplier owns 2735 Gears / reducers patents

motorIP-locked

Fourier Intelligence Nidec

sole-source · supplier owns 2254 Electric motors patents

motorIP-locked

Doosan Robotics Nidec

sole-source · supplier owns 2254 Electric motors patents

computeIP-locked

NEURA Robotics Qualcomm

sole-source · supplier owns 2112 Computing patents

memoryIP-locked

NVIDIA SK hynix

sole-source · supplier owns 2098 Memory patents

memoryIP-locked

1X SK hynix

sole-source · supplier owns 2098 Memory patents

memoryIP-locked

Amazon SK hynix

sole-source · supplier owns 2098 Memory patents

memoryIP-locked

Advanced Micro Devices SK hynix

sole-source · supplier owns 2098 Memory patents

powerIP-locked

Apptronik Texas Instruments

sole-source · supplier owns 2066 Power electronics patents

cameraIP-locked

NEURA Robotics Intel

sole-source · supplier owns 2061 Imaging / cameras patents

computeIP-locked

Boston Dynamics Intel

sole-source · supplier owns 2061 Computing patents

computeIP-locked

1X NVIDIA

sole-source · supplier owns 2061 Computing patents

computeIP-locked

Figure AI NVIDIA

sole-source · supplier owns 2061 Computing patents

cameraIP-locked

Apptronik Intel

sole-source · supplier owns 2061 Imaging / cameras patents

computeIP-locked

Apptronik NVIDIA

sole-source · supplier owns 2061 Computing patents

computeIP-locked

AgiBot NVIDIA

sole-source · supplier owns 2061 Computing patents

computeIP-locked

Boston Dynamics NVIDIA

sole-source · supplier owns 2061 Computing patents

cameraIP-locked

Agility Robotics Intel

sole-source · supplier owns 2061 Imaging / cameras patents

computeIP-locked

Agility Robotics NVIDIA

sole-source · supplier owns 2061 Computing patents

powerIP-locked

NVIDIA Infineon

sole-source · supplier owns 2052 Power electronics patents

powerIP-locked

Advanced Micro Devices Infineon

sole-source · supplier owns 2052 Power electronics patents

batteryIP-locked

NEURA Robotics Samsung SDI

sole-source · supplier owns 2050 Batteries patents

batteryIP-locked

Apptronik Samsung SDI

sole-source · supplier owns 2050 Batteries patents

batteryIP-locked

Rainbow Robotics Samsung SDI

sole-source · supplier owns 2050 Batteries patents

bearingIP-locked

Kawasaki Heavy Industries NSK

sole-source · supplier owns 2030 Bearings patents

bearingIP-locked

Boston Dynamics NSK

sole-source · supplier owns 2030 Bearings patents

bearingIP-locked

FANUC NSK

sole-source · supplier owns 2030 Bearings patents

actuatorIP-locked

FANUC NSK

sole-source · supplier owns 2030 Robotics / manipulators patents

bearingIP-locked

Estun Automation NSK

sole-source · supplier owns 2030 Bearings patents

bearingIP-locked

HD Hyundai Robotics NSK

sole-source · supplier owns 2030 Bearings patents

sensorIP-locked

HD Hyundai Robotics SICK AG

sole-source · supplier owns 1519 Force / torque sensors patents

motorIP-locked

Estun Automation Panasonic

sole-source · supplier owns 1518 Electric motors patents

bearingIP-locked

Doosan Robotics JTEKT

sole-source · supplier owns 1445 Bearings patents

bearingIP-locked

Boston Dynamics JTEKT

sole-source · supplier owns 1445 Bearings patents

bearingIP-locked

ABB Robotics JTEKT

sole-source · supplier owns 1445 Bearings patents

encoderIP-locked

Kawasaki Heavy Industries Yaskawa Electric

sole-source · supplier owns 1142 Robotics / manipulators patents

motorIP-locked

Kawasaki Heavy Industries Yaskawa Electric

sole-source · supplier owns 1142 Electric motors patents

motorIP-locked

HD Hyundai Robotics Yaskawa Electric

sole-source · supplier owns 1142 Electric motors patents

powerIP-locked

HD Hyundai Robotics Yaskawa Electric

sole-source · supplier owns 1142 Power electronics patents

computeIP-locked

Kawasaki Heavy Industries Yaskawa Electric

sole-source · supplier owns 1142 Computing patents

powerIP-locked

Kawasaki Heavy Industries Yaskawa Electric

sole-source · supplier owns 1142 Power electronics patents

sensorIP-locked

Kawasaki Heavy Industries Yaskawa Electric

sole-source · supplier owns 1142 Force / torque sensors patents

reducerIP-locked

Kawasaki Heavy Industries Nabtesco

sole-source · supplier owns 995 Gears / reducers patents

reducerIP-locked

Estun Automation Nabtesco

sole-source · supplier owns 995 Gears / reducers patents

reducerIP-locked

FANUC Nabtesco

sole-source · supplier owns 995 Gears / reducers patents

reducerIP-locked

HD Hyundai Robotics Nabtesco

sole-source · supplier owns 995 Gears / reducers patents

bearingIP-locked

HD Hyundai Robotics Nabtesco

sole-source · supplier owns 995 Bearings patents

bearingIP-locked

Doosan Robotics THK

sole-source · supplier owns 923 Bearings patents

bearingIP-locked

NEURA Robotics THK

sole-source · supplier owns 923 Bearings patents

bearingIP-locked

Kawasaki Heavy Industries THK

sole-source · supplier owns 923 Bearings patents

reducerIP-locked

Rainbow Robotics Harmonic Drive

sole-source · supplier owns 805 Gears / reducers patents

reducerIP-locked

ABB Robotics Harmonic Drive

sole-source · supplier owns 805 Gears / reducers patents

reducerIP-locked

Doosan Robotics Harmonic Drive

sole-source · supplier owns 805 Gears / reducers patents

reducerIP-locked

HD Hyundai Robotics Harmonic Drive

sole-source · supplier owns 805 Gears / reducers patents

reducerIP-locked

Kawasaki Heavy Industries Harmonic Drive

sole-source · supplier owns 805 Gears / reducers patents

powerIP-locked

NVIDIA Monolithic Power

sole-source · supplier owns 456 Power electronics patents

cameraIP-locked

AgiBot Orbbec

sole-source · supplier owns 151 Imaging / cameras patents

powerIP-locked

ABB Robotics Phoenix Contact

sole-source · supplier owns 122 Power electronics patents

computeIP-locked

Amazon Taiwan Manufacturing

sole-source · supplier owns 120 Computing patents

computeIP-locked

NVIDIA Taiwan Manufacturing

sole-source · supplier owns 120 Computing patents

computeIP-locked

Advanced Micro Devices Taiwan Manufacturing

sole-source · supplier owns 120 Computing patents

motorIP-locked

Fourier Intelligence Kollmorgen

sole-source · supplier owns 64 Electric motors patents

motorIP-locked

Tesla Kollmorgen

sole-source · supplier owns 64 Electric motors patents

motorIP-locked

Doosan Robotics Kollmorgen

sole-source · supplier owns 64 Electric motors patents

motorIP-locked

Boston Dynamics Kollmorgen

sole-source · supplier owns 64 Electric motors patents

motorIP-locked

Agility Robotics Kollmorgen

sole-source · supplier owns 64 Electric motors patents

cameraIP-locked

1X OmniVision

sole-source · supplier owns 57 Imaging / cameras patents

cameraIP-locked

Figure AI OmniVision

sole-source · supplier owns 57 Imaging / cameras patents

cameraIP-locked

Fourier Intelligence OmniVision

sole-source · supplier owns 57 Imaging / cameras patents

cameraIP-locked

1X Sony

sole-source · supplier owns 34 Imaging / cameras patents

bearingIP-locked

Rainbow Robotics SKF

sole-source · supplier owns 32 Bearings patents

bearingIP-locked

Estun Automation SKF

sole-source · supplier owns 32 Bearings patents

bearingIP-locked

ABB Robotics SKF

sole-source · supplier owns 32 Bearings patents

sensorIP-locked

ABB Robotics ATI Industrial Automation

sole-source · supplier owns 32 Force / torque sensors patents

bearingIP-locked

Figure AI SKF

sole-source · supplier owns 32 Bearings patents

bearingIP-locked

Apptronik SKF

sole-source · supplier owns 32 Bearings patents

bearingIP-locked

HD Hyundai Robotics SKF

sole-source · supplier owns 32 Bearings patents

bearingIP-locked

Kawasaki Heavy Industries SKF

sole-source · supplier owns 32 Bearings patents

sensorIP-locked

Estun Automation ATI Industrial Automation

sole-source · supplier owns 32 Force / torque sensors patents

sensorIP-locked

HD Hyundai Robotics ATI Industrial Automation

sole-source · supplier owns 32 Force / torque sensors patents

bearingIP-locked

1X SKF

sole-source · supplier owns 32 Bearings patents

bearingIP-locked

Doosan Robotics SKF

sole-source · supplier owns 32 Bearings patents

bearingIP-locked

Fourier Intelligence SKF

sole-source · supplier owns 32 Bearings patents

bearingIP-locked

Agility Robotics SKF

sole-source · supplier owns 32 Bearings patents

reducerIP-locked

Fourier Intelligence Neugart

sole-source · supplier owns 20 Gears / reducers patents

sensorIP-locked

HD Hyundai Robotics Tamagawa Seiki

sole-source · supplier owns 12 Force / torque sensors patents

sensorIP-locked

1X Bosch Sensortec

sole-source · supplier owns 3 Force / torque sensors patents

sensorIP-locked

FANUC Omron (Adept)

sole-source · supplier owns 2 Force / torque sensors patents

GEOGRAPHIC EXPOSURE

Country-of-origin concentration

Where each buyer's confirmed suppliers are based and produce. Single-country reliance — the “country-of-factory” risk — is the systemic exposure institutions price.

🇺🇸 Advanced Micro Devices

suppliers in 🇺🇸 United States 30%

10 confirmed suppliers · diversified geographic risk

🇸🇪 SKF

suppliers in 🇸🇪 Sweden 100%

1 confirmed supplier · high concentration geographic risk

🇨🇳 Fourier Intelligence

suppliers in 🇨🇭 Switzerland 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Astera Labs

suppliers in 🇺🇸 United States 67%

3 confirmed suppliers · moderate concentration geographic risk

🇺🇸 Texas Instruments

suppliers in 🇹🇼 Taiwan 28%

7 confirmed suppliers · diversified geographic risk

🇨🇭 ABB Robotics

suppliers in 🇺🇸 United States 42%

7 confirmed suppliers · low concentration geographic risk

🇩🇪 KUKA

suppliers in 🇨🇭 Switzerland 33%

3 confirmed suppliers · diversified geographic risk

Tata Sons

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇹🇼 Powertech

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇩🇪 Infineon

suppliers in 🇺🇸 United States 50%

6 confirmed suppliers · moderate concentration geographic risk

🇺🇸 Amazon

suppliers in 🇺🇸 United States 72%

21 confirmed suppliers · high concentration geographic risk

🇯🇵 TDK InvenSense

suppliers in 🇹🇼 Taiwan 50%

2 confirmed suppliers · moderate concentration geographic risk

🇨🇳 OmniVision

suppliers in 🇹🇼 Taiwan 40%

5 confirmed suppliers · low concentration geographic risk

🇹🇼 UMC

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇩🇪 Siemens EDA

suppliers in 🇺🇸 United States 67%

3 confirmed suppliers · moderate concentration geographic risk

🇩🇪 Siltronic

suppliers in 🇩🇪 Germany 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Tesla

suppliers in 🇨🇳 China 45%

16 confirmed suppliers · low concentration geographic risk

🇯🇵 Advantest

suppliers in 🇮🇹 Italy 50%

2 confirmed suppliers · moderate concentration geographic risk

SoftBank

suppliers in 🇬🇧 United Kingdom 100%

1 confirmed supplier · high concentration geographic risk

🇨🇳 Estun Automation

suppliers in 🇨🇳 China 100%

1 confirmed supplier · high concentration geographic risk

🇨🇳 Hua Hong

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Microsoft

suppliers in 🇺🇸 United States 63%

16 confirmed suppliers · moderate concentration geographic risk

🇰🇷 HD Hyundai Robotics

suppliers in 🇩🇪 Germany 50%

2 confirmed suppliers · moderate concentration geographic risk

🇯🇵 FANUC

suppliers in 🇺🇸 United States 100%

2 confirmed suppliers · high concentration geographic risk

🇺🇸 Micron

suppliers in 🇯🇵 Japan 41%

10 confirmed suppliers · low concentration geographic risk

🇨🇳 Zhongji InnoLight

suppliers in 🇯🇵 Japan 50%

2 confirmed suppliers · moderate concentration geographic risk

🇹🇼 Taiwan Manufacturing

suppliers in 🇺🇸 United States 36%

11 confirmed suppliers · low concentration geographic risk

🇺🇸 Agility Robotics

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇨🇳 Wolong Electric

suppliers in 🇨🇳 China 100%

1 confirmed supplier · high concentration geographic risk

Robert Bosch GmbH

suppliers in 🇨🇳 China 50%

2 confirmed suppliers · moderate concentration geographic risk

🇺🇸 Apptronik

suppliers in 🇺🇸 United States 100%

2 confirmed suppliers · high concentration geographic risk

🇯🇵 Denso / Denso Wave

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Broadcom

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇰🇷 Rainbow Robotics

suppliers in 🇩🇪 Germany 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Standard Bots

suppliers in 🇺🇸 United States 67%

3 confirmed suppliers · moderate concentration geographic risk

🇨🇭 STMicroelectronics

suppliers in 🇨🇳 China 50%

2 confirmed suppliers · moderate concentration geographic risk

🇺🇸 Lam Research

suppliers in 🇹🇼 Taiwan 51%

2 confirmed suppliers · moderate concentration geographic risk

🇰🇷 Wonik Robotics

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇩🇪 Vacuumschmelze

suppliers in 🇨🇦 Canada 100%

3 confirmed suppliers · high concentration geographic risk

🇺🇸 SambaNova

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Qualcomm

suppliers in 🇺🇸 United States 38%

8 confirmed suppliers · low concentration geographic risk

🇯🇵 Panasonic

suppliers in 🇨🇳 China 100%

2 confirmed suppliers · high concentration geographic risk

🇮🇪 Aptiv

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Coherent

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇨🇳 SMIC

suppliers in 🇨🇳 China 67%

3 confirmed suppliers · moderate concentration geographic risk

🇯🇵 Ibiden

suppliers in 🇯🇵 Japan 100%

1 confirmed supplier · high concentration geographic risk

🇹🇼 Delta Electronics

suppliers in 🇺🇸 United States 100%

2 confirmed suppliers · high concentration geographic risk

🇨🇳 Empyrean

suppliers in 🇩🇪 Germany 100%

1 confirmed supplier · high concentration geographic risk

🇨🇳 CATL

suppliers in 🇨🇳 China 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Boston Dynamics

suppliers in 🇰🇷 South Korea 37%

3 confirmed suppliers · low concentration geographic risk

🇩🇪 Schaeffler

suppliers in 🇨🇳 China 50%

2 confirmed suppliers · moderate concentration geographic risk

🇺🇸 MaxLinear

suppliers in 🇹🇼 Taiwan 63%

8 confirmed suppliers · moderate concentration geographic risk

🇯🇵 Sumitomo Heavy Industries

suppliers in 🇯🇵 Japan 100%

1 confirmed supplier · high concentration geographic risk

🇰🇷 Samsung SDI

suppliers in 🇰🇷 South Korea 100%

3 confirmed suppliers · high concentration geographic risk

Hon Hai Precision Industry

suppliers in 🇨🇳 China 50%

2 confirmed suppliers · moderate concentration geographic risk

🇺🇸 Navitas

suppliers in 🇹🇼 Taiwan 50%

2 confirmed suppliers · moderate concentration geographic risk

🇯🇵 Harmonic Drive

suppliers in 🇯🇵 Japan 100%

1 confirmed supplier · high concentration geographic risk

🇯🇵 Sony

suppliers in 🇹🇼 Taiwan 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Cadence Design

suppliers in 🇹🇼 Taiwan 50%

2 confirmed suppliers · moderate concentration geographic risk

🇨🇳 Orbbec

suppliers in 🇺🇸 United States 67%

3 confirmed suppliers · moderate concentration geographic risk

🇺🇸 Arteris

suppliers in 🇺🇸 United States 67%

6 confirmed suppliers · moderate concentration geographic risk

🇨🇳 JL MAG Rare-Earth

suppliers in 🇨🇳 China 100%

2 confirmed suppliers · high concentration geographic risk

🇨🇳 BYD

suppliers in 🇨🇳 China 80%

10 confirmed suppliers · high concentration geographic risk

🇺🇸 Marvell

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇩🇪 Bosch Rexroth

suppliers in 🇬🇧 United Kingdom 50%

2 confirmed suppliers · moderate concentration geographic risk

🇺🇸 NVIDIA

suppliers in 🇺🇸 United States 44%

31 confirmed suppliers · low concentration geographic risk

🇺🇸 Hewlett Packard Enterprise

suppliers in 🇺🇸 United States 100%

4 confirmed suppliers · high concentration geographic risk

🇺🇸 Covariant

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Figure AI

suppliers in 🇺🇸 United States 77%

3 confirmed suppliers · high concentration geographic risk

🇺🇸 Analog Devices

suppliers in 🇹🇼 Taiwan 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 GlobalFoundries

suppliers in 🇺🇸 United States 71%

7 confirmed suppliers · high concentration geographic risk

🇸🇪 Einride

suppliers in 🇳🇱 Netherlands 50%

2 confirmed suppliers · moderate concentration geographic risk

🇳🇱 NXP Semiconductors

suppliers in 🇺🇸 United States 50%

4 confirmed suppliers · moderate concentration geographic risk

🇹🇼 MediaTek

suppliers in 🇺🇸 United States 50%

2 confirmed suppliers · moderate concentration geographic risk

🇨🇳 Harmonic Drive (Shanghai)

suppliers in 🇯🇵 Japan 100%

1 confirmed supplier · high concentration geographic risk

🇰🇷 LG Innotek

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇯🇵 Omron (Adept)

suppliers in 🇨🇳 China 100%

1 confirmed supplier · high concentration geographic risk

🇨🇳 UBTech Robotics

suppliers in 🇨🇳 China 67%

3 confirmed suppliers · moderate concentration geographic risk

🇯🇵 Nidec

suppliers in 🇨🇳 China 100%

1 confirmed supplier · high concentration geographic risk

🇩🇰 Kassow Robots

suppliers in 🇨🇭 Switzerland 100%

1 confirmed supplier · high concentration geographic risk

🇰🇷 Hyundai Motor

suppliers in 🇺🇸 United States 83%

5 confirmed suppliers · high concentration geographic risk

🇺🇸 Amkor

suppliers in 🇩🇪 Germany 100%

1 confirmed supplier · high concentration geographic risk

🇬🇧 Arm

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇨🇳 AgiBot

suppliers in 🇨🇳 China 75%

4 confirmed suppliers · high concentration geographic risk

🇮🇱 Mentee Robotics

suppliers in 🇨🇳 China 50%

2 confirmed suppliers · moderate concentration geographic risk

🇮🇳 Tata Electronics

suppliers in 🇯🇵 Japan 25%

4 confirmed suppliers · diversified geographic risk

🇨🇳 Eoptolink

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

Toyota Motor

suppliers in 🇨🇳 China 57%

7 confirmed suppliers · moderate concentration geographic risk

🇺🇸 Skild AI

suppliers in 🇺🇸 United States 100%

2 confirmed suppliers · high concentration geographic risk

🇺🇸 Applied Materials

suppliers in 🇰🇷 South Korea 51%

4 confirmed suppliers · moderate concentration geographic risk

🇰🇷 Samsung Electronics

suppliers in 🇺🇸 United States 37%

19 confirmed suppliers · low concentration geographic risk

🇨🇳 Zhongke Sanhuan

suppliers in 🇨🇳 China 100%

2 confirmed suppliers · high concentration geographic risk

🇹🇼 Advantech

suppliers in 🇩🇪 Germany 100%

1 confirmed supplier · high concentration geographic risk

🇰🇷 SK hynix

suppliers in 🇺🇸 United States 50%

8 confirmed suppliers · moderate concentration geographic risk

🇯🇵 Panasonic Energy

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Entegris

suppliers in 🇹🇼 Taiwan 100%

1 confirmed supplier · high concentration geographic risk

EQT Partners

suppliers in 🇳🇴 Norway 100%

1 confirmed supplier · high concentration geographic risk

🇯🇵 Kawasaki Heavy Industries

suppliers in 🇯🇵 Japan 100%

1 confirmed supplier · high concentration geographic risk

🇺🇸 Vishay Intertechnology

suppliers in 🇰🇷 South Korea 50%

2 confirmed suppliers · moderate concentration geographic risk

🇺🇸 Intel

suppliers in 🇯🇵 Japan 38%

19 confirmed suppliers · low concentration geographic risk

🇳🇴 1X

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇨🇳 Galbot

suppliers in 🇨🇳 China 67%

3 confirmed suppliers · moderate concentration geographic risk

🇯🇵 SUMCO

suppliers in 🇺🇸 United States 100%

1 confirmed supplier · high concentration geographic risk

🇯🇵 Yaskawa Electric

suppliers in 🇨🇳 China 50%

2 confirmed suppliers · moderate concentration geographic risk

COUNTRY-OF-FACTORY

Where the parts are actually made

HQ tells you where a supplier is based; this is where its components are produced. A buyer can look diversified by headquarters yet concentrate real production in one country — the exposure that actually bites. Top 24 by production concentration.

🇸🇪 SKF

produced in 🇸🇪 Sweden 100%

1 production country · high concentration

🇨🇳 Fourier Intelligence

produced in 🇨🇭 Switzerland 100%

1 production country · high concentration

Tata Sons

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇹🇼 Powertech

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇹🇼 UMC

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇩🇪 Siltronic

produced in 🇩🇪 Germany 100%

1 production country · high concentration

SoftBank

produced in 🇬🇧 United Kingdom 100%

1 production country · high concentration

🇨🇳 Estun Automation

produced in 🇨🇳 China 100%

1 production country · high concentration

🇨🇳 Hua Hong

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇯🇵 FANUC

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇺🇸 Agility Robotics

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇨🇳 Wolong Electric

produced in 🇨🇳 China 100%

1 production country · high concentration

🇯🇵 Denso / Denso Wave

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇺🇸 Broadcom

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇰🇷 Rainbow Robotics

produced in 🇩🇪 Germany 100%

1 production country · high concentration

🇰🇷 Wonik Robotics

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇩🇪 Vacuumschmelze

produced in 🇨🇦 Canada 100%

1 production country · high concentration

🇺🇸 SambaNova

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇯🇵 Panasonic

produced in 🇨🇳 China 100%

1 production country · high concentration

🇺🇸 Coherent

produced in 🇺🇸 United States 100%

1 production country · high concentration

🇯🇵 Ibiden

produced in 🇯🇵 Japan 100%

1 production country · high concentration

🇨🇳 Empyrean

produced in 🇩🇪 Germany 100%

1 production country · high concentration

🇨🇳 CATL

produced in 🇨🇳 China 100%

1 production country · high concentration

🇯🇵 Sumitomo Heavy Industries

produced in 🇯🇵 Japan 100%

1 production country · high concentration

COMPONENT CHOKEPOINTS

Concentration at the part level

SPLC measures concentration company-by-company; this is one rung deeper — which component types the whole graph depends on the fewest suppliers for. Confirmed edges only; HHI over suppliers, buyers = how many companies pull through it.

ai_chips

27 suppliers · 44 buyers · HHI 0.07

top: NVIDIA

foundry

7 suppliers · 27 buyers · HHI 0.35

top: Taiwan Manufacturing

ai_compute

17 suppliers · 24 buyers · HHI 0.1

top: Arteris

physical_ai

21 suppliers · 14 buyers · HHI 0.05

top: Skild AI

merchant_gpuconcentrated

2 suppliers · 10 buyers · HHI 0.5

top: Intel

imu

5 suppliers · 10 buyers · HHI 0.31

top: Murata Manufacturing

humanoid

8 suppliers · 10 buyers · HHI 0.16

top: Galbot

advanced_packaging

6 suppliers · 9 buyers · HHI 0.2

top: Ibiden

compute

3 suppliers · 8 buyers · HHI 0.43

top: Qualcomm

rare_earth_magnets

3 suppliers · 8 buyers · HHI 0.37

top: Ningbo Yunsheng

hbmconcentrated

2 suppliers · 7 buyers · HHI 0.52

top: Micron

osat

3 suppliers · 7 buyers · HHI 0.38

top: Amkor

harmonic_reducersconcentrated

2 suppliers · 6 buyers · HHI 0.72

top: Leaderdrive

custom_asicconcentrated

2 suppliers · 6 buyers · HHI 0.53

top: Broadcom

force_torqueconcentrated

2 suppliers · 5 buyers · HHI 0.56

top: Sunrise Instruments

switch_siliconconcentrated

2 suppliers · 4 buyers · HHI 0.59

top: Astera Labs

batteries

4 suppliers · 4 buyers · HHI 0.28

top: CATL

industrial_arm

7 suppliers · 4 buyers · HHI 0.16

top: Dobot

SUPPLIER CONCENTRATION

Single-buyer dependence

For each supplier, how concentrated its confirmed customer base is (Herfindahl over buyers). A lone buyer is a revenue single-point-of-failure for the supplier.

🇺🇸 Advanced Micro Devices

buyer · HHI 0.10

low concentration

🇺🇸 Synopsys

buyer · HHI 0.13

high concentration

🇸🇪 SKF

buyer · HHI 1.00

high concentration

🇨🇳 C&U

buyer · HHI 1.00

high concentration

🇨🇳 China Northern Rare Earth High-Tech

buyer · HHI 1.00

high concentration

🇯🇵 Sumitomo Electric

buyer · HHI 1.00

high concentration

🇺🇸 Astera Labs

buyer · HHI 0.28

moderate concentration

buyer · HHI 1.00

high concentration

🇺🇸 Texas Instruments

buyer · HHI 0.33

high concentration

🇦🇹 AT&S

buyer · HHI 0.50

high concentration

🇹🇼 Powertech

buyer · HHI 0.50

high concentration

🇨🇳 Sunrise Instruments

buyer · HHI 0.25

high concentration

🇩🇪 Infineon

buyer · HHI 0.33

high concentration

🇯🇵 TDK InvenSense

buyer · HHI 1.00

high concentration

🇨🇳 Zhejiang Sanhua Intelligent Controls

buyer · HHI 0.51

moderate concentration

🇹🇼 UMC

buyer · HHI 0.25

high concentration

🇺🇸 ACM Research

buyer · HHI 0.20

high concentration

🇩🇪 Siltronic

buyer · HHI 0.20

high concentration

🇺🇸 Tesla

buyer · HHI 1.00

high concentration

🇨🇳 Ganzhou Keli Rare Earth New Materials

buyer · HHI 1.00

high concentration

🇯🇵 Advantest

buyer · HHI 0.17

high concentration

🇯🇵 Tokyo Ohka Kogyo

buyer · HHI 0.33

high concentration

🇩🇪 Merck KGaA

buyer · HHI 1.00

high concentration

🇰🇷 LG Energy Solution

buyer · HHI 1.00

high concentration

🇯🇵 Murata Manufacturing

buyer · HHI 0.20

moderate concentration

🇯🇵 Toppan Printing

buyer · HHI 1.00

high concentration

🇯🇵 Resonac

buyer · HHI 0.50

high concentration

🇺🇸 MP Materials

buyer · HHI 1.00

high concentration

🇹🇼 Winbond

buyer · HHI 1.00

high concentration

🇰🇷 Key Foundry

buyer · HHI 1.00

high concentration

🇨🇳 Estun Automation

buyer · HHI 1.00

high concentration

🇨🇳 Leaderdrive

buyer · HHI 0.14

high concentration

🇨🇳 Hua Hong

buyer · HHI 1.00

high concentration

Regal Rexnord

buyer · HHI 1.00

high concentration

🇨🇳 China Rare Earth

buyer · HHI 1.00

high concentration

🇮🇱 Tower

buyer · HHI 1.00

high concentration

🇺🇸 Microsoft

buyer · HHI 0.33

high concentration

🇰🇷 HD Hyundai Robotics

buyer · HHI 1.00

high concentration

🇺🇸 Micron

buyer · HHI 0.11

high concentration

🇨🇳 Zhongji InnoLight

buyer · HHI 0.25

high concentration

🇰🇷 EcoPro BM

buyer · HHI 1.00

high concentration

🇺🇸 Linde

buyer · HHI 0.50

high concentration

🇹🇼 Taiwan Manufacturing

buyer · HHI 0.04

low concentration

🇺🇸 Agility Robotics

buyer · HHI 0.33

high concentration

🇨🇭 maxon

buyer · HHI 0.33

high concentration

🇺🇸 FormFactor

buyer · HHI 0.25

high concentration

🇺🇸 Persona AI

buyer · HHI 1.00

high concentration

🇨🇭 ABB

buyer · HHI 1.00

high concentration

🇹🇼 Hiwin

buyer · HHI 1.00

high concentration

🇨🇳 Wolong Electric

buyer · HHI 0.50

high concentration

🇺🇸 Broadcom

buyer · HHI 0.14

low concentration

🇺🇸 Standard Bots

buyer · HHI 1.00

high concentration

🇨🇭 STMicroelectronics

buyer · HHI 0.17

high concentration

🇺🇸 Lam Research

buyer · HHI 0.33

high concentration

🇯🇵 NTN

buyer · HHI 1.00

high concentration

🇰🇷 Samsung Electro-Mechanics

buyer · HHI 0.20

high concentration

🇰🇷 Wonik Robotics

buyer · HHI 0.33

high concentration

🇩🇪 Vacuumschmelze

buyer · HHI 1.00

high concentration

🇺🇸 SambaNova

buyer · HHI 1.00

high concentration

🇺🇸 Qualcomm

buyer · HHI 0.08

high concentration

🇯🇵 Panasonic

buyer · HHI 1.00

high concentration

🇮🇪 Aptiv

buyer · HHI 0.33

high concentration

🇬🇧 Signaloid

buyer · HHI 1.00

high concentration

🇺🇸 Coherent

buyer · HHI 0.33

high concentration

🇺🇸 Credo

buyer · HHI 0.50

high concentration

🇩🇪 Bosch Sensortec

buyer · HHI 0.50

high concentration

🇨🇳 SMIC

buyer · HHI 0.50

high concentration

🇯🇵 Ibiden

buyer · HHI 0.20

high concentration

🇺🇸 IonQ

buyer · HHI 0.17

high concentration

🇨🇳 Ningbo Tuopu

buyer · HHI 1.00

high concentration

🇺🇸 Hemlock

buyer · HHI 1.00

high concentration

🇺🇸 Vicor

buyer · HHI 0.25

high concentration

🇨🇳 Empyrean

buyer · HHI 1.00

high concentration

🇨🇳 CATL

buyer · HHI 0.33

high concentration

🇨🇳 EVE Energy

buyer · HHI 0.50

high concentration

🇺🇸 Boston Dynamics

buyer · HHI 1.00

high concentration

🇩🇪 Schaeffler

buyer · HHI 1.00

high concentration

🇯🇵 Shinko Electric Industries

buyer · HHI 0.33

high concentration

🇨🇳 AMEC

buyer · HHI 0.50

high concentration

🇺🇸 MaxLinear

buyer · HHI 0.50

high concentration

🇯🇵 Sumitomo Heavy Industries

buyer · HHI 1.00

high concentration

🇨🇳 Moons' Electric

buyer · HHI 1.00

high concentration

🇺🇸 Kollmorgen

buyer · HHI 0.25

high concentration

🇨🇳 PaXini Tech

buyer · HHI 1.00

high concentration

🇹🇼 Unimicron

buyer · HHI 1.00

high concentration

🇯🇵 Kokusai Electric

buyer · HHI 0.50

high concentration

🇨🇳 Dobot

buyer · HHI 0.25

high concentration

🇹🇼 Powerchip

buyer · HHI 0.50

high concentration

🇯🇵 Nachi-Fujikoshi

buyer · HHI 1.00

high concentration

🇨🇳 Ningbo Zhongda Leader Intelligent Transmission Co., Ltd.

buyer · HHI 1.00

high concentration

🇨🇳 Hesai

buyer · HHI 0.14

high concentration

Hon Hai Precision Industry

buyer · HHI 1.00

high concentration

🇰🇷 Lotte Energy Materials

buyer · HHI 1.00

high concentration

🇺🇸 Navitas

buyer · HHI 1.00

high concentration

🇯🇵 Harmonic Drive

buyer · HHI 0.50

high concentration

🇳🇱 ASML

buyer · HHI 0.25

high concentration

🇩🇪 NEURA Robotics

buyer · HHI 1.00

high concentration

🇺🇸 Harmonic Drive L

buyer · HHI 0.50

high concentration

🇺🇸 Cadence Design

buyer · HHI 0.11

high concentration

🇨🇳 RoboSense

buyer · HHI 0.50

high concentration

🇺🇸 Arteris

buyer · HHI 0.10

high concentration

🇨🇳 JL MAG Rare-Earth

buyer · HHI 0.25

high concentration

🇸🇪 Ovako

buyer · HHI 1.00

high concentration

🇨🇳 BYD

buyer · HHI 0.34

moderate concentration

🇺🇸 Marvell

buyer · HHI 0.25

high concentration

🇩🇪 Bosch Rexroth

buyer · HHI 0.50

high concentration

🇺🇸 NVIDIA

buyer · HHI 0.03

low concentration

🇺🇸 Hewlett Packard Enterprise

buyer · HHI 1.00

high concentration

🇺🇸 Covariant

buyer · HHI 0.33

high concentration

🇺🇸 Figure AI

buyer · HHI 1.00

high concentration

🇺🇸 Corning

buyer · HHI 0.20

high concentration

🇰🇷 POSCO Future M

buyer · HHI 1.00

high concentration

🇺🇸 Analog Devices

buyer · HHI 1.00

high concentration

🇺🇸 GlobalFoundries

buyer · HHI 0.09

high concentration

🇸🇪 Einride

buyer · HHI 1.00

high concentration

🇳🇱 NXP Semiconductors

buyer · HHI 1.00

high concentration

🇹🇼 MediaTek

buyer · HHI 0.33

high concentration

🇺🇸 ATI Industrial Automation

buyer · HHI 0.33

high concentration

🇨🇳 Jiangxi South Rare Earth Hi-Tech

buyer · HHI 1.00

high concentration

🇺🇸 Microchip

buyer · HHI 1.00

high concentration

🇨🇳 Shuanghuan Driveline

buyer · HHI 0.50

moderate concentration

🇯🇵 Omron (Adept)

buyer · HHI 1.00

high concentration

🇨🇳 UBTech Robotics

buyer · HHI 1.00

high concentration

🇯🇵 Screen

buyer · HHI 1.00

high concentration

🇯🇵 Nidec

buyer · HHI 1.00

high concentration

🇰🇷 Hyundai Motor

buyer · HHI 1.00

high concentration

🇺🇸 Amkor

buyer · HHI 0.25

high concentration

🇬🇧 Arm

buyer · HHI 0.09

low concentration

🇨🇳 Ningbo Yunsheng

buyer · HHI 0.20

high concentration

🇨🇳 Primarius

buyer · HHI 1.00

high concentration

🇯🇵 Tokyo Electron

buyer · HHI 0.25

moderate concentration

🇮🇱 Mentee Robotics

buyer · HHI 1.00

high concentration

🇮🇳 Tata Electronics

buyer · HHI 0.50

high concentration

🇨🇳 Eoptolink

buyer · HHI 0.25

high concentration

🇺🇸 Skild AI

buyer · HHI 0.33

high concentration

🇺🇸 Applied Materials

buyer · HHI 0.33

low concentration

🇰🇷 Samsung Electronics

buyer · HHI 0.11

low concentration

🇨🇳 Zhongke Sanhuan

buyer · HHI 0.25

high concentration

🇯🇵 Harmonic Winbell

buyer · HHI 1.00

high concentration

🇯🇵 Nabtesco

buyer · HHI 0.50

moderate concentration

🇨🇳 Rockchip

buyer · HHI 0.33

high concentration

🇩🇪 Ewellix

buyer · HHI 0.33

high concentration

🇨🇳 Suzhou Green Harmonic Drive Equipment

buyer · HHI 1.00

high concentration

🇰🇷 SK hynix

buyer · HHI 0.18

low concentration

🇺🇸 Entegris

buyer · HHI 0.50

moderate concentration

🇺🇸 Monolithic Power

buyer · HHI 1.00

high concentration

🇺🇸 Vishay Intertechnology

buyer · HHI 1.00

high concentration

🇺🇸 Intel

buyer · HHI 0.07

low concentration

🇳🇴 1X

buyer · HHI 1.00

high concentration

🇹🇭 Alphatec Packaging

buyer · HHI 1.00

high concentration

🇨🇳 Galbot

buyer · HHI 0.33

high concentration

🇨🇳 Midea

buyer · HHI 1.00

high concentration

🇨🇳 JCET

buyer · HHI 0.50

high concentration

🇨🇳 Eyou Robot

buyer · HHI 1.00

high concentration

🇨🇳 JAKA Robotics

buyer · HHI 0.33

high concentration

🇯🇵 SUMCO

buyer · HHI 1.00

high concentration

RELATIONSHIP MATURITY

Edge age & stability

RelationshipComponentAgeStabilityType
Taiwan ManufacturingEntegris foundry mo unknown 0.38
NidecTesla actuator_motor 12mo young 0.52
Suzhou Green Harmonic Drive EquipmentTesla harmonic_reducer 12mo young 0.64
Zhejiang Sanhua Intelligent ControlsTesla actuator_assembly 12mo young 0.59
Applied MaterialsIntel ai_chips mo unknown 0.38
SK hynixNVIDIA hbm 28mo established 0.82
Wolong ElectricNoetix Robotics servomotors mo unknown 0.38
SK hynixMicrosoft hbm 5mo new 0.60
Samsung ElectronicsQualcomm ai_chips mo unknown 0.39
NVIDIAMicrosoft ai_gpu 10mo young 0.62
NVIDIAFigure AI ai_gpu 23mo established 0.76
BYDApple batteries mo unknown 0.38
Shuanghuan DrivelineABB Robotics planetary_reducers mo unknown 0.38
Cadence DesignNVIDIA ai_chips mo unknown 0.39
Kokusai ElectricIntel ai_chips mo unknown 0.38
Murata ManufacturingTexas Instruments imu mo unknown 0.38
Taiwan ManufacturingApplied Materials foundry mo unknown 0.38
Taiwan ManufacturingTexas Instruments foundry mo unknown 0.38
Kokusai ElectricMicron ai_chips mo unknown 0.38
Tokyo ElectronMicron ai_chips mo unknown 0.38
Murata ManufacturingMicron imu mo unknown 0.38
Taiwan ManufacturingMicron foundry mo unknown 0.38
Taiwan ManufacturingLam Research foundry mo unknown 0.38
MicronNVIDIA hbm mo unknown 0.39
ScreenIntel ai_chips mo unknown 0.38
CATLTesla batteries mo unknown 0.38
ASMLIntel ai_chips mo unknown 0.39
EntegrisGlobalFoundries ai_chips mo unknown 0.38
Samsung ElectronicsVertiv ai_chips mo unknown 0.38
UMCIntel foundry mo unknown 0.39
STMicroelectronicsQualcomm imu mo unknown 0.39
STMicroelectronicsTesla imu mo unknown 0.38
ASMLTaiwan Manufacturing ai_chips mo unknown 0.38
UMCMediaTek foundry mo unknown 0.38
AmkorQualcomm osat mo unknown 0.38
STMicroelectronicsSamsung Electronics imu mo unknown 0.38
Lam ResearchTaiwan Manufacturing ai_chips mo unknown 0.38
QualcommMeta Platforms compute mo unknown 0.39
NVIDIAAlphabet ai_chips mo unknown 0.38
NVIDIAUniversal Robots A/S ai_chips mo unknown 0.38
SynopsysSamsung Electronics ai_chips mo unknown 0.39
MicronMeta Platforms hbm mo unknown 0.38
STMicroelectronicsAmazon imu mo unknown 0.38
QualcommFigure AI compute mo unknown 0.39
NVIDIAMobile Industrial Robots A/S ai_chips mo unknown 0.38
QualcommXiaomi Robotics compute mo unknown 0.38
SMICNXP Semiconductors foundry mo unknown 0.38
Hua HongSTMicroelectronics foundry mo unknown 0.38
GlobalFoundriesNavitas foundry mo unknown 0.38
NVIDIAMeta Platforms ai_chips mo unknown 0.38
STMicroelectronicsNVIDIA imu mo unknown 0.38
SK hynixSanDisk hbm mo unknown 0.38
STMicroelectronicsAmpere Computing imu mo unknown 0.38
Advanced Micro DevicesMeta Platforms merchant_gpu mo unknown 0.39
Advanced Micro DevicesSiemens EDA merchant_gpu mo unknown 0.38
Taiwan ManufacturingArista Networks foundry mo unknown 0.38
AlphabetLG Innotek custom_asic mo unknown 0.38
NVIDIAMentee Robotics ai_chips mo unknown 0.38
Advanced Micro DevicesAmazon merchant_gpu mo unknown 0.38
ACM ResearchSK hynix ai_chips mo unknown 0.39
ACM ResearchHua Hong ai_chips mo unknown 0.38
ACM ResearchSMIC ai_chips mo unknown 0.38
ACM ResearchYangtze Memory Technologies ai_chips mo unknown 0.38
InfineonAmkor ai_chips mo unknown 0.38
ArmMeta Platforms ai_chips mo unknown 0.39
Advanced Micro DevicesMicrosoft merchant_gpu mo unknown 0.39
MicronSamsung Electronics hbm mo unknown 0.39
CorningApple advanced_packaging mo unknown 0.38
Cadence DesignInfineon ai_chips mo unknown 0.38
ArmAlphabet ai_chips mo unknown 0.38
ArmApple ai_chips mo unknown 0.38
SynopsysAmazon ai_chips mo unknown 0.38
CoherentNVIDIA optical_modules mo unknown 0.38
Astera LabsAdvanced Micro Devices switch_silicon mo unknown 0.38
Taiwan ManufacturingCerebras Systems foundry mo unknown 0.38
GlobalFoundriesApple foundry mo unknown 0.38
CoherentApple optical_modules mo unknown 0.38
Taiwan ManufacturingCadence Design foundry mo unknown 0.38
GlobalFoundriesRenesas Electronics foundry mo unknown 0.38
Cadence DesignSocionext ai_chips mo unknown 0.38
IntelMicrosoft merchant_gpu mo unknown 0.39
GlobalFoundriesNXP Semiconductors foundry mo unknown 0.38
MarvellAmazon custom_asic mo unknown 0.39
HesaiXiaomi Robotics vision mo unknown 0.38
IntelAmazon merchant_gpu mo unknown 0.38
GlobalFoundriesGroq foundry mo unknown 0.38
Hyundai MotorAvride humanoid mo unknown 0.38
NVIDIASiemens EDA ai_chips mo unknown 0.39
GlobalFoundriesInfineon foundry mo unknown 0.38
Aclara Resources Inc.Vacuumschmelze physical_ai mo unknown 0.38
HesaiBYD vision mo unknown 0.38
HesaiToyota Motor vision mo unknown 0.38
Taiwan Manufacturing foundry mo unknown 0.38
LindeTaiwan Manufacturing ai_chips mo unknown 0.38
HesaiUnitree Robotics vision mo unknown 0.38
QualcommAmazon compute mo unknown 0.38
Arista NetworksMicrosoft switch_silicon mo unknown 0.38
Ningbo TuopuTesla rotary_actuator 12mo young 0.52
AmkorIntel osat mo unknown 0.38
IntelUMC merchant_gpu mo unknown 0.38
InfineonNVIDIA ai_chips mo unknown 0.38
NVIDIAAgility Robotics ai_chips mo unknown 0.38
Harmonic DriveTesla harmonic_reducer 12mo young 0.52
NVIDIAAlphabet ai_chips mo unknown 0.38
NVIDIAGatik ai_chips mo unknown 0.38
Alchip TechnologiesAstera Labs networking mo unknown 0.38
NVIDIAHyundai Motor ai_chips mo unknown 0.39
Cadence DesignSamsung Electronics ai_chips mo unknown 0.38
EntegrisNVIDIA ai_chips mo unknown 0.38
SynopsysTaiwan Manufacturing ai_chips mo unknown 0.38
Cadence DesignArm ai_chips mo unknown 0.38
Texas InstrumentsNVIDIA compute mo unknown 0.38
NXP SemiconductorsNVIDIA compute mo unknown 0.38
Taiwan ManufacturingMicrosoft foundry mo unknown 0.38
NVIDIAMediaTek ai_chips mo unknown 0.39
CorningBroadcom advanced_packaging mo unknown 0.38
CorningGlobalFoundries advanced_packaging mo unknown 0.38
SynopsysGlobalFoundries ai_chips mo unknown 0.38
QualcommPanasonic Energy compute mo unknown 0.38
Advanced Micro DevicesArista Networks merchant_gpu mo unknown 0.38
Cadence DesignMarvell ai_chips mo unknown 0.38
Cadence DesignGlobalFoundries ai_chips mo unknown 0.38
NavitasDelta Electronics ai_chips mo unknown 0.38
GlobalFoundriesHyundai Motor foundry mo unknown 0.38
WinbondTaiwan Manufacturing ai_compute mo unknown 0.38
Omron (Adept)Comau physical_ai mo unknown 0.36
Cadence DesignSK hynix ai_chips mo unknown 0.38
CorningMeta Platforms advanced_packaging mo unknown 0.38
JSR CorporationLam Research ai_chips mo unknown 0.38
Taiwan ManufacturingNVIDIA foundry mo unknown 0.39
LindeMicron ai_chips mo unknown 0.38
ArmInfineon ai_chips mo unknown 0.38
Tokyo ElectronTeradyne, Inc. ai_chips mo unknown 0.38
NVIDIADelta Electronics ai_chips mo unknown 0.38
NVIDIASK hynix ai_chips mo unknown 0.38
NVIDIA1X ai_chips mo unknown 0.38
SK hynixNVIDIA hbm mo unknown 0.39
Monolithic PowerNVIDIA ai_chips mo unknown 0.38
Texas InstrumentsApptronik compute mo unknown 0.38
Taiwan ManufacturingBiren Technology foundry mo unknown 0.38
Taiwan ManufacturingFuriosaAI foundry mo unknown 0.38
SK hynixFuriosaAI hbm mo unknown 0.38
Harmonic DriveHarmonic Drive (Shanghai) harmonic_reducers mo unknown 0.38
Harmonic Drive LBoston Dynamics actuators_reducers mo unknown 0.38
Taiwan ManufacturingCambricon foundry mo unknown 0.38
Harmonic WinbellHarmonic Drive actuators_reducers mo unknown 0.38
Taiwan ManufacturingNVIDIA foundry mo unknown 0.39
MediaTekMicrosoft networking mo unknown 0.38
ArmAgiBot ai_chips mo unknown 0.38
CATLGalbot batteries mo unknown 0.38
Taiwan Manufacturingd-Matrix foundry mo unknown 0.38
DobotBYD industrial_arm mo unknown 0.38
NVIDIAEngineAI ai_chips mo unknown 0.38
IntelEngineAI merchant_gpu mo unknown 0.38
GalbotCATL humanoid mo unknown 0.38
GalbotToyota Motor humanoid mo unknown 0.36
AdvantestTaiwan Manufacturing ai_chips mo unknown 0.38
CovariantAmazon physical_ai mo unknown 0.38
NVIDIABosch Rexroth ai_chips mo unknown 0.38
IonQHyundai Motor quantum mo unknown 0.38
MarvellMicrosoft custom_asic mo unknown 0.38
Taiwan ManufacturingPreferred Networks foundry mo unknown 0.38
MicrosoftSanctuary AI ai_compute mo unknown 0.38
ATI Industrial AutomationUniversal Robots A/S force_torque mo unknown 0.38
IbidenNVIDIA advanced_packaging mo unknown 0.38
SK hynixRebellions hbm mo unknown 0.38
Texas InstrumentsUBTech Robotics compute mo unknown 0.38
AdvantestNVIDIA ai_chips mo unknown 0.38
AdvantestAdvanced Micro Devices ai_chips mo unknown 0.38
AdvantestSamsung Electronics ai_chips mo unknown 0.38
AdvantestSK hynix ai_chips mo unknown 0.38
AT&SAdvanced Micro Devices advanced_packaging mo unknown 0.38
AT&SIntel advanced_packaging mo unknown 0.38
ATI Industrial AutomationFANUC force_torque mo unknown 0.38
Bosch SensortecApple imu mo unknown 0.38
HiwinBoston Dynamics roller_screws mo unknown 0.38
HD Hyundai RoboticsHyundai Motor industrial_arm mo unknown 0.38
NEURA RoboticsHD Hyundai Robotics humanoid mo unknown 0.38
Taiwan ManufacturingIluvatar CoreX foundry mo unknown 0.38
CoherentMitsubishi Electric optical_modules mo unknown 0.38
Taiwan ManufacturingMoore Threads foundry mo unknown 0.38
UBTech RoboticsTexas Instruments humanoid mo unknown 0.38
AMECSMIC ai_chips mo unknown 0.38
EmpyreanSMIC ai_chips mo unknown 0.38
IntelHewlett Packard Enterprise merchant_gpu mo unknown 0.38
IbidenIntel advanced_packaging mo unknown 0.38
IbidenTaiwan Manufacturing advanced_packaging mo unknown 0.38
Taiwan ManufacturingImpinj foundry mo unknown 0.38
NVIDIAGalbot ai_chips mo unknown 0.38
Estun AutomationBYD industrial_arm mo unknown 0.38
JAKA RoboticsFlex Ltd. industrial_arm mo unknown 0.38
Samsung ElectronicsKunlunxin ai_chips mo unknown 0.38
MideaPanasonic oem mo unknown 0.38
Samsung ElectronicsRebellions ai_chips mo unknown 0.38
ArmRebellions ai_chips mo unknown 0.38
Ningbo Zhongda Leader Intelligent Transmission Co., Ltd.Siasun Robot & Automation physical_ai mo unknown 0.38
Technoprobe S.p.A.Advantest ai_compute mo unknown 0.38
Bosch Rexrothcongatec roller_screws mo unknown 0.38
Bota SystemsKassow Robots force_torque mo unknown 0.38
Persona AIHD Hyundai Robotics physical_ai mo unknown 0.38
CovariantOTTO Motors physical_ai mo unknown 0.38
NabtescoKUKA planetary_reducers mo unknown 0.38
SignaloidBosch Rexroth ai_compute mo unknown 0.38
ATI Industrial AutomationYaskawa Electric force_torque mo unknown 0.38
LeaderdriveUBTech Robotics harmonic_reducers mo unknown 0.38
LeaderdriveFigure AI harmonic_reducers mo unknown 0.38
LeaderdriveUnitree Robotics harmonic_reducers mo unknown 0.38
FormFactorAdvantest ai_compute mo unknown 0.39
JCETTexas Instruments osat mo unknown 0.38
JCETQualcomm osat mo unknown 0.38
LeaderdriveGalbot harmonic_reducers mo unknown 0.38
Taiwan ManufacturingMaxLinear foundry mo unknown 0.38
Harmonic Drive LIntuitive Surgical, Inc. actuators_reducers mo unknown 0.38
1XEQT Partners humanoid mo unknown 0.38
DobotLuxshare Precision Industry industrial_arm mo unknown 0.38
DobotOmron (Adept) industrial_arm mo unknown 0.38
ArterisEnflame ai_compute mo unknown 0.38
KollmorgenRobCo servomotors mo unknown 0.38
Ganzhou Keli Rare Earth New MaterialsZhongke Sanhuan physical_ai mo unknown 0.38
IbidenAdvanced Micro Devices advanced_packaging mo unknown 0.38
EoptolinkAmazon optical_modules mo unknown 0.38
EoptolinkMeta Platforms optical_modules mo unknown 0.38
EwellixTechman Robot roller_screws mo unknown 0.38
EwellixEcon Robot Inc roller_screws mo unknown 0.38
Advanced Micro DevicesHewlett Packard Enterprise merchant_gpu mo unknown 0.38
Ajinomoto Co., Inc.Ibiden ai_compute mo unknown 0.38
IonQArcher Materials quantum mo unknown 0.38
JL MAG Rare-EarthToyota Motor rare_earth_magnets mo unknown 0.38
KollmorgenRbot9 servomotors mo unknown 0.38
KollmorgenHEBI Robotics servomotors mo unknown 0.38
KollmorgenStereotaxis servomotors mo unknown 0.38
Advanced Semiconductor EngineeringMaxLinear ai_compute mo unknown 0.38
Greatek Electronics, Inc.MaxLinear ai_compute mo unknown 0.38
ASMLSK hynix ai_chips mo unknown 0.38
JL MAG Rare-EarthNidec rare_earth_magnets mo unknown 0.38
MunEDA GmbHEmpyrean ai_compute mo unknown 0.38
BroadcomEoptolink custom_asic mo unknown 0.38
EoptolinkNVIDIA optical_modules mo unknown 0.38
EVE EnergyTesla batteries mo unknown 0.38
JL MAG Rare-EarthTesla rare_earth_magnets mo unknown 0.38
LeaderdriveTesla harmonic_reducers mo unknown 0.38
JL MAG Rare-EarthBYD rare_earth_magnets mo unknown 0.38
BYDEinride batteries mo unknown 0.38
EinrideAmazon physical_ai mo unknown 0.38
NVIDIACovariant ai_chips mo unknown 0.38
BroadcomAlphabet custom_asic mo unknown 0.39
AMECTaiwan Manufacturing ai_chips mo unknown 0.38
ArmMicrosoft ai_chips mo unknown 0.39
NVIDIAApptronik ai_chips mo unknown 0.38
LeaderdriveAgiBot harmonic_reducers mo unknown 0.38
ArmAlphabet ai_chips mo unknown 0.38
Advanced Micro DevicesAlphabet merchant_gpu mo unknown 0.38
NVIDIAFigure AI ai_chips mo unknown 0.39
Taiwan ManufacturingAlphabet foundry mo unknown 0.38
IntelAlphabet merchant_gpu mo unknown 0.38
Hon Hai Precision IndustryNVIDIA mo unknown 0.39
Taiwan ManufacturingEnflame foundry mo unknown 0.38
GalbotRobert Bosch GmbH humanoid mo unknown 0.38
Nachi-FujikoshiToyota Motor industrial_arm mo unknown 0.38
IbidenSamsung Electronics advanced_packaging mo unknown 0.38
DobotWingtech Technology industrial_arm mo unknown 0.38
JAKA RoboticsLuxshare Precision Industry industrial_arm mo unknown 0.38
Bosch RexrothAdvantech roller_screws mo unknown 0.38
IntelMaxLinear merchant_gpu mo unknown 0.38
UMCMaxLinear foundry mo unknown 0.38
SchaefflerRainbow Robotics roller_screws mo unknown 0.38
maxonFourier Intelligence servomotors mo unknown 0.38
Astera LabsNVIDIA switch_silicon mo unknown 0.39
NTNToyota Motor robotics mo unknown 0.38
NVIDIAGideon ai_chips mo unknown 0.38
Samsung ElectronicsApplied Materials ai_chips mo unknown 0.39
Astera LabsMicrosoft switch_silicon mo unknown 0.38
ArmSoftBank ai_chips mo unknown 0.39
SiltronicInfineon ai_chips mo unknown 0.38
FormFactorSK hynix ai_compute mo unknown 0.38
FormFactorSamsung Electronics ai_compute mo unknown 0.38
FormFactorMicron ai_compute mo unknown 0.38
Taiwan ManufacturingAmazon foundry mo unknown 0.38
SK hynixApplied Materials hbm mo unknown 0.39
Samsung Electro-MechanicsAdvanced Micro Devices advanced_packaging mo unknown 0.38
SKC / AbsolicsAdvanced Micro Devices advanced_packaging mo unknown 0.38
SiltronicSamsung Electronics ai_chips mo unknown 0.38
IntelNVIDIA merchant_gpu mo unknown 0.39
IntelSpaceX merchant_gpu mo unknown 0.39
NVIDIAFlex Ltd. ai_chips mo unknown 0.38
Samsung Electro-MechanicsBYD advanced_packaging mo unknown 0.38
maxonShadow Robot Company servomotors mo unknown 0.38
HesaiNuro vision mo unknown 0.38
Skild AIHon Hai Precision Industry physical_ai mo unknown 0.38
NVIDIASkild AI ai_chips mo unknown 0.38
ResonacTaiwan Manufacturing ai_chips mo unknown 0.38
NVIDIANuro ai_chips mo unknown 0.38
Skild AIABB Robotics physical_ai mo unknown 0.38
Wacker Chemie AGSiltronic mo unknown 0.38
PowerchipTata Electronics foundry mo unknown 0.38
CubeMarsMentee Robotics physical_ai mo unknown 0.38
SiltronicMicron ai_chips mo unknown 0.38
SiltronicTaiwan Manufacturing ai_chips mo unknown 0.38
NVIDIAServe Robotics ai_chips mo unknown 0.38
UnimicronNVIDIA advanced_packaging mo unknown 0.38
Shinko Electric IndustriesAdvanced Micro Devices advanced_packaging mo unknown 0.38
VicorAlphabet ai_chips mo unknown 0.38
VicorIntel ai_chips mo unknown 0.38
Tokyo Ohka KogyoSK hynix ai_chips mo unknown 0.38
Tokyo Ohka KogyoIntel ai_chips mo unknown 0.38
VicorNVIDIA ai_chips mo unknown 0.38
VicorCerebras Systems ai_chips mo unknown 0.38
PowertechSK hynix osat mo unknown 0.38
Shinko Electric IndustriesIntel advanced_packaging mo unknown 0.38
SKFTesla robotics mo unknown 0.38
PowertechSamsung Electronics osat mo unknown 0.38
Tata ElectronicsRobert Bosch GmbH ai_compute mo unknown 0.39
NVIDIAAmazon ai_gpu 10mo young 0.62
Samsung Electro-MechanicsQualcomm advanced_packaging mo unknown 0.38
NVIDIAStandard Bots ai_chips mo unknown 0.38
Standard BotsAmazon physical_ai mo unknown 0.38
BYDNuro batteries mo unknown 0.38
SiltronicIntel ai_chips mo unknown 0.38
Taiwan ManufacturingTDK InvenSense foundry mo unknown 0.38
Hewlett Packard EnterpriseSkild AI ai_compute mo unknown 0.38
ASMLTata Electronics ai_chips mo unknown 0.38
Tokyo ElectronTata Electronics ai_chips mo unknown 0.38
TDK InvenSenseSamsung Electronics imu mo unknown 0.38
GlobalFoundriesTDK InvenSense foundry mo unknown 0.38
Wonik RoboticsAlphabet physical_ai mo unknown 0.38
EwellixUniversal Robots A/S roller_screws mo unknown 0.38
Samsung ElectronicsPreferred Networks ai_chips mo unknown 0.38
Taiwan ManufacturingNVIDIA foundry 16mo young 0.69
EoptolinkMicrosoft optical_modules mo unknown 0.38
Bosch SensortecMicrosoft imu mo unknown 0.38
Skild AIUniversal Robots A/S physical_ai mo unknown 0.38
QualcommZebra Technologies compute mo unknown 0.38
Meta PlatformsWonik Robotics custom_asic mo unknown 0.38
SMICCambricon foundry mo unknown 0.38
Bota SystemsKUKA force_torque mo unknown 0.38
QualcommAlphabet compute mo unknown 0.38
AdvantestMicron ai_chips mo unknown 0.38
Sumitomo Heavy IndustriesKawasaki Heavy Industries planetary_reducers mo unknown 0.38
Zhongke SanhuanApple rare_earth_magnets mo unknown 0.38
Tokyo Ohka KogyoSamsung Electronics ai_chips mo unknown 0.38
Wonik RoboticsNVIDIA physical_ai mo unknown 0.38
Wonik RoboticsMeta Platforms physical_ai mo unknown 0.38
Ningbo YunshengAgiBot rare_earth_magnets mo unknown 0.38
BroadcomApple custom_asic mo unknown 0.39
Shinko Electric IndustriesNVIDIA advanced_packaging mo unknown 0.38
EVE EnergyCummins batteries mo unknown 0.38
MicrosoftHP ai_compute mo unknown 0.38
NVIDIAHP ai_chips mo unknown 0.38
IntelHP merchant_gpu mo unknown 0.38
EcoPro BMSamsung SDI physical_ai mo unknown 0.38
QualcommDell compute mo unknown 0.38
Taiwan ManufacturingMeta Platforms foundry mo unknown 0.38
GlobalWafersGlobalFoundries ai_chips mo unknown 0.38
GlobalFoundriesApplied Materials foundry mo unknown 0.38
China Rare EarthJL MAG Rare-Earth physical_ai mo unknown 0.38
HesaiNeolix vision mo unknown 0.38
LeaderdriveNoetix Robotics harmonic_reducers mo unknown 0.38
Shuanghuan DrivelineNoetix Robotics planetary_reducers mo unknown 0.38
Zhejiang Sanhua Intelligent ControlsNoetix Robotics actuators_reducers mo unknown 0.38
Taiwan ManufacturingOmniVision foundry mo unknown 0.38
PowerchipOmniVision foundry mo unknown 0.38
Samsung ElectronicsOmniVision ai_chips mo unknown 0.38
Taiwan ManufacturingOrbbec foundry mo unknown 0.38
MicrosoftOrbbec ai_compute mo unknown 0.38
PrimariusSamsung Electronics ai_chips mo unknown 0.38
NVIDIAPudu Robotics ai_chips mo unknown 0.38
RokaeSiemens EDA physical_ai mo unknown 0.38
maxonWeilan (AlphaDog) servomotors mo unknown 0.38
Sunrise InstrumentsKUKA force_torque mo unknown 0.38
Sunrise InstrumentsYaskawa Electric force_torque mo unknown 0.38
Eyou RobotAgiBot physical_ai mo unknown 0.38
Ningbo YunshengSchaeffler rare_earth_magnets mo unknown 0.38
Zhongji InnoLightAmazon optical_modules mo unknown 0.38
PaXini TechBYD physical_ai mo unknown 0.38
Sunrise InstrumentsABB Robotics force_torque mo unknown 0.38
Ningbo YunshengEstun Automation rare_earth_magnets mo unknown 0.38
Sunrise InstrumentsHon Hai Precision Industry force_torque mo unknown 0.38
Zhongji InnoLightNVIDIA optical_modules mo unknown 0.38
NVIDIAOrbbec ai_chips mo unknown 0.38
MicronAmazon hbm mo unknown 0.38
China Northern Rare Earth High-TechJL MAG Rare-Earth physical_ai mo unknown 0.38
NVIDIAGalaxea AI ai_chips mo unknown 0.38
IntelGeek+ (Geekplus) merchant_gpu mo unknown 0.38
HesaiMeituan vision mo unknown 0.38
NVIDIALimX Dynamics ai_chips mo unknown 0.38
Ningbo YunshengBYD rare_earth_magnets mo unknown 0.38
RoboSenseBYD vision mo unknown 0.38
IntelLimX Dynamics merchant_gpu mo unknown 0.38
Zhongke SanhuanBYD rare_earth_magnets mo unknown 0.38
Lotte Energy MaterialsSamsung SDI physical_ai mo unknown 0.38
CogniboticsStandard Bots physical_ai mo unknown 0.38
RoboflowStandard Bots physical_ai mo unknown 0.38
HemlockSUMCO ai_compute mo unknown 0.38
Key FoundryVishay Intertechnology ai_compute mo unknown 0.38
VacuumschmelzeCyclic Materials rare_earth_magnets mo unknown 0.38
Zhongke SanhuanTesla rare_earth_magnets mo unknown 0.38
Zhongke SanhuanAlphabet rare_earth_magnets mo unknown 0.38
Mitsubishi ElectricZhongji InnoLight industrial_arm mo unknown 0.38
RockchipLimX Dynamics ai_compute mo unknown 0.38
Nordson CorporationPowertech ai_compute mo unknown 0.38
OvakoSKF physical_ai mo unknown 0.38
ASMPTTata Electronics ai_compute mo unknown 0.38
Ucore Rare Metals Inc.Vacuumschmelze physical_ai mo unknown 0.38
TowerVishay Intertechnology ai_compute mo unknown 0.38
POSCO Future MSamsung SDI physical_ai mo unknown 0.38
Cyclic MaterialsVacuumschmelze physical_ai mo unknown 0.38
RockchipNoetix Robotics ai_compute mo unknown 0.38
Moons' ElectricNoetix Robotics physical_ai mo unknown 0.38
ArterisInfineon ai_compute mo unknown 0.38
ResonacInfineon ai_chips mo unknown 0.38
CATLXiaomi Robotics batteries mo unknown 0.38
ArterisAdvanced Micro Devices ai_compute mo unknown 0.38
ArterisRenesas Electronics ai_compute mo unknown 0.38
UMCTexas Instruments foundry mo unknown 0.38
MediaTekDell networking mo unknown 0.38
TeslaAptiv humanoid mo unknown 0.38
ArterisTenstorrent ai_compute mo unknown 0.38
ArterisNXP Semiconductors ai_compute mo unknown 0.38
ArterisIntel ai_compute mo unknown 0.38
AptivBYD physical_ai mo unknown 0.38
Advanced Micro DevicesArteris merchant_gpu mo unknown 0.38
Renesas ElectronicsArteris compute mo unknown 0.38
NVIDIANeolix ai_chips mo unknown 0.38
JAKA RoboticsToyota Motor industrial_arm mo unknown 0.38
Toppan PrintingOmniVision ai_compute mo unknown 0.38
Alphatec PackagingOmniVision ai_compute mo unknown 0.38
C&UWolong Electric physical_ai mo unknown 0.38
Jiangxi South Rare Earth Hi-TechZhongke Sanhuan physical_ai mo unknown 0.38
SynopsysArteris ai_chips mo unknown 0.38
BroadcomMicrosoft custom_asic mo unknown 0.38
Vishay IntertechnologyDenso / Denso Wave ai_compute mo unknown 0.38
CorningNVIDIA advanced_packaging mo unknown 0.38
Nan Ya PCBAdvanced Micro Devices advanced_packaging mo unknown 0.38
CovariantABB Robotics physical_ai mo unknown 0.38
SUMCOSamsung Electronics ai_chips mo unknown 0.38
Wolong ElectricUnitree Robotics servomotors mo unknown 0.38
RockchipUBTech Robotics ai_compute mo unknown 0.38
MarvellNVIDIA custom_asic mo unknown 0.39
BroadcomAmazon custom_asic mo unknown 0.38
VDL GroepEinride physical_ai mo unknown 0.38
InfineonDevanthro (Roboy) ai_chips mo unknown 0.38
SambaNovaIntel accelerators mo unknown 0.39
RoboSenseNeolix vision mo unknown 0.38
Zhongji InnoLightAlphabet optical_modules mo unknown 0.38
Tata ElectronicsQualcomm ai_compute mo unknown 0.38
Zhongji InnoLightMeta Platforms optical_modules mo unknown 0.38
QualcommSamsung Electronics compute mo unknown 0.39
BroadcomZhongji InnoLight custom_asic mo unknown 0.38
MediaTekSamsung Electronics networking mo unknown 0.38
NVIDIAAgile Robots ai_chips mo unknown 0.38
NVIDIACartken ai_chips mo unknown 0.38
Merck KGaATexas Instruments ai_chips mo unknown 0.38
Ningbo YunshengPanasonic rare_earth_magnets mo unknown 0.38
NVIDIATesla ai_chips mo unknown 0.39
AptivVecna Robotics physical_ai mo unknown 0.39
IntelSambaNova merchant_gpu mo unknown 0.39
IonQQuantumBasel quantum mo unknown 0.39
Samsung Electro-MechanicsSamsung Electronics advanced_packaging mo unknown 0.39
Murata ManufacturingNVIDIA imu mo unknown 0.38
NVIDIAHewlett Packard Enterprise ai_chips mo unknown 0.39
BroadcomHewlett Packard Enterprise custom_asic mo unknown 0.38
QualcommHP compute mo unknown 0.38
AptivComau physical_ai mo unknown 0.39
NVIDIAFANUC ai_chips mo unknown 0.38
Advanced Micro DevicesHP merchant_gpu mo unknown 0.38
IonQAmazon quantum mo unknown 0.38
AmkorTaiwan Manufacturing osat mo unknown 0.38
MarvellMeta Platforms custom_asic mo unknown 0.38
Samsung ElectronicsMeta Platforms ai_chips mo unknown 0.38
GlobalWafersMicron ai_chips mo unknown 0.38
Applied MaterialsGlobalFoundries ai_chips mo unknown 0.38
Applied MaterialsQualcomm ai_chips mo unknown 0.38
MaxLinearNVIDIA ai_compute mo unknown 0.38
JabilMaxLinear mo unknown 0.38
MicronAlphabet hbm mo unknown 0.38
NVIDIAMagna International ai_chips mo unknown 0.38
MaxLinearAdvanced Micro Devices ai_compute mo unknown 0.38
Samsung ElectronicsMaxLinear ai_chips mo unknown 0.38
MicrochipNVIDIA ai_compute mo unknown 0.38
Samsung ElectronicsNVIDIA ai_chips mo unknown 0.38
AmkorAstera Labs osat mo unknown 0.38
Lam ResearchSamsung Electronics ai_chips mo unknown 0.38
CredoAmazon switch_silicon mo unknown 0.38
ArterisSamsung Electronics ai_compute mo unknown 0.39
Samsung Electro-MechanicsGroq advanced_packaging mo unknown 0.38
NVIDIASuper Micro Computer ai_chips mo unknown 0.38
Taiwan ManufacturingSony foundry mo unknown 0.38
Agility RoboticsSchaeffler humanoid mo unknown 0.38
Agility RoboticsAmazon humanoid mo unknown 0.38
Agility RoboticsToyota Motor humanoid mo unknown 0.38
Andes TechnologiesArteris ai_compute mo unknown 0.39
SiFiveArteris ai_compute mo unknown 0.39
SynopsysKeysight ai_chips mo unknown 0.39
SynopsysKeysight Technologies ai_chips mo unknown 0.38
PanasonicTesla physical_ai mo unknown 0.38
Mentee RoboticsIntel physical_ai mo unknown 0.38
ArterisSocionext ai_compute mo unknown 0.38
Cadence DesignArteris ai_chips mo unknown 0.38
ArterisTexas Instruments ai_compute mo unknown 0.38
Samsung ElectronicsCorsair ai_chips mo unknown 0.38
Taiwan ManufacturingTesla foundry 30mo established 0.76
SynopsysMicrosoft ai_chips mo unknown 0.39
Samsung ElectronicsTesla foundry 11mo young 0.63
Lam ResearchASE Technology ai_chips mo unknown 0.38
Taiwan ManufacturingNXP Semiconductors foundry mo unknown 0.38
NabtescoABB Robotics planetary_reducers mo unknown 0.38
MicronMicrosoft hbm mo unknown 0.38
MicronCorsair hbm mo unknown 0.38
IonQ quantum mo unknown 0.38
MaxLinear ai_compute mo unknown 0.38
IonQMicrosoft quantum mo unknown 0.38
MicronIntel hbm mo unknown 0.39
Arm ai_chips mo unknown 0.39
SK hynixMeta Platforms hbm mo unknown 0.38
Figure AIAmazon humanoid mo unknown 0.38
BroadcomCelestica custom_asic mo unknown 0.39
MP MaterialsApple physical_ai mo unknown 0.39
QualcommSTMicroelectronics compute mo unknown 0.38
Taiwan ManufacturingNavitas foundry mo unknown 0.38
Advanced Micro DevicesAlphabet merchant_gpu mo unknown 0.38
Analog DevicesNVIDIA imu mo unknown 0.38
Advanced Micro DevicesAlibaba Group merchant_gpu mo unknown 0.38
Taiwan ManufacturingAnalog Devices foundry mo unknown 0.38
Astera LabsAmazon switch_silicon mo unknown 0.38
Astera LabsNVIDIA switch_silicon mo unknown 0.38
ArmSamsung Electronics ai_chips mo unknown 0.38
CredoNVIDIA switch_silicon mo unknown 0.38
MicronAstera Labs hbm mo unknown 0.38
Advanced Micro DevicesCadence Design merchant_gpu mo unknown 0.38
Regal RexnordABB Robotics mo unknown 0.38
ACM ResearchMicron ai_chips mo unknown 0.38
NVIDIATata Sons ai_chips mo unknown 0.38
Murata ManufacturingGlobalFoundries imu mo unknown 0.38
Murata ManufacturingIntel imu mo unknown 0.38
IntelDell merchant_gpu mo unknown 0.39
ArmNVIDIA ai_chips mo unknown 0.39
ArmAmazon ai_chips mo unknown 0.39
Boston DynamicsHyundai Motor humanoid mo unknown 0.39
Boston DynamicsHyundai Motor humanoid mo unknown 0.39
ABBABB Robotics physical_ai mo unknown 0.39
GlobalFoundriesQualcomm foundry mo unknown 0.38
GlobalFoundriesCoherent foundry mo unknown 0.38
Taiwan ManufacturingIntel foundry mo unknown 0.38
Samsung ElectronicsTesla ai_chips mo unknown 0.39
BroadcomCelestica custom_asic mo unknown 0.39
IntelDell merchant_gpu mo unknown 0.39
Samsung ElectronicsTesla ai_chips mo unknown 0.39
Intel merchant_gpu mo unknown 0.39
Sumitomo ElectricSumitomo Heavy Industries ai_compute mo unknown 0.39
Broadcom custom_asic mo unknown 0.39
MicrosoftArm ai_compute mo unknown 0.39
QualcommBooster Robotics compute mo unknown 0.41
LG Energy SolutionBoston Dynamics batteries mo unknown 0.38
Tokyo ElectronIntel ai_chips mo unknown 0.38

OWNERSHIP & STRATEGIC INVESTMENT

Who owns whom

Equity ties shape the supply graph — the “German” reducer in Western cobots is Japanese-owned, and the hyperscalers funding the humanoid OEM are also its compute suppliers.

Corporate control

  • Harmonic Drive Systems Harmonic Drive SE 100% board source
  • Harmonic Drive Systems Harmonic Drive LLC 100% board source
  • Harmonic Drive Systems Harmonic Winbell 100% board source
  • Harmonic Drive Systems Harmonic Drive Shanghai control board source
  • Hyundai Motor Boston Dynamics control source
  • Hyundai Motor HD Hyundai Robotics control source
  • Midea JAKA Robotics control source
  • Midea KUKA 94.55% source
  • LG Innotek LG Energy Solution 100% source
  • Samsung Electronics Samsung Electro-Mechanics control source
  • Samsung Electronics Samsung SDI control source
  • AMEC 100% source
  • AT&S control source
  • ATI Industrial Automation control source
  • MediaTek Alchip Technologies control source
  • Robert Bosch GmbH Bosch Rexroth 100% source
  • Robert Bosch GmbH Bosch Sensortec 100% source
  • Dobot control source
  • EQT Partners Ewellix control source
  • GlobalFoundries control source
  • Hua Hong control source
  • Kokusai Electric control source
  • Regal Rexnord Kollmorgen 100% source
  • OmniVision control source
  • RoboSense control source
  • SMIC control source
  • Sony Socionext 50.1% source
  • Vacuumschmelze control source
  • Wolong Electric control source
  • AT&S 71% source
  • ATI Industrial Automation 100% source
  • Bosch Sensortec Bosch Rexroth 100% source
  • Nippon Steel Proterial 100% source
  • Infinera Corporation Credo control source
  • Merck KGaA GlobalWafers control source
  • Ningbo Hua Hong Integrated Circuit Co., Ltd. Hua Hong control source
  • Kokusai Electric control source
  • LG Electronics LG Innotek 100% source
  • Robert Bosch GmbH control source
  • RoboSense control source
  • SMIC control source
  • SUMCO 50.1% source
  • Toyota Motor 50.1% source
  • AMEC 100% source
  • Amazon 6 River Systems 100% source
  • Amazon Amazon Annapurna Labs 100% source
  • Bosch Sensortec control source
  • Onto Innovation Inc. Cascade Microtech 100% source
  • China Northern Rare Earth High-Tech China Rare Earth control source
  • SZ DJI Osmo Technology Co., Ltd. D-Robotics control source
  • Kangwon Land Inc. EcoPro BM control source
  • Hon Hai Precision Industry 100% source
  • Micron GlobalWafers 100% source
  • Hyundai Heavy Industries Group HD Hyundai Robotics control source
  • Hemlock Investment Holding Company Hemlock 100% source
  • Jiangsu Hua Hong Integrated Circuit Co., Ltd. Hua Hong control source
  • Hua Hong control source

Strategic investments

  • NVIDIA Figure AI venture round source
  • Microsoft Figure AI venture round source
  • Amazon Figure AI venture round source
  • SK hynix Kioxia direct equity source
  • 1X venture round source
  • MediaTek ASE Technology direct equity source
  • Agility Robotics venture round source
  • Agility Robotics venture round source
  • Amazon Agility Robotics venture round source
  • Qualcomm Ampere Computing venture round source
  • SoftBank Arm direct equity source
  • BYD direct equity source
  • CATL direct equity source
  • Credo direct equity source
  • SoftBank Figure AI venture round source
  • Figure AI venture round source
  • GlobalFoundries direct equity source
  • Hesai venture round source
  • Hesai venture round source
  • Hesai venture round source
  • Jiangsu Nanhui Electronics Co., Ltd. Hua Hong direct equity source
  • Siemens EDA Infineon direct equity source
  • Toyota Motor JTEKT direct equity source
  • JTEKT direct equity source
  • NXP Semiconductors direct equity source
  • Macom Technology Solutions Holdings Navitas direct equity source
  • Alibaba Group Orbbec direct equity source
  • Toyota Motor Preferred Networks direct equity source
  • SMIC direct equity source
  • SMIC direct equity source
  • SoftBank SambaNova venture round source
  • SambaNova venture round source
  • SambaNova venture round source
  • Wacker Chemie AG Siltronic direct equity source
  • Infineon Siltronic direct equity source
  • UBTech Robotics venture round source
  • Qualcomm UBTech Robotics venture round source
  • SoftBank UBTech Robotics venture round source
  • MediaTek UMC direct equity source
  • 1X venture round source
  • Agility Robotics venture round source
  • Samsung Electronics Agility Robotics direct equity source
  • Toyota Motor Figure AI venture round source
  • NVIDIA Hesai direct equity source
  • Hua Hong direct equity source
  • SMIC venture round source
  • Eurosemiconductor STMicroelectronics direct equity source
  • Shin-Etsu Chemical SUMCO direct equity source
  • SambaNova venture round source
  • Malaysia Smelting Corporation Siltronic direct equity source
  • Toyota Motor direct equity source
  • Qualcomm UMC direct equity source
  • Hon Hai Precision Industry Unimicron direct equity source
  • SoftBank 1X venture round source
  • ABB Robotics ANYbotics AG direct equity source
  • Intrinsic Agility Robotics venture round source
  • Everline Capital Credo venture round source
  • Credo venture round source
  • Menlo Ventures Credo venture round source
  • SoftBank Deutsche Telekom direct equity source
  • EVE Energy direct equity source
  • Geely Holding Group EVE Energy direct equity source
  • Ijijim Capital Einride venture round source
  • Norrsken VC Einride venture round source
  • Scania CV AB Einride venture round source
  • Figure AI venture round source
  • Siemens EDA Franka Robotics direct equity source
  • SoftBank GreyOrange venture round source
  • Corning Hemlock direct equity source
  • Shin-Etsu Chemical Hemlock direct equity source
  • Rhineland Capital Partners Hesai venture round source
  • Midea Horizon Robotics direct equity source
  • Groupe Arnault ID Quantique direct equity source
  • Apax Partners ID Quantique direct equity source
  • Intel Figure AI venture round source
  • Intel SambaNova venture round source
  • Intel Tenstorrent venture round source

⚑ Ecosystem lock-in: NVIDIA, Microsoft and Amazon all hold venture stakes in Figure AI — the same three firms that dominate AI-compute supply. They are funding the demand for their own chips.

SOLE-SOURCE RISK early

Single points of failure

Buyers wholly dependent on a single supplier for a component. Sparse today — only one qualifies so far; this fills in as more sole-source edges are confirmed.

🇺🇸 NVIDIA Corporation

sole-source dependent on

  • foundry
  • hbm

max dependency materiality 0.95 · moderate

click for the underlying dependencies →

All risk analytics are materialized views over confirmed (≥0.7) edges. As more confirmed edges load, more buyers and suppliers surface here. (Backward-integration “captive supplier” pairs — a buyer owning its supplier — have no instances in the current set.)

DOUBLE LOCK-INS

A sole-source part whose own material is also concentrated

The compounded risk: a Tier-1 sole-source supplier whose upstream (Tier-2) input is itself concentrated — locked at the component and the material tier, two rungs down. 4 in the current data.

oemdouble lock

Panasonic Midea

T1 sole-source · fed by Midea (T2)

rare_earth_magnetsdouble lock

Panasonic Ningbo Yunsheng

T1 sole-source · fed by Ningbo Yunsheng (T2)

ai_computedouble lock

Vishay Intertechnology Tower

T1 sole-source · fed by Tower (T2)

ai_computedouble lock

Vishay Intertechnology Key Foundry

T1 sole-source · fed by Key Foundry (T2)

SUPPLY DEPTH

How far upstream we can trace each chain

Tier 1 = supplier to the maker. Tier 2 = supplier to that supplier — the material / sub-component one rung deeper. Solid = human-verified; dotted = sourced but not yet checked. 33 tier-2+ links across 16 suppliers.

T1 Allegro MicroSystems
T2 UMC · foundry T2 Taiwan Manufacturing · foundry T2 · ai_compute T2 SMIC · foundry
T1 JL MAG Rare-Earth
T2 China Rare Earth · physical_ai T2 China Rare Earth · physical_ai T2 China Northern Rare Earth High-Tech · physical_ai T2 China Northern Rare Earth High-Tech · physical_ai
T1 Galbot
T2 Leaderdrive · harmonic_reducers T2 NVIDIA · ai_chips T2 CATL · batteries
T1 Tata Electronics
T2 ASML · ai_chips T2 Powerchip · foundry T2 Tokyo Electron · ai_chips
T1 Zhongke Sanhuan
T2 Jiangxi South Rare Earth Hi-Tech · physical_ai T2 Ganzhou Keli Rare Earth New Materials · physical_ai T2 China Northern Rare Earth High-Tech · physical_ai
T1 SMIC
T2 Empyrean · ai_chips T2 ACM Research · ai_chips T2 AMEC · ai_chips
T1 Panasonic
T2 Midea · oem T2 Ningbo Yunsheng · rare_earth_magnets
T1 Vishay Intertechnology
T2 Tower · ai_compute T2 Key Foundry · ai_compute
T1 Skild AI
T2 NVIDIA · ai_chips T2 Hewlett Packard Enterprise · ai_compute
T1 Covariant
T2 NVIDIA · ai_chips
T1 Eoptolink
T2 Broadcom · custom_asic
T1 Amkor
T2 Infineon · ai_chips
T1 Standard Bots
T2 NVIDIA · ai_chips
T1 Mentee Robotics
T2 NVIDIA · ai_chips
T1 Zhongji InnoLight
T2 Broadcom · custom_asic
T1 Ningbo Yunsheng
T2 China Northern Rare Earth High-Tech · physical_ai